Wafer cooling device

Abstract

The utility model discloses a wafer cooling device, and particularly relates to the technical field of cooling devices, which comprises a cooling assembly for cooling and radiating a wafer. A functional assembly for enhancing the cooling efficiency is arranged outside the cooling assembly; the functional assembly comprises two guide shells distributed in a spaced mode, guide grooves are formed in the bottom ends of the guide shells in a penetrating mode, the two guide grooves in the two guide shells communicate with each other, a plurality of air holes distributed at intervals are formed in the bottom ends of the guide shells in a penetrating mode, and the air holes communicate with the guide grooves. Guide holes are formed in the sides, close to each other, of the two guide shells in a penetrating mode. According to the utility model, through the guide grooves, the air holes and the guide holes which are communicated with one another, when the cooling fan operates, cold air emitted by the cold guide table can be guided and conveyed to the outside and the top of the wafer through the guide holes by the guide grooves, so that the cold air can be used for cooling and cooling the wafer in all directions, the cooling efficiency is improved, and the effect of rapidly cooling the wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling devices, in particular to a wafer cooling device. Background Art

[0002] When semiconductor wafers are assembled and produced, the different distribution densities of electronic components on the wafers lead to differences in the residual temperature on the wafer surface. In order to prevent the temperature from affecting the installation of different electronic components and to facilitate subsequent processing and production, the wafers need to be cooled to reach normal room temperature.

[0003] As shown in the application document with the prior art publication number CN218849432U, it includes several semiconductor refrigeration sheets, and also includes: a refrigeration seat, the refrigeration surface of the semiconductor refrigeration sheet is installed at the bottom of the refrigeration seat, and is arranged in a circular array; a heat exchange seat, the heat exchange seat is connected to the refrigeration seat, the heating surface of the semiconductor refrigeration sheet is connected to the top of the heat exchange seat, and a cooling water path is provided on the heat exchange seat, and the cooling water path is arranged opposite to the semiconductor refrigeration sheet. This technical solution realizes refrigeration through semiconductor refrigeration sheets, and cools the semiconductor refrigeration sheets by water cooling, which can ensure the rapid cooling of the wafer, reduce the cost, and is noiseless and simple in structure.

[0004] However, the above technical solution can only gradually cool the wafer from the bottom with the help of the cooling boss, resulting in that the outside and top of the wafer are not quickly cooled by the cold air, which affects the cooling efficiency of the wafer. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a wafer cooling device, which has interconnected guide grooves, air holes and guide holes, so that when the cooling fan is running, the cold air emitted from the cooling platform can be guided by the guide grooves and transported to the outside and top of the wafer through the guide holes. In this way, the cold air can cool and dissipate the heat of the wafer in all directions, thereby improving the cooling efficiency and achieving the effect of quickly cooling the wafer, so as to solve the problems arising from the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer cooling device, comprising a cooling component for cooling and dissipating heat for a wafer;

[0007] The cooling assembly is provided with a functional component for enhancing cooling efficiency on the outside;

[0008] The functional component comprises two guide shells distributed at intervals, a guide groove is formed through the bottom of the guide shells, the two guide grooves on the two guide shells are connected, a plurality of air holes distributed at intervals are formed through the bottom of the guide shells, the air holes are connected to the guide grooves, and a guide hole is formed through the adjacent sides of the two guide shells, the guide hole is connected to the guide grooves;

[0009] The tops of the two guide shells are provided with a same mounting plate, a heat dissipation fan is embedded in the mounting plate, and the positions of the heat dissipation fan and the guide holes correspond to each other up and down.

[0010] In a preferred embodiment, the cooling assembly includes a water tank, the front side of the water tank is fixedly connected to a material pipe, semiconductor refrigeration plates are fixedly embedded on both sides of the water tank, a cooling platform is installed on the top of the water tank, the bottom end of the cooling platform passes through the water tank and extends to the inside of the water tank; two guide shells are both mounted on the outside of the top of the cooling platform, and the cooling platform is arranged between two connected guide grooves.

[0011] In a preferred embodiment, a threaded rod is provided at the top of the front end of the water tank, and fixed plates are provided at both ends of the threaded rod. Both ends of the threaded rod are movably connected to the two fixed plates through bearings, and the external thread of the threaded rod is connected to a connecting seat, and the rear ends of the two connecting seats are respectively fixed to the front sides of the two guide shells; the threads at both ends of the threaded rod have opposite directions, and the threads at both ends of the threaded rod are symmetrically distributed about the central axis of the threaded rod.

[0012] In a preferred embodiment, a handle is provided on one side of one of the fixing plates away from the threaded rod, and the handle passes through the fixing plate and is fixed to the threaded rod.

[0013] In a preferred embodiment, two spaced-apart mounting brackets are installed on the rear side of the mounting plate, and the front sides of the bottom ends of the mounting brackets are fixed to the rear side of the water tank.

[0014] In a preferred embodiment, two spaced support frames are provided at the top of the rear end of the water tank, the support frames are provided at the front side of the mounting frame, and the support frames and the mounting bracket are distributed in a triangular shape.

[0015] Technical effects and advantages of the utility model:

[0016] 1. Through the interconnected guide grooves, air holes and guide holes, when the cooling fan is running, the cold air emitted from the cooling platform can be guided by the guide grooves through the guide holes and transported to the outside and top of the wafer, so that the cold air can cool down the wafer in an all-round way, improve the cooling efficiency, and achieve the effect of rapid cooling of the wafer;

[0017] 2. The rotation of the threaded rod drives the two connecting seats to move inward or outward at the same time, so as to facilitate the workers to operate the guide shell to contact or move away from the wafer, thereby improving the convenience of the workers to operate the guide shell and take and place the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a cross-sectional view of the guide shell of the utility model;

[0020] Figure 3 This is the front view of the water tank of the utility model;

[0021] Figure 4 It is a side sectional view of the water tank of the utility model;

[0022] Figure 5 It is a schematic diagram of the guide shell of the utility model after adjustment.

[0023] The accompanying drawings are marked as follows: 1. guide shell; 2. guide groove; 3. air hole; 4. guide hole; 5. mounting plate; 6. cooling fan; 7. water tank; 8. material pipe; 9. semiconductor refrigeration plate; 10. cooling platform; 11. threaded rod; 12. fixing plate; 13. connecting seat; 14. handle; 15. mounting bracket; 16. support frame. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Refer to the instruction manual Figure 1-5 , the utility model provides a wafer cooling device, including a cooling component for cooling and dissipating heat from a wafer;

[0026] like Figure 1 , 3 As shown in Figures 4 and 5, the cooling component includes a water tank 7, a material pipe 8 is fixedly connected to the front side of the water tank 7, semiconductor refrigeration sheets 9 are fixedly embedded on both sides of the water tank 7, a cooling platform 10 is installed on the top of the water tank 7, and the bottom end of the cooling platform 10 passes through the water tank 7 and extends to the inside of the water tank 7; two guide shells 1 are both mounted on the outside of the top of the cooling platform 10, and the cooling platform 10 is arranged between two connected guide grooves 2, and the liquid in the water tank 7 is cooled and cooled by the semiconductor refrigeration sheets 9, so that the cooling platform 10 in contact with the liquid can cool the wafer.

[0027] In order to improve the cooling efficiency of the wafer, a functional component for enhancing the cooling efficiency is provided outside the cooling component;

[0028] like Figure 1 , 2 As shown in 5, the functional component includes two guide shells 1 distributed at intervals, a guide groove 2 is formed through the bottom end of the guide shell 1, and the two guide grooves 2 on the two guide shells 1 are connected. A plurality of air holes 3 distributed at intervals are formed through the bottom end of the guide shell 1, and the air holes 3 are connected to the guide groove 2. A guide hole 4 is formed through the adjacent sides of the two guide shells 1, and the guide hole 4 is connected to the guide groove 2; the tops of the two guide shells 1 are provided with the same mounting plate 5, and a cooling fan 6 is embedded in the mounting plate 5, and the cooling fan 6 corresponds to the position of the guide hole 4 up and down.

[0029] like Figure 1 and 5 As shown, a threaded rod 11 is provided at the top of the front end of the water tank 7, and a fixing plate 12 is provided at both ends of the threaded rod 11. Both ends of the threaded rod 11 are movably connected to the two fixing plates 12 through bearings. A connecting seat 13 is connected to the outer thread of the threaded rod 11, and the rear ends of the two connecting seats 13 are respectively fixed to the front sides of the two guide shells 1; the threads at both ends of the threaded rod 11 are in opposite directions, and the threads at both ends of the threaded rod 11 are symmetrically distributed about the central axis of the threaded rod 11. The two connecting seats 13 are driven to move inward or outward at the same time by the rotation of the threaded rod 11. When moving inward, the two guide shells 1 can cover the outside of the wafer. When moving outward, the two guide shells 1 can be kept away from the wafer to facilitate the staff to take the wafer. A handle 14 is provided on the side of one of the fixing plates 12 away from the threaded rod 11. The handle 14 passes through the fixing plate 12 and is fixed to the threaded rod 11. Through the connection between the handle 14 and the threaded rod 11, the staff can operate the handle 14 to drive the threaded rod 11 to rotate, thereby improving the convenience of the staff to operate the threaded rod 11.

[0030] like Figure 1 and 5 As shown, two spaced-apart mounting brackets 15 are installed on the rear side of the mounting plate 5, and the front side of the bottom end of the mounting bracket 15 is fixed together with the rear side of the water tank 7. The mounting bracket 15 is connected with the mounting plate 5 and the water tank 7, so that the mounting bracket 15 can support the mounting plate 5, thereby ensuring the stability of the cooling fan 6 during operation. Two spaced-apart supporting frames 16 are provided on the top of the rear end of the water tank 7, and the supporting frames 16 are arranged on the front side of the mounting frame. The supporting frames 16 and the mounting bracket 15 are distributed in a triangle. By setting the supporting frames 16, the stability of the mounting bracket 15 can be enhanced and the supporting strength of the mounting bracket 15 can be improved.

[0031] First, the staff places the wafer on the cooling platform 10, and then drives the semiconductor cooling sheet 9 to cool the liquid in the water tank 7. At this time, the cooling platform 10 is cooled by the liquid to cool the wafer;

[0032] In order to improve the cooling efficiency, the staff drives the threaded rod 11 to rotate by operating the handle 14, so that the two connecting seats 13 on the threaded rod 11 can drive the two guide shells 1 to move inward at the same time, so that the wafer is located between the two connected guide grooves 2 in the two guide shells 1, and then with the help of the connected guide grooves 2, air holes 3 and guide holes 4, when the cooling fan 6 is running, the cold air emitted by the cooling table 10 can be guided by the guide groove 2 through the guide hole 4 and transported to the outside and top of the wafer, so that the wafer can be cooled and dissipated in all directions, thereby improving the cooling efficiency.

[0033] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A wafer cooling device, Features: including a cooling assembly for cooling and dissipating heat from the wafer; The cooling assembly is provided with a functional component for enhancing cooling efficiency on the outside; The functional component comprises two guide shells (1) arranged at intervals, a guide groove (2) is formed through the bottom end of the guide shell (1), the two guide grooves (2) on the two guide shells (1) are connected, a plurality of air holes (3) are formed through the bottom end of the guide shell (1) arranged at intervals, the air holes (3) are connected to the guide groove (2), and a guide hole (4) is formed through the sides of the two guide shells (1) adjacent to each other, the guide hole (4) is connected to the guide groove (2); The tops of the two guide shells (1) are provided with a common mounting plate (5), a heat dissipation fan (6) is embedded inside the mounting plate (5), and the positions of the heat dissipation fan (6) and the guide holes (4) correspond to each other in vertical direction.

2. A wafer cooling device according to claim 1, Features: The cooling assembly comprises a water tank (7), the front side of the water tank (7) is fixedly connected to a material pipe (8), both sides of the water tank (7) are fixedly embedded with semiconductor refrigeration plates (9), the top of the water tank (7) is equipped with a cooling platform (10), and the bottom end of the cooling platform (10) passes through the water tank (7) and extends into the interior of the water tank (7); The two guide shells (1) are both sleeved on the outside of the top of the cooling platform (10), and the cooling platform (10) is arranged between two connected guide grooves (2).

3. A wafer cooling device according to claim 2, Features: A threaded rod (11) is provided at the top of the front end of the water tank (7), and fixing plates (12) are provided at both ends of the threaded rod (11). Both ends of the threaded rod (11) are movably connected to the two fixing plates (12) through bearings, and the threaded rod (11) is externally threadedly connected to a connecting seat (13), and the rear ends of the two connecting seats (13) are respectively fixed to the front sides of the two guide shells (1); The threads at both ends of the threaded rod (11) have opposite thread directions, and the threads at both ends of the threaded rod (11) are symmetrically distributed about the central axis of the threaded rod (11).

4. A wafer cooling device according to claim 3, Features: A handle (14) is provided on one side of one of the fixing plates (12) away from the threaded rod (11); the handle (14) passes through the fixing plate (12) and is fixed to the threaded rod (11).

5. The wafer cooling device according to claim 2, Features: Two spaced-apart mounting brackets (15) are mounted on the rear side of the mounting plate (5), and the front side of the bottom end of the mounting bracket (15) is fixed to the rear side of the water tank (7).

6. A wafer cooling device according to claim 5, Features: Two spaced support frames (16) are provided at the top of the rear end of the water tank (7); the support frames (16) are provided at the front side of the mounting frame; the support frames (16) and the mounting bracket (15) are distributed in a triangular shape.

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