Alkali-resistant ultrasonic cleaning FPC

Abstract

The utility model discloses an alkali-resistant ultrasonic cleaning FPC, which comprises an FPC body and electromagnetic shielding films, the electromagnetic shielding films comprise a first shielding film and a second shielding film, and the first shielding film and the second shielding film respectively cover the upper surface and the lower surface of the FPC. The electromagnetic shielding film comprises a shielding layer, a soft film layer and a hard film layer which are sequentially stacked from bottom to top, the upper surface of the soft film layer and the upper surface of the hard film layer are each provided with a chemical impedance processing layer, and the first shielding film and the second shielding film which are located on the FPC body are arranged in a staggered mode. As the chemical impedance treatment layers are arranged on the upper surfaces of the soft film layer and the hard film layer, the electromagnetic shielding film cannot be burnt when being subjected to ultrasonic cleaning by an alkaline cleaning agent, so that the anti-interference effect of the electromagnetic shielding film is ensured, and the product competitiveness is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to an alkali-resistant ultrasonic cleaning FPC. Background Art

[0002] After SMT, the camera module needs to be cleaned ultrasonically to remove the contaminants left by SMT. Alkaline detergent is added during ultrasonic cleaning so that the camera module can be cleaned more thoroughly.

[0003] As customers' requirements for camera module performance become higher, FPC-type camera modules often need to add electromagnetic shielding film to the FPC to reduce the electromagnetic interference of subsequent equipment or signals on the camera module transmission signal.

[0004] However, ordinary electromagnetic shielding films are often burned by alkaline detergents during ultrasonic cleaning, which will affect the anti-electromagnetic interference effect of the electromagnetic film, reduce the anti-interference effect, and reduce the competitiveness of the product. Utility Model Content

[0005] The technical problem to be solved by the utility model is how to ensure the anti-interference effect of the electromagnetic shielding film during alkaline ultrasonic cleaning and improve the competitiveness of the product.

[0006] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0007] In order to solve the above technical problems, the utility model provides an FPC resistant to alkali ultrasonic cleaning, which includes an FPC body and an electromagnetic shielding film, the electromagnetic shielding film includes a first shielding film and a second shielding film, the first shielding film and the second shielding film respectively cover the upper surface and the lower surface of the FPC, the electromagnetic shielding film includes a shielding layer, a soft film layer and a hard film layer stacked in sequence from bottom to top, the upper surfaces of the soft film layer and the hard film layer are both provided with a chemical impedance treatment layer, and the first shielding film and the second shielding film located on the FPC body are staggered with each other.

[0008] As a preferred implementation of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, a grid layer is provided on the FPC body, the routing of the grid layer is high-density routing, and the routing of the grid layer is thick-line width routing.

[0009] As a preferred implementation of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, the length of the first shielding film located above the FPC body is longer than the length of the second shielding film located below the FPC body.

[0010] As a preferred implementation of the FPC resistant to alkali ultrasonic cleaning provided by the utility model, the first shielding film and the second shielding film have the same length but different starting positions.

[0011] As a preferred embodiment of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, the FPC body includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.

[0012] As a preferred embodiment of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, the FPC body also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.

[0013] As a preferred implementation of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.

[0014] As a preferred implementation of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.

[0015] As a preferred embodiment of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, a two-dimensional code laser area is provided on the upper surface of the FPC, and a black ink layer and a white ink layer provided on the black ink layer are provided on the upper surface of the FPC located on the two-dimensional code laser area, and the white ink layer is formed with a two-dimensional code by laser.

[0016] As a preferred embodiment of the alkali-resistant ultrasonic cleaning FPC provided by the utility model, the thickness of the black ink layer is 30 μm ～ 40μm, the thickness of the white ink layer is 10μm ～ 20μm.

[0017] The utility model has the following beneficial effects:

[0018] Since the upper surfaces of the soft film layer and the hard film layer are both provided with a chemical impedance treatment layer, the electromagnetic shielding film will not be burned during ultrasonic cleaning with an alkaline detergent, thereby ensuring the anti-interference effect of the electromagnetic shielding film and improving product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 The utility model provides a structural schematic diagram of an alkali-resistant ultrasonic cleaning FPC.

[0021] Figure 2 for Figure 1 Schematic diagram of the structure of electromagnetic shielding film.

[0022] Figure 3 for Figure 2 Schematic diagram of the stacked structure.

[0023] Figure 4 This is a schematic diagram of the structure of Example 2.

[0024] Figure 5 This is a schematic diagram of the structure of Example 3.

[0025] Description of Figure Numbers:

[0026] FPC body 1; electromagnetic shielding film 2; first shielding film 201; second shielding film 202; shielding layer 21; soft film layer 22; hard film layer 23; chemical impedance treatment layer 24; glue layer 25;

[0027] Base material layer 11; circuit layer 12; metal heat dissipation layer 13; through hole 14;

[0028] Black ink layer 101; white ink layer 102. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] The utility model provides an FPC resistant to alkali ultrasonic cleaning, which comprises an FPC body and an electromagnetic shielding film, wherein the electromagnetic shielding film comprises a first shielding film and a second shielding film, wherein the first shielding film and the second shielding film respectively cover the upper surface and the lower surface of the FPC, wherein the electromagnetic shielding film comprises a shielding layer, a soft film layer and a hard film layer which are sequentially stacked from bottom to top, wherein the upper surfaces of the soft film layer and the hard film layer are both provided with a chemical impedance treatment layer, and the first shielding film and the second shielding film which are located on the FPC body are staggered with each other.

[0033] Since the upper surfaces of the soft film layer and the hard film layer are both provided with a chemical impedance treatment layer, the electromagnetic shielding film will not be burned during ultrasonic cleaning with an alkaline detergent, thereby ensuring the anti-interference effect of the electromagnetic shielding film and improving product competitiveness.

[0034] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.

[0035] Example 1

[0036] See also Figures 1 to 3, an alkaline-resistant ultrasonic cleaning FPC provided by the utility model, comprising an FPC body 1 and an electromagnetic shielding film 2, the electromagnetic shielding film 2 comprising a first shielding film 201 and a second shielding film 202, the first shielding film 201 and the second shielding film 202 respectively covering the upper surface and the lower surface of the FPC, the electromagnetic shielding film 2 comprising a shielding layer 21, a soft film layer 22 and a hard film layer 23 stacked in sequence from bottom to top, the upper surfaces of the soft film layer 22 and the hard film layer 23 are both provided with a chemical impedance treatment layer 24, the first shielding film 201 and the second shielding film 202 located on the FPC body 1 are staggered, the positions of the first shielding film 201 and the second shielding film 202 cannot be kept flush, and it is generally recommended that the two surfaces differ by about 0.5mm, because if it is kept flush, that is, there are steps on the upper and lower sides of this position of the FPC, and it is easy to be broken from here when bending. The lower surface of the shielding layer 21 is provided with a glue layer 25 so that the shielding layer 21 can be pasted on the surface of the FPC body 1.

[0037] Furthermore, a grid layer is provided on the FPC body 1, and the routing of the grid layer is high-density routing, and the routing of the grid layer is thick-line routing. The denser the routing of the grid layer, the greater the density of the hard film layer 23 and the soft film layer 22 attached to this layer, that is, the greater the impedance. Similarly, the thicker the line width of the routing of the grid layer, the greater the width of the hard film layer 23 and the soft film layer 22 attached here, that is, the greater the impedance.

[0038] Furthermore, the length of the first shielding film 201 located above the FPC body 1 is longer than the length of the second shielding film 202 located below the FPC body 1, so that the positions of the first shielding film 201 and the second shielding film 202 cannot be kept flush to prevent breaking.

[0039] Furthermore, the first shielding film 201 and the second shielding film 202 have the same length but different starting positions, so that the positions of the first shielding film 201 and the second shielding film 202 cannot be kept flush to prevent breaking.

[0040] Example 2

[0041] See also Figure 4As a further optimization scheme of Example 1, in this embodiment, the FPC body 1 includes a substrate layer 11, a circuit layer 12 arranged on the upper surface of the substrate layer 11, and a metal heat dissipation layer 13 arranged on the lower surface of the substrate layer 11. The arrangement method can be that the circuit layer 12 and the metal heat dissipation layer 13 are respectively attached to the substrate layer 11 by double-sided adhesive. Since the thickness of the substrate layer 11 is relatively thin, the heat on the FPC body 1 can be diffused to the metal heat dissipation layer 13 through the substrate layer 11. The metal heat dissipation layer 13 can effectively increase the heat dissipation area of ​​the FPC body 1 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC body 1. The substrate layer 11 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 13 can be a copper foil layer.

[0042] Furthermore, the FPC body 1 also includes at least one through-hole 14 penetrating the substrate layer 11, the circuit layer 12 and the metal heat dissipation layer 13, and the inner wall of the through-hole 14 is provided with a heat-conducting layer in contact with the circuit layer 12 and the metal heat dissipation layer 13. By utilizing the good thermal conductivity of the through-hole 14, the circuit layer 12 and the metal heat dissipation layer 13 on both sides of the substrate layer 11 can be electrically connected to play a good thermal conductivity function, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.

[0043] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 14, and the heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 12, and is also in contact with the heat-conducting layer in the through hole 14, so that the circuit layer 12 and the metal heat dissipation layer 13 can be connected to the external heat-conducting structure through the through hole 14, so that the heat in the FPC body 1 is diffused to the external heat-conducting structure through the heat conductor in the through hole 14, so as to further improve the heat dissipation efficiency of the FPC body 1. Preferably, in order to enable the through hole 14 to be connected to the external heat-conducting structure, the through hole 14 is disposed at the edge of the FPC body 1.

[0044] Furthermore, the metal heat dissipation layer 13 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.

[0045] Example 3

[0046] See also Figure 5As a further optimization scheme of Example 1, in this embodiment, a two-dimensional code laser area is further provided on the upper surface of the FPC body 1. A black ink layer 101 and a white ink layer 102 provided on the black ink layer 101 are provided on the upper surface of the FPC body 1 located on the two-dimensional code laser area. The white ink layer 102 is formed with a two-dimensional code by laser. Since two layers of ink are provided, the black ink layer 101 and the white ink layer 102, the surface white ink layer 102 is lasered off by laser to expose the bottom black ink layer 101. The area where the laser is lasered is displayed as black. The two-dimensional code generated in this way has a good contrast effect and is easy to scan. At the same time, the two-dimensional code will not fall off and be damaged, which prevents the two-dimensional code from being invalid, and greatly reduces the labor cost.

[0047] Furthermore, the thickness of the black ink layer 101 is 30 μm. ～ 40 μm. The thickness of the white ink layer 102 is 10 μm ～ 20μm. This thickness is the thickness that the commonly used ultraviolet laser can just penetrate, and there is no dust around after the laser irradiation, which has the advantages of high rhythm and efficiency. The reason why the thickness of the lower black ink layer 101 is thicker than the thickness of the upper white ink layer 102 is to avoid laser power energy fluctuations and prevent the black ink layer 101 from being penetrated by the laser and causing damage to the internal layer of the FPC body 1.

[0048] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. An FPC resistant to alkaline ultrasonic cleaning, It is characterized in that It includes an FPC body and an electromagnetic shielding film, the electromagnetic shielding film includes a first shielding film and a second shielding film, the first shielding film and the second shielding film respectively cover the upper surface and the lower surface of the FPC, the electromagnetic shielding film includes a shielding layer, a soft film layer and a hard film layer stacked in sequence from bottom to top, the upper surfaces of the soft film layer and the hard film layer are both provided with a chemical impedance treatment layer, and the first shielding film and the second shielding film located on the FPC body are staggered with each other.

2. The FPC resistant to alkali ultrasonic cleaning according to claim 1, It is characterized in that A grid layer is arranged on the FPC body, the routing of the grid layer is high-density routing, and the routing of the grid layer is thick-line width routing.

3. The FPC resistant to alkali ultrasonic cleaning according to claim 1, It is characterized in that The length of the first shielding film located above the FPC body is longer than the length of the second shielding film located below the FPC body.

4. The FPC resistant to alkali ultrasonic cleaning according to claim 1, It is characterized in that The first and second shielding films have the same length but different starting positions.

5. The FPC resistant to alkali ultrasonic cleaning according to claim 1, It is characterized in that The FPC body includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.

6. The FPC resistant to alkali ultrasonic cleaning according to claim 5, It is characterized in that The FPC body further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.

7. The FPC resistant to alkali ultrasonic cleaning according to claim 6, It is characterized in that A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.

8. The FPC resistant to alkali ultrasonic cleaning according to claim 5, It is characterized in that The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.

9. The FPC resistant to alkali ultrasonic cleaning according to claim 1, It is characterized in that A two-dimensional code laser area is arranged on the upper surface of the FPC, a black ink layer and a white ink layer arranged on the black ink layer are arranged on the upper surface of the FPC body located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.

10. The FPC resistant to alkali ultrasonic cleaning according to claim 9, It is characterized in that The thickness of the black ink layer is 30 μm ～ 40μm, the thickness of the white ink layer is 10μm ～ 20μm.

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