Wafer transmission and flatness adjustment mechanism in ALD cavity

Abstract

The utility model relates to the technical field of wafer transmission, and particularly discloses a wafer transmission and flatness adjusting mechanism in an ALD cavity, which comprises a cavity body internally provided with a wafer body, a power transmission assembly used for driving a reaction inner cavity ceramic heating group to move, and a flatness adjusting assembly used for adjusting the flatness of the wafer body. The limiting hexagonal flange face nut A and the limiting hexagonal flange face nut B are arranged at the proper positions of the upper ends of the driving connecting base and the driven connecting base, the limiting positions where the driven connecting base and the driving connecting base can move are determined, and the driving connecting base installed on the sliding block of the guide rail assembly is driven by the electric cylinder to move. And the driven connecting seat is driven to move by using the spring I, so that the secondary stable transmission of the wafer is finally realized. The height of the first hexagonal fillister head screw and the height of the second hexagonal fillister head screw are adjusted so as to adjust the position of the lifting rod base, the flatness of the wafer body is indirectly adjusted through three sets of PI N rods, and it is guaranteed that the wafer body is located at the proper horizontal position for film coating.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer transmission, and in particular relates to a wafer transmission and flatness adjustment mechanism in an ALD chamber. Background Art

[0002] Before the Atomic Layer Deposition (ALD) equipment starts the coating reaction, it is necessary to use a vacuum device to keep the inside of the chamber in a vacuum state, and then alternately introduce a reaction precursor source and an inert gas into the chamber; under a stable flow field in the reaction chamber, the reaction precursor source is evenly diffused and falls on the surface of the wafer substrate material, and the density of the reaction precursor source in the same plane is ensured to be uniform. At this time, the flatness of the wafer placement is particularly important for the uniformity of film formation on the wafer surface; if the wafer is not placed flatly at the coating reaction position during the coating reaction, it is easy to have uneven coating on the wafer surface and local coating defects. During a coating process, if the wafer is not placed horizontally or in an inappropriate position, local coating defects, local atomic accumulation, and deposition of different atoms at the defective position of the previous layer may easily occur during the alternating introduction of different reaction precursor sources and the layer-by-layer growth of the atomic layers, and the film quality requirements cannot be met. Currently, in the semiconductor field on the market, improvements in wafer flatness are mainly focused on adjusting and improving the flatness of the wafer substrate itself during the wafer manufacturing process. In the field of semiconductor atomic deposition equipment, there are very few inventions and designs that specifically adjust the flatness of the wafer when it is placed on a carrier and that can meet the needs of most existing equipment. Existing designs also need to be further improved. Utility Model Content

[0003] The purpose of the utility model is to provide a wafer transmission and flatness adjustment mechanism in an ALD chamber to solve the problems raised in the above-mentioned background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A wafer transmission and flatness adjustment mechanism in an ALD chamber, comprising:

[0006] A cavity body with a wafer body, a power transmission component for driving the ceramic heating group in the reaction cavity to move, and a flatness adjustment component for adjusting the flatness of the wafer body are provided inside. The power transmission component is provided at the lower end of the cavity body, and the flatness adjustment component is installed on the power transmission component.

[0007] Preferably, the power transmission component includes an electric cylinder, a mounting part, an active connecting seat, a connecting member 1 and a driven connecting seat, the electric cylinder is arranged at the bottom end of the cavity body, the output end of the electric cylinder is connected to the active connecting seat via the mounting part, the active connecting seat is connected to the driven connecting seat via the connecting member 1, the bottom end of the active connecting seat is connected to the reaction cavity ceramic heating group, and is used to drive the reaction cavity ceramic heating group to move, and the arranged electric cylinder can drive the active connecting seat and the driven connecting seat to move.

[0008] Preferably, the mounting member includes an electric cylinder connection seat, the electric cylinder connection seat is installed on one side of the active connection seat by bolts, the output end of the electric cylinder is connected to the electric cylinder connection seat, and the output end of the electric cylinder can drive the active connection seat to move through the electric cylinder connection seat.

[0009] Preferably, the connecting piece 1 includes a spring mounting nut column, a spring 1 and a small round nut, the bottom end of the active connecting seat is equipped with the spring mounting nut column, one end of the spring mounting nut column passes through the active connecting seat and is connected to the driven connecting seat, the outer end of the spring mounting nut column is sleeved with the spring 1, the spring 1 is located between the active connecting seat and the driven connecting seat, the spring 1 installed between the active connecting seat and the driven connecting seat can ensure that the distance between the active connecting seat and the driven connecting seat is fixed and can move upward together, the outer end of the spring mounting nut column is provided with the small round nut, the small round nut is located at the upper end of the spring 1, and the small round nut is located at the lower end of the driven connecting seat;

[0010] The connecting piece 1 also includes a middle mounting seat of a multi-section welded bellows and a multi-section welded bellows 1. The middle mounting seat of the multi-section welded bellows is connected to one side of the driven connecting seat. The upper end of the active connecting seat is provided with a multi-section welded bellows 1, which has telescopic performance and can maintain good sealing. The middle mounting seat of the multi-section welded bellows is provided with a hole that matches the multi-section welded bellows 1 inside. By twisting the set spring mounting nut column, the telescopic amount of spring 1 is compressed, and the height position of the driven connecting piece is adjusted to ensure that the lower surface of the middle mounting seat of the multi-section welded bellows and the surface of the driven connecting seat are matched, connected and fixed.

[0011] Preferably, the flatness adjustment component includes a lifting rod seat and a PIN rod, the lifting rod seat is provided at the upper end of the middle mounting seat of the multi-section welded bellows, the upper end of the lifting rod seat is arranged as a truncated cone-shaped ring, a through hole one matching with the lifting rod seat is provided inside the bottom end of the cavity body, the PIN rod is provided at the upper end of the lifting rod seat, the PIN rod is arranged in three groups and are arranged in an array with the center of the through hole one as the center, a heating disk ceramic cover plate and a metal heating disk are provided inside the cavity body, a through hole two matching with the PIN rod is provided inside the heating disk ceramic cover plate and the metal heating disk, the ends of the three groups of PIN rods are all located at the lower end of the wafer body, and when the reaction cavity ceramic heating group moves upward to the head of the PIN rod, the head of the PIN rod can be completely sunk into the heating ceramic cover plate, and at this time the entire heating ceramic surface remains flat;

[0012] The flatness adjustment component also includes hexagonal cylindrical head screw 2, hexagonal cylindrical head screw 1 and a bellows pressing block. The lower end of the driven connecting seat is equipped with the hexagonal cylindrical head screw 2, the upper end of the hexagonal cylindrical head screw 2 passes through the lower end of the driven connecting seat and fits on the lower end surface of the middle mounting seat of the multi-section welded bellows, the upper end of the driven connecting seat is provided with the bellows pressing block, the upper end of the bellows pressing block is equipped with the hexagonal cylindrical head screw 1, the lower end of the hexagonal cylindrical head screw 1 passes through the upper end of the bellows pressing block and fits on the upper end surface of the middle mounting seat of the multi-section welded bellows.

[0013] Preferably, a guide rail assembly is provided at the bottom end of the cavity body, and the guide rail assembly includes an upper slider and a lower slider. The active connecting seat is installed on one side of the lower slider by screws, and the driven connecting seat is installed on one side of the upper slider by screws. The upper slider is located above the lower slider. The set guide rail assembly is conducive to the smooth vertical movement of the active connecting seat and the driven connecting seat to prevent deviation.

[0014] Preferably, a cavity bottom support frame is installed at the bottom end of the cavity body, and the cavity bottom support frame includes a circular chassis, an electric cylinder base mounting plate is installed at the bottom end of the circular chassis, and the electric cylinder is installed at the bottom end of the circular chassis through the electric cylinder base mounting plate, and a side vertical plate is provided on one side of the bottom end of the cavity bottom support frame, and the guide rail assembly is installed on one side of the side vertical plate by screws, and the multi-section welded bellows is installed at the lower end of the circular chassis.

[0015] Preferably, it also includes a limiting component, which includes a limiting nut column B, the upper end of the limiting nut column B is threadedly connected to the limiting nut column A, the upper end of the limiting nut column A is connected to the circular chassis, the upper end of the limiting nut column A is provided with a threaded end, the threaded end of the limiting nut column A is threadedly connected to the circular chassis, the lower end of the limiting nut column A is located inside the driven connecting seat, the outer end of the limiting nut column A is threadedly connected to the limiting hexagonal flange nut A, the lower end of the limiting nut column B is located inside the active connecting seat, and the outer end of the limiting nut column B is threadedly connected to the limiting hexagonal flange nut B.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. By setting the limiting hexagonal flange nut A and the limiting hexagonal flange nut B at the appropriate positions on the upper ends of the active connection seat and the driven connection seat, the limit positions of the driven connection seat and the active connection seat that can move are determined, and the active connection seat installed on the slider of the guide rail assembly is driven by the electric cylinder to move, and the driven connection seat is driven to move by the spring 1, finally realizing the secondary stable transmission of the wafer;

[0018] 2. Adjust the position of the lifting rod seat by adjusting the height of the hexagonal cylindrical head screw 1 and the hexagonal cylindrical head screw 2, and indirectly adjust the flatness of the wafer body through 3 sets of PIN rods to ensure that the wafer body in a horizontal position will not be shifted when placed on the horizontal heating plate ceramic cover, ensuring that the wafer body is in an appropriate horizontal position for coating, thereby improving the film forming efficiency of the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall internal structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure of the utility model;

[0021] Figure 3 It is a partial enlarged schematic diagram of the utility model;

[0022] In the figure: 1. Cavity body; 2. Cavity bottom support frame; 3. Electric cylinder; 4. Lifting rod seat; 5. Middle mounting seat of multi-section welding bellows; 6. Reaction cavity ceramic heating group; 7. Electric cylinder connecting seat; 8. Limiting nut column B; 9. Active connecting seat; 10. Spring 1; 11. Small round nut; 12. Driven connecting seat; 13. Limiting nut column A; 14. Limiting hexagonal flange nut B; 15. Limiting hexagonal flange nut A; 16. Wafer body; 17. PIN rod; 18. Heating plate ceramic cover; 19. Multi-section welding bellows 1; 20. Electric cylinder base mounting plate; 21. Guide rail assembly; 22. Spring mounting nut column; 23. Metal heating plate; 24. Bellows pressing block; 25. Hexagonal cylindrical head screw 1; 26. Hexagonal cylindrical head screw 2. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example:

[0025] See also Figure 1-Figure 3 As shown, a wafer transfer and flatness adjustment mechanism in an ALD chamber comprises:

[0026] A cavity body 1 is provided with a wafer body 16 inside, a power transmission component for driving the reaction cavity ceramic heating group 6 to move, and a flatness adjustment component for adjusting the flatness of the wafer body 16. A power transmission component is provided at the lower end of the cavity body 1, and a flatness adjustment component is installed on the power transmission component.

[0027] refer to Figure 1-Figure 3 As shown, the power transmission component includes an electric cylinder 3, a mounting part, an active connecting seat 9, a connecting part 1 and a driven connecting seat 12. The electric cylinder 3 is arranged at the bottom end of the cavity body 1. The output end of the electric cylinder 3 is connected to the active connecting seat 9 through the mounting part. The active connecting seat 9 is connected to the driven connecting seat 12 through the connecting part 1. The bottom end of the active connecting seat 9 is connected to the reaction cavity ceramic heating group 6, which is used to drive the reaction cavity ceramic heating group 6 to move. The arranged electric cylinder 3 can drive the active connecting seat 9 and the driven connecting seat 12 to move.

[0028] refer to Figure 1-Figure 3As shown, the mounting part includes an electric cylinder connection seat 7, and the electric cylinder connection seat 7 is installed on one side of the active connection seat 9 by bolts. The output end of the electric cylinder 3 is connected to the electric cylinder connection seat 7, and the output end of the electric cylinder 3 can drive the active connection seat 9 to move through the electric cylinder connection seat 7.

[0029] refer to Figure 1-Figure 3 As shown, the connecting piece 1 includes a spring mounting nut column 22, a spring 10 and a small round nut 11. The bottom end of the active connecting seat 9 is installed with a spring mounting nut column 22. One end of the spring mounting nut column 22 passes through the active connecting seat 9 and is connected to the driven connecting seat 12. The outer end of the spring mounting nut column 22 is sleeved with a spring 10. The interior of the active connecting seat 9 is provided with a mounting hole matched with the spring 10. That is, when the active connecting seat 9 moves upward, the driven connecting seat 12 can be driven to move upward by the spring 10 and the small round nut 11. The spring 10 is located between the active connecting seat 9 and the driven connecting seat 12. The spring 10 installed between the active connecting seat 9 and the driven connecting seat 12 can ensure that the distance between the active connecting seat 9 and the driven connecting seat 12 is fixed in the early stage, and can move upward together. The outer end of the spring mounting nut column 22 is provided with a small round nut 11. The small round nut 11 is located at the upper end of the spring 10, and the small round nut 11 is located at the lower end of the driven connecting seat 12.

[0030] The connecting piece 1 also includes a multi-section welded bellows middle mounting seat 5 and a multi-section welded bellows 19. The multi-section welded bellows middle mounting seat 5 is connected to one side of the driven connecting seat 12. The multi-section welded bellows 19 is arranged on the upper end of the active connecting seat 9, which has telescopic performance and can maintain good sealing. The interior of the multi-section welded bellows middle mounting seat 5 is provided with a hole that matches the multi-section welded bellows 19. The multi-section welded bellows 19 and the multi-section welded bellows middle mounting seat 5 can be a sliding connection or a fixed connection. By twisting the set spring mounting nut column 22, the expansion and contraction amount of the spring 10 is compressed, and the height position of the driven connecting piece is adjusted to ensure that the lower surface of the multi-section welded bellows middle mounting seat 5 and the surface of the driven connecting seat 12 are matched, connected and fixed.

[0031] refer to Figure 1-Figure 3As shown, the flatness adjustment component includes a lifting rod seat 4 and a PIN rod 17, the upper end of the multi-section welded bellows middle mounting seat 5 is provided with a lifting rod seat 4, the upper end of the lifting rod seat 4 is set to a truncated cone shape extending outward, which is conducive to placing the upper end of the lifting rod seat 4 inside the cavity body 1, and a through hole 1 that matches the lifting rod seat 4 is opened inside the bottom end of the cavity body 1, and a PIN rod 17 is set at the upper end of the lifting rod seat 4, and the PIN rod 17 is set in three groups and arranged in an array with the center of the through hole 1 as the center, and a heating plate ceramic cover plate 18 and a metal heating plate 23 are arranged inside the cavity body 1, and the heating plate ceramic cover plate 18 and the metal heating plate 23 are both provided with a through hole 2 that matches the PIN rod 17, and the ends of the three groups of PIN rods 17 are all located at the lower end of the wafer body 16, and when the reaction cavity ceramic heating group 6 moves upward to the head of the PIN rod 17, the head of the PIN rod 17 can be completely sunk into the heating ceramic cover plate, and at this time, the entire heating ceramic surface remains flat;

[0032] The flatness adjustment component also includes a hexagonal cylindrical head screw 26, a hexagonal cylindrical head screw 25 and a bellows pressing block 24. The lower end of the driven connecting seat 12 is installed with a hexagonal cylindrical head screw 26, the upper end of the hexagonal cylindrical head screw 26 passes through the lower end of the driven connecting seat 12 and fits on the lower end surface of the middle mounting seat 5 of the multi-section welded bellows, and the upper end of the driven connecting seat 12 is provided with a bellows pressing block 24. The upper end of the bellows pressing block 24 is installed with a hexagonal cylindrical head screw 25, the lower end of the hexagonal cylindrical head screw 25 passes through the upper end of the bellows pressing block 24 and fits on the upper end surface of the middle mounting seat 5 of the multi-section welded bellows.

[0033] refer to Figure 1-Figure 3 As shown, a guide rail assembly 21 is provided at the bottom end of the cavity body 1, and the guide rail assembly 21 includes an upper slider and a lower slider. The active connecting seat 9 is installed on one side of the lower slider by screws, and the driven connecting seat 12 is installed on one side of the upper slider by screws. The upper slider is located above the lower slider. The set guide rail assembly 21 is conducive to the active connecting seat 9 and the driven connecting seat 12 to move smoothly in the vertical direction to prevent deviation.

[0034] refer to Figure 1-Figure 3 As shown, a cavity bottom support frame 2 is installed at the bottom end of the cavity body 1, and the cavity bottom support frame 2 includes a circular chassis, and an electric cylinder base mounting plate 20 is installed at the bottom end of the circular chassis. The electric cylinder 3 is installed at the bottom end of the circular chassis through the electric cylinder base mounting plate 20. A side vertical plate is provided on one side of the bottom end of the cavity bottom support frame 2, and a guide rail assembly 21 is installed on one side of the side vertical plate by screws, and a multi-section welded bellows 19 is installed at the lower end of the circular chassis.

[0035] refer to Figure 1-Figure 3As shown, it also includes a limiting component, which includes a limiting nut column B8, the upper end of the limiting nut column B8 is threadedly connected to the limiting nut column A13, the upper end of the limiting nut column A13 is connected to the circular chassis, the upper end of the limiting nut column A13 is provided with a threaded end, the threaded end of the limiting nut column A13 is threadedly connected to the circular chassis, the lower end of the limiting nut column A13 is located inside the driven connecting seat 12, the outer end of the limiting nut column A13 is threadedly connected to the limiting hexagonal flange nut A15, the lower end of the limiting nut column B8 is located inside the active connecting seat 9, and the outer end of the limiting nut column B8 is threadedly connected to the limiting hexagonal flange nut B14.

[0036] During operation, the electric cylinder is energized to control the output end of the electric cylinder 3 to move upward, and at the same time, the active connection seat 9 and the driven connection seat 12 are driven to move upward along the guide rail assembly 21. The spring 10 installed between the active connection seat 9 and the driven connection seat 12 can ensure that the distance between the active connection seat 9 and the driven connection seat 12 is fixed, and they move upward together; when the upper surface of the driven connection seat 12 contacts the limiting hexagonal flange nut A15, the output end of the electric cylinder 3 stops moving, and the driven connection seat 12 and the active connection seat 9 also stop moving upward. The limiting hexagonal flange nut A15 can adjust the height according to actual conditions; at this time, the head surfaces of the three groups of PIN rods 17 arranged in a triangular array contact the lower surface of the wafer body 16, and the wafer body 16 is moved upward. Lift it to a certain height to separate the wafer body 16 from the wafer fork arm that transfers the wafer to the reaction chamber, move out the wafer fork arm, and at the same time adjust the three hexagonal cylindrical head screws 26 installed at the bottom of the driven connecting seat 12 so that the head surfaces of the three PIN rods 17 are completely in contact with the lower surface of the wafer body 16, and measure the flatness of the wafer body 16. After ensuring that the wafer body 16 is placed completely horizontally, stop adjusting the hexagonal cylindrical head screws 26 on the lower bottom surface of the driven connecting seat 12, and at the same time tighten the hexagonal cylindrical head screws 25 on the upper surface of the driven connecting seat 12 set in a symmetrical position to ensure that the middle mounting seat 5 of the multi-section welded bellows is completely fixed, thereby ensuring that the lifting rod seat 4 is in a fixed position and ensuring that the wafer body 16 is in a horizontal position. When the electric cylinder 3 is continuously powered, the output end of the electric cylinder 3 moves upward, the active connection seat 9 is connected to the lower slider of the guide rail assembly and drives the reaction cavity ceramic heating group 6 to move upward along the guide rail assembly 21. The driven connection seat 12 is fixed at this time, and when it rises to a certain height, the bottom of the PIN rod 17 is separated from the lifting rod seat 4, and the head is completely sunk into the heating plate ceramic cover 18. At this time, the wafer body 16 is placed flat on the heating plate ceramic cover 18. Since the PIN rod 17 is completely horizontal when it holds up the wafer body 16, the reaction cavity ceramic heating group 6 moves upward until the head of the PIN rod 17 is completely sunk into the heating plate ceramic cover 18. When the wafer body 16 in a horizontal position is placed on the horizontal heating plate ceramic cover 18, there will be no position drift, ensuring that the wafer body 16 is coated at an appropriate horizontal position, thereby improving the film forming efficiency. The output end of the electric cylinder 3 continues to move upward, and when the upper surface of the active connecting seat 9 contacts the surface of the limiting hexagonal flange nut A15, the limiting hexagonal flange nut B14 is adjusted to just transfer the wafer body 16 to the required height for reaction, the electric cylinder 3 stops working, and the active connecting seat 9 and the reaction cavity ceramic heating group 6 stop moving upward together. At this time, the heating plate ceramic cover 18 places the wafer body 16 in the appropriate position for reaction in the reaction chamber.

[0037] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer transfer and flatness adjustment mechanism in an ALD chamber, It is characterized in that include: A cavity body (1) is provided with a wafer body (16) inside, a power transmission component for driving a reaction cavity ceramic heating group (6) to move, and a flatness adjustment component for adjusting the flatness of the wafer body (16), wherein the power transmission component is provided at the lower end of the cavity body (1), and the flatness adjustment component is mounted on the power transmission component.

2. According to claim 1, a wafer transfer and flatness adjustment mechanism in an ALD chamber, Features: The power transmission assembly comprises an electric cylinder (3), a mounting member, an active connecting seat (9), a connecting member 1 and a driven connecting seat (12); the electric cylinder (3) is arranged at the bottom end of the cavity body (1); the output end of the electric cylinder (3) is connected to the active connecting seat (9) via the mounting member; the active connecting seat (9) is connected to the driven connecting seat (12) via the connecting member 1; and the bottom end of the active connecting seat (9) is connected to the ceramic heating group (6) of the reaction cavity.

3. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 2, Features: The mounting member comprises an electric cylinder connection seat (7), one side of the active connection seat (9) is mounted with the electric cylinder connection seat (7) via bolts, and the output end of the electric cylinder (3) is connected to the electric cylinder connection seat (7).

4. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 3, Features: The connecting member 1 comprises a spring mounting nut column (22), a spring 1 (10) and a small round nut (11); the bottom end of the active connecting seat (9) is mounted with the spring mounting nut column (22); one end of the spring mounting nut column (22) passes through the active connecting seat (9) and is connected to the driven connecting seat (12); the outer end of the spring mounting nut column (22) is sleeved with the spring 1 (10); the spring 1 (10) is located between the active connecting seat (9) and the driven connecting seat (12); the outer end of the spring mounting nut column (22) is provided with the small round nut (11); the small round nut (11) is located at the upper end of the spring 1 (10); and the small round nut (11) is located at the lower end of the driven connecting seat (12); The connecting member 1 also includes a middle mounting seat (5) of a multi-section welded bellows and a multi-section welded bellows 1 (19); one side of the driven connecting seat (12) is connected to the middle mounting seat (5) of the multi-section welded bellows; the upper end of the active connecting seat (9) is provided with the multi-section welded bellows 1 (19); and a hole matching the multi-section welded bellows 1 (19) is provided inside the middle mounting seat (5) of the multi-section welded bellows.

5. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 4, Features: The flatness adjustment component comprises a lifting rod seat (4) and a PIN rod (17); the lifting rod seat (4) is arranged at the upper end of the middle mounting seat (5) of the multi-section welded bellows; a through hole one cooperating with the lifting rod seat (4) is provided inside the bottom end of the cavity body (1); the PIN rod (17) is provided at the upper end of the lifting rod seat (4); the PIN rod (17) is arranged in three groups and are arranged in an array with the center of the through hole one as the center; a heating plate ceramic cover plate (18) and a metal heating plate (23) are arranged inside the cavity body (1); a through hole two cooperating with the PIN rod (17) is provided inside the heating plate ceramic cover plate (18) and the metal heating plate (23); the ends of the three groups of PIN rods (17) are all located at the lower end of the wafer body (16); The flatness adjustment component also includes a second hexagonal cylindrical head screw (26), a first hexagonal cylindrical head screw (25) and a bellows pressing block (24); the second hexagonal cylindrical head screw (26) is installed at the lower end of the driven connecting seat (12); the upper end of the second hexagonal cylindrical head screw (26) passes through the lower end of the driven connecting seat (12) and fits against the lower end surface of the middle mounting seat (5) of the multi-section welded bellows; the upper end of the driven connecting seat (12) is provided with the bellows pressing block (24); the upper end of the bellows pressing block (24) is installed with the first hexagonal cylindrical head screw (25); the lower end of the first hexagonal cylindrical head screw (25) passes through the upper end of the bellows pressing block (24) and fits against the upper end surface of the middle mounting seat (5) of the multi-section welded bellows.

6. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 5, Features: A guide rail assembly (21) is provided at the bottom end of the cavity body (1), and the guide rail assembly (21) includes an upper slider and a lower slider, the active connection seat (9) is mounted on one side of the lower slider by means of screws, and the driven connection seat (12) is mounted on one side of the upper slider by means of screws, and the upper slider is located above the lower slider.

7. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 6, Features: A cavity bottom support frame (2) is installed at the bottom end of the cavity body (1), and the cavity bottom support frame (2) includes a circular chassis, and an electric cylinder base mounting plate (20) is installed at the bottom end of the circular chassis. The electric cylinder (3) is installed at the bottom end of the circular chassis through the electric cylinder base mounting plate (20). A side vertical plate is provided on one side of the bottom end of the cavity bottom support frame (2), and the guide rail assembly (21) is installed on one side of the side vertical plate by screws. The multi-section welded corrugated pipe (19) is installed at the lower end of the circular chassis.

8. The wafer transport and flatness adjustment mechanism in an ALD chamber according to claim 7, Features: The invention also comprises a limiting assembly, wherein the limiting assembly comprises a limiting nut column B (8), the upper end of the limiting nut column B (8) is threadedly connected to the limiting nut column A (13), the upper end of the limiting nut column A (13) is connected to the circular chassis, the upper end of the limiting nut column A (13) is provided with a threaded end, the threaded end of the limiting nut column A (13) is threadedly connected to the circular chassis, the lower end of the limiting nut column A (13) is located inside the driven connecting seat (12), the outer end of the limiting nut column A (13) is threadedly connected to the limiting hexagonal flange nut A (15), the lower end of the limiting nut column B (8) is located inside the active connecting seat (9), and the outer end of the limiting nut column B (8) is threadedly connected to the limiting hexagonal flange nut B (14).

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