Wafer bearing device

Abstract

The utility model relates to a wafer bearing device. According to the technical scheme, a cylindrical boss is fixedly installed on the upper surface of a base and is a hollow shell, three through holes are formed in the edge of the circumferential side wall of the top of the cylindrical boss in a circumferential array mode, bearing mechanisms are installed in the through holes respectively, each bearing mechanism comprises a rotating shaft, and the rotating shafts are rotationally inserted into the through holes respectively; the upper end of the rotating shaft is fixedly connected with one end of a rotating supporting block, the upper surface of the other end of the rotating supporting block is fixedly connected with a wafer supporting table, the center of the upper end of the wafer supporting table is fixedly connected with a limiting column, and the rotating shaft is driven by a driving mechanism to rotate at the same time. An output shaft of the motor is fixedly sleeved with a first gear, three second gears are arranged on the circumferential side wall of the first gear in a circumferential array mode, and the second gears are fixedly arranged on the corresponding rotating shafts in a sleeving mode respectively. The beneficial effects of the utility model are that the wafer is prevented from being polluted by particulate matters, and the adaptability of bearing the wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the field of wafer production and processing, and relates to a wafer carrying device. Background Art

[0002] Wafers, also known as slices or substrates, are the basic raw materials for manufacturing semiconductor devices. They are silicon wafers used in the manufacture of silicon semiconductor circuits, and their original material is silicon. The process of manufacturing wafers is to first dissolve high-purity polycrystalline silicon and then add silicon crystal seeds, and then slowly pull them out to form cylindrical single crystal silicon. Then, after the silicon crystal rod is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. The main processing methods of wafers include sheet processing and batch processing, which can process one or more wafers at the same time. The diameter of the wafer ranges from 25.4 mm (1 inch) to 300 mm (11.8 inches), and the most advanced wafer factories use 300 mm wafers. Wafers can be processed into various circuit component structures and become IC products with specific electrical functions. The production of wafers is applied to PECVD equipment, and the robotic arm on the PECVD equipment transfers the wafer to the chuck in the process chamber for processing. Since the wafer is placed directly on the chuck, particle contamination is prone to occur on the front and back sides of the wafer. At the same time, the wafers are of different sizes, and the existing carrying devices have a relatively fixed size for carrying wafers, which is not flexible enough and has poor adaptability.

[0003] Therefore, the utility model provides a wafer carrying device to solve the above problems. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model discloses a wafer carrying device, which adopts the technical solution of comprising a base, a cylindrical boss being fixedly mounted on the upper surface of the base, the cylindrical boss being a hollow shell, and three through holes being arranged in a circumferential array on the edge of the circumferential side wall of the top of the cylindrical boss, and carrying mechanisms being respectively mounted in the through holes, the carrying mechanisms comprising a rotating shaft, the rotating shafts being rotatably inserted in the through holes, the upper end of the rotating shaft being fixedly connected to one end of a rotating support block, the upper surface of the other end of the rotating support block being fixedly connected to a wafer support, the upper end center of the wafer support being fixedly connected to a limiting column, the rotating shaft being simultaneously driven to rotate by a driving mechanism, and the driving mechanism being mounted inside the cylindrical boss.

[0005] As a preferred solution of the utility model, the circumferential outer wall of the cylindrical boss has four fixing ears in a circumferential array; the cylindrical boss is fixedly installed with the lower base through the fixing ears.

[0006] As a preferred solution of the utility model, first mounting holes are respectively provided on the base corresponding to the mounting holes of the fixing ears, and a plurality of second mounting holes are provided in a circular array on the circumferential edge of the base; the device is fixedly installed through the second mounting holes of the base, thereby improving its stability during use.

[0007] As a preferred solution of the utility model, the distance between the upper surface of the rotating support block and the upper surface of the wafer support table is 5 mm; such a design prevents friction between the lower surface of the wafer and the rotating support block, thereby avoiding damage to the wafer.

[0008] As a preferred solution of the utility model, the distance between the circumferential side wall of the wafer support and the circumferential side wall of the limiting column is 5-10 mm; such a design ensures that the circumferential edge of the wafer support supports the circumferential edge of the wafer.

[0009] As a preferred solution of the utility model, the driving mechanism includes a motor, which is fixedly installed at the center of the base, and a first gear is fixedly mounted on the output shaft of the motor. Three second gears are arranged in a circular array on the circumferential side wall of the first gear, and the second gears are respectively fixedly mounted on corresponding rotating shafts; the first gear is driven to rotate by the motor, and the first gear simultaneously drives the second gear to rotate, thereby driving the rotating shaft to rotate simultaneously, so that the rotating support block rotates, thereby realizing the simultaneous rotation of three groups of wafer supports and limit columns, thereby realizing the bearing of wafers of different sizes, and improving the adaptability of the device.

[0010] The beneficial effects of the utility model are as follows: by controlling the rotation of the motor, the three rotating support blocks on the circumferential edge of the upper surface of the cylindrical boss are adjusted to rotate simultaneously, thereby driving the three groups of wafer supports and limiting columns to rotate simultaneously, thereby flexibly adjusting the size of the bearing range of the device, realizing the bearing of wafers of different diameters, and improving its flexibility and adaptability in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is a bottom view schematic diagram of the overall structure of the utility model;

[0013] Figure 3 It is a schematic diagram of the cylindrical boss and the bearing mechanism of the utility model;

[0014] Figure 4 It is a schematic diagram of the driving mechanism of the utility model.

[0015] In the figure: 1-base, 2-cylindrical boss, 3-bearing mechanism, 4-driving mechanism, 11-first mounting hole, 12-second mounting hole, 21-through hole, 22-fixing ear, 31-rotating shaft, 32-rotating support block, 33-wafer support, 34-limiting column, 41-motor, 42-first gear, 43-second gear. DETAILED DESCRIPTION

[0016] Example 1

[0017] like Figures 1 to 4 As shown, a wafer carrying device described in the utility model adopts a technical solution that includes a base 1, a plurality of second mounting holes 12 are arranged in a circumferential array on the circumferential edge of the base 1, a cylindrical boss 2 is fixedly installed on the upper surface of the base 1, the cylindrical boss 2 is a hollow shell, three through holes 21 are arranged in a circumferential array on the circumferential side wall edge of the top of the cylindrical boss 2, first mounting holes 11 are also arranged on the base 1 corresponding to the mounting holes of the fixing ears 22, four fixing ears 22 are arranged in a circumferential array on the circumferential outer wall of the cylindrical boss 2, a carrying mechanism 3 is respectively installed in the through hole 21, the carrying mechanism 3 includes a rotating shaft 31, the rotating shaft 31 is respectively rotatably inserted in the through hole 21, the upper end of the rotating shaft 31 is fixedly connected to one end of a rotating support block 32, the rotating support block 32 The upper surface of the other end is fixedly connected to the wafer holder 33, the distance between the upper surface of the rotating support block 32 and the upper surface of the wafer holder 33 is 5mm, the upper end center of the wafer holder 33 is fixedly connected to the limiting column 34, the spacing between the circumferential side wall of the wafer holder 33 and the circumferential side wall of the limiting column 34 is 5-10mm, the rotating shaft 31 is simultaneously driven to rotate by the driving mechanism 4, the driving mechanism 4 is installed inside the cylindrical boss 2, the driving mechanism 4 includes a motor 41, the motor 41 is fixedly installed at the center of the base 1, the output shaft of the motor 41 is fixedly mounted with a first gear 42, the circumferential side wall of the first gear 42 is provided with three second gears 43 in a circular array, and the second gears 43 are respectively fixedly mounted on the corresponding rotating shaft 31.

[0018] The working principle of the utility model is as follows: when in use, the device is fixed through the second mounting hole 12 opened on the circumferential edge of the base 1, and then the motor 41 is controlled to rotate, driving the first gear 42 to rotate, and the first gear 42 rotates and drives the second gear 43 to rotate at the same time, and the second gear 43 drives the rotating shaft 31 to rotate at the same time, and the rotating shaft 31 drives the rotating support block 32 to rotate, and the other end of the rotating support block 32 carries a wafer support table 33 and a limiting column 34 to realize the bearing support of wafers of different sizes.

[0019] The electrical connection methods or structures not described in detail herein are prior art.

[0020] Although the specific embodiments of the present invention are described in detail above, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the field without departing from the purpose of the present invention, and modifications or deformations without creative labor are still within the scope of protection of the present invention.

Claims

1. A wafer carrying device, characterized in that: The invention comprises a base (1), a cylindrical boss (2) being fixedly mounted on the upper surface of the base (1), the cylindrical boss (2) being a hollow shell, three through holes (21) being arranged in a circumferential array on the circumferential side wall edge of the top of the cylindrical boss (2), a bearing mechanism (3) being respectively mounted in the through holes (21), the bearing mechanism (3) comprising a rotating shaft (31), the rotating shaft (31) being rotatably inserted in the through holes (21), the upper end of the rotating shaft (31) being fixedly connected to one end of a rotating support block (32), the upper surface of the other end of the rotating support block (32) being fixedly connected to a wafer support table (33), the upper end center of the wafer support table (33) being fixedly connected to a limiting column (34), the rotating shaft (31) being simultaneously driven to rotate by a driving mechanism (4), the driving mechanism (4) being mounted inside the cylindrical boss (2).

2. A wafer carrier according to claim 1, characterized in that: The cylindrical boss (2) has four fixing ears (22) arranged in a circumferential array on the circumferential outer wall thereof.

3. A wafer carrying device according to claim 2, characterized in that: The base (1) corresponding to the mounting holes of the fixing ears (22) is also provided with first mounting holes (11), and a plurality of second mounting holes (12) are arranged in a circular array on the circumferential edge of the base (1).

4. A wafer carrying device according to claim 1, characterized in that: The distance between the upper surface of the rotating support block (32) and the upper surface of the wafer support table (33) is 5 mm.

5. The wafer carrier device according to claim 1, characterized in that: The distance between the circumferential side wall of the wafer support (33) and the circumferential side wall of the limiting column (34) is 5-10 mm.

6. The wafer carrier device according to claim 1, characterized in that: The driving mechanism (4) comprises a motor (41), the motor (41) being fixedly mounted at the center of the base (1), a first gear (42) being fixedly mounted on the output shaft of the motor (41), three second gears (43) being arranged in a circumferential array on the circumferential side wall of the first gear (42), and the second gears (43) being fixedly mounted on corresponding rotating shafts (31) respectively.

Images