Lamp bead removing device and repairing equipment

Abstract

The utility model belongs to the technical field of Mini LED defect maintenance, and provides a lamp bead removing device and repair equipment. The lamp bead removing device comprises a workbench, a removing mechanism and a force detection component; the workbench is used for mounting a workpiece; the removing mechanism comprises a movable removing component which can abut against the workpiece. The force detection part is connected to the removing part and used for obtaining abutting force information of the removing part on the workpiece. The technical problem that in the prior art, when a removing component removes lamp beads, a bonding pad is prone to being damaged is solved.

Description

Technical Field

[0001] The present application belongs to the field of Mini LED defect repair technology, and in particular, relates to a lamp bead removal device and repair equipment. Background Art

[0002] During the production process of Mini LED products, chips are prone to damage, displacement, missing or falling off. Therefore, a Mini LED rework equipment is needed to repair the failed lamp beads on the lamp board of the chip during the production process.

[0003] One step in the repair process is to remove the failed lamp beads (or failed lamp beads). The lamp beads are installed on the soldering pads of the lamp board. When removing them, the picker is first moved a preset distance to abut against the soldering pad, and then the picker is moved relative to the lamp beads to remove the failed lamp beads from the soldering pad.

[0004] However, when there is a deviation in the distance that the picker moves relative to the soldering pad, when the picker removes the lamp bead, the contact force of the picker on the soldering pad is too large, causing the picker to damage the soldering pad, thereby damaging the product. Utility Model Content

[0005] The purpose of the present application is to provide a lamp bead removal device and a repair device, aiming to solve the technical problem in the prior art that the soldering pads are easily damaged when removing components and lamp beads.

[0006] The first object of the present application is to provide a lamp bead removal device, comprising:

[0007] A workbench for mounting workpieces;

[0008] A rejecting mechanism, comprising a movable rejecting component, wherein the rejecting component is capable of abutting against the workpiece;

[0009] A force detection component is connected to the rejecting component to obtain information about the abutment force of the rejecting component on the workpiece.

[0010] In one embodiment, the rejection mechanism further includes a distance measuring component, which is used to measure the distance between the rejection component and the workpiece. The distance measuring component is communicatively connected to the rejection mechanism to control the movement distance of the rejection component relative to the workpiece.

[0011] In one embodiment, the force detection component includes a load sensor, and the load sensor is connected to the rejection component.

[0012] In one embodiment, the force detection component is communicatively connected to the rejection mechanism, and the rejection mechanism can control the working mode of the rejection mechanism according to the abutment force information, wherein the working mode of the rejection mechanism includes a mode in which the rejection mechanism is shut down or a mode in which the rejection mechanism controls the movement of the rejection component relative to the workpiece.

[0013] In one of the embodiments, the rejection mechanism further includes a first motion assembly, which is connected to the rejection component so that the rejection component can move toward or away from the workpiece in a first preset direction.

[0014] In one of the embodiments, the rejection device further includes a second motion component, which is connected to the workbench to drive the workbench to move within the work surface; and the first preset direction is perpendicular to the work surface.

[0015] In one embodiment, the second motion component includes a driving component, a sliding platform and a fixed platform, the workbench is slidably connected to the sliding platform along a second preset direction, and the sliding platform is slidably connected to the fixed platform along a third preset direction, and the second preset direction and the third preset direction are both parallel to the work surface; the driving component is respectively connected to the workbench and the sliding platform to drive the workbench and the sliding platform to move.

[0016] In one embodiment, the second motion component further includes a rotation mechanism, and the rotation mechanism is connected to the workbench so that the workbench rotates around a preset axis relative to the sliding platform, and the preset axis is configured at an angle to the work surface.

[0017] In one embodiment, the lamp bead rejection device also includes an image acquisition component, which is used to obtain the position of the failed lamp bead on the workpiece. The image acquisition component is communicatively connected to the second motion component to adjust the position of the workbench within the work surface through the second motion component.

[0018] In one of the embodiments, the lamp bead rejection device further includes a heating component, and the heating component is used to heat the workpiece.

[0019] In one embodiment, the lamp bead removal device further comprises a blowing assembly, and the blowing assembly is used to blow hot air to the surface of the workpiece; and / or

[0020] The lamp bead rejection device also includes an air suction component, and the air suction port of the air suction component is directed toward the failed lamp bead on the workpiece.

[0021] In one of the embodiments, the lamp bead removal device further includes a video acquisition component, the lens of which faces the surface of the workpiece to obtain video information of the lamp bead removal process.

[0022] The second object of the present application is to provide a rework device, comprising a lamp bead removal device as described in any one of the above items.

[0023] The beneficial effects of the lamp bead rejection device and rework equipment of the present application compared with the prior art are as follows: compared with the prior art, in the lamp bead rejection device and rework equipment, by installing a force detection component on the rejection component, the force detection component can monitor and supervise the contact force of the rejection component on the soldering pad in real time before the rejection component rejects the failed lamp bead; the contact force information can become the basis for the operation of the rejection mechanism, so that the rejection mechanism can work according to the size of the contact force obtained by the force detection component. The rejection component can only reject the lamp bead when the contact force of the rejection component on the soldering pad is less than a preset value. In this process, the rejection component will not cause damage to the soldering pad, which protects the workpiece and improves the rejection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a schematic diagram of the structure of a lamp bead removal device provided in an embodiment of the present application. Figure 1 ;

[0026] Figure 2 yes Figure 1 axonometric drawing;

[0027] Figure 3 This is a schematic diagram of the structure of a lamp bead removal device provided in an embodiment of the present application. Figure 2 ;

[0028] Figure 4 It is a structural schematic diagram of a rework device provided in an embodiment of the present application;

[0029] Figure 5 yes Figure 4 Axonometric drawing of .

[0030] Explanation of the accompanying drawings: 1. workbench; 2. rejection mechanism; 21. rejection component; 22. distance measurement component; 23. first motion component; 3. force detection component; 4. second motion component; 41. sliding platform; 42. fixed platform; 43. rotation mechanism; 5. video acquisition component; 6. image acquisition component; 7. heating component; 8. blowing component; 9. suction component; 10. lamp bead rejection device; 20. crystal fixing device; Y, second preset direction; X, third preset direction; Z, first preset direction; R, preset axis. DETAILED DESCRIPTION

[0031] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0032] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "upward", "vertical", "horizontal", "bottom", "inside", "outside", "inner side", "outer side" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0036] See also Figure 1 and Figure 2 As shown, the embodiment of the present application provides a lamp bead rejection device 10, which includes a workbench 1, a rejection mechanism 2 and a force detection component 3; the workbench 1 is used to mount the workpiece; the rejection mechanism 2 includes a movable rejection component 21, and the rejection component 21 can abut against the workpiece; the force detection component 3 is connected to the rejection component 21 to obtain the abutment force information of the rejection component 21 on the workpiece.

[0037] Specifically, the workbench 1 is used to install and fix the workpiece. The workbench 1 has a mounting surface. The workpiece is placed on the mounting surface. The rejecting component 21 can move toward or away from the mounting surface. The rejecting component 21 can be located directly above the workpiece.

[0038] The workbench 1 may also be provided with a fixing structure, through which the workpiece can be fixed and limited on the installation surface.

[0039] The workpiece is the wafer (or chip, etc.) to be repaired, and the wafer includes a lamp board and lamp beads arranged in an array on the lamp board, and the lamp board is connected with soldering pads, and the lamp beads are directly soldered to the soldering pads. The lamp beads can be soldered to the soldering pads by tinning; among them, there are lamp beads with abnormal light emission among the lamp beads on the workpiece, and the lamp beads with abnormal light emission can be called failed lamp beads or failed lamp beads.

[0040] The functions of the rejection device include but are not limited to rejecting failed lamp beads. The main working component of the rejection device for rejecting lamp beads is the rejection component 21. The rejection component 21 can move. The rejection component 21 can move toward the workpiece to abut against the workpiece, and can also move away from the workpiece to separate from the workpiece; the rejection component 21 can adopt a picking knife, and the tool head of the picking knife can be in various shapes. For example, the tool head is a trapezoidal structure, and the shape of the tool head is different, and the taper is varied, so as to be able to adapt to different types of chips.

[0041] When the removal component 21 removes the failed lamp bead, first, the removal component 21 needs to abut against the soldering pad beside the lamp bead, and the removal component 21 needs to move from the initial position to the working position, and the working position is the position where the removal component 21 abuts against the soldering pad; then, through the relative movement of the removal component 21 and the soldering pad, the removal component 21 scrapes the lamp bead from the soldering pad from the side. When scraping, the scraping knife can be moved laterally, or the workbench 1 can be used to drive the workpiece to move laterally to achieve relative movement between the removal component 21 and the workpiece; when scraping, since the removal component 21 forms an abutment force (or extrusion force) on the surface of the soldering pad, there is a situation where the removal component 21 will damage the soldering pad when the abutment force is too large.

[0042] The rejecting mechanism 2 controls the rejecting component 21 to move a preset distance from the initial position to the working position. Due to errors in the movement of the rejecting component 21, or failures in the operation of the rejecting mechanism 2, the contact force between the rejecting component 21 and the pad is too large, thereby damaging the pad during rejection.

[0043] Therefore, the present application connects the force detection component 3 to the removal component 21. The force detection component 3 can detect and obtain the abutment force information of the removal component 21 when it abuts against the workpiece. The abutment force information includes the numerical value of the abutment force. The force detection component 3 can adopt a force sensor that can measure the size of the extrusion force. Through the force detection component 3, when the removal component 21 abuts against the welding pad, the size of the extrusion force of the removal component 21 on the welding pad can be monitored in real time.

[0044] The lamp bead rejection device 10 may also include a control unit, and the force detection component 3 can also be connected to the control unit so that when it is detected that the abutment force of the rejection component 21 on the solder pad exceeds a preset value, abnormal information is fed back to the control unit, so that the control unit can remind or alarm.

[0045] When the abutment force information exceeds a preset value, the rejection mechanism 2 can be shut down to stop working; or, when the abutment force information exceeds a preset value, the rejection mechanism 2 can be adjusted to move the rejection component 21 relative to the workpiece so that the abutment force information is within the preset value range. During the adjustment process, the force detection component 3 can monitor the abutment force of the rejection component 21 on the pad in real time.

[0046] For example, in the rejection work, the rejection component 21 is first in the initial position. During rejection, the rejection mechanism 2 moves the rejection component 21 by L meters, and then the rejection component 21 reaches the working position abutting against the workpiece. The force detection component 3 detects the abutment force of the rejection component 21 relative to the workpiece. When the abutment force is less than a preset value, the rejection mechanism 2 can perform subsequent rejection work. Since the abutment force is within a reasonable range, the rejection component 21 will not cause damage to the pad during the rejection process. When the force detection component 3 detects that the abutment force is greater than the preset value, it means that there is a risk of the rejection component 21 damaging the pad during rejection, and a warning signal is provided for the rejection work. Subsequently, the rejection mechanism 2 can be shut down, and the position of the rejection component 21 can be adjusted to move the rejection component 21 away from the workpiece by a preset distance. The force detection component 3 monitors in real time so that the rejection component 21 moves to a range where the abutment force is less than the preset value, and then the subsequent rejection work can be performed to improve the movement accuracy of the rejection mechanism 2, protect the pad, protect the workpiece, and improve the rejection effect and work accuracy.

[0047] In this embodiment, by installing the force detection component 3 on the rejection component 21, the force detection component 3 can monitor and supervise the abutment force of the rejection component 21 on the soldering pad in real time before the rejection component 21 rejects the failed lamp bead; the abutment force information can become the basis for the operation of the rejection mechanism 2, so that the rejection mechanism 2 can work according to the size of the abutment force obtained by the force detection component 3. The rejection component 21 can only reject the lamp bead when the abutment force of the rejection component 21 on the soldering pad is less than a preset value. During this process, the rejection component 21 will not cause damage to the soldering pad, but will protect the workpiece and improve the rejection effect.

[0048] In one embodiment, referring to Figure 1 and Figure 2 As shown, the rejection mechanism 2 further includes a distance measuring component 22, which is used to measure the distance between the rejection component 21 and the workpiece. The distance measuring component 22 is communicatively connected to the rejection mechanism 2 to control the moving distance of the rejection component 21 relative to the workpiece.

[0049] Specifically, the distance measuring component 22 is used to measure the distance between the removal component 21 and the workpiece. Specifically, the distance measuring component 22 is used to measure the distance between the removal component 21 and the workpiece in the first preset direction Z. The distance measuring component 22 can use a laser rangefinder.

[0050] In the initial state, the rejection component 21 is located at the initial position, and the initial position is far away from the workpiece. For example, in the initial position, the height of the rejection component 21 from the workpiece is L, and the height value is measured by the distance measuring component 22. The distance measuring component 22 can be connected to the rejection mechanism 2. After the distance measuring component 22 measures the distance information between the rejection component 21 and the workpiece, the distance information is transmitted to the rejection mechanism 2. The control module in the rejection mechanism 2 moves the rejection component 21 relative to the workpiece by a distance L to reach the working position according to the above distance information, so that the rejection component 21 abuts against the pad, and the abutment force between the rejection component 21 and the pad is maintained within a reasonable range.

[0051] After the rejection component 21 abuts against the pad, the force detection component 3 detects the abutment force of the rejection component 21 on the pad. When the value of the abutment force information is less than the preset value, the rejection mechanism 2 can work normally. When the value of the abutment force information is greater than or equal to the preset value, the operator can shut down the rejection device according to the abutment force information, or adjust the moving distance of the rejection component 21.

[0052] In this embodiment, the distance measuring component 22 is mainly used to provide working data to the rejection mechanism 2. The rejection mechanism 2 determines the moving distance of the rejection component 21 relative to the workpiece based on the distance information transmitted by the distance measuring component 22. When the rejection component 21 moves to the working position abutting against the workpiece, the force detection component 3 can monitor the abutment force of the rejection component 21 on the pad in real time, and can detect the accuracy of the working data provided by the distance measuring component 22 to avoid data errors. In addition, the abutment force information of the force detection component 3 can also be used to detect whether the distance measuring component 22 is working abnormally, thereby providing guarantee for the normal operation of the rejection device.

[0053] In one embodiment, the force detection component 3 includes a load sensor, and the load sensor is connected to the rejection component 21.

[0054] The load sensor is a sensor device that completes the measurement of the force applied to the rejection component 21 by checking the load applied to the rejection component 21. The load sensor can convert the pressure transmitted from the rejection component 21 into a corresponding electrical signal, which can be obtained by the control module in the rejection mechanism 2, thereby achieving the purpose of measurement and providing a basis for the movement of the rejection component 21 in the rejection mechanism 2.

[0055] In this embodiment, the use of a load sensor can improve the accuracy of measurement, so that the abutment force of the removal component 21 on the pad can be measured more accurately, ensuring that the removal component 21 is not easy to damage the pad when removing the lamp bead, thereby protecting the pad.

[0056] In one embodiment, the force detection component 3 is communicatively connected to the rejection mechanism 2, and the rejection mechanism 2 can control the working mode of the rejection mechanism 2 according to the abutment force information, wherein the working mode of the rejection mechanism 2 includes a mode in which the rejection mechanism 2 is shut down or a mode in which the rejection mechanism 2 controls the movement of the rejection component 21 relative to the workpiece.

[0057] Specifically, the rejection mechanism 2 has a control module, which can control the movement of the rejection component 21. The force detection component 3 is communicatively connected with the control module in the rejection mechanism 2 so that the rejection mechanism 2 can control the working mode of the rejection mechanism 2 according to the acquired abutment force information.

[0058] Among them, the working mode of the rejection mechanism 2 includes a mode in which the rejection mechanism 2 is shut down. Specifically, the force detection component 3 transmits the abutment force information to the control module in the rejection mechanism 2. When the abutment force information exceeds a preset value, the rejection mechanism 2 is shut down, and the rejection component 21 no longer rejects the lamp beads on the workpiece, thereby protecting the welding pad.

[0059] Among them, the working mode of the rejection mechanism 2 also includes a mode in which the rejection mechanism 2 controls the movement of the rejection component 21 relative to the workpiece. Specifically, the force detection component 3 transmits the abutment force information to the control module in the rejection mechanism 2. When the abutment force information exceeds the preset value, the rejection mechanism 2 adjusts the rejection component 21 to move in the direction away from the solder pad relative to the solder pad, so that the abutment force of the rejection component 21 on the solder pad is less than the preset value, thereby achieving the purpose of real-time regulation or adjustment of the moving distance of the rejection component 21 relative to the workpiece, so that the abutment force between the rejection component 21 and the solder pad is always maintained within the optimal range (that is, the value of the abutment force information is less than the preset value), which protects the solder pad, thereby improving the rejection effect and improving the processing accuracy.

[0060] In this embodiment, the force detection component 3 is communicatively connected with the rejection mechanism 2, so that the rejection mechanism 2 can stop working or adjust the position of the rejection component 21 when there is a risk of damaging the soldering pad, thereby ensuring that the rejection component 21 can reject the failed lamp beads without damaging the soldering pad, thereby protecting the soldering pad.

[0061] In one embodiment, referring to Figure 1 and Figure 2 As shown, the rejection mechanism 2 further includes a first motion component 23, which is connected to the rejection component 21 so that the rejection component 21 can move toward or away from the workpiece in a first preset direction Z.

[0062] Specifically, the first motion assembly 23 includes a first driver, a fixed seat and a movable seat. The first driver can be a motor, a hydraulic mechanism, etc. The movable seat is slidably connected to the fixed seat. The first driver is connected to the movable seat to drive the movable seat to move on the fixed seat; the rejection component 21 is connected to the movable seat, and the rejection component 21 can move with the movable seat.

[0063] The movable seat can move relative to the workpiece along a first preset direction Z, and the first preset direction Z includes but is not limited to a vertical direction. Therefore, it can be understood that the removal component 21 can follow the movable seat to move toward or away from the workpiece along the vertical direction.

[0064] The movable seat and the fixed seat can be connected through a guide rail assembly, which includes a guide rail component and a sliding component. The guide rail component is extended along a first preset direction Z, and the sliding component is slidably connected to the guide rail component along the first preset direction Z. The guide rail component is installed on the fixed seat, and the sliding component is installed on the movable seat.

[0065] The force detection component 3 is connected to the first driver in the first motion component 23 in communication, and the first driver has a control module. The force detection component 3 transmits the acquired contact force information to the control module in the first driver; the distance measuring component 22 is connected to the first driver of the first motion mechanism, that is, the distance measuring component 22 is connected to the control module in the first driver in communication, and the distance measuring component 22 is used to transmit distance information to the first driver. The first driver can move the rejection component 21 from the initial position to the working position according to the distance information, that is, the first driver can adjust the descending height of the rejection component 21 according to the distance information transmitted by the distance measuring component 22; in the working position, the contact force information transmitted by the force detection component 3 is sent to the control module of the first driver. When the value of the contact force information is less than the preset value, the rejection mechanism 2 can continue to work normally. When the value of the contact force information is greater than or equal to the preset value, the rejection mechanism 2 can be shut down, or the first driver in the rejection mechanism 2 adjusts the rejection component 21 to move a reasonable distance away from the pad along the first preset direction Z, so that the value of the contact force information is less than the preset value, and the rejection mechanism 2 can continue to remove the lamp beads.

[0066] In the present embodiment, the distance measuring component 22 is used to provide the first driver with the distance information that the rejection component 21 should descend. After the distance information is obtained by distance measurement, it is transmitted to the control module of the first driver, and the first driver drives the rejection component 21 to descend a preset distance; after the rejection component 21 reaches the working position, the force detection component 3 can monitor the abutment force of the rejection component 21 on the pad in real time, and feedback the abutment force information to the first driver. When the abutment force information does not exceed the preset value, the distance measuring component 22 does not adjust the first driver; when the abutment force is too large and exceeds the preset value, the force detection component 3 feedbacks the abutment force information to the first driver, and the first driver adjusts the movement of the rejection component 21 so that the abutment force between the rejection component 21 and the pad is less than the preset abutment force, so that the abutment force is kept within a reasonable range, which protects the pad. Through real-time monitoring and feedback, the rejection accuracy of the rejection mechanism 2 can be improved and the processing quality can be improved.

[0067] In one embodiment, referring to Figure 1 and Figure 2 As shown, the rejection device further includes a second motion component 4, which is connected to the workbench 1 to drive the workbench 1 to move within the work surface; the first preset direction Z is perpendicular to the work surface.

[0068] When the rejecting component 21 rejects the failed lamp bead, the rejecting component 21 and the failed lamp bead need to perform lateral (or transverse) relative movement, so that the rejecting component 21 squeezes the failed lamp bead from the side to make the failed lamp bead detach from the soldering pad.

[0069] In one method, during rejection, the rejection component 21 does not move laterally, the rejection component 21 is fixed, and the second moving component 4 drives the workbench 1 to move, so that the workpiece moves relative to the rejection component 21, and the rejection component 21 and the workpiece move laterally relative to each other, and the rejection component 21 squeezes the failed lamp bead laterally, so that the failed lamp bead is detached from the soldering pad.

[0070] In this embodiment, the first motion component 23 drives the rejection component 21 to move along the first preset direction Z, the first preset direction Z is a vertical direction, the lateral movement plane of the workpiece is the working surface of the workbench 1, and the working plane can be a horizontal plane. The second motion component 4 can drive the workbench 1 to move in the horizontal working plane, so it can be known that the first preset direction Z is perpendicular to the working plane; wherein, the second motion component 4 can at least drive the workbench 1 to reciprocate in one direction in the working plane, and the direction is set as the second preset direction Y; the second motion component 4 drives the workbench 1 to move along the second preset direction Y, and the rejection component 21 squeezes the failed lamp beads, causing the lamp beads to detach from the soldering pad.

[0071] In one embodiment, referring to Figure 1 and Figure 2 As shown, the second motion assembly 4 includes a driving component, a sliding platform 41 and a fixed platform 42. The workbench 1 is slidably connected to the sliding platform 41 along the second preset direction Y, and the sliding platform 41 is slidably connected to the fixed platform 42 along the third preset direction X. The second preset direction Y and the third preset direction X are both parallel to the working surface; the driving component is respectively connected to the workbench 1 and the sliding platform 41 to drive the workbench 1 and the sliding platform 41 to move.

[0072] Specifically, the driving component may adopt a motor, a hydraulic mechanism, etc., and the driving component may include multiple independent driving parts. For example, the driving component includes a first driving part and a second driving part. The first driving part is connected to the workbench 1 to drive the workbench 1 to move relative to the sliding platform 41; the second driving part is connected to the sliding platform 41 to drive the sliding platform 41 to move relative to the fixed platform 42.

[0073] Reference Figure 2 As shown, the workbench 1, the sliding platform 41 and the fixed platform 42 are stacked from top to bottom, and the workbench 1 moves along the second preset direction Y relative to the sliding platform 41. When the workbench 1 moves along the second preset direction Y, the rejection component 21 can squeeze the failed lamp beads, thereby rejecting the failed lamp beads.

[0074] The sliding platform 41 moves relative to the fixed platform 42 along the third preset direction X, and the third preset direction X may be perpendicular to the second preset direction Y, so that the workbench 1 can be driven by the driving component to move to any position in the work surface.

[0075] Before the rejection operation is performed, the workbench 1 carrying the workpiece is located at a deviated position away from the bottom of the rejection component 21. When the rejection operation is performed, the driving component drives the sliding platform 41 and the workbench 1 to move, so that the workbench 1 first moves to the bottom of the distance measuring component 22, and the height of the workpiece is confirmed by the distance measuring component 22 to position the workpiece; then, the driving component drives the workbench 1 to move to the position below the rejection component 21, and then drives the rejection component 21 to move toward the workpiece to the abutment position along the first preset direction Z through the first motion component 23; then, the driving component in the second motion component 4 drives the workbench 1 to move half a dot spacing along the second preset direction Y or along the third preset direction X to reject the failed lamp beads.

[0076] In this embodiment, the second motion component 4 is used to drive the workbench 1 to move, so that the workbench 1 can be moved to the bottom of the distance measuring component 22 and the rejection component 21 respectively, so that the distance measuring component 22 and the rejection component 21 do not need to move parallel to the work surface direction. Only the workbench 1 needs to move to achieve the distance measurement and the positioning of the rejection component 21 and the workpiece. Before the rejection component 21 performs the rejection operation, the preliminary positioning work is completed, which is beneficial to improve the rejection accuracy.

[0077] In one embodiment, referring to Figure 1 and Figure 2 As shown, the second motion assembly 4 further includes a rotating mechanism 43, which is connected to the workbench 1 so that the workbench 1 rotates around a preset axis R relative to the sliding platform, and the preset axis R is configured at an angle to the work surface.

[0078] Specifically, the rotating mechanism 43 can be connected between the workbench 1 and the sliding platform 41. The rotating mechanism 43 can drive the workbench 1 to rotate relative to the sliding platform 41 around a preset axis R. The preset axis R can form an angle of 0°-90° with the working surface. When the preset axis R forms an angle of 90° with the working surface, the preset axis R is parallel to the first preset direction Z, that is, the preset axis R is along the vertical direction.

[0079] In this embodiment, by providing a rotating mechanism 43, the workbench 1 can be rotated around a preset axis R, thereby achieving the purpose of adjusting the horizontality of the workbench 1, allowing the surface of the workpiece to maintain a vertical relationship with the removal component 21, and allowing the removal component 21 to move relative to the pad parallel to the surface of the pad, thereby achieving the purpose of protecting the surface of the pad.

[0080] In one embodiment, referring to Figure 3As shown, the lamp bead rejection device 10 also includes an image acquisition component 6, which is used to obtain the position of the failed lamp bead on the workpiece. The image acquisition component 6 is communicatively connected to the second motion component 4 to adjust the position of the workbench 1 in the work surface through the second motion component 4.

[0081] Specifically, the image acquisition component 6 may use a camera, which is used to locate the workpiece and the failed lamp beads on the workpiece to ensure that the rejection component 21 can be accurately positioned with any failed lamp bead, thereby ensuring the smooth progress of the subsequent rejection process.

[0082] In this embodiment, the image acquisition component 6 can roughly locate the workpiece and the failed lamp beads on the workpiece before the distance measurement component 22 measures the distance, and the image acquisition component 6 can also accurately locate the failed lamp beads again after the distance measurement is completed. The image acquisition component 6 may include multiple cameras, and the multiple cameras are used in conjunction with each other. The image acquisition can take pictures and locate the failed lamp beads on the workpiece during the entire working process of the rejection device to obtain the position coordinates of the failed lamp beads.

[0083] In one embodiment, referring to Figure 4 and Figure 5 As shown, the lamp bead rejection device 10 also includes a heating component 7, which is used to heat the workpiece to soften the solder paste on the failed lamp bead.

[0084] In this embodiment, the heating component 7 can heat the workpiece by emitting laser; since the failed lamp bead is soldered to the pad through solder paste, before removing the failed lamp bead, it is necessary to emit laser through the heating component 7 to heat the solder paste between the failed lamp bead and the pad to soften the solder paste, thereby reducing the adhesion between the failed lamp bead and the pad, which is beneficial to separate the failed lamp bead from the pad through the removal component 21, thereby helping to reduce the damage to the pad during the removal process.

[0085] In one embodiment, referring to Figure 3 As shown, the lamp bead removal device 10 also includes a blowing assembly 8, which is used to blow hot air to the surface of the workpiece.

[0086] Among them, the blowing component 8 is mainly used to shorten the curing time of the solder paste during the removal process of the removal component 21 after the heating component 7 is heated, so that the solder paste is not easy to further harden during the removal process, so that the failed lamp beads and the solder paste of the solder pad can still be kept in a softened state by the hot air blown by the blowing component 8 during the removal process, so as to reduce the damage of the removal component 21 to the solder pad during the removal process.

[0087] In addition, the lamp bead removal device 10 also includes a suction component 9, and the suction port of the suction component 9 is directed toward the failed lamp beads on the workpiece. Specifically, the suction component 9 is mainly used in the process of removing the failed lamp beads. After the failed lamp beads are removed, the failed lamp beads detached from the soldering pads and the residual solder paste will remain on the soldering pads. Through the suction force of the suction component 9, the failed lamp beads detached from the soldering pads and the residual solder paste can be discharged to the outside of the workbench 1 through the suction component 9, so as to clean up debris and protect the soldering pads.

[0088] In one embodiment, referring to Figure 1 and Figure 2 and Figure 3 As shown, the lamp bead removal device 10 also includes a video acquisition component 5, and the lens of the video acquisition component 5 faces the surface of the workpiece to obtain video information of the lamp bead removal process.

[0089] The video acquisition component 5 is capable of video recording, and can record the surface condition of the workpiece during the entire operation of the rejection component 21. The video acquisition component 5 can be connected to an external display device so that the entire operation process of the rejection device can be observed through the display device.

[0090] The entire working process of the lamp bead rejection device 10 is that before the rejection process, the second motion component 4 can drive the workbench 1 to carry the workpiece and move it to the bottom of the image acquisition component 6, so as to take a picture of the workpiece through the image acquisition component 6 to roughly locate it, that is, locate the product mark point, and preliminarily locate the position of the failed lamp bead.

[0091] Subsequently, driven by the second motion component 4, the workbench 1 moves the position of the failed lamp bead to the bottom of the distance measuring component 22 for height confirmation feedback. By comparing the feedback value with the set value, the first motion component 23 drives the heating component 7 and the image acquisition component 6 to rise or fall as a whole to reach the depth of field of the image component. The second motion component 4 moves again to move the product to the bottom of the image acquisition component 6. Subsequently, the image acquisition component 6 takes a photo to accurately locate the defective lamp bead, and confirms the deviation value in the first preset direction Z and the second preset direction Y through algorithm calculation.

[0092] After the position of the failed lamp bead is accurately located, the rejection process begins, that is, the failed lamp bead is removed by the rejection component 21. Before the removal, the heating device will emit a laser to heat the failed bead to soften the solder paste, thereby reducing damage to the pad during the removal; the heating process can be monitored in real time by the image acquisition component 6. In addition,

[0093] After the solder paste is softened, the second motion component 4 moves the failed lamp bead to the bottom of the rejection component 21. Combined with the height feedback from the distance measuring component 22, the first motion component 23 drives the rejection component 21 to drop to a suitable height. Then the second motion component 4 moves the workbench 1 along the third preset direction X or the second preset direction Y by half a dot spacing to remove the lamp bead. This rejection process is monitored by the image acquisition component 6. In this process, the force transmitted by the rejection component 21 is monitored by the load sensor in real time to prevent the data transmitted by the distance measuring component 22 from being wrong, resulting in accidental damage to the pad, thereby damaging the product.

[0094] In addition, during this process, the blowing component 8 can be started to blow hot air to extend the curing time of the solder paste and achieve a better removal effect. Furthermore, during the removal process, the suction component 9 can be used to clean and collect the lamp beads that have been removed from the solder pad and the removed solder paste.

[0095] After the lamp bead removal device 10 removes a failed lamp bead, the second motion component 4 drives the workpiece to move to the bottom of the image acquisition component 6 to take pictures to confirm the removal effect. The above process is repeated until all the failed lamp beads on the workpiece are removed, and the removal process ends.

[0096] The present application also provides a repair device, referring to Figure 4 and Figure 5 As shown, the rework equipment includes the lamp bead removal device 10 in the above-mentioned embodiment; when the rework equipment removes the failed lamp beads on the chip, it can monitor the abutment force on the removal component 21 in real time, thereby ensuring that the removal component 21 removes the failed lamp beads without exceeding the preset abutment force, thereby reducing the damage to the soldering pad and protecting the soldering pad. The specific working process can be found in the above-mentioned embodiment of the lamp bead removal device 10, which will not be repeated here.

[0097] In addition, refer to Figure 4 and Figure 5 As shown, the repair equipment may also include a crystal bonding device 20. After the failed lamp beads are removed by the lamp bead removal device 10, the crystal bonding device 20 can re-weld and fix new lamp beads on the corresponding positions on the pads, that is, to bond the new lamp beads so that the chip as a whole can emit light normally.

[0098] The crystal bonding process is the last step of the rework process and has a great impact on the effect of rework. After the removal work is completed, the workpiece is driven by the second motion component 4 to the bottom of the heating component, and the height compensation parameters are compensated according to the position coordinates. After it is in place, the heating component 7 starts heating. The heating component 7 can use a laser, and the laser is equipped with coaxial temperature measurement. When the laser heating temperature exceeds the preset range, the laser should stop working immediately to prevent the circuit board or pad from being burned due to excessive laser temperature. After the crystal bonding is completed, it is driven by the second motion component 4 to the bottom of the image acquisition component 6 to take pictures to confirm the crystal bonding effect; repeat the above process until the separate RGB crystal bonding (three-color crystal bonding) is completed, and the crystal bonding process ends. Among them, the crystal bonding process uses laser welding, and there is temperature feedback during the process. The temperature on the workpiece is always fed back to avoid damage to the workpiece.

[0099] The above are only preferred embodiments of the present application, and only specifically describe the technical principles of the present application. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application, and other specific implementation methods of the present application that can be associated with the technicians in this field without creative work, should be included in the scope of protection of the present application.

Claims

1. A lamp bead removal device, characterized in that: include: A workbench (1) for mounting a workpiece; A rejecting mechanism (2), comprising a movable rejecting component (21), wherein the rejecting component (21) is capable of abutting against the workpiece; A force detection component (3) is connected to the rejecting component (21) to obtain information on the abutment force of the rejecting component (21) on the workpiece.

2. The lamp bead removal device according to claim 1, characterized in that: The rejection mechanism (2) further comprises a distance measuring component (22), wherein the distance measuring component (22) is used to measure the distance between the rejection component (21) and the workpiece, and the distance measuring component (22) is communicatively connected to the rejection mechanism (2) to control the moving distance of the rejection component (21) relative to the workpiece.

3. The lamp bead removal device according to claim 1, characterized in that: The force detection component (3) comprises a load sensor, and the load sensor is connected to the rejection component (21).

4. The lamp bead removal device according to any one of claims 1 to 3, characterized in that: The force detection component (3) is communicatively connected to the rejection mechanism (2), and the rejection mechanism (2) is capable of controlling a working mode of the rejection mechanism (2) according to the abutment force information, wherein the working mode of the rejection mechanism (2) includes a mode in which the rejection mechanism (2) is stopped or a mode in which the rejection mechanism (2) controls the rejection component (21) to move relative to the workpiece.

5. The lamp bead removal device according to any one of claims 1 to 3, characterized in that: The rejection mechanism (2) further comprises a first motion component (23), wherein the first motion component (23) is connected to the rejection component (21) so as to enable the rejection component (21) to move towards or away from the workpiece in a first preset direction (Z).

6. The lamp bead removal device according to claim 5, characterized in that: The rejection device further comprises a second motion component (4), wherein the second motion component (4) is connected to the workbench (1) so as to drive the workbench (1) to move within a work surface; and the first preset direction (Z) is perpendicular to the work surface.

7. The lamp bead removal device according to claim 6, characterized in that: The second motion component (4) comprises a driving component, a sliding platform (41) and a fixed platform (42); the workbench (1) is slidably connected to the sliding platform (41) along a second preset direction (Y); the sliding platform (41) is slidably connected to the fixed platform (42) along a third preset direction (X); the second preset direction (Y) and the third preset direction (X) are both parallel to the work surface; the driving component is respectively connected to the workbench (1) and the sliding platform (41) to drive the workbench (1) and the sliding platform (41) to move.

8. The lamp bead removal device according to claim 7, characterized in that: The second motion component (4) further comprises a rotating mechanism (43), wherein the rotating mechanism (43) is connected to the workbench (1) so as to enable the workbench (1) to rotate relative to the sliding platform (41) around a preset axis (R), wherein the preset axis (R) is arranged at an angle to the work surface.

9. The lamp bead removal device according to claim 6, characterized in that: The lamp bead rejection device (10) further comprises an image acquisition component (6), wherein the image acquisition component (6) is used to obtain the position of the failed lamp bead on the workpiece, and the image acquisition component (6) is communicatively connected with the second motion component (4) so ​​as to adjust the position of the workbench (1) within the work surface through the second motion component (4).

10. The lamp bead removal device according to any one of claims 1 to 3, characterized in that: The lamp bead rejection device (10) further comprises a heating component (7), and the heating component (7) is used to heat the workpiece.

11. The lamp bead removal device according to any one of claims 1 to 3, characterized in that: The lamp bead removal device (10) further comprises a blowing assembly (8), wherein the blowing assembly (8) is used to blow hot air toward the surface of the workpiece; and / or The lamp bead rejection device (10) further comprises an air suction component (9), wherein the air suction port of the air suction component (9) faces the failed lamp bead on the workpiece.

12. The lamp bead removal device according to any one of claims 1 to 3, characterized in that: The lamp bead rejection device (10) further comprises a video acquisition component (5), wherein the lens of the video acquisition component (5) faces the surface of the workpiece so as to obtain video information of the lamp bead rejection process.

13. A rework device, characterized in that: It comprises a lamp bead removing device (10) as claimed in any one of claims 1 to 12.

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