Stamping die of flexible circuit board

Abstract

The utility model discloses a stamping die for a flexible circuit board. The stamping die comprises an upper die assembly, a lower die assembly, a guide assembly, a material stacking guide block and a blanking conveying mechanism, the upper die assembly comprises an upper die base, a fixing plate, a material pressing plate, a spring, a first guide column and a punching head. The lower die assembly comprises a lower die base and a bottom plate, the material stacking guide block is arranged at the bottom of a punched hole of the lower die base, and a material sliding groove is formed in the side wall of the material stacking guide block. According to the utility model, the material stacking guide block is arranged at the bottom of the lower die assembly, and the material sliding groove is formed in the side wall of the material stacking guide block, so that when the die is used for stamping, the flexible circuit board formed by stamping can be stacked, blanked and arranged under the guide action of the material sliding groove, and the influence on the subsequent processing of the flexible circuit board due to disordered stacking of products is avoided; the blanking conveying mechanism is arranged below the material stacking guide block, and the blanking conveying mechanism can realize automatic blanking conveying of the flexible circuit board, so that manual operation is reduced, and the production efficiency of the flexible circuit board is effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of stamping dies, in particular to a stamping die for a flexible circuit board. Background Art

[0002] Flexible printed circuit board (FPCB) is a printed circuit made of flexible insulating substrate, which has many advantages that rigid printed circuit boards do not have. For example, it can be bent, rolled, folded freely, can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection; the use of flexible printed circuit boards can greatly reduce the size of electronic products, which meets the needs of the development of electronic products towards high density, miniaturization and high reliability.

[0003] In the prior art, in the production process of flexible circuit boards, it is necessary to use a stamping die to stamp the circuit board substrate to obtain a flexible circuit board of a specific shape. However, after the stamping die has stamped the circuit board substrate, the molded products obtained are difficult to be neatly stacked and taken out, and workers are required to manually stack and arrange them, which is time-consuming and labor-intensive, thereby affecting the production efficiency of the flexible circuit boards.

[0004] Therefore, the prior art has defects and needs to be improved. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a stamping die for a flexible circuit board which can automatically stack and unload materials and improve production efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solution: a stamping die for a flexible circuit board, comprising an upper die assembly, a lower die assembly, a guide assembly and a stacking guide block;

[0007] The upper mold assembly is located on the top of the lower mold assembly, and the guide assembly is arranged between the upper mold assembly and the lower mold assembly to guide and position the upper mold assembly;

[0008] The upper die assembly comprises an upper die seat, a fixing plate, a pressing plate, a spring, a first guide column and a punching head;

[0009] The fixing plate is arranged at the bottom of the upper die seat, the top of the punch head is arranged on the fixing plate, the pressing plate is arranged below the fixing plate, the spring is arranged between the fixing plate and the pressing plate, and the spring is used to apply a downward elastic force to the pressing plate;

[0010] The pressing plate is provided with a punching avoidance hole for the punching head to pass through up and down;

[0011] The bottom of the first guide column is threadedly connected to the pressing plate, and the fixing plate is provided with a first guide hole for the first guide column to slide up and down;

[0012] The lower die assembly comprises a lower die seat and a bottom plate, wherein the lower die seat is arranged on the top of the bottom plate, and the lower die seat and the bottom plate are provided with punching holes of the same shape as the punching head, wherein the punching holes are used to guide and adapt the punching head to punch and move along the hole direction inside the punching holes;

[0013] Guide pulleys are provided on the lower die base on both sides of the punching hole, and the guide pulleys are used to guide and transport the circuit board substrate to be stamped and formed. The stacking guide block is arranged at the bottom of the punching hole, and the side wall of the stacking guide block is provided with a sliding groove, and the sliding groove is used to guide the stacked flexible circuit board falling from the punching hole.

[0014] By adopting the above technical solution, in the stamping die of the flexible circuit board, the stamping head is in a convex shape, the number of the stamping heads is two, and the two stamping heads are arranged opposite to each other.

[0015] By adopting the above-mentioned technical solutions, in the stamping die of the flexible circuit board, a drilling cone head is provided at the bottom of the stamping head, and the drilling cone head is used to drill holes on the surface of the flexible circuit board.

[0016] By adopting the above-mentioned technical solutions, the stamping die of the flexible circuit board also includes a material unloading and conveying mechanism, which is arranged below the stacking guide block to be used for unloading and conveying the stacked flexible circuit boards in the stacking guide block.

[0017] By adopting the above-mentioned technical solutions, in the stamping die of the flexible circuit board, the material unloading and conveying mechanism includes a material moving plate, a slide rail, a screw rod, a threaded seat and a driving motor;

[0018] The material moving plate is located below the stacking guide block, the slide rail is extended along the first direction, and the bottom of the material moving plate is slidably connected to the slide rail via a slider;

[0019] The end of the material moving plate is connected to the threaded seat, and the threaded seat is sleeved on the screw rod. The output shaft of the driving motor is connected to the screw rod to drive the screw rod to rotate. The threaded seat pushes the material moving plate to move along the slide rail as the screw rod rotates.

[0020] By adopting the above-mentioned technical solutions, in the stamping die of the flexible circuit board, a gap is provided between the stacking guide block and the material moving plate.

[0021] By adopting the above-mentioned technical solutions, in the stamping die of the flexible circuit board, a pulley avoidance hole is provided at the bottom of the pressing plate, and the pulley avoidance hole is used to accommodate the top of the guide pulley.

[0022] By adopting the above-mentioned technical solutions, in the stamping die of the flexible circuit board, the guide assembly includes four second guide pillars;

[0023] The tops of the four second guide pillars are respectively connected to the corners of the fixed plate, and the lower die base is provided with second guide holes for the second guide pillars to slide up and down;

[0024] The pressing plate is sleeved on the second guide post, and the pressing plate can slide up and down along the length direction of the second guide post.

[0025] Compared with the prior art, the utility model has the following beneficial effects:

[0026] The utility model provides a stacking guide block at the bottom of the lower die assembly, and a sliding groove is provided on the side wall of the stacking guide block. When the mold is stamping, the flexible circuit board to be stamped can be arranged in layers under the guidance of the sliding groove, so as to avoid disorderly accumulation of products and affect the subsequent processing of the flexible circuit board; by providing a material unloading and conveying mechanism under the stacking guide block, the material unloading and conveying mechanism can realize automatic material unloading and conveying of the flexible circuit board, thereby reducing manual operation, saving time and labor, and effectively improving the production efficiency of the flexible circuit board; the guide pulley provided on the lower die base can guide the circuit board substrate to move along the correct path on the lower die base, so as to avoid position offset or skewness and cause material waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0029] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the structure of the upper mold assembly of the utility model;

[0031] Figure 3 This is a schematic diagram of the structure of the material feeding and conveying mechanism of the utility model;

[0032] Figure 4 This is a schematic diagram of the structure of the lower mold assembly of the utility model;

[0033] Figure 5 This is a schematic diagram of the installation structure of the stacking guide block of the utility model;

[0034] Figure 6 It is a schematic diagram of the structure of the stacking guide block of the utility model. DETAILED DESCRIPTION

[0035] In order to make the utility model's purpose, features, and advantages more obvious and easy to understand, the following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. Obviously, the embodiments described below are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0037] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0038] like Figures 1 to 6 As shown, the embodiment of the utility model provides a stamping die for a flexible circuit board, comprising an upper die assembly 1, a lower die assembly 2, a guide assembly 3 and a stacking guide block 4;

[0039] The upper die assembly 1 is located on the top of the lower die assembly 2, and the guide assembly 3 is arranged between the upper die assembly 1 and the lower die assembly 2 to guide and position the upper die assembly 1, thereby ensuring that the upper die assembly 1 can be accurately aligned with the lower die assembly 2 during the stamping process, thereby ensuring the accuracy of the stamping process.

[0040] The upper die assembly 1 includes an upper die base 11, a fixing plate 12, a pressing plate 13, a spring 14, a first guide column 15 and a punch head 16;

[0041] The fixing plate 12 is arranged at the bottom of the upper die seat 11, the top of the punch head 16 is arranged on the fixing plate 12, the pressing plate 13 is arranged below the fixing plate 12, and the spring 14 is arranged between the fixing plate 12 and the pressing plate 13, and the spring 14 is used to apply a downward elastic force to the pressing plate 13; the pressing plate 13 can press the circuit board substrate on the lower die assembly 2 to avoid position displacement of the flexible circuit board during the stamping process;

[0042] The pressing plate 13 is provided with a stamping avoidance hole 130 for the stamping head 16 to pass through up and down, the bottom of the first guide column 15 is threadedly connected to the pressing plate 13, and the fixed plate 12 is provided with a first guide hole (not shown) for the first guide column 15 to slide up and down; during the stamping operation, the upper die seat 11 can be pushed downward by the action of the external stamping drive device, so that the stamping head 16 passes through the stamping avoidance hole 130 and stamps with the surface of the circuit board substrate. At this time, the fixed plate 12 can squeeze the spring 14, prompting the first guide column 15 to slide upward along the first guide hole, so as to avoid deformation caused by excessive pressure on the circuit board substrate.

[0043] The lower die assembly 2 includes a lower die base 21 and a bottom plate 22. The lower die base 21 is arranged on the top of the bottom plate 22. The lower die base 21 and the bottom plate 22 are provided with a punching hole 210 with the same shape as the punching head 16. The punching hole 210 is used to guide and adapt the punching head 16 to punch and move along the hole direction inside it. The punching hole 210 can play a role in positioning and guiding, ensuring that the punching head 16 moves along the correct trajectory during the stamping process, thereby improving the stability and accuracy of the stamping operation.

[0044] The lower die base 21 on both sides of the punching hole 210 is provided with guide pulleys 211, and the guide pulleys 211 are used to guide and transport the circuit board substrate to be punched and formed. The stacking guide block 4 is provided at the bottom of the punching hole 210, and the side wall of the stacking guide block 4 is provided with a sliding groove 40, and the sliding groove 40 is used to guide the stacked flexible circuit board falling from the punching hole 210. The guide pulley 211 can guide the circuit board substrate to move along the correct path on the lower die base 21 to avoid position offset or skewness and cause material waste. The setting of the sliding groove 40 can enable the stamped flexible circuit board products to be stacked and arranged, avoiding disorderly accumulation of products, thereby affecting subsequent processing.

[0045] like Figure 2 As shown, further, the punch head 16 is in a convex shape, and the number of the punch heads 16 is two, and the two punch heads 16 are arranged opposite to each other. The punch heads 16 arranged opposite to each other can perform synchronous punching, which can improve the punching production efficiency and maximize the use of the circuit board substrate, reduce waste generation, and reduce production costs.

[0046] like Figure 2 As shown, further, a drilling cone head 161 is provided at the bottom of the punch head 16, and the drilling cone head 161 is used to drill holes on the surface of the flexible circuit board to meet the layout requirements of the flexible circuit board in circuit wiring and installation connection.

[0047] like Figure 1 and Figure 3 As shown, further, it also includes a material unloading and conveying mechanism 5, which is arranged below the stacking guide block 4 to unload and convey the stacked flexible circuit boards in the stacking guide block 4. The material unloading and conveying mechanism 5 can realize automatic unloading and conveying of the flexible circuit boards, thereby reducing manual operations and improving production efficiency.

[0048] like Figure 3 As shown, further, the material unloading conveying mechanism 5 includes a material moving plate 51, a slide rail 52, a screw rod 53, a threaded seat 54 and a driving motor 55; the material moving plate 51 is located below the stacking guide block 4, the slide rail 52 is extended along the first direction, and the bottom of the material moving plate 51 is slidably connected to the slide rail 52 through a slider;

[0049] The end of the material moving plate 51 is connected to the threaded seat 54, and the threaded seat 54 is sleeved on the screw rod 53. The output shaft of the driving motor 55 is connected to the screw rod 53 to drive the screw rod 53 to rotate. The threaded seat 54 pushes the material moving plate 51 to move along the slide rail 52 as the screw rod 53 rotates, so as to drive the stacked flexible circuit boards to detach from the stacking guide block 4, thereby realizing the regular unloading and conveying of the flexible circuit boards.

[0050] Furthermore, a gap is provided between the stacking guide block 4 and the material moving plate 51 to prevent the material moving plate 51 from rubbing against the stacking guide block 4 during movement, thereby ensuring that the material moving plate 51 can move smoothly during the material unloading process.

[0051] like Figure 2 As shown, further, a pulley avoidance hole 131 is provided at the bottom of the pressing plate 13, and the pulley avoidance hole 131 is used to accommodate the top of the guide pulley 211. The pulley avoidance hole 131 can prevent the guide pulley 211 from being squeezed by direct contact with the pressing plate 13, thereby protecting the guide pulley 211 from damage.

[0052] like Figure 1 and Figure 2 As shown, further, the guide assembly 3 includes four second guide pillars 31, the tops of the four second guide pillars 31 are respectively connected to the corners of the fixed plate 12, the lower die seat 21 is provided with second guide holes 212 for the second guide pillars 31 to slide up and down, the press plate 13 is sleeved on the second guide pillars 31, and the press plate 13 can slide up and down along the length direction of the second guide pillars 31. The second guide pillars 31 can provide vertical guide support for the upper die assembly 1 to prevent the fixed plate 12 and the press plate 13 from deviating during the demoulding process.

[0053] The utility model sets a stacking guide block 4 at the bottom of the lower mold assembly 2, and the side wall of the stacking guide block 4 is provided with a sliding groove 40. When the mold is stamping, the flexible circuit board to be stamped can be arranged in layers under the guidance of the sliding groove 40, so as to avoid disorderly accumulation of products and affect the subsequent processing of the flexible circuit board; by setting a material unloading conveying mechanism 5 below the stacking guide block 4, the material unloading conveying mechanism 5 can realize automatic unloading and conveying of the flexible circuit board, thereby reducing manual operation, saving time and labor, and effectively improving the production efficiency of the flexible circuit board; the guide pulley 211 set on the lower mold base 21 can guide the circuit board substrate to move along the correct path on the lower mold base 21, so as to avoid position displacement or skewness and cause waste of materials.

[0054] As described above, the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A stamping die for a flexible circuit board, It is characterized in that It includes an upper die assembly, a lower die assembly, a guide assembly and a stacking guide block; The upper mold assembly is located on the top of the lower mold assembly, and the guide assembly is arranged between the upper mold assembly and the lower mold assembly to guide and position the upper mold assembly; The upper die assembly comprises an upper die seat, a fixing plate, a pressing plate, a spring, a first guide column and a punching head; The fixing plate is arranged at the bottom of the upper die seat, the top of the punch head is arranged on the fixing plate, the pressing plate is arranged below the fixing plate, the spring is arranged between the fixing plate and the pressing plate, and the spring is used to apply a downward elastic force to the pressing plate; The pressing plate is provided with a punching avoidance hole for the punching head to pass through up and down; The bottom of the first guide column is threadedly connected to the pressing plate, and the fixing plate is provided with a first guide hole for the first guide column to slide up and down; The lower die assembly comprises a lower die seat and a bottom plate, wherein the lower die seat is arranged on the top of the bottom plate, and the lower die seat and the bottom plate are provided with punching holes of the same shape as the punching head, wherein the punching holes are used to guide and adapt the punching head to punch and move along the hole direction inside the punching holes; Guide pulleys are provided on the lower die base on both sides of the punching hole, and the guide pulleys are used to guide and transport the circuit board substrate to be stamped and formed. The stacking guide block is arranged at the bottom of the punching hole, and the side wall of the stacking guide block is provided with a sliding groove, and the sliding groove is used to guide the stacked flexible circuit board falling from the punching hole.

2. The stamping die for the flexible circuit board according to claim 1, It is characterized in that The punching head is in a convex shape, there are two punching heads, and the two punching heads are arranged opposite to each other.

3. The stamping die for the flexible circuit board according to claim 1, It is characterized in that A drilling cone head is provided at the bottom of the punch head, and the drilling cone head is used to drill holes on the surface of the flexible circuit board.

4. The stamping die for the flexible circuit board according to claim 1, It is characterized in that It also includes a material unloading and conveying mechanism, which is arranged below the stacking guide block and is used for unloading and conveying the stacked flexible circuit boards in the stacking guide block.

5. The stamping die for the flexible circuit board according to claim 4, It is characterized in that The material unloading and conveying mechanism comprises a material moving plate, a slide rail, a screw rod, a threaded seat and a driving motor; The material moving plate is located below the stacking guide block, the slide rail is extended along the first direction, and the bottom of the material moving plate is slidably connected to the slide rail via a slider; The end of the material moving plate is connected to the threaded seat, and the threaded seat is sleeved on the screw rod. The output shaft of the driving motor is connected to the screw rod to drive the screw rod to rotate. The threaded seat pushes the material moving plate to move along the slide rail as the screw rod rotates.

6. The stamping die for the flexible circuit board according to claim 5, It is characterized in that A gap is arranged between the stacking guide block and the material moving plate.

7. The stamping die for the flexible circuit board according to claim 1, It is characterized in that A pulley avoidance hole is provided at the bottom of the pressing plate, and the pulley avoidance hole is used to accommodate the top of the guide pulley.

8. The stamping die for the flexible circuit board according to claim 1, It is characterized in that The guide assembly includes four second guide pillars; The tops of the four second guide pillars are respectively connected to the corners of the fixed plate, and the lower die base is provided with second guide holes for the second guide pillars to slide up and down; The pressing plate is sleeved on the second guide column, and the pressing plate can slide up and down along the length direction of the second guide column.

Images