Linear cutting equipment for probe card machining

Abstract

The utility model discloses wire cutting equipment for probe card machining. The device comprises a base, an open groove formed in the base and a collecting and stabilizing assembly arranged in the open groove and at the bottom of the base, the collecting and stabilizing assembly comprises a transverse plate fixedly connected with the bottom of the base, an embedded block is fixedly connected to the bottom of the transverse plate, a first embedded groove is formed in the surface of the transverse plate, and a second embedded groove is formed in the surface of a supporting block; the supporting block and the transverse plate can be overlaid and replaced, that is, when the wire cutting mechanism works on the probe card, generated chippings enter an inner cavity formed in the shell, that is, the shell adjusts the angle of a baffle through hinges arranged on the two sides, so that the chipping spraying position is blocked, the chipping collecting force is increased, and the working efficiency is improved. And the shell can be detached and discharged through a sliding rail mechanism arranged at the bottom and in the open groove, the collected chippings can be rapidly dumped, the usability is improved, and the probe card machining equipment has a good measure for rapidly collecting the chippings when conducting wire cutting.

Description

Technical Field

[0001] The utility model relates to the technical field of probe card processing equipment, in particular to a wire cutting equipment for probe card processing. Background Art

[0002] The probe card is a test interface that is mainly used to test bare chips. It connects the test machine and the chip and transmits signals to test chip parameters. In recent years, semiconductor process technology has advanced by leaps and bounds, surpassing the prediction of Moore's Law by several years. At present, it has advanced to below 32 nanometers. Products emphasize thinness and shortness. ICs are getting smaller and smaller, more powerful, and with more and more pins. In order to reduce the area occupied by chip packaging and improve IC performance, flip-chip packaging is currently widely used in graphics chips, chipsets, memory, and CPUs.

[0003] However, there are some problems in the use of existing probe card processing equipment. The probe card processing equipment currently on the market lacks a good and rapid method for collecting debris during wire cutting, which easily causes debris to escape, making it inconvenient to clean up, and the overall support structure is inconvenient to adjust. Utility Model Content

[0004] The utility model aims to provide a wire cutting device for processing a probe card to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: comprising a base, a slot opened inside the base, and a collecting and stabilizing component arranged inside the slot and at the bottom of the base;

[0006] The collecting and stabilizing assembly includes a horizontal plate fixedly connected to the bottom of the base, an embedding block fixedly connected to the bottom of the horizontal plate, a first embedding groove is provided on the surface of the horizontal plate, one end of the embedding block is fitted and connected inside the second embedding groove, and the second embedding groove is provided on the surface of the supporting block, so that the supporting block can be stacked and replaced with the horizontal plate.

[0007] Preferably, the collecting and stabilizing assembly further comprises a slide rail mechanism provided on the grooved surface, and one end of the slide rail mechanism is arranged at the bottom of the shell.

[0008] Preferably, hinges are detachably connected on both sides of the shell, there are multiple hinges, and an inner cavity is opened inside the shell.

[0009] Preferably, one end of the hinge is connected to a baffle, and the baffle moves up and down.

[0010] Preferably, a wire cutting mechanism is provided on the surface of the base.

[0011] Preferably, the collecting and stabilizing assembly is arranged and connected below the wire cutting mechanism.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model, that is, when the wire cutting mechanism works on the probe card, the debris generated by it enters the inner cavity opened inside the shell, that is, the shell adjusts the angle of the baffle through the hinges arranged on both sides, so as to block the position where the debris is ejected, thereby increasing the collection force of the debris, and the shell can be disassembled and released through the slide rail mechanism arranged in the bottom and the slot, and the collected debris can be quickly dumped, which increases the usability, that is, the bottom of the base is connected to the cross plate, and the cross plate is composed of a first embedded groove and an embedded block, so that it can cover multiple cross plates, increase the adjustability of the base height, and make it adaptable to different heights, so that the probe card processing equipment has a good measure to quickly collect debris when performing wire cutting, so that it is not easy to cause debris to escape, it is more convenient to clean, and the overall support structure is easy to adjust. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0015] Figure 2 This is a schematic diagram of the housing structure of an embodiment of the utility model;

[0016] Figure 3 This is a schematic diagram of the support block structure of an embodiment of the utility model.

[0017] In the figure: 1, base; 2, wire cutting mechanism; 3, slotting; 401, slide rail mechanism; 402, shell; 403, inner cavity; 404, hinge; 405, baffle; 406, cross plate; 407, first embedded groove; 408, embedded block; 409, second embedded groove; 410, support block. DETAILED DESCRIPTION

[0018] In order to facilitate the problem to be solved, the embodiment of the utility model provides a wire cutting device for probe card processing. The technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0019] Example

[0020] See also Figure 1-3The present embodiment provides a base 1, a slot 3 provided inside the base 1, and a collecting and stabilizing component arranged inside the slot 3 and at the bottom of the base 1. The collecting and stabilizing component includes a horizontal plate 406 fixedly connected to the bottom of the base 1, an embedding block 408 fixedly connected to the bottom of the horizontal plate 406, a first embedding groove 407 provided on the surface of the horizontal plate 406, one end of the embedding block 408 is cooperatively connected to the inside of a second embedding groove 409, and the second embedding groove 409 is provided on the surface of a supporting block 410. The supporting block 410 can be superimposed and replaced with the horizontal plate 406, so that the probe card processing equipment has a good measure to quickly collect debris when performing wire cutting, so that it is not easy to cause debris to escape, it is more convenient to clean, and the overall support structure is easy to adjust.

[0021] In this embodiment, the collecting and stabilizing component further includes a slide rail mechanism 401 provided on the surface of the slot 3, one end of the slide rail mechanism 401 is provided at the bottom of the shell 402, hinges 404 are detachably connected to both sides of the shell 402, and there are multiple hinges 404. An inner cavity 403 is provided inside the shell 402, and a baffle 405 is provided and connected to one end of the hinge 404, and the baffle 405 moves up and down. A wire cutting mechanism 2 is provided on the surface of the base 1, and the collecting and stabilizing component is provided and connected below the wire cutting mechanism 2, that is, when the wire cutting mechanism 2 works on the probe card, the debris generated by it enters the inner cavity 403 provided inside the shell 402. 03, that is, the shell 402 adjusts the angle of the baffle 405 through the hinges 404 set on both sides, so as to block the position of the debris injection and increase the collection of the debris. The shell 402 can be disassembled and released through the slide rail mechanism 401 set in the bottom and the slot 3, and the collected debris can be quickly dumped to increase the usability. That is, the bottom of the base 1 is connected to the cross plate 406, and the cross plate 406 is composed of a first embedding groove 407 and an embedding block 408, so that it can cover multiple cross plates 406, increase the adjustability of the height of the base 1, and make it adaptable to different heights.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wire cutting device for processing a probe card, characterized in that: It comprises a base (1), a slot (3) provided inside the base (1), and a collecting and stabilizing component provided inside the slot (3) and at the bottom of the base (1); The collecting and stabilizing assembly comprises a transverse plate (406) fixedly connected to the bottom of the base (1); an insert block (408) is fixedly connected to the bottom of the transverse plate (406); a first insert groove (407) is provided on the surface of the transverse plate (406); one end of the insert block (408) is fitted and connected to the inside of a second insert groove (409); the second insert groove (409) is provided on the surface of a supporting block (410); and the supporting block (410) can be stacked and replaced with the transverse plate (406).

2. The wire cutting device for processing a probe card according to claim 1, characterized in that: The collecting and stabilizing assembly further comprises a slide rail mechanism (401) formed on the surface of the slot (3), and one end of the slide rail mechanism (401) is arranged at the bottom of the shell (402).

3. The wire cutting device for processing a probe card according to claim 2, characterized in that: Hinges (404) are detachably connected on both sides of the shell (402), and there are multiple hinges (404). An inner cavity (403) is opened inside the shell (402).

4. The wire cutting device for processing a probe card according to claim 3, characterized in that: One end of the hinge (404) is connected to a baffle (405), and the baffle (405) moves up and down.

5. The wire cutting device for processing a probe card according to claim 1, characterized in that: A wire cutting mechanism (2) is provided on the surface of the base (1).

6. The wire cutting device for processing a probe card according to claim 5, characterized in that: The collecting and stabilizing component is arranged and connected below the wire cutting mechanism (2).

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