Accurate flow adjusting device for electroplating
By introducing components such as cross partitions, liquid level monitors and servo motors into the electroplating device, the precise control of the flow rate of the electroplating solution in each electroplating tank is achieved, and the problem of inaccurate replenishment of electroplating solution in the prior art is solved, and the problem of inaccurate replenishment of electroplating solution in the prior art is improved. plating effect and equipment reliability.
Patent Information
- Application Number
- CN202420894483.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The existing copper ion replenishment device for electroplating is difficult to accurately control the flow of the electroplating solution in multiple electroplating tanks, resulting in a decrease in the electroplating effect and affecting the quality.
A precise flow regulation device for electroplating is designed, using components such as cross partitions, liquid level monitors, pump bodies, return pipes, servo motors and electronically controlled valves to ensure each electroplating by measuring and controlling the flow of the electroplating solution in real time. The copper ions in the tank are replenished accurately to avoid liquid level changes.
The precise control of the flow rate of the electroplating solution in the room of a single electroplating tank is achieved, the plating quality and equipment reliability are improved, and the uniform replenishment and use of the electroplating solution is ensured.
Smart Images
Figure CN222160422U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating, in particular to a precise flow regulating device for electroplating. Background Art
[0002] Electroplating is a process in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis in a plating solution containing a pre-plated metal, with the base metal to be plated as the cathode, thereby forming a coating. The coating formed can enhance the corrosion resistance of the base metal, increase hardness, prevent wear, and improve conductivity, smoothness, heat resistance and surface beauty. It has been widely used in recent years. The main components of the plating solution are main salt (providing ions of the electroplated metal), conductive salt (used to increase the conductivity of the solution), anode activator (promoting anode dissolution and increasing anode current density), buffer (regulating and controlling the pH of the solution) and some additives (improving the performance of the coating and the role of electroplating quality). As the electroplating proceeds, the ions of the electroplated metal in the main salt are continuously consumed, and the current density and electroplating effect of the plating solution are reduced, thereby affecting the electroplating effect. Therefore, it is necessary to replenish the metal ions to be plated in the plating solution in a timely manner.
[0003] After searching: the authorization announcement number is CN210104117U, which is a copper ion replenishing device for electroplating. The device includes a tank body, a centrifugal pump and a liquid storage tank. The tank body includes a number of independent tank chambers. A porous partition is provided at the bottom of the tank chamber. The bottom of the tank chamber is connected to the liquid storage tank and a flow regulating valve is provided between the two. The centrifugal pump is located between the liquid storage tank and the tank body. The output end of the centrifugal pump is connected to a plurality of delivery pipelines, each delivery pipeline corresponds to a tank chamber, and is used to deliver electroplating liquid to the tank chamber. A valve is provided at the output end of each delivery pipeline.
[0004] However, the copper ion replenishing device for electroplating mentioned above still has some shortcomings. It uses a flow control valve to perform overall regulation of the flow rate of the plating solution in multiple electroplating tank chambers, which is inconvenient for single precise regulation, thereby reducing the precise regulation of the amount of copper dissolved in the plating solution in a single electroplating tank chamber, thereby affecting the quality of electroplating. Therefore, we propose a precise flow control device for electroplating to solve the above problems. Utility Model Content
[0005] The utility model aims to solve the above-mentioned shortcomings and proposes a precise flow regulating device for electroplating.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A precise flow regulating device for electroplating, comprising an electroplating pool and an electroplating liquid tank, wherein a cross partition is fixedly connected in the electroplating pool, two liquid level monitors are fixedly connected on both sides of the electroplating pool, a single electroplating tank chamber copper ion replenishing mechanism is arranged between the electroplating pool and the cross partition electroplating liquid tank, the single electroplating tank chamber copper ion replenishing mechanism comprises a pump body fixedly connected to the top of the electroplating liquid tank and four reflux pipes fixedly connected to the bottom of the electroplating pool, four conveying electric control valves are fixedly connected to the top of the pump body, the four reflux pipes are all connected to the bottom of one side of the electroplating liquid tank, and a single electroplating tank chamber precise flow regulating component is arranged on the reflux pipe.
[0008] Preferably, the single electroplating tank chamber precise flow control component includes a flow meter arranged on the reflux pipe and a control plate fixedly mounted on the outside of the reflux pipe, a servo motor is fixedly connected to one side of the control plate, a driving shaft is fixedly connected to the output shaft of the servo motor, a driving tooth is fixedly connected to one end of the driving shaft, two horizontal screw rods are rotatably connected to the inner walls on both sides of the control plate, driven teeth are fixedly mounted on the outer sides of the two horizontal screw rods, the driving tooth is meshed with the two driven teeth, the outer sides of the two horizontal screw rods are threadedly mounted with the same movable plate, a gate plate is fixedly connected to one side of the movable plate, and the gate plate is slidably mounted in the reflux pipe.
[0009] Preferably, an opening is provided on one side of the reflux pipe, and the gate plate is slidably sleeved in the opening.
[0010] Preferably, the movable plate is slidably sleeved in the regulating plate.
[0011] Preferably, the top of the pump body is fixedly connected to a liquid supply pipe, the top of the liquid supply pipe is fixedly connected to a transverse pipe, one side of the transverse pipe is fixedly connected to two liquid outlet pipes, and four delivery electronically controlled valves are respectively fixedly connected to the bottom of the corresponding liquid outlet pipes.
[0012] Preferably, four electroplating tanks are formed between the cross partition and the electroplating pool.
[0013] Preferably, the four conveying electronically controlled valves correspond to the corresponding electroplating tanks, respectively, the four reflux pipes correspond to the corresponding electroplating tanks, respectively, and the four liquid level monitors correspond to the corresponding electroplating tanks, respectively.
[0014] Preferably, a liquid inlet pipe is fixedly connected to the bottom of one side of the electroplating liquid tank, one end of the liquid inlet pipe is fixedly connected to a main pipe, one end of the main pipe is fixedly connected to two branch pipes, and four reflux pipes are respectively fixedly connected to the top of the corresponding branch pipes.
[0015] In the utility model, the precise flow regulating device for electroplating, when it is necessary to supplement copper ions in the corresponding electroplating tank, opens the corresponding conveying electric control valve, passes the electroplating liquid in the electroplating liquid tank to the corresponding electroplating tank through the pump body, and measures the flow of the outflowing electroplating liquid through the flow meter according to the real-time feedback of the liquid level in the electroplating tank by the liquid level monitor. When it is too fast or too slow, the servo motor is started, and the servo motor drives the rotation of the driving shaft and the active gear, and the active gear drives the synchronous rotation of the two driven gears and the horizontal screw rod, and the two horizontal screw rods drive the moving plate and the gate plate to move horizontally in the reflux pipe, thereby adjusting the cross-sectional area of the effective electroplating liquid, so that the flow of the electroplating liquid is appropriate, and the liquid level is prevented from moving down or up due to too fast or too slow flow;
[0016] In the utility model, the precise flow regulating device for electroplating can individually control the flow of the electroplating solution in a single electroplating tank, thereby avoiding the change of the liquid level in the electroplating tank caused by the different use of the electroplating solution in each electroplating tank. The electroplating solution after replenishing copper ions flows from the reflux pipe, the branch pipe, the main pipe and the liquid inlet pipe into the electroplating liquid tank for electroplating.
[0017] The utility model has a reasonable structural design and can individually control the flow rate of the electroplating solution in a single electroplating tank, thereby avoiding changes in the liquid level in the electroplating tank caused by different use of the electroplating solution in each electroplating tank, and further can accurately control the amount of copper dissolved in the electroplating solution in a single electroplating tank, thereby improving the quality of electroplating and having high reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the structure of a precise flow regulating device for electroplating proposed by the utility model;
[0019] Figure 2 This is a partial stereoscopic diagram of a precise flow regulating device for electroplating proposed by the utility model;
[0020] Figure 3 A three-dimensional diagram of a single electroplating tank chamber precise flow control component of a precise flow control device for electroplating proposed by the utility model;
[0021] Figure 4 This is a schematic structural diagram of part A of a precise flow regulating device for electroplating proposed by the utility model.
[0022] In the figure: 1. electroplating tank; 2. liquid level monitor; 3. cross partition; 4. electroplating liquid tank; 5. pump body; 6. liquid supply pipe; 7. cross pipe; 8. liquid outlet pipe; 9. conveying electronic control valve; 10. reflux pipe; 11. regulating board; 12. flow meter; 13. branch pipe; 14. main pipeline; 15. liquid inlet pipe; 16. driving shaft; 17. servo motor; 18. driving gear; 19. driven gear; 20. cross screw; 21. moving plate; 22. gate. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0024] Reference Figure 1-4 A precise flow regulating device for electroplating comprises an electroplating pool 1 and an electroplating liquid tank 4, wherein a cross partition 3 is fixedly connected in the electroplating pool 1, and two liquid level monitors 2 are fixedly connected on both sides of the electroplating pool 1, and a single electroplating tank chamber copper ion replenishing mechanism is arranged between the electroplating pool 1, the cross partition 3 and the electroplating liquid tank 4, and the single electroplating tank chamber copper ion replenishing mechanism comprises a pump body 5 fixedly connected to the top of the electroplating liquid tank 4 and four reflux pipes 10 fixedly connected to the bottom of the electroplating pool 1, and four conveying electric control valves 9 are fixedly connected to the top of the pump body 5, and the four reflux pipes 10 are all connected to the bottom of one side of the electroplating liquid tank 4, and a single electroplating tank chamber precise flow regulating component is arranged on the reflux pipe 10.
[0025] In the utility model, a single electroplating tank chamber precise flow control component includes a flow meter 12 arranged on a reflux pipe 10 and a control plate 11 fixedly sleeved on the outside of the reflux pipe 10, a servo motor 17 is fixedly connected to one side of the control plate 11, a drive shaft 16 is fixedly connected to the output shaft of the servo motor 17, and an active tooth 18 is fixedly connected to one end of the drive shaft 16, two cross screws 20 are rotatably connected to the inner walls on both sides of the control plate 11, the outer sides of the two cross screws 20 are fixedly sleeved with driven teeth 19, the active teeth 18 are meshed with the two driven teeth 19, the outer sides of the two cross screws 20 are threadedly sleeved with the same moving plate 21, one side of the moving plate 21 is fixedly connected with a gate plate 22, and the gate plate 22 is slidably sleeved in the reflux pipe 10.
[0026] The working principle is as follows: when it is necessary to add copper ions to the corresponding electroplating tank, the corresponding delivery electronic control valve 9 is opened, and the electroplating liquid in the electroplating liquid tank 4 is passed to the corresponding electroplating tank through the pump body 5. According to the real-time feedback of the liquid level in the electroplating tank by the liquid level monitor 2, the flow rate of the outflowing electroplating liquid can be measured by the flow meter 12. When it is too fast or too slow, the servo motor 17 is started, and the servo motor 17 drives the rotation of the driving shaft 16 and the active gear 18, and the active gear 18 drives the two driven gears 19 and the horizontal screw rod. 20 rotates synchronously, and the two horizontal screws 20 drive the movable plate 21 and the gate plate 22 to move horizontally in the reflux pipe 10, so as to adjust the cross-sectional area of the effective electroplating solution, so that the flow rate of the electroplating solution is appropriate, and the flow rate of the electroplating solution in a single electroplating tank is avoided to avoid the change of the liquid level in the electroplating tank due to the different use of the electroplating solution in each electroplating tank. The electroplating solution after replenishing copper ions flows back into the electroplating solution tank 4 for electroplating.
[0027] In the utility model, an opening is provided on one side of the reflux pipe 10, the movable plate 21 is slidably sleeved in the regulating plate 11, and the gate plate 22 is slidably sleeved in the opening, which can guide the gate plate 22 and the movable plate 21 to make their movement more stable.
[0028] In the utility model, the top of the pump body 5 is fixedly connected to a liquid supply pipe 6, the top of the liquid supply pipe 6 is fixedly connected to a transverse pipe 7, one side of the transverse pipe 7 is fixedly connected to two liquid outlet pipes 8, and four conveying electric control valves 9 are respectively fixedly connected to the bottom of the corresponding liquid outlet pipes 8, which is beneficial to conveying the plating liquid in the plating liquid box 4 to the corresponding plating tank through the pump body 5.
[0029] In the utility model, four electroplating tanks are formed between the cross partition 3 and the electroplating pool 1, four conveying electric control valves 9 correspond to the corresponding electroplating tanks, four reflux pipes 10 correspond to the corresponding electroplating tanks, and four liquid level monitors 2 correspond to the corresponding electroplating tanks, so that copper ions can be added to the four electroplating tanks separately, the liquid level can be monitored separately, and the electroplating liquid can be discharged separately.
[0030] In the utility model, a liquid inlet pipe 15 is fixedly connected to the bottom of one side of the electroplating liquid tank 4, one end of the liquid inlet pipe 15 is fixedly connected to the main pipeline 14, one end of the main pipeline 14 is fixedly connected to two branch pipes 13, and four reflux pipes 10 are respectively fixedly connected to the top of the corresponding branch pipes 13. The electroplating liquid after replenishing copper ions flows back into the electroplating liquid tank 4 from the reflux pipe 10, the branch pipe 13, the main pipeline 14 and the liquid inlet pipe 15 for electroplating.
[0031] In the utility model, when it is necessary to supplement copper ions in the corresponding electroplating tank, the corresponding delivery electronic control valve 9 is opened, and the electroplating liquid in the electroplating liquid tank 4 is passed to the corresponding electroplating tank through the pump body 5. According to the real-time feedback of the liquid level in the electroplating tank by the liquid level monitor 2, the flow rate of the outflowing electroplating liquid can be measured by the flow meter 12. When it is too fast or too slow, the servo motor 17 is started, and the servo motor 17 drives the rotation of the driving shaft 16 and the active gear 18. The active gear 18 drives the synchronous rotation of the two driven teeth 19 and the horizontal screw rod 20. The two horizontal The screw rod 20 drives the movable plate 21 and the gate plate 22 to move horizontally in the reflux pipe 10, thereby adjusting the cross-sectional area of the effective electroplating liquid so that the flow rate of the electroplating liquid is appropriate, avoiding the liquid level from moving down or up due to too fast or too slow flow, and thus the flow rate of the electroplating liquid in a single electroplating tank can be controlled individually to avoid the change of the liquid level in the electroplating tank due to the different use of the electroplating liquid in each electroplating tank. The electroplating liquid after replenishing copper ions flows back into the electroplating liquid tank 4 from the reflux pipe 10, the branch pipe 13, the main pipe 14 and the liquid inlet pipe 15 for electroplating.
[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A precise flow control device for electroplating, characterized in that: The invention comprises an electroplating tank (1) and an electroplating liquid tank (4), wherein a cross partition (3) is fixedly connected inside the electroplating tank (1), and two liquid level monitors (2) are fixedly connected on both sides of the electroplating tank (1). A single electroplating tank chamber copper ion replenishing mechanism is arranged between the electroplating tank (1), the cross partition (3) and the electroplating liquid tank (4), and the single electroplating tank chamber copper ion replenishing mechanism comprises a pump body (5) fixedly connected to the top of the electroplating liquid tank (4) and four reflux pipes (10) fixedly connected to the bottom of the electroplating tank (1), and the top of the pump body (5) is fixedly connected to four conveying electric control valves (9), and the four reflux pipes (10) are all connected to the bottom of one side of the electroplating liquid tank (4), and a single electroplating tank chamber precise flow control component is arranged on the reflux pipe (10).
2. The precise flow rate regulating device for electroplating according to claim 1, characterized in that: The single electroplating tank chamber precise flow control component comprises a flow meter (12) arranged on a reflux pipe (10) and a control plate (11) fixedly sleeved on the outer side of the reflux pipe (10); a servo motor (17) is fixedly connected to one side of the control plate (11); a drive shaft (16) is fixedly connected to the output shaft of the servo motor (17); one end of the drive shaft (16) is fixedly connected to a driving tooth (18); two transverse screw rods (20) are rotatably connected to the inner walls on both sides of the control plate (11); driven teeth (19) are fixedly sleeved on the outer sides of the two transverse screw rods (20); the driving teeth (18) mesh with the two driven teeth (19); the outer sides of the two transverse screw rods (20) are threadedly sleeved with the same movable plate (21); a gate plate (22) is fixedly connected to one side of the movable plate (21); the gate plate (22) is slidably sleeved in the reflux pipe (10).
3. The precise flow rate regulating device for electroplating according to claim 2, characterized in that: An opening is provided on one side of the return pipe (10), and the gate plate (22) is slidably sleeved in the opening.
4. The precise flow rate regulating device for electroplating according to claim 2, characterized in that: The movable plate (21) is slidably sleeved in the regulating plate (11).
5. The precise flow rate regulating device for electroplating according to claim 1, characterized in that: The top of the pump body (5) is fixedly connected to a liquid supply pipe (6), the top of the liquid supply pipe (6) is fixedly connected to a transverse pipe (7), one side of the transverse pipe (7) is fixedly connected to two liquid outlet pipes (8), and four conveying electric control valves (9) are respectively fixedly connected to the bottom of the corresponding liquid outlet pipes (8).
6. The precise flow rate regulating device for electroplating according to claim 1, characterized in that: Four electroplating tanks are formed between the cross partition (3) and the electroplating pool (1).
7. The precise flow rate regulating device for electroplating according to claim 6, characterized in that: The four conveying electric control valves (9) correspond to the corresponding electroplating tanks respectively, the four reflux pipes (10) correspond to the corresponding electroplating tanks respectively, and the four liquid level monitors (2) correspond to the corresponding electroplating tanks respectively.
8. The precise flow rate regulating device for electroplating according to claim 1, characterized in that: A liquid inlet pipe (15) is fixedly connected to the bottom of one side of the electroplating liquid tank (4), one end of the liquid inlet pipe (15) is fixedly connected to a main pipe (14), one end of the main pipe (14) is fixedly connected to two branch pipes (13), and four return pipes (10) are respectively fixedly connected to the top of the corresponding branch pipes (13).