High-efficiency bearing frame for circuit board
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI YONGCHANG TECHNOLOGY CO LTD
- Filing Date
- 2025-08-21
- Publication Date
- 2026-06-26
AI Technical Summary
Existing technologies that use edge clamping or pin-type conveying of ring circuit boards are prone to damage, resulting in economic losses.
A high-efficiency support frame for circuit boards is designed, including a support plate, clearance holes, annular support surface and buffer. The clearance holes and support surface support the annular circuit board to avoid direct contact with electrical components, and the buffer reduces wear.
It effectively reduces the probability of damage to toroidal circuit boards, improves load-bearing efficiency and service life, and reduces economic losses.
Smart Images

Figure CN224410186U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board support, and in particular to a high-efficiency support frame for circuit boards. Background Technology
[0002] After the circuit board is manufactured and formed, it needs to be cut into several ring-shaped circuit boards. After being cut out, the ring-shaped circuit boards need to undergo cleaning, drying, electrical testing, and AOI final inspection.
[0003] In the prior art, the ring circuit board is usually transported by edge clamping or ejector pin conveying in the above process steps. However, the above conveying methods have a high risk of damaging the ring circuit board and can easily cause economic losses.
[0004] Therefore, it is necessary to propose a high-efficiency support frame for circuit boards to avoid damage to ring-shaped circuit boards, which has become an important technical problem that urgently needs to be solved. Utility Model Content
[0005] This application provides a high-efficiency carrier for circuit boards, which aims to solve the problem that the existing technology usually uses edge clamping or pin-type conveying to transport ring circuit boards, but the above-mentioned conveying methods all have the risk of damaging the ring circuit boards.
[0006] To achieve the above objectives, this application proposes a high-efficiency support frame for circuit boards, comprising: a support plate; and further comprising: a plurality of first clearance holes, wherein the support plate is provided with a plurality of first clearance holes at intervals; a second clearance hole, wherein the second clearance hole is formed on the support plate, the second clearance hole is located above the first clearance holes and is coaxially arranged with the first clearance holes, and the inner diameter of the second clearance hole is larger than that of the first clearance hole; and an annular support surface, wherein an annular support surface is formed between the first clearance holes and the second clearance holes to support an annular circuit board, wherein the outer diameter of the circuit board is equal to the inner diameter of the second clearance hole.
[0007] In some embodiments, the system further includes: a plurality of positioning through holes, wherein the carrier plate is provided with a plurality of positioning through holes at intervals.
[0008] In some embodiments, the system further includes a pick-and-place slot, which is disposed adjacent to the second clearance hole and is connected to the second clearance hole.
[0009] In some embodiments, it further includes: an intermediate support post, wherein an intermediate support post is coaxially disposed within the first clearance hole, and the inner diameter of the annular circuit board is equal to the outer diameter of the intermediate support post.
[0010] In some embodiments, the system further includes a first buffer, wherein the first buffer is disposed at the bottom of the support plate.
[0011] In some embodiments, it also includes:
[0012] The second buffer is provided on the left and right sides of the bearing plate.
[0013] This application proposes a high-efficiency support frame for circuit boards, comprising: a support plate; and further comprising: multiple first clearance holes spaced apart on the support plate; second clearance holes formed on the support plate, located above and coaxially aligned with the first clearance holes, the inner diameter of the second clearance hole being larger than that of the first clearance holes; and an annular support surface formed between the first and second clearance holes to support the annular circuit board, the outer diameter of the circuit board being equal to the inner diameter of the second clearance hole. During the support process of the circuit board, the annular circuit board is placed into the second clearance hole, and the annular circuit board abuts against the annular support surface under the action of gravity, thereby achieving the support of the annular circuit board. The first clearance holes are used to avoid electrical components on the annular circuit board. This method effectively supports the annular circuit board, resulting in a low probability of damage to the circuit board. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:
[0015] Figure 1 This is a three-dimensional structural diagram of a high-efficiency support frame for circuit boards according to an embodiment of this application;
[0016] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;
[0017] Figure 3 This is a three-dimensional structural diagram of another high-efficiency support frame for circuit boards in one embodiment of this application.
[0018] In the figure: 1. Support plate; 2. Positioning through hole; 3. Second buffer; 4. First buffer; 5. Second clearance hole; 6. First clearance hole; 7. Pick-up and drop groove; 8. Annular support surface; 9. Intermediate support column. Detailed Implementation
[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0020] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0021] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.
[0022] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.
[0023] See Figure 1 and Figure 2 As shown, this application proposes a high-efficiency support frame for circuit boards, comprising: a support plate 1; and further comprising: a plurality of first clearance holes 6, wherein the support plate 1 is provided with a plurality of first clearance holes 6 at intervals; a second clearance hole 5, wherein the second clearance hole 5 is formed on the support plate 1, the second clearance hole 5 is located above the first clearance holes 6 and is coaxially arranged with the first clearance holes 6, and the inner diameter of the second clearance hole 5 is larger than that of the first clearance hole 6; and an annular support surface 8, wherein an annular support surface 8 is formed between the first clearance holes 6 and the second clearance holes 5 to support an annular circuit board, wherein the outer diameter of the circuit board is equal to the inner diameter of the second clearance hole 5.
[0024] The support plate 1 is the structural foundation of the high-efficiency support frame for circuit boards. All other structures on the high-efficiency support frame for circuit boards are directly or indirectly set on the support plate 1. The support plate 1 is preferably cuboid in shape. When the support plate 1 is placed on the conveyor belt, it can be moved by the conveyor belt or conveyor chain. The four edges of the support plate 1 that are parallel to the height direction are rounded to reduce the sharpness of the edges and prevent injury to workers.
[0025] The first clearance hole 6, the second clearance hole 5, and the annular support surface 8 are the core structures of the high-efficiency support frame for circuit boards. The annular circuit board is placed in the second clearance hole 5, and under the action of gravity, it abuts against the annular support surface 8, thus achieving support for the annular circuit board. The first clearance hole 6 is used to allow electrical components on the annular circuit board to pass.
[0026] In this embodiment, nine first clearance holes 6 and nine corresponding second clearance holes 5 are provided, allowing nine annular circuit boards to be placed at once, which improves load-bearing efficiency. The diameter difference between the first clearance holes 6 and the second clearance holes 5 is within the range of 1mm to 3mm. This difference can be adjusted during production according to engineering parameters to maintain a small diameter difference between the first clearance holes 6 and the second clearance holes 5, effectively supporting the annular circuit boards and preventing electrical components from contacting them.
[0027] Specifically, during the circuit board bearing process, the annular circuit board is placed into the second clearance hole 5. Under the action of gravity, the annular circuit board abuts against the annular support surface 8, thereby achieving bearing of the annular circuit board. The first clearance hole 6 is used to avoid electrical components on the annular circuit board. By using the above method, the annular circuit board is effectively supported, and the probability of damage to the circuit board is low.
[0028] The support plate 1 is made of wood. The wood-based support plate 1 possesses sufficient mechanical strength and is not easily worn by the circuit board. The wood-based support plate 1 is also lightweight, facilitating its transfer via conveyor belt or conveyor chain. The support plate 1 is coated with an anti-corrosion coating. Tung oil is preferably used as the anti-corrosion coating.
[0029] See Figure 1 and Figure 2 As shown, in some embodiments, it further includes: multiple positioning through holes 2, with multiple positioning through holes 2 spaced apart on the carrier plate 1. During the final AOI inspection of the annular circuit board, it is necessary to fix the position of the carrier plate 1. At this time, a positioning rod that can be raised can be set at a fixed position. When the carrier plate 1 moves to a preset position, the positioning rod rises and inserts into the corresponding positioning through hole 2, thereby fixing the annular circuit board to the preset position.
[0030] In this embodiment, the bottom of the positioning through hole 2 is provided with a tapered enlarged diameter section. The enlarged diameter section can effectively guide the positioning rod and facilitate the insertion of the positioning rod.
[0031] See Figure 1 and Figure 2As shown, in some embodiments, it further includes a pick-and-place groove 7, which is located adjacent to the second clearance hole 5 and communicates with the second clearance hole 5. When it is necessary to remove the annular circuit board, a finger can be inserted into the pick-and-place groove 7 to press against the edge of the annular circuit board to remove it. Similarly, the pick-and-place groove 7 facilitates the placement of the annular circuit board. Preferably, the depth of the pick-and-place groove 7 is greater than the depth of the second clearance hole 5.
[0032] See Figure 3 As shown, in some embodiments, it further includes: an intermediate support post 9, which is coaxially disposed within the first clearance hole 6, and the inner diameter of the annular circuit board is equal to the outer diameter of the intermediate support post 9. The intermediate support post 9 is used to better position the annular circuit board and ensure that the annular circuit board and the first clearance hole 6 are coaxial.
[0033] See Figure 1 and Figure 2 As shown, in some embodiments, it further includes: a first buffer 4, which is disposed at the bottom of the support plate 1. The first buffer 4 is bonded to the bottom of the support plate 1. The first buffer 4 is a rubber component. The conveyor chain contacts the support plate 1 through the first buffer 4, effectively forming a buffer between the first buffer 4 and the conveyor chain, thereby enhancing the service life of the support plate 1.
[0034] See Figure 1 and Figure 2 As shown, in some embodiments, a second buffer 3 is further included, with the second buffer 3 disposed on the left and right sides of the support plate 1. Two second buffers 3 are respectively bonded to the left and right sides of the support plate 1. During the cleaning, drying, and electrical testing processes of the support plate 1, it is necessary to fix the support plate 1 vertically. The aforementioned fixing method generally involves setting cylinders on both the left and right sides of the support plate 1, and then fixing the support plate 1 through clamps connected to the cylinders. The provision of the second buffer 3 can effectively form a buffer layer between the clamps and the support plate 1, thereby enhancing the service life of the support plate 1.
[0035] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.
Claims
1. A high-efficiency support frame for circuit boards, comprising: Support plate (1); The feature is that it further includes: a plurality of first clearance holes (6), and the bearing plate (1) is provided with a plurality of first clearance holes (6) at intervals. The second clearance hole (5) is opened on the bearing plate (1). The second clearance hole (5) is located above the first clearance hole (6) and is coaxially arranged with the first clearance hole (6). The inner diameter of the second clearance hole (5) is larger than that of the first clearance hole (6). The annular support surface (8) is formed between the first clearance hole (6) and the second clearance hole (5) to support the annular circuit board. The outer diameter of the circuit board is equal to the inner diameter of the second clearance hole (5).
2. The high-efficiency support frame for circuit boards according to claim 1, characterized in that, Also includes: Multiple positioning through holes (2) are provided on the bearing plate (1) at intervals.
3. The high-efficiency support frame for circuit boards according to claim 1, characterized in that, Also includes: The pick-and-place slot (7) is located adjacent to the second clearance hole (5) and is connected to the second clearance hole (5).
4. The high-efficiency support frame for circuit boards according to claim 1, characterized in that, Also includes: The intermediate support column (9) is coaxially arranged inside the first clearance hole (6), and the inner diameter of the annular circuit board is equal to the outer diameter of the intermediate support column (9).
5. The high-efficiency support frame for circuit boards according to claim 1, characterized in that, Also includes: The first buffer (4) is disposed at the bottom of the bearing plate (1).
6. The high-efficiency support frame for circuit boards according to claim 1, characterized in that, Also includes: The second buffer (3) is provided on the left and right sides of the bearing plate (1).