Immersed cooling water tank and immersed cooling system comprising same

Abstract

The utility model provides an immersed cooling water tank and an immersed cooling system. The immersed cooling water tank comprises a shell and a pipeline assembly. The shell comprises a positioning element. The positioning element is used for limiting a lowest mounting surface of an electronic device. The pipeline assembly comprises a flow inlet branch pipe and a plurality of flow inlets. The flow inlets are formed in the flow inlet branch pipes, and the size of each flow inlet is 1 / 0.5 to 1 / 6.5 of the size of each flow inlet branch pipe.

Description

Technical Field

[0001] The invention relates to an immersion cooling water tank and an immersion cooling system comprising the same. Background Art

[0002] Immersion cooling systems that utilize fluids to cool electronic devices are gaining popularity. However, current immersion cooling systems are not satisfactory in all aspects. Utility Model Content

[0003] Some embodiments of the present disclosure provide an immersion cooling water tank. The immersion cooling water tank includes a shell and a pipe assembly. The shell includes a positioning element. The positioning element is used to define a lowest mounting surface of an electronic device. The pipe assembly includes an inlet branch pipe and a plurality of inlet ports. The inlet ports are arranged on the inlet branch pipe. The size of each of the inlet ports is 1 / 4.5 to 1 / 6.5 of the size of the inlet branch pipe.

[0004] In some embodiments, the shortest distance between the lowest mounting surface and one of the corresponding inlet ports is between 1 mm and 30 mm. The pipeline assembly further includes a fluid inlet and an inlet main pipe. The inlet main pipe is fluidically connected to the fluid inlet. The inlet branch pipe is fluidically connected to the inlet main pipe, and the size of the inlet branch pipe is different from the size of the inlet main pipe.

[0005] In some embodiments, the pipeline assembly further comprises a fluid outlet, an outlet pipe, and an outlet port. The outlet pipe is fluidically connected to the fluid outlet. The outlet port is fluidically connected to the outlet pipe. The fluid outlet is disposed above the fluid inlet. The size of each of the inlets is smaller than the size of the outlet port.

[0006] Some embodiments of the present disclosure provide an immersion cooling water tank. The immersion cooling water tank includes a shell, a pipe assembly, and an annular partition element. The aforementioned pipe assembly includes a fluid inlet and a fluid outlet. The aforementioned fluid inlet is arranged in the aforementioned shell, and is used to allow a fluid to flow into the aforementioned shell. The aforementioned fluid outlet is arranged in the aforementioned shell, and is used to allow the aforementioned fluid to flow out of the aforementioned shell. The aforementioned annular partition element is protruding from an inner wall surface of the aforementioned shell, and is located between the aforementioned fluid inlet and the aforementioned fluid outlet, so that the inner area of ​​the aforementioned shell is divided into a first area and a second area above the first area.

[0007] In some embodiments, the temperature of the fluid in the first zone is different from the temperature of the fluid in the second zone. In some embodiments, the submerged cooling water tank further comprises a baffle, wherein the annular partition element surrounds the baffle.

[0008] Some embodiments of the present disclosure provide an immersion cooling system, which includes an immersion cooling water tank as described above, a heat exchange device, and a pump, wherein the fluid flowing into and out of the immersion cooling water tank is pumped to the heat exchange device by the pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] When reading the accompanying drawings, the various aspects of the present disclosure can be best understood from the following detailed description. It should be noted that the various features are not necessarily drawn to scale. In fact, the size of the various features may be arbitrarily enlarged or reduced to make a clear description.

[0010] Figure 1 is a perspective view of an immersion cooling system according to some embodiments.

[0011] Figure 2 as well as Figure 3 is a perspective view of an immersion cooling water tank from different viewing angles according to some embodiments.

[0012] Figure 4 is an enlarged side view of a portion of an immersion cooling water tank according to some embodiments.

[0013] Figure 5 as well as Figure 6 is a perspective view of an immersion cooling water tank from different viewing angles according to some embodiments.

[0014] Figure 7 is a partially enlarged perspective view of an immersion cooling water tank according to some embodiments.

[0015] Figure 8 is an enlarged side view of a portion of an immersion cooling water tank according to some embodiments.

[0016] Fig. 9 as well as Fig.10 is a perspective view of an immersion cooling water tank from different viewing angles according to some embodiments.

[0017] Fig.11 is a perspective view of a tubing assembly according to some embodiments.

[0018] Fig.12 is a top view of a tubing assembly according to some embodiments.

[0019] Fig.13A as well as Fig. 13B is a schematic diagram of the relative positions of the outlet and the electronic device according to some embodiments.

[0020] Description of reference numerals:

[0021] 100: Immersion Cooling System

[0022] 200: Heat exchange device

[0023] 300: Immersed cooling water tank

[0024] 310: Upper shell

[0025] 311: Handle

[0026] 320: Front housing

[0027] 321: Wall

[0028] 330: Rear housing

[0029] 340: Base

[0030] 350: Ring separator element

[0031] 360: Front bezel

[0032] 370: Tailgate

[0033] 371: Positioning element

[0034] 400: Pipeline components

[0035] 410: Fluid inlet

[0036] 420: Fluid outlet

[0037] 430: Inlet Supervisor

[0038] 440: Outflow pipe

[0039] 450: Inlet branch pipe

[0040] 460: Inlet

[0041] 470: Outlet

[0042] 500: Electronic devices

[0043] 500B: Lowest mounting surface

[0044] 560: Inlet

[0045] 600: diversion structure

[0046] A1: first cross-sectional area

[0047] A2: Second cross-sectional area

[0048] A3: First cross-sectional area

[0049] A4: Second cross-sectional area

[0050] D1: Shortest distance

[0051] D2: Shortest distance DETAILED DESCRIPTION

[0052] The following disclosure provides many different embodiments or examples, and describes specific examples of various components and arrangements to implement different features of the present disclosure. For example, if the specification describes that a first feature is formed "above" a second feature, it means that embodiments in which the first feature and the second feature are in direct contact may be included, and embodiments in which additional features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact may be included. In addition to the orientations shown in the accompanying drawings, these spatially related terms are intended to include different orientations of the device in use or operation. The device can be turned to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein can also be interpreted in the same way.

[0053] Furthermore, ordinal numbers in the specification and claims, such as "first", "second", etc., do not have a sequential relationship, and are only used to mark and distinguish two different elements with the same name. In addition, the terms "including" and / or "having" are open-ended words, and therefore should be interpreted as "including but not limited to...". Therefore, when the terms "including" and / or "having" are used in this specification, they specify the existence of corresponding features, regions, steps, operations and / or components, but do not exclude the existence of one or more corresponding features, regions, steps, operations and / or components.

[0054] Please refer to Figure 1 , to understand an immersion cooling system 100 . Figure 1 is a perspective view of an immersion cooling system 100 according to some embodiments. The immersion cooling system 100 can be used to cool a plurality of electronic devices 500. The electronic devices 500 can be conventional servers, artificial intelligence (AI) servers, devices including backup battery units (BBU), etc., but are not limited thereto.

[0055] The immersion cooling system 100 includes a pump (not shown), a heat exchange device 200, and an immersion cooling water tank 300. The electronic device 500 can be immersed in a fluid (which can be single-phase or two-phase) in the immersion cooling water tank 300 and thus cooled. The fluid flowing into and out of the immersion cooling water tank 300 can be pumped to the heat exchange device 200 by the pump to adjust the temperature of the fluid. For example, the heat exchange device 200 can ensure that the fluid is sufficiently low temperature before flowing into the immersion cooling water tank 300. In some embodiments, the heat exchange device 200 can have a control function and can serve as a control device.

[0056] The immersion cooling water tank 300 may include an upper housing 310, a front housing 320, and a rear housing 330. In some embodiments, the upper housing 310, the front housing 320, and the rear housing 330 may be collectively referred to as housings. The upper housing 310 is disposed above the front housing 320 and connected to the front housing 320. In some embodiments, the upper housing 310 includes a handle 311. In some embodiments, the upper housing 310 may be moved by holding the handle 311 to place or remove the electronic device 500.

[0057] In some embodiments, the front housing 320 includes a plurality of walls 321. The walls 321 surround the electronic device 500. In some embodiments, the walls 321 include metal, such as a high thermal conductivity metal, but not limited thereto. The rear housing 330 is disposed behind the front housing 320. In some embodiments, the rear housing 330 includes the same material as the front housing 320, but not limited thereto.

[0058] Next, please refer to Figures 2 to 8 , to further understand the immersion cooling water tank 300. For the convenience of explanation, Figures 2 to 4 In the embodiment, the upper shell 310 and the front shell 320 are omitted. Figure 2 as well as Figure 3 is a perspective view of an immersion cooling water tank 300 from different viewing angles according to some embodiments. Figure 4 is a partially enlarged side view of an immersion cooling water tank 300 according to some embodiments.

[0059] Again, for the sake of convenience, Figures 5 to 8 In the figure, the electronic device 500 is further omitted. Figure 5 as well as Figure 6 is a perspective view of an immersion cooling water tank 300 from different viewing angles according to some embodiments. Figure 7 is a partially enlarged perspective view of an immersion cooling water tank 300 according to some embodiments. Figure 8 is a partially enlarged side view of an immersion cooling water tank 300 according to some embodiments.

[0060] The submerged cooling water tank 300 may further include a base 340 , an annular partition element 350 , a plurality of front baffles 360 , a plurality of rear baffles 370 , and a pipe assembly 400 .

[0061] The base 340 is disposed below the annular partition element 350. The base 340 may have a supporting function. In some embodiments, the base 340 includes a plurality of cuboids.

[0062] The annular partition element 350 is convexly disposed on an inner wall surface of the front shell 320. That is, the annular partition element 350 is disposed on the inner wall surface of the front shell 320 and protrudes from the inner wall surface of the front shell 320. In some embodiments, the annular partition element 350 and the front shell 320 are closely matched (close fit). That is, there is almost no gap between the annular partition element 350 and the front shell 320. In some embodiments, the annular partition element 350 can surround the front baffle 360 ​​and the rear baffle 370, and thereby fix the front baffle 360 ​​and the rear baffle 370. The details of the annular partition element 350 will be described in detail below. Fig. 9 as well as Fig.10 Detailed description.

[0063] The front baffle 360 ​​and the rear baffle 370 are used to fix and separate the electronic devices 500. In some embodiments, one front baffle 360 ​​and one rear baffle 370 are used to fix one electronic device 500. Through the front baffle 360 ​​and the rear baffle 370, the electronic devices 500 can be arranged relatively closely, which can improve the space utilization rate of the internal space of the immersion cooling water tank 300.

[0064] In some embodiments, the front baffle 360 ​​and the rear baffle 370 may include a front positioning element (not shown) and a rear positioning element 371 (indicated at Fig. 9 ) to define a lowest mounting surface of the electronic device 500 and reduce the possibility of the electronic device 500 colliding with the pipe assembly 400. In some embodiments, the front positioning element and the rear positioning element 371 can be a protrusion parallel to the lowest mounting surface of the electronic device 500, but is not limited thereto.

[0065] The pipe assembly 400 includes a fluid inlet 410 and a fluid outlet 420. In some embodiments, the fluid inlet 410 and the fluid outlet 420 are disposed on the rear housing 330, and the fluid outlet 420 is disposed above the fluid inlet 410. Figure 4 as well as Figure 8 In the figure, arrows are used to indicate the inflow and outflow of fluid. Specifically, the fluid used to cool the electronic device 500 flows into the immersion cooling water tank 300 (e.g., the front housing 320) through the fluid inlet 410, and the fluid that has absorbed the heat generated by the electronic device 500 flows out of the immersion cooling water tank 300 (e.g., the front housing 320) through the fluid outlet 420. The details of the pipe assembly 400 will be described in detail below. Fig.11 as well as Fig.12 Detailed description.

[0066] Next, in addition to Figures 2 to 8 In addition, please refer to Fig. 9 as well as Fig.10, to understand the annular separation element 350. Fig. 9 as well as Fig.10 3 is a perspective view of the immersion cooling water tank 300 from different perspectives according to some embodiments. The annular partition element 350 is located between the fluid inlet 410 and the fluid outlet 420. In some embodiments, the top surface of the annular partition element 350 is located between the fluid inlet 410 and the fluid outlet 420 in the vertical direction.

[0067] When the fluid for cooling the electronic device 500 flows into the immersion cooling water tank 300 through the fluid inlet 410, the annular partition element 350 can divide the immersion cooling water tank 300 into a first zone Z1 and a second zone Z2 above the first zone Z1, wherein the temperature of the fluid in the first zone Z1 is different from the temperature of the fluid in the second zone Z2. In some embodiments, the temperature of the fluid in the first zone Z1 is lower than the temperature of the fluid in the second zone Z2.

[0068] In some embodiments, the first zone Z1 represents a region where the fluid has not yet absorbed the heat generated by the electronic device 500, and the second zone Z2 represents a region where the fluid has already absorbed the heat generated by the electronic device 500. In some embodiments, the first zone Z1 is a region above the topmost surface of the annular partition element 350, and the second zone Z2 is a region surrounded by the annular partition element 350, but the separation between the first zone Z1 and the second zone Z2 is not limited thereto.

[0069] The annular partition element 350 can reduce the possibility that the fluid flows into the immersion cooling water tank 300 through the fluid inlet 410 and then flows out of the immersion cooling water tank 300 through the fluid outlet 420 before flowing through the electronic device 500. Alternatively, the annular partition element 350 can reduce the possibility that the fluid that has absorbed the heat generated by the electronic device 500 flows to the vicinity of the fluid inlet 410. That is, the annular partition element 350 can achieve the effect of separating fluids of different temperatures, guide the fluid to flow in a desired direction, and help the circulation of the fluid, thereby improving the cooling efficiency.

[0070] Next, please refer to Fig.11 as well as Fig.12 , to understand the pipeline assembly 400. Fig.11 is a perspective view of a tube assembly 400 according to some embodiments. Fig.12 4 is a top view of a pipe assembly 400 according to some embodiments. In addition to a fluid inlet 410 and a fluid outlet 420 , the pipe assembly 400 may include an inlet main pipe 430 , an outlet pipe 440 , a plurality of inlet branches 450 , a plurality of inlet ports 460 , and a plurality of outlet ports 470 .

[0071] The inlet main pipe 430 is fluidically connected to the fluid inlet 410. The inlet branch pipe 450 is fluidically connected to the inlet main pipe 430. The inlet port 460 is fluidically connected to the inlet branch pipe 450. That is, the fluid flows through the fluid inlet 410, the inlet main pipe 430, the inlet branch pipe 450, and the inlet port 460 in sequence and flows into the immersion cooling water tank 300 to cool the electronic device 500. In some embodiments, each electronic device 500 corresponds to two rows of inlets 460, but the arrangement of the inlets 460 is not limited thereto. Compared to the case where each electronic device 500 corresponds to only one row of inlets 460, each electronic device 500 corresponds to two rows of inlets 460 to achieve a better cooling effect.

[0072] In some embodiments, the size of the inlet main pipe 430, the size of the inlet branch pipe 450, and the size of the inlet port 460 are different from each other. In some embodiments, the size of each inlet port 460 is 1 / 4.5 to 1 / 6.5 of the size of each inlet branch pipe 450 (that is, the size of the inlet branch pipe 450 can be 4.5 times to 6.5 times the size of the inlet port 460, and the expression of 1 / 4.5 to 1 / 6.5 is based on the size of the inlet port 460, so it is expressed in a way that the numerator is 1). By designing the size of the inlet port 460, the liquid in the inlet branch pipe 450 can flow out from each inlet port 460 evenly, and each electronic device 500 can obtain a similar cooling effect. That is, the fluid in different inlets 460 can have approximately the same flow rate, flow rate, etc.

[0073] The outlet pipe 440 is fluidically connected to the fluid outlet 420. The outlet port 470 is fluidically connected to the outlet pipe 440. That is, the fluid will flow out of the submerged cooling water tank 300 through the fluid outlet 420 after flowing through the outlet port 470 and the outlet pipe 440 in sequence. In some embodiments, the size of the outlet port 470 is substantially the same as the size of the outlet pipe 440, but is not limited thereto. In some embodiments, the size of each outlet port 470 is substantially the same. In some embodiments, the number of outlet ports 470 is much smaller than the number of inlet ports 460. In some embodiments, the size of the inlet branch pipe 450 is smaller than the size of the outlet port 470.

[0074] Next, please refer to Fig.13A as well as Fig. 13B . Fig.13A as well as Fig. 13B 4 is a schematic diagram of the relative positions of the inlet 460 and the electronic device 500 according to some embodiments. For the convenience of description, the same or similar elements may be labeled with the same or similar reference numerals.

[0075] exist Fig.13AIn the illustrated embodiment, the inlet port 460 protrudes relative to the top surface of the inlet branch pipe 450. The inlet port 460 corresponds to a lowest mounting surface 500B (e.g., defined by the front positioning element and the rear positioning element 371 as described above) of the electronic device 500. In some embodiments, a shortest distance D1 between the lowest mounting surface 500B of the electronic device 500 and the inlet port 460 is between 1 mm and 30 mm.

[0076] The inlet 460 may include a cross-sectional area gradient portion. The cross-sectional area of ​​the cross-sectional area gradient portion may be changed. The cross-sectional area gradient portion may include a first cross-sectional area A1 and a second cross-sectional area A2, and the first cross-sectional area A1 is different from the second cross-sectional area A2. In some embodiments, the first cross-sectional area A1 is the minimum cross-sectional area of ​​the cross-sectional area gradient portion, and the second cross-sectional area A2 is the maximum cross-sectional area of ​​the cross-sectional area gradient portion. In some embodiments, the ratio of the first cross-sectional area A1 to the second cross-sectional area A2 is between 1 / 2 and 1 / 3. In this way, the liquid in the inlet branch pipe 450 can flow out evenly from each inlet 460, and each electronic device 500 can obtain a similar cooling effect.

[0077] In addition, the inlet 460 may also include a uniform cross-sectional area portion connected to the cross-sectional area gradient portion. The uniform cross-sectional area portion has a uniform cross-sectional area. The cross-sectional area gradient portion is above the uniform cross-sectional area portion. In some embodiments, the ratio of the minimum size of the cross-sectional area gradient portion to the size of the uniform cross-sectional area portion is between 1 / 2 and 1 / 3. In this way, the liquid in the inlet branch pipe 450 can flow out from each inlet 460 more evenly, and each electronic device 500 can obtain a more similar cooling effect.

[0078] exist Fig. 13B In the illustrated embodiment, the inlet 560 is recessed relative to the top surface of the inlet branch pipe 450. The inlet 560 corresponds to a lowest mounting surface 500B (e.g., defined by the front positioning element and the rear positioning element 371 as described above) of the electronic device 500. In some embodiments, a shortest distance D2 between the lowest mounting surface 500B of the electronic device 500 and the inlet 560 is between 1 mm and 30 mm.

[0079] The inlet 560 may include a cross-sectional area gradient portion. The cross-sectional area of ​​the cross-sectional area gradient portion may be changed. The cross-sectional area gradient portion may include a first cross-sectional area A3 and a second cross-sectional area A4, and the first cross-sectional area A3 is different from the second cross-sectional area A4. In some embodiments, the first cross-sectional area A3 is the minimum cross-sectional area of ​​the cross-sectional area gradient portion, and the second cross-sectional area A4 is the maximum cross-sectional area of ​​the cross-sectional area gradient portion. In some embodiments, the ratio of the first cross-sectional area A3 to the second cross-sectional area A4 is between 1 / 2 and 1 / 3. In this way, the liquid in the inlet branch pipe 450 can flow out evenly from each inlet 560, and each electronic device 500 can obtain a similar cooling effect.

[0080] In addition, the inlet 560 may also include a uniform cross-sectional area portion connected to the cross-sectional area gradient portion. The uniform cross-sectional area portion has a uniform cross-sectional area. The cross-sectional area gradient portion is above the uniform cross-sectional area portion. In some embodiments, the ratio of the minimum size of the cross-sectional area gradient portion to the size of the uniform cross-sectional area portion is between 1 / 2 and 1 / 3. In this way, the liquid in the inlet branch pipe 450 can flow out of each inlet 560 more evenly, and each electronic device 500 can obtain a more similar cooling effect.

[0081] Because the shortest distance D1 (or the shortest distance D2) between the lowest mounting surface 500B of the electronic device 500 and the inlet 460 (or inlet 560) is between 1 mm and 30 mm, the fluid flowing out of the inlet 460 (or inlet 560) can almost entirely flow to the lowest mounting surface 500B of the electronic device 500, thereby avoiding waste of fluid, thereby reducing costs and improving cooling efficiency.

[0082] In addition, because the cross-sectional area of ​​the inlet 460 (or the inlet 560) at the end relatively close to the electronic device 500 is reduced, the flow rate of the fluid flowing to the electronic device 500 can be increased, thereby improving the cooling efficiency. Moreover, such a design can guide the fluid to flow to the lowest mounting surface 500B of the electronic device 500. In some embodiments, the inlet 460 (or the inlet 560) can be equipped with a guide structure 600. The guide structure 600 is used to further guide the fluid to flow to the lowest mounting surface 500B of the electronic device 500.

[0083] In summary, some embodiments of the present disclosure provide an immersion cooling water tank and an immersion cooling system including the same, so as to utilize a fluid to cool a plurality of electronic devices. The immersion cooling water tank includes a shell and a pipe assembly. The pipe assembly may include a fluid inlet for allowing the fluid to flow into the immersion cooling water tank, an inlet main pipe, an inlet branch pipe, an inlet port, an outlet port for allowing the fluid to flow out of the immersion cooling water tank, and a fluid outlet.

[0084] By designing the size of the inlet, the fluid in different inlets can have substantially the same flow rate, flow rate, etc. Also, because the cross-sectional area of ​​the inlet at the end relatively close to the electronic device is reduced, the flow rate of the fluid flowing to the electronic device can be increased, thereby improving the cooling efficiency.

[0085] In some embodiments, the distance between a lowest mounting surface of the electronic device and the inlet is between 1 mm and 30 mm, so that the fluid flowing out of the inlet can almost all flow to the lowest mounting surface of the electronic device, thereby avoiding waste of fluid, thereby reducing costs and improving cooling efficiency. In addition, the immersion cooling water tank may include an annular partition element. The annular partition element can achieve the effect of separating fluids of different temperatures, guiding the fluid to flow in a desired direction, and facilitating the circulation of the fluid, thereby improving cooling efficiency.

[0086] The features of several embodiments are summarized above so that those skilled in the art can better understand the various aspects of the present disclosure. It should be understood by those skilled in the art that the present disclosure can be easily used as a basis for designing or modifying other processes and devices to achieve the same purpose or achieve the same advantages of the embodiments introduced herein. It should also be understood by those skilled in the art that such equivalent configurations do not deviate from the concept and scope of the present disclosure. Moreover, various changes, substitutions and modifications may be made to the present disclosure without departing from the concept and scope of the present disclosure. The features between the embodiments can be arbitrarily mixed and matched for use as long as they do not conflict with the concept of the present disclosure.

Claims

1. An immersion cooling water tank, characterized in that: The immersion cooling water tank includes: A housing including a positioning element for defining a lowest mounting surface of an electronic device; and A pipeline component includes an inlet branch pipe and a plurality of inlet ports, wherein the plurality of inlet ports are arranged on the inlet branch pipe, and the size of each of the plurality of inlet ports is 1 / 4.5 to 1 / 6.5 of the size of the inlet branch pipe.

2. The submerged cooling water tank according to claim 1, characterized in that: A shortest distance between the lowest mounting surface and one of the corresponding plurality of inlets is between 1 mm and 30 mm.

3. The submerged cooling water tank according to claim 1, characterized in that: The pipeline assembly also includes: a fluid inlet; and an inlet main pipe, the fluid being connected to the fluid inlet; The inlet branch pipe is fluidically connected to the inlet main pipe, and the size of the inlet branch pipe is different from the size of the inlet main pipe.

4. The submerged cooling water tank according to claim 3, characterized in that: The pipeline assembly also includes: a fluid outlet; an outlet pipe, fluidically connected to the fluid outlet; and an outlet port, fluidly connected to the outlet pipe; The fluid outlet is arranged above the fluid inlet.

5. The submerged cooling water tank according to claim 4, characterized in that: The size of each of the plurality of inlets is smaller than the size of the outlet.

6. An immersion cooling water tank, characterized in that: The immersion cooling water tank includes: a housing; A pipeline assembly, comprising: a fluid inlet, disposed in the housing, for allowing a fluid to flow into the housing; and a fluid outlet disposed on the housing for allowing the fluid to flow out of the housing; and an annular separation element; The annular partition element is protruded from an inner wall surface of the shell and is located between the fluid inlet and the fluid outlet, so that the inner area of ​​the shell is divided into a first area and a second area above the first area.

7. The submerged cooling water tank according to claim 6, characterized in that: The temperature of the fluid in the first zone is different from the temperature of the fluid in the second zone.

8. The submerged cooling water tank according to claim 6, characterized in that: The submerged cooling water tank further comprises a baffle, wherein the annular partition element surrounds the baffle.

9. An immersion cooling system, characterized in that: The immersion cooling system include: The submerged cooling water tank according to claim 1 or claim 6; a heat exchange device; and One pump; The pump draws fluid flowing into and out of the immersion cooling water tank to the heat exchange device.

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