Outer layer gluing device for circuit board processing

Abstract

The utility model discloses an outer layer gluing device for circuit board processing, which comprises a rack, a conveyor belt is arranged in the rack, a first frame, a second frame and a third frame are arranged at the top of the rack, a gluing assembly is arranged in the second frame, a first cylinder is arranged at the top of the first frame, and a second cylinder is arranged at the top of the third frame. An output shaft of the first air cylinder penetrates through the first frame and is connected with a lifting frame, a cleaning roller is rotationally installed in the lifting frame, an adsorption glue layer is arranged on the surface of the cleaning roller, a fan is arranged on the top of the second frame, the output end of the fan is connected with a three-way pipe, and the two ends of the three-way pipe communicate with a first pipeline and a second pipeline correspondingly. Through the arrangement, dust removal can be conveniently carried out on the circuit board before gluing, the situation that dust is attached to the surface of the circuit board, and the bonding firmness of a gluing layer and the circuit board is affected is avoided, the gluing layer on the circuit board after gluing can be conveniently cooled and cured, the curing speed of the gluing layer can be increased, and the circuit board can be better protected.

Description

Technical Field

[0001] The utility model relates to an outer layer glue coating device for processing a circuit board. Background Art

[0002] During the production and processing of circuit boards, they need to be coated with an outer layer of glue. The outer layer of glue can protect the circuit boards from mechanical damage, chemical corrosion, and contamination by dust, moisture, pollutants, etc.

[0003] The existing glue coating device is not convenient for cleaning the dust on the surface of the circuit board before gluing. The circuit board with dust will affect the firmness of the adhesive layer and the circuit board, thereby affecting the protective effect of the outer layer of the circuit board. In addition, after the existing glue coating device glues the circuit board, the adhesive layer of the circuit board is mostly naturally dried, which cannot increase the curing speed of the adhesive layer, and is not convenient for achieving the purpose of rapid protection of the circuit board, which has certain limitations.

[0004] Therefore, it is necessary to provide an outer layer glue coating device for circuit board processing to solve the above problems. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide an outer layer glue coating device for processing a circuit board, so as to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above problems, the utility model adopts the following technical solutions:

[0007] A device for coating outer layers of glue for processing circuit boards, comprising a frame, a conveyor belt being installed inside the frame, a first frame, a second frame and a third frame being arranged on the top of the frame, a coating assembly being arranged inside the second frame, a first cylinder being arranged on the top of the first frame, an output shaft of the first cylinder passing through the first frame and being connected to a lifting frame, a cleaning roller being rotatably installed inside the lifting frame, an adsorption glue layer being arranged on the surface of the cleaning roller, a fan being arranged on the top of the second frame, a three-way pipe being connected to the output end of the fan, a first pipeline and a second pipeline being connected to both ends of the three-way pipe respectively, one end of the first pipeline being connected to an air outlet assembly located inside the first frame, and one end of the second pipeline being connected to a cooling assembly located inside the third frame.

[0008] Preferably, the air outlet assembly includes an air outlet main pipe and air outlet branch pipes, one end of the first pipeline passes through the first frame and is connected to the air outlet main pipe, and a plurality of equidistantly distributed air outlet branch pipes are arranged at the bottom of the air outlet main pipe.

[0009] Preferably, the cooling component includes a refrigerator, an output pipe, a cold air main pipe and a cold air branch pipe. The second pipeline, the refrigerator and the output pipe are connected in sequence. One end of the output pipe passes through the third frame and is connected to the cold air main pipe. A number of equidistantly distributed cold air branch pipes are arranged at the bottom of the cold air main pipe.

[0010] Preferably, a first solenoid valve and a second solenoid valve are respectively provided at both ends of the three-way pipe.

[0011] Preferably, both ends of the lifting frame are slidably penetrated by an insertion rod, and a pull plate is provided at the opposite ends of the two insertion rods, a return spring is provided between the pull plate and the lifting frame, and limiting holes are provided at both ends of the cleaning roller and corresponding to the insertion rods, and the limiting holes can be used for the insertion of the insertion rods.

[0012] Preferably, the glue coating assembly includes an electromagnetic slide rail, a sliding seat, a second cylinder, a connecting box, a glue coating cylinder, an electric push rod and a piston. The electromagnetic slide rail is fixedly arranged inside the second frame. A sliding seat is slidingly arranged on the electromagnetic slide rail. A second cylinder is arranged at the bottom of the sliding seat. The output shaft of the second cylinder is connected to the connecting box and the glue coating cylinder in sequence. The electric push rod is arranged inside the connecting box. The output shaft of the electric push rod passes through the glue coating cylinder and is connected to the piston.

[0013] Preferably, a feeding port is provided on one side of the glue coating cylinder, and a discharge valve is provided at the bottom of the glue coating cylinder.

[0014] The beneficial effects of the utility model are:

[0015] 1. The circuit board is transported by a conveyor belt. When the circuit board is transported to the inside of the first frame, air is discharged downward through the fan, the three-way pipe, the first pipeline and the air outlet assembly to blow away the dust on the surface of the circuit board. The dust on the surface of the circuit board is adsorbed through the first cylinder, the lifting frame, the cleaning roller and the adsorption glue layer to achieve further dust removal effect on the circuit board, so as to avoid dust adhering to the surface of the circuit board and affecting the firmness of the adhesive layer and the circuit board.

[0016] 2. The glue-coated circuit board is transported to the inside of the third frame and ventilated to the second pipeline through the fan and the three-way pipe. The incoming wind passes through the cooling component to form cold wind, and the cold wind is output downward to cool the circuit board, so that the glue layer on the circuit board is cooled and solidified. Compared with the natural air drying method, the curing speed of the glue layer can be increased to better protect the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below, but this does not limit the protection scope of the utility model.

[0018] Figure 1 A front view of the entire device provided by the utility model;

[0019] Figure 2 A left view of the first frame and the air outlet assembly provided by the utility model;

[0020] Figure 3 A right side view of the first frame and the cleaning roller provided by the utility model;

[0021] Figure 4 The utility model provides Figure 3 A cross-sectional view of the cleaning roller at center A;

[0022] Figure 5 A side view of a second frame provided by the utility model;

[0023] Figure 6 The utility model provides Figure 5 A cross-sectional view of the middle structure;

[0024] Figure 7 This is a side view of the third frame provided by the utility model.

[0025] Among them, 1. frame; 2. conveyor belt; 3. first frame; 4. second frame; 5. third frame; 6. glue coating assembly; 61. electromagnetic slide rail; 62. sliding seat; 63. second cylinder; 64. connecting box; 65. glue coating cylinder; 66. electric push rod; 67. piston; 7. first cylinder; 8. lifting frame; 9. cleaning roller; 10. fan; 11. three-way pipe; 12. first pipeline; 13. second pipeline; 14. air outlet assembly; 141. main air outlet pipe; 142. branch air outlet pipe; 15. cooling assembly; 151. refrigerator; 152. output pipe; 153. cold air main pipe; 154. cold air branch pipe; 16. first solenoid valve; 17. second solenoid valve; 18. plug rod; 19. pull plate; 20. reset spring. DETAILED DESCRIPTION

[0026] See also Figures 1 to 7 The outer layer gluing device for circuit board processing shown in the figure includes a frame 1, a conveyor belt 2 is installed in the frame 1, a first frame 3, a second frame 4 and a third frame 5 are arranged on the top of the frame 1, a gluing component 6 is arranged inside the second frame 4, a first cylinder 7 is arranged on the top of the first frame 3, the output shaft of the first cylinder 7 passes through the first frame 3 and is connected to a lifting frame 8, a cleaning roller 9 is rotatably installed in the lifting frame 8, and an adsorption glue layer is provided on the surface of the cleaning roller 9, a fan 10 is arranged on the top of the second frame 4, the output end of the fan 10 is connected to a three-way pipe 11, and the two ends of the three-way pipe 11 are respectively connected to a first pipeline 12 and a second pipeline 13, one end of the first pipeline 12 is connected to an air outlet component 14 located inside the first frame 3, and one end of the second pipeline 13 is connected to a cooling component 15 located inside the third frame 5.

[0027] Furthermore, the air outlet assembly 14 includes an air outlet main pipe 141 and an air outlet branch pipe 142 . One end of the first pipeline 12 passes through the first frame 3 and is connected to the air outlet main pipe 141 . A plurality of equidistantly distributed air outlet branch pipes 142 are arranged at the bottom of the air outlet main pipe 141 .

[0028] The main air outlet pipe 141 and a plurality of branch air outlet pipes 142 are used to better disperse the dust on the surface of the circuit board.

[0029] Furthermore, the cooling component 15 includes a refrigerator 151, an output pipe 152, a cold air main pipe 153 and a cold air branch pipe 154. The second pipeline 13, the refrigerator 151 and the output pipe 152 are connected in sequence. One end of the output pipe 152 passes through the third frame 5 and is connected to the cold air main pipe 153. A plurality of equidistantly distributed cold air branch pipes 154 are arranged at the bottom of the cold air main pipe 153.

[0030] The refrigerator 151 is started, and the wind output from the second pipeline 13 is cooled by the refrigerator 151 to form cold wind, and passes through the cold wind main pipe 153 and a plurality of cold wind branch pipes 154 to cool down the circuit boards at different positions.

[0031] Furthermore, a first solenoid valve 16 and a second solenoid valve 17 are respectively disposed at both ends of the three-way pipe 11 .

[0032] The first solenoid valve 16 and the second solenoid valve 17 can control the connection status of the three-way pipe 11 with the first pipeline 12 and the second spiral tube 13 respectively, so as to realize the dust blowing of the circuit board before gluing or the cooling of the circuit board after gluing, so as to expand the application range of the device.

[0033] Furthermore, both ends of the lifting frame 8 are slidably penetrated by an insertion rod 18, and a pull plate 19 is provided at the opposite ends of the two insertion rods 18. A return spring 20 is provided between the pull plate 19 and the lifting frame 8, and limiting holes are provided at both ends of the cleaning roller 9 and corresponding to the insertion rods 18, and the limiting holes can be used for the insertion of the insertion rods 18.

[0034] By pulling the pull plates 19 on both sides to disengage the insertion rod 18 from the limiting holes on the cleaning roller 9, the cleaning roller 9 inside the lifting frame 8 can be removed so as to clean the cleaning roller 9 or better, for subsequent cleaning of the circuit board.

[0035] Furthermore, the glue coating assembly 6 includes an electromagnetic slide rail 61, a sliding seat 62, a second cylinder 63, a connecting box 64, a glue coating cylinder 65, an electric push rod 66 and a piston 67. The electromagnetic slide rail 61 is fixedly arranged inside the second frame 4. A sliding seat 62 is slidingly arranged on the electromagnetic slide rail 61. A second cylinder 63 is arranged at the bottom of the sliding seat 62. The output shaft of the second cylinder 63 is connected to the connecting box 64 and the glue coating cylinder 65 in sequence. The electric push rod 66 is arranged inside the connecting box 64. The output shaft of the electric push rod 66 passes through the glue coating cylinder 65 and is connected to the piston 67. A feeding port is arranged on one side of the glue coating cylinder 65, and a discharge valve is arranged at the bottom of the glue coating cylinder 65.

[0036] The glue coating raw material is added into the glue coating cylinder 65 through the feeding port, and the second cylinder 63 is started to extend its output shaft so that the bottom of the glue coating cylinder 65 is close to the position of the circuit board to be glued, and the electric push rod 66 is started and the discharge valve at the bottom of the glue coating cylinder 65 is opened, so that the circuit board can be glued. The electromagnetic slide rail 61 can drive the sliding seat 62 and the glue coating cylinder 65 below it to move in the front and rear directions to adapt to the gluing work of circuit boards in different positions.

[0037] When the utility model is used, the circuit board is placed on the conveyor belt 2 for transportation. When the circuit board is transported to the inside of the first frame 3, the fan 10 is started and ventilated to the first pipeline 12 through the three-way pipe 11. The output wind is discharged downward through the air outlet component 14, so as to blow away the dust on the surface of the circuit board. When the circuit board is transported to the bottom of the cleaning roller 9, the output shaft of the first cylinder 7 is extended to drive the lifting frame 8 and the cleaning roller 9 to move downward, so that the adsorption glue layer on the surface of the cleaning roller 9 contacts the surface of the circuit board, so as to adsorb the dust on the surface of the circuit board, and reach the circuit board. To further remove dust from the circuit board, the circuit board is then transported to the inside of the second frame 4, and the circuit board is coated with glue through the glue coating component 6. When the glued circuit board is transported to the inside of the third frame 5, it is also ventilated to the second pipeline 13 through the fan 10 and the three-way pipe 11. The incoming wind passes through the cooling component 15 to form cold wind, and the cold wind is output downward to cool the circuit board, so that the glue layer on the circuit board is cooled and solidified. Compared with the natural air drying method, the curing speed of the glue layer can be increased, so as to better protect the circuit board.

[0038] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. An outer layer glue coating device for circuit board processing, characterized in that: The machine comprises a frame, a conveyor belt is installed in the frame, a first frame, a second frame and a third frame are arranged on the top of the frame, a glue coating component is arranged inside the second frame, a first cylinder is arranged on the top of the first frame, an output shaft of the first cylinder passes through the first frame and is connected with a lifting frame, a cleaning roller is rotatably installed in the lifting frame, an adsorption glue layer is arranged on the surface of the cleaning roller, a fan is arranged on the top of the second frame, a three-way pipe is connected to the output end of the fan, the two ends of the three-way pipe are respectively connected with a first pipeline and a second pipeline, one end of the first pipeline is connected with an air outlet component located inside the first frame, and one end of the second pipeline is connected with a cooling component located inside the third frame.

2. The outer layer glue coating device for circuit board processing according to claim 1, characterized in that: The air outlet assembly includes an air outlet main pipe and an air outlet branch pipe. One end of the first pipeline passes through the first frame and is connected to the air outlet main pipe. A plurality of equidistantly distributed air outlet branch pipes are arranged at the bottom of the air outlet main pipe.

3. The outer layer glue coating device for circuit board processing according to claim 1, characterized in that: The cooling component includes a refrigerator, an output pipe, a cold air main pipe and a cold air branch pipe. The second pipeline, the refrigerator and the output pipe are connected in sequence. One end of the output pipe passes through the third frame and is connected to the cold air main pipe. A plurality of equidistantly distributed cold air branch pipes are arranged at the bottom of the cold air main pipe.

4. The outer layer glue coating device for circuit board processing according to claim 1, characterized in that: The two ends of the three-way pipe are respectively provided with a first solenoid valve and a second solenoid valve.

5. The outer layer glue coating device for circuit board processing according to claim 1, characterized in that: Insertion rods are slidably penetrated at both ends of the lifting frame, and pull plates are provided at the opposite ends of the two insertion rods. A return spring is provided between the pull plate and the lifting frame, and limiting holes are provided at both ends of the cleaning roller and corresponding to the insertion rods, and the limiting holes can be used for the insertion of the insertion rods.

6. The outer layer glue coating device for circuit board processing according to claim 1, characterized in that: The glue coating assembly includes an electromagnetic slide rail, a sliding seat, a second cylinder, a connecting box, a glue coating cylinder, an electric push rod and a piston. The electromagnetic slide rail is fixedly arranged inside the second frame. A sliding seat is slidingly arranged on the electromagnetic slide rail. A second cylinder is arranged at the bottom of the sliding seat. The output shaft of the second cylinder is connected to the connecting box and the glue coating cylinder in sequence. The electric push rod is arranged inside the connecting box. The output shaft of the electric push rod passes through the glue coating cylinder and is connected to the piston.

7. The outer layer glue coating device for circuit board processing according to claim 6, characterized in that: A feeding port is arranged on one side of the glue coating cylinder, and a discharge valve is arranged at the bottom of the glue coating cylinder.

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