Exposure platform and exposure equipment with same

Abstract

The utility model relates to an exposure platform and exposure equipment with the same, the exposure platform comprises a base station and a cooling device, the base station comprises a vacuum adsorption area, a PCB (Printed Circuit Board) to be exposed is placed in the vacuum adsorption area, and the cooling device is used for cooling the base station when the PCB is exposed; the cooling device comprises a heat exchange pipe installed on the bottom side of the base table, and cooling water circulates in the heat exchange pipe. Due to the fact that the specific heat capacity of water is large, when the PCB is exposed, cooling water circulating in the heat exchange tubes can rapidly absorb heat of the base and the PCB, the base and the PCB are rapidly cooled, the temperature of the base and the temperature of the PCB are controlled within the set temperature range, and the problem that the exposure reject ratio is increased due to the fact that the temperature of the PCB is too high is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of exposure, in particular to an exposure platform and exposure equipment having the same. Background Art

[0002] With the development of electronic technology, the application of circuit boards (PCB, Printed Circuit Board, printed circuit board, etc.) is becoming more and more extensive, and the technical requirements for their processing and manufacturing are becoming higher and higher.

[0003] In the existing PCB board processing technology, the PCB board must undergo a high-temperature baking process before the exposure process to ensure that the ink on the PCB board is exposed in a dry state. However, when the production capacity demand is high, the PCB board is left to air for a short time after high-temperature baking. The temperature of the PCB board itself is still very high during exposure, causing the ink on the PCB board to adhere to the exposure platform, affecting the exposure accuracy and product quality, thereby increasing the defect rate of the exposure process. Utility Model Content

[0004] In order to solve the above problems, the utility model provides an exposure platform and an exposure device having the same.

[0005] The utility model provides an exposure platform, which comprises: a base, the base comprises a vacuum adsorption area, and a PCB plate to be exposed is placed in the vacuum adsorption area; a cooling device, which is used to cool the base when the PCB plate is exposed; the cooling device comprises a heat exchange tube installed on the bottom side of the base, and cooling water flows in the heat exchange tube.

[0006] As a further improvement of the present invention, the heat exchange tube is arranged corresponding to the vacuum adsorption area, and the heat exchange tube is bent and arranged on the bottom side of the base.

[0007] As a further improvement of the present invention, the cooling device includes a cover plate for shielding the heat exchange tube, and the cover plate is threadedly connected to the bottom side of the base.

[0008] As a further improvement of the present invention, a receiving groove for receiving the heat exchange tube is concavely formed on the bottom side of the base, and the cover plate closes the receiving groove.

[0009] As a further improvement of the present invention, the heat exchange tube is bonded to the bottom side of the base by resin potting.

[0010] As a further improvement of the utility model, the heat exchange tube is a copper tube or a stainless steel tube, and the cooling device also includes a water cooler for supplying cooling distilled water to the heat exchange tube, and the water cooler is provided with a temperature regulating device, a filtering device and a flow control device.

[0011] As a further improvement of the present invention, the water cooler includes a water outlet and a water return end, the heat exchange tube includes a water inlet and a water outlet, and the cooling device includes a first connecting pipe connecting the water outlet and the water inlet, and a second connecting pipe connecting the water return end and the water outlet.

[0012] As a further improvement of the present invention, the cooling device also includes a first joint connecting the first connecting pipe and the heat exchange pipe, and a second joint connecting the second connecting pipe and the heat exchange pipe. The first joint and the second joint can be detachably connected to the bottom side of the base.

[0013] As a further improvement of the present invention, the exposure platform further includes an anti-sticking pad arranged on the upper side of the vacuum adsorption area.

[0014] Another aspect of the present invention provides an exposure device, wherein the exposure platform described in any one of the above technical solutions is arranged in the exposure device.

[0015] Compared with the prior art, the exposure platform of the utility model is provided with a cooling device, which specifically includes a heat exchange tube installed on the bottom side of the base, and cooling water flows in the heat exchange tube. Since the specific heat capacity of water is large, when the PCB board is exposed, the cooling water flowing in the heat exchange tube can quickly absorb the heat of the base and the PCB board, so that the base and the PCB board are quickly cooled, thereby controlling the temperature of the base and the PCB board within the set temperature range, solving the problem of increased exposure defect rate caused by excessively high temperature of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is an exploded schematic diagram of the exposure platform;

[0017] Figure 2 yes Figure 1 Schematic diagram of another perspective of the medium exposure platform;

[0018] Figure 3 yes Figure 1 A schematic diagram of the structure of the bottom of the middle exposure platform;

[0019] Figure 4 yes Figure 3 Bottom view of the exposure platform. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention is described below by means of specific embodiments shown in the accompanying drawings.

[0021] See also Figures 1 to 4As shown, the utility model provides an exposure platform, the exposure platform includes a base 1 and a cooling device 2, wherein the base 1 includes a vacuum adsorption area, and the PCB board 3 to be exposed is placed in the vacuum adsorption area. The cooling device 2 is used to cool the base 1 when the PCB board 3 is exposed. Specifically, the cooling device 2 includes a heat exchange tube 21 installed on the bottom side of the base 1, and cooling water flows in the heat exchange tube 21. Since the specific heat capacity of water is large, when the PCB board 3 is exposed, the cooling water flowing in the heat exchange tube 21 can quickly absorb the heat of the base 1 and the PCB board 3, so that the base 1 and the PCB board 3 are quickly cooled, and the temperature of the base 1 and the PCB board 3 is controlled within a set temperature range, thereby solving the problem of an increase in the exposure defect rate due to the excessive temperature of the PCB board 3. In addition, the cooling device 2 can improve the stability of the exposure platform and improve the compatibility of the exposure platform with ink models.

[0022] It is understandable that the vacuum adsorption area can be set in the central area of ​​the base 1 or the entire area of ​​the base 1, and the area of ​​the vacuum adsorption area is not less than the area of ​​the PCB board 3 to be exposed. When the exposure platform exposes PCB boards 3 of various sizes, the vacuum adsorption area of ​​the base 1 is not less than the area of ​​the PCB board 3 of the largest size. The vacuum adsorption area of ​​the base 1 is connected to the vacuum generating device, so that the PCB board 3 is adsorbed on the surface of the base 1, ensuring the accuracy of the position of the PCB board 3 after alignment during the exposure process. In a specific embodiment of the utility model, a vacuum adapter box 4 is set on the bottom side of the base 1, and the vacuum generator and the vacuum adsorption area are connected through the vacuum adapter box 4.

[0023] In the present utility model, the heat exchange tube 21 can be multi-segment or integrated. In a specific embodiment, the heat exchange tube 21 is arranged corresponding to the vacuum adsorption area, so that the cooling water in the heat exchange tube 21 directly cools the PCB board 3 placed in the vacuum adsorption area. At the same time, the heat exchange tube 21 is bent and arranged on the bottom side of the base 1, which increases the contact area between the heat exchange tube 21 and the vacuum adsorption area of ​​the base 1, speeds up the speed at which the cooling device 2 absorbs the heat of the base 1 and the PCB board 3, and also makes the base 1 and the PCB board 3 cool more evenly, thereby solving the problem of increased exposure failure rate due to excessive temperature of the PCB board 3, and increasing the stability of the exposure platform operation. It can be understood that the bending arrangement of the heat exchange tube 21 is not limited, such as "U" shape, "snake" shape, "circle" shape maze and the like.

[0024] In the utility model, the heat exchange tube 21 can be connected to the base 1 in various ways. In the present embodiment, the cooling device 2 includes a cover plate 22 for shielding the heat exchange tube 21, and the cover plate 22 is threadedly connected to the bottom side of the base 1. The cover plate 22 is provided so that the heat exchange tube 21 can be detachably connected to the bottom side of the base 1, which is convenient for the later replacement or maintenance of the heat exchange tube 21. At the same time, the cover plate 22 can also play a role in protecting the heat exchange tube 21. It can be understood that the cover plate 22 can be multi-section or integrated, and the cover plate 22 is arranged along the arrangement direction of the heat exchange tube 21. After the cover plate 22 is connected to the bottom side of the base 1, a storage space for accommodating water pipes is formed between the cover plate 22 and the base 1.

[0025] Further, the bottom side of the base 1 is concavely provided with a receiving groove 12 for accommodating the heat exchange tube 21. After the heat exchange tube 21 is installed in the receiving groove 12, the cover plate 22 is buckled on the bottom side of the base 1 to close the receiving groove 12, and the heat exchange tube 21 is detachably connected to the base 1 by screws. Specifically, the cover plate 22 can be in the shape of a flat plate. The receiving groove 12 is provided on the base 1, which can effectively shorten the heat absorption path of the cooling water in the heat exchange tube 21, so that the base 1 and the PCB board 3 can be cooled quickly. In addition, for an exposure platform where it is not convenient to groove the base 1, the cover plate 22 can be set to an arc shape, and the arc space of the cover plate 22 forms the receiving groove 12 for accommodating the heat exchange tube 21. Of course, it can be understood that the setting method of the cover plate 22 is not limited to this, and the method of forming a receiving space between the cover plate 22 and the bottom side of the base 1 is a feasible solution of the utility model.

[0026] In another specific embodiment of the present invention, the heat exchange tube 21 is connected to the bottom side of the base 1 by bonding, which can avoid water seepage at the pipe connection of the heat exchange tube 21. Specifically, the heat exchange tube 21 can be fixedly connected to the bottom side of the base 1 by resin potting bonding. The bonding connection method is more suitable for application scenarios where the heat exchange tube 21 is arranged in multiple sections or the heat exchange tube 21 does not need to be frequently disassembled.

[0027] In a specific embodiment of the present invention, the heat exchange tube 21 is a copper tube or a stainless steel tube, so as to accelerate the speed at which the cooling water in the heat exchange tube 21 absorbs the heat of the base 1 and the PCB board 3, so that the base 1 and the PCB board 3 are quickly cooled, and the temperature of the base 1 and the PCB board 3 is controlled within a set temperature range, thereby solving the problem of increased exposure failure rate caused by excessive temperature of the PCB board 3. Of course, it is understandable that the heat exchange tube 21 can also be made of other metal materials with high thermal conductivity.

[0028] Furthermore, the cooling device 2 also includes a water cooler for supplying cooling distilled water to the heat exchange tube 21, and the water cooler provides distilled water to the metal heat exchange tube 21. Specifically, a filtering device is provided in the water cooler to ensure that the distilled water flowing in the heat exchange tube 21 is free of impurities, thereby avoiding the problem of the heat exchange tube 21 being blocked due to accumulated impurities, and also avoiding the problem of the heat exchange tube 21 being damaged by chemical reaction with impurities. In addition, the water cooler in this embodiment is provided with a temperature regulating device and a flow control device, so as to control the cooling temperature and flow size of the distilled water supplied by the water cooler, and to adjust the temperature and flow of the distilled water in the heat exchange tube 21.

[0029] Specifically, the water cooler includes a water outlet and a water return end, the heat exchange tube 21 includes a water inlet and a water outlet, and the cooling device 2 includes a first connecting tube 23 and a second connecting tube 24, the first connecting tube 23 connects the water outlet and the water inlet, and the second connecting tube 24 connects the water return and the water outlet, and the water cooler and the heat exchange tube 21 are connected through the first connecting tube 23 and the second connecting tube 24, and the cooling water in the water cooler is continuously provided to the heat exchange tube 21, so as to cool the base 1 and the PCB board 3, and avoid poor exposure caused by the ink of the PCB board 3 adhering to the exposure platform. In this embodiment, the first connecting tube 23 and the second connecting tube 24 are both set as metal pipes.

[0030] Furthermore, the cooling device 2 also includes a first joint 25 and a second joint 26, and the first joint 25 is used to connect the first connecting pipe 23 and the heat exchange pipe 21, and the second joint 26 is used to connect the second connecting pipe 24 and the heat exchange pipe 21. It can be understood that the heat exchange pipe 21 is arranged near the bottom side of the base 1. In order to achieve connection with the water outlet and return ends of the water cooler, the first connecting pipe 23 and the second connecting pipe 24 are usually arranged in an extension direction that is different from the water inlet and outlet of the heat exchange pipe 21. Therefore, the first joint 25 and the second joint 26 can easily connect the heat exchange pipe 21 with the first connecting pipe 23 and the second connecting pipe 24 with different extension directions or heights.

[0031] In a specific embodiment of the utility model, the working process of the cooling device 2 is as follows: the water chiller passes the cooled distilled water through the flow meter and then flows to the first connecting pipe 23 through the water outlet, and then injects the cooled distilled water in the pipeline into the copper heat exchange tube 21 in the base 1 through the first joint 25. The cooled distilled water takes away the heat in the vacuum adsorption area during the process of flowing through the heat exchange tube, and then the distilled water after heat exchange flows through the water outlet and the second joint 26 in turn and flows into the second connecting pipe 24, and finally flows into the water chiller through the return water end, thereby forming a closed-loop cooling system. The specific flow direction of distilled water can be referred to Figure 3 shown.

[0032] The overall flatness and smoothness of the base 1 of the exposure platform of the utility model are relatively high, reaching the micron level, so that the anti-sticking effect is better, and it can meet the industry's micron and sub-micron level circuit board production needs. The surface of the vacuum adsorption area of ​​the base 1 is provided with hundreds of square boss supports, which greatly improves the response time of vacuuming and breaking the vacuum of the base 1, shortens the exposure cycle, and improves the production capacity of the exposure platform.

[0033] The exposure platform also includes an anti-sticking pad 5 arranged on the upper side of the vacuum adsorption area, so that the exposure platform is not easy to stick to the ink of the PCB board 3. The utility model effectively prevents the ink of the PCB board 3 from sticking to the exposure platform through the cooperation of the anti-sticking pad 5 and the cooling device 2, thereby avoiding poor exposure caused by the ink of the PCB board 3 sticking to the exposure platform.

[0034] The utility model also provides an exposure device, which includes an exposure platform for exposing a PCB board. The specific structure of the exposure platform is as described above and will not be repeated here. When the exposure device of the utility model is exposed, the cooling water flowing in the heat exchange tube 21 can quickly absorb the heat of the base 1 and the PCB board 3, so that the base 1 and the PCB board 3 are quickly cooled, and the temperature of the base 1 and the PCB board 3 is controlled within a set temperature range, thereby solving the problem of an increase in the exposure defect rate due to the excessive temperature of the PCB board 3. In addition, the cooling device 2 can improve the stability of the exposure platform and improve the compatibility of the exposure platform with the ink model. It can be understood that, except for the exposure platform, the other structures of the exposure device can use the structures in the prior art and will not be repeated here.

[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. An exposure platform, characterized in that: The exposure platform comprises: A base, the base comprising a vacuum adsorption area, and the PCB plate to be exposed is placed in the vacuum adsorption area; A cooling device, used to cool the base when the PCB plate is exposed; The temperature-lowering device includes a heat exchange tube installed on the bottom side of the base, and cooling water flows in the heat exchange tube.

2. The exposure platform according to claim 1, characterized in that: The heat exchange tube is arranged corresponding to the vacuum adsorption area, and the heat exchange tube is bent and arranged on the bottom side of the base.

3. The exposure platform according to claim 1, characterized in that: The cooling device comprises a cover plate for shielding the heat exchange tube, and the cover plate is threadedly connected to the bottom side of the base.

4. The exposure platform according to claim 3, characterized in that: A receiving groove for receiving the heat exchange tube is concavely formed on the bottom side of the base, and the cover plate closes the receiving groove.

5. The exposure platform according to claim 1, characterized in that: The heat exchange tube is bonded to the bottom side of the base by resin potting.

6. The exposure platform according to claim 1, characterized in that: The heat exchange tube is a copper tube or a stainless steel tube, and the cooling device also includes a water cooler for supplying cooling distilled water to the heat exchange tube. The water cooler is provided with a temperature regulating device, a filtering device and a flow control device.

7. The exposure platform according to claim 6, characterized in that: The water cooler includes a water outlet and a water return end, the heat exchange tube includes a water inlet and a water outlet, and the cooling device includes a first connecting pipe connecting the water outlet and the water inlet, and a second connecting pipe connecting the water return end and the water outlet.

8. The exposure platform according to claim 7, characterized in that: The cooling device also includes a first joint connecting the first connecting pipe and the heat exchange pipe, and a second joint connecting the second connecting pipe and the heat exchange pipe. Both the first joint and the second joint can be detachably connected to the bottom side of the base.

9. The exposure platform according to claim 1, characterized in that: The exposure platform also includes an anti-sticking pad arranged on the upper side of the vacuum adsorption area.

10. An exposure device, characterized in that: The exposure device is provided with an exposure platform as described in any one of claims 1 to 9.

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