Preheating cleaning device and battery production system

Abstract

The utility model provides a preheating cleaning device and a battery production system. The problem that in the prior art, the welding quality of a circuit board is poor is solved. The preheating cleaning device comprises a mounting plate, a preheating assembly and a cleaning assembly; the mounting plate is provided with a to-be-heated surface which is used for placing a circuit board; the preheating assembly comprises a heat conduction structure. The heat conduction structure is provided with a flow channel used for allowing a medium to flow. The heat conduction structure is arranged on the mounting plate; the heat conduction structure is used for transferring heat of a medium in the flow channel to a to-be-heated surface; the cleaning assembly is used for cleaning the circuit board placed on the surface to be heated.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a preheating and cleaning device and a battery production system. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board. A printed circuit board (PCB) is a key component used to connect and support electronic components in electronic devices. The circuit board not only provides physical support between electronic components, but also realizes the electrical connection between components through conductive paths (usually copper traces) printed on the board.

[0003] When a welding device is used to weld a circuit board, the welding quality of the circuit board after welding is poor, resulting in a low yield rate of the circuit board. Utility Model Content

[0004] The main technical problem solved by the present application is to provide a preheating and cleaning device and a battery production system to solve the problem of poor welding quality of circuit boards in the prior art.

[0005] In order to solve the above technical problems, the first technical solution adopted in the present application is: to provide a preheating and cleaning device, the preheating and cleaning device includes a mounting plate, a preheating component and a cleaning component; the mounting plate has a surface to be heated, and the surface to be heated is used to place the circuit board; the preheating component includes a heat-conducting structure; the heat-conducting structure has a flow channel, and the flow channel is used for medium flow; the heat-conducting structure is arranged on the mounting plate; the heat-conducting structure is used to transfer the heat of the medium in the flow channel to the surface to be heated; the cleaning component is used to clean the circuit board placed on the surface to be heated.

[0006] In this embodiment, a circuit board is placed on the surface to be heated, a medium is introduced into the flow channel of the heat-conducting structure, the medium flows in the flow channel, and the heat of the medium is transferred to the heat-conducting structure. Since the heat-conducting structure is arranged on the mounting plate, the heat of the heat-conducting structure is transferred to the mounting plate, thereby increasing the temperature of the surface to be heated on the mounting plate. Since the circuit board is placed on the surface to be heated, the temperature of the circuit board is increased, which plays a role in preheating the circuit board. The cleaning component can be used to clean impurities on the circuit board, thereby reducing impurities on the circuit board and playing a role in cleaning the circuit board. When the preheated and cleaned circuit board is welded, the temperature difference between the circuit board and the welding temperature is reduced, and the cleanliness of the circuit board is improved, thereby improving the welding quality, so that the yield of the circuit board is also improved.

[0007] In some embodiments, the heat-conducting structure includes a heat-conducting plate and a coil; the heat-conducting plate is fixed on the first surface; the pipe of the coil is a flow channel; the coil is arranged on the surface of the heat-conducting plate away from the first surface; the first surface is arranged opposite to the surface to be heated.

[0008] In this embodiment, after the medium is introduced into the coil, the heat of the medium is transferred to the coil. The coil is arranged on the surface of the heat conducting plate away from the first surface, so that the heat of the coil is transferred to the heat conducting plate. The heat conducting plate is fixed to the first surface, so that the heat on the heat conducting plate is transferred to the first surface of the mounting plate, thereby increasing the temperature of the surface to be heated on the mounting plate. The contact area between the heat conducting plate and the first surface is large, so that the temperature at different positions of the surface to be heated is roughly the same, thereby improving the uniformity of the temperature of the surface to be heated, reducing the risk of deformation of the circuit board due to uneven heating, and further improving the yield of the circuit board.

[0009] In some embodiments, the preheating assembly further includes an insulation box; the insulation box is disposed on the first surface and has an opening facing the first surface; the heat conducting plate and the coil are both located in the insulation box through the opening.

[0010] In this embodiment, the heat preservation box can improve the utilization rate of the heat of the heat-conducting structure, thereby increasing the rate of preheating the circuit board.

[0011] In some embodiments, the preheating assembly also includes a liquid storage tank and a water pump; the liquid storage tank is used to store and heat liquid; the inlet of the water pump is connected to the liquid storage tank; one end of the coil extends out of the insulation box and is connected to the outlet of the water pump; the other end of the coil extends out of the insulation box and is connected to the liquid storage tank.

[0012] In this embodiment, the liquid in the liquid storage tank can be transported to the coil by a water pump. The coil, the liquid storage tank and the water pump can form a circulation loop to achieve the purpose of reusing the liquid. The liquid storage tank can replenish the heat lost by the liquid, so that the liquid transported to the coil is always at a relatively stable temperature.

[0013] In some embodiments, the cleaning assembly includes a cleaning part, an elastic member and a connecting member; the cleaning part is connected to one end of the elastic member, and the other end of the elastic member is connected to the connecting member; the connecting member is restricted from moving in a direction perpendicular to the surface to be heated; the elastic member is used to provide elastic force to the cleaning part so that the cleaning part can always contact the circuit board placed on the surface to be heated.

[0014] In this embodiment, the elastic member allows the cleaning part to always contact the circuit board and have a certain contact pressure, so that the cleaning part can fully clean the circuit board, thereby improving the cleaning rate of the circuit board and further improving the welding quality of the circuit board.

[0015] In some embodiments, the cleaning component also includes a mounting portion and a sliding portion; the mounting portion is arranged on the mounting plate and has a slide groove; the extension direction of the slide groove is parallel to the surface to be heated; the sliding portion is connected to the connecting piece and is slidably arranged in the slide groove.

[0016] In this embodiment, by utilizing the cooperation of the slide groove of the mounting part and the sliding part, the connecting part, the elastic part and the cleaning part can slide as a whole relative to the mounting plate, so that the cleaning part can clean the circuit board placed on the surface to be heated, thereby speeding up the cleaning rate of the circuit board.

[0017] In some embodiments, the cleaning assembly further includes a screw mechanism, which is connected to the mounting plate; the screw mechanism is connected to the sliding portion, driving the sliding portion to slide in the sliding groove.

[0018] In this embodiment, the lead screw mechanism can be used to drive the sliding part to slide, thereby realizing automatic cleaning.

[0019] In some embodiments, the cleaning component also includes a collecting portion and a bracket; the mounting plate is fixed on the bracket; the collecting portion and the mounting plate are arranged opposite to each other; the surface of the mounting plate away from the collecting portion is an inclined surface to be heated; the collecting portion is slidably connected to the bracket; the collecting portion can be slid out from the lower end of the surface to be heated and is used to collect impurities.

[0020] In this embodiment, when cleaning the circuit board placed on the surface to be heated, the collecting part is slid out from the lower end of the surface to be heated, and the cleaning part allows the impurities on the circuit board to fall onto the surface to be heated; the inclined surface to be heated can allow the impurities to slide from the surface to be heated to the lower end and fall into the collecting part, so that the collecting part plays the role of collecting impurities. After cleaning, the collecting part is slid to the bottom of the mounting plate to play the role of hiding the collecting part, thereby reducing the occupied space.

[0021] In some embodiments, the cleaning assembly further comprises a filter portion, which is located between the mounting plate and the collecting portion; the filter portion is slidably connected to the bracket; the filter portion can be slidably extended from the lower end of the surface to be heated and is used to filter impurities.

[0022] In this embodiment, when cleaning the circuit board placed on the surface to be heated, the collecting part and the filtering part are both slid out from the lower end of the surface to be heated, and the cleaning part allows the impurities on the circuit board to fall onto the surface to be heated; the inclined surface to be heated can allow the impurities to slide from the surface to be heated to the lower end and fall into the filtering part, and the filtering part filters the larger impurities and leaves them in the filtering part, while the smaller impurities fall into the collecting part through the filtering part, so that the filtering part plays the role of filtering impurities. After cleaning, the collecting part and the filtering part are both slid to the bottom of the mounting plate to hide the collecting part and the filtering part, thereby reducing the occupied space.

[0023] In order to solve the above technical problems, the second technical solution provided by the present application is: to provide a battery production system, the battery production system includes a preheating and cleaning device, a welding device and an assembly device; the preheating and cleaning device is used to preheat and clean the circuit board; the welding device is used to weld the preheated and cleaned circuit board; the assembly device is used to assemble the welded circuit board, battery box and battery cell into a battery device. Since the battery production system includes the above preheating and cleaning device, it has the same effect as the preheating and cleaning device, and will not be repeated. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 It is a structural schematic diagram of the electrical equipment provided by this application;

[0026] Figure 2 is a schematic diagram of the structure of the battery device provided by the present application;

[0027] Figure 3 It is a schematic diagram of the structure of a battery cell provided in this application;

[0028] Figure 4 It is a structural schematic diagram of a preheating and cleaning device provided by the present application;

[0029] Figure 5 It is a structural schematic diagram of another preheating cleaning device provided by the present application;

[0030] Figure 6 is a bottom view of the preheating and cleaning device provided by the present application;

[0031] Figure 7 yes Figure 5 The enlarged view at Q in the figure;

[0032] Figure 8 yes Figure 4 Magnified view at P.

[0033] In the figure: 1. battery device; 11. battery box; 111. upper box; 112. lower box; 12. battery cell; 121. connecting member; 122. cover plate; 123. pole; 124. safety valve; 125. electrode assembly; 126. shell; 3. electrical components; 2. preheating and cleaning device; 21. mounting plate; 211. surface to be heated; 212. first surface; 22. preheating assembly; 221. water pump; 222. liquid storage tank; 223. Heat-conducting structure; 2231, coil; 2232, heat-conducting plate; 224, heat-insulating box; 23, cleaning assembly; 231, connecting piece; 232, elastic piece; 233, cleaning part; 234, mounting part; 2341, slide groove; 235, sliding part; 236, screw mechanism; 24, circuit board; 25, mounting frame; 261, slider; 262, slide rail; 27, filter part; 28, collecting part; 29, bracket; 291, side panel; 292, bottom panel. DETAILED DESCRIPTION

[0034] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0035] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by technicians in this field without making creative work are within the scope of protection of this application.

[0037] The terms "first", "second" and "third" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0038] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] When a welding device is used to weld a circuit board, due to the large difference between the temperature of the circuit board and the welding temperature of the welding device, the welding device causes the temperature of the circuit board to rise rapidly. The large temperature difference may cause the circuit board to bend and deform, the solder joints to be loose, etc., resulting in poor welding quality of the circuit board after welding. When there are many impurities on the circuit board, the impurities may cause the solder joints to be loose, resulting in poor welding quality of the circuit board after welding, thereby resulting in a low yield rate of the circuit board.

[0040] In order to solve the problem of poor welding quality of existing circuit boards, an embodiment of the present application provides a preheating cleaning device, which includes a mounting plate, a preheating component and a cleaning component; the mounting plate has a surface to be heated, and the surface to be heated is used to place the circuit board; the preheating component includes a heat-conducting structure; the heat-conducting structure has a flow channel, and the flow channel is used for medium flow; the heat-conducting structure is arranged on the mounting plate; the heat-conducting structure is used to transfer the heat of the medium in the flow channel to the surface to be heated; the cleaning component is used to clean the circuit board placed on the surface to be heated. The circuit board is placed on the surface to be heated, and the medium is introduced into the flow channel of the heat-conducting structure. The medium flows in the flow channel, and the heat of the medium is transferred to the heat-conducting structure. Since the heat-conducting structure is arranged on the mounting plate, the heat of the heat-conducting structure is transferred to the mounting plate, thereby increasing the temperature of the surface to be heated on the mounting plate. Since the circuit board is placed on the surface to be heated on the mounting plate, the temperature of the circuit board is increased, which plays a role in preheating the circuit board. The cleaning component can be used to clean impurities on the circuit board, thereby reducing impurities on the circuit board and playing a role in cleaning the circuit board. When the preheated and cleaned circuit board is welded, the temperature difference between the circuit board and the welding temperature is reduced, and the cleanliness of the circuit board is improved, thereby improving the welding quality of the circuit board and improving the yield rate of the circuit board.

[0041] An embodiment of the present application provides a battery production system, which includes a preheating and cleaning device, a welding device and an assembly device; the preheating and cleaning device is used to preheat and clean the circuit board; the welding device is used to weld the preheated and cleaned circuit board; the assembly device is used to assemble the welded circuit board, battery case and battery cell into a battery device.

[0042] The welding device may be a manual arc welding device, a submerged arc welding device, a CO2 gas shielded welding device, a MIG inert gas shielded welding device, a plasma arc welding device, an ultrasonic welding device, etc. The welding device may weld the welding position of the circuit board, and the welding position may be the position where the electronic component is welded on the circuit board; the electronic component may be a resistor, a capacitor, etc. The assembly device may be a robotic arm, etc.

[0043] The battery device can be a power battery, which is a power source for tools. Power batteries mostly refer to batteries that provide power for vehicles such as electric cars, electric trains, electric bicycles, golf carts, and aerospace. Of course, the battery device 1 can also be an energy storage battery, which refers to a battery used to store energy from renewable energy sources such as hydropower, thermal power, wind power, and solar power stations.

[0044] See also Figure 1The battery device 1 can be installed on an electrical device to provide electrical energy to the electrical device; for example, the battery device 1 is electrically connected to an electrical device 3 of the electrical device. The electrical device 3 can be a component or device that can use electricity; the electrical device 3 can be a controller and an electronic component, etc. The controller can be a central processing unit (CPU), a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0045] Electrical equipment can be vehicles, mobile phones, portable devices, laptops, ships, spacecraft, electric toys and electric tools, etc. Vehicles can be fuel vehicles, gas vehicles or new energy vehicles, and new energy vehicles can be pure electric vehicles, hybrid vehicles or extended-range vehicles, etc. Spacecraft include airplanes, rockets, space shuttles and spacecrafts, etc. Electric toys include fixed or mobile electric toys, such as game consoles, electric car toys, electric ship toys and electric airplane toys, etc.; electric tools include metal cutting electric tools, grinding electric tools, assembly electric tools and railway electric tools, such as electric drills, electric grinders, electric wrenches, electric screwdrivers, electric hammers, impact drills, concrete vibrators and electric planers, etc. For the convenience of explanation, the following embodiments are described by taking the electric equipment as a vehicle as an example.

[0046] In some examples, the electric device may be a vehicle, and the electric device 3 may be a lamp (such as a headlight, a taillight, etc.), a display screen, a dashboard, a control system (such as a controller), etc. of the vehicle. The electric device may also include other parts, such as a vehicle frame, and the battery device 1 and the electric device 3 are both mounted on the vehicle body.

[0047] See also Figure 2 In the battery device 1, the battery case 11 has a chamber, and one or more battery cells 12 are accommodated in the chamber; the battery case 11 can protect the battery cells 12 and also facilitate the collection of multiple battery cells 12. In some examples, the battery case 11 may include a lower case 112 and an upper case 111.

[0048] The shape of the battery case 11 can be specifically set as needed; for example, the shape of the battery case 11 can be cylindrical, and the corresponding battery device 1 can be called a round battery; for another example, the shape of the battery case 11 can be rectangular, and the corresponding battery device 1 can be called a rectangular battery.

[0049] The battery cell 12 may be a secondary battery, which refers to a battery cell 12 that can be continuously used by activating active materials by charging after the battery cell 12 is discharged. The battery cell 12 may include, but is not limited to, a lithium ion battery, a sodium ion battery, a sodium lithium ion battery, a lithium metal battery, a sodium metal battery, a lithium sulfur battery, a magnesium ion battery, a nickel metal hydride battery, a nickel cadmium battery, a lead storage battery, and the like.

[0050] See also Figure 3 The battery cell 12 may include a housing 126, an electrode assembly 125, and a cover plate 122. The housing 126 has a connected cavity and a mounting port. The number of electrode assemblies 125 may be one or more; the electrode assembly 125 is mounted in the cavity of the housing 126. The cover plate 122 is connected to the housing 126 and covers the mounting port. The housing 126 is filled with an electrolyte, such as an electrolyte.

[0051] The electrode assembly 125 may include an anode electrode sheet and a cathode electrode sheet, and a separator disposed between the anode electrode sheet and the cathode electrode sheet. During the charge and discharge process of the battery cell 12, active ions (such as lithium ions) are inserted and removed back and forth between the anode electrode sheet and the cathode electrode sheet. The separator can prevent the anode electrode sheet and the cathode electrode sheet from short-circuiting to a certain extent, and can allow active ions to pass through.

[0052] The battery cell 12 may also include a safety valve 124 (also referred to as a pressure relief valve), two poles 123 and two connecting members 121 (also referred to as current collecting members). The safety valve 124 may be provided on the cover plate 122, for example, the safety valve 124 is fixed on the cover plate 122, and the safety valve 124 is used to actuate when the internal pressure or temperature of the battery cell 12 reaches a threshold value to discharge the internal electrolyte to reduce the internal pressure or temperature of the battery cell 12. For example, the safety valve 124 may be a temperature-sensitive valve, a pressure-sensitive valve, etc. Two poles 123 may be provided on the cover plate 122, and the two poles 123 are respectively a positive pole 123 and a negative pole 123, and one pole 123 is connected to one connecting member 121 accordingly. The connecting member 121 is located between the cover plate 122 and the electrode assembly 125, and is used to electrically connect the electrode assembly 125 and the pole 123. The shell 126 is a hollow structure, and the material of the shell 126 can be metal or plastic; for example, the material of the shell 126 can be copper, iron, aluminum, steel, aluminum alloy, etc.

[0053] The circuit board 24 is used to collect voltage signals, temperature signals and other signals of the battery cells, and summarize and output them to, for example, a battery management system. The battery management system (BMS) is a system for managing battery devices. The battery management system manages and controls the battery cells based on the signals obtained from the battery device 1. For example, the battery management system may include a battery management unit (BMU), a cell management circuit (CMC), sensors and some electronic control devices. The battery management unit is connected to the cell management circuit, sensors and electronic control devices to realize the interaction of information and instructions.

[0054] The embodiment of the present application also provides a preheating cleaning device, see Figure 4~Figure 8 The preheating and cleaning device 2 includes a mounting plate 21, a preheating component 22 and a cleaning component 23; the mounting plate 21 has a surface to be heated 211, and the surface to be heated 211 is used to place a circuit board 24; the preheating component 22 includes a heat-conducting structure 223; the heat-conducting structure 223 has a flow channel, and the flow channel is used for medium flow; the heat-conducting structure 223 is arranged on the mounting plate 21; the heat-conducting structure 223 is used to transfer the heat of the medium in the flow channel to the surface to be heated 211; the cleaning component 23 is used to clean the circuit board 24 placed on the surface to be heated 211.

[0055] The preheating and cleaning device 2 can preheat and clean the circuit board 24. In one embodiment, after the preheating and cleaning process is completed, the preheated and cleaned circuit board 24 can be removed from the surface to be heated 211 and placed on a welding device for welding.

[0056] In another embodiment, the circuit board 24 does not need to be removed from the heating surface 211, so that the welding device can directly weld the circuit board 24 on the heating surface 211; after welding, the cleaning component 23 can be used to clean the circuit board 24 again.

[0057] The material of the mounting plate 21 may be a heat-conducting material, and the heat-conducting material may be a metal or a non-metallic heat-conducting material, such as ceramic. The surface 211 to be heated of the mounting plate 21 may be a plane or a curved surface. In the present embodiment, the surface 211 to be heated of the mounting plate 21 is a plane, and may be horizontally arranged or inclined. In some examples, the circuit board 24 may be placed directly on the surface 211 to be heated. In other examples, the circuit board 24 may be placed indirectly on the surface 211 to be heated. For example, the circuit board 24 is placed on the mounting frame 25, and the mounting frame 25 is then placed on the surface 211 to be heated. Among them, a limiting portion may be provided on the surface 211 to be heated, and the limiting portion limits the movement of the circuit board 24 along the surface 211 to be heated. Of course, a limiting portion may not be provided.

[0058] The cleaning component 23 is a type of equipment that can clean the circuit board 24. For example, the cleaning component 23 can be a blower or a brush. In this embodiment, the cleaning component 23 is a brush.

[0059] The material of the heat-conducting structure 223 can be a heat-conducting material, and the heat-conducting material can be a metal or a non-metallic heat-conducting material. In some examples, the heat-conducting structure 223 can be a horizontal plate, and a flow channel is arranged inside the horizontal plate. In other examples, the heat-conducting structure 223 may include a heat-conducting plate 2232 and a coil 2231. For example, the heat-conducting plate 2232 and the coil 2231 are both heat-conducting materials. The heat-conducting structure 223 can be arranged on the side of the mounting plate 21. The heat-conducting structure 223 can also be arranged on the first surface 212 of the mounting plate 21, and the first surface 212 is arranged opposite to the surface to be heated 211, and the other surfaces of the mounting plate 21 except the surface to be heated 211 and the first surface 212 are provided with a heat insulation layer.

[0060] The medium can be a hot gas, such as hot air. The medium can also be a hot liquid, such as hot water. The temperature of the medium is greater than the temperature of the heat-conducting structure 223, so that the heat of the medium can be transferred to the heat-conducting structure 223, so that the temperature of the heat-conducting structure 223 increases.

[0061] In some examples, the preheating cleaning device 2 further includes a liquid storage tank 222 and a water pump 221, and the medium can be transported into the flow channel by using the liquid storage tank 222 and the water pump 221. In other examples, the medium is transported into the flow channel by using an external device. For example, the external device can be a steam engine, and the steam engine transports hot steam into the flow channel.

[0062] In some examples, the circuit board 24 is preheated first and then cleaned. In other examples, the circuit board 24 is cleaned first and then preheated. In other examples, the circuit board 24 is cleaned and preheated at the same time.

[0063] In this embodiment, the circuit board 24 is placed on the surface to be heated 211, and a medium is introduced into the flow channel of the heat-conducting structure 223. The medium flows in the flow channel, and the heat of the medium is transferred to the heat-conducting structure 223. Since the heat-conducting structure 223 is arranged on the mounting plate 21, the heat of the heat-conducting structure 223 is transferred to the mounting plate 21, thereby increasing the temperature of the surface to be heated 211 on the mounting plate 21. Since the circuit board 24 is placed on the surface to be heated 211, the temperature of the circuit board 24 is increased, which plays a role in preheating the circuit board 24. The cleaning component 23 can be used to clean impurities on the circuit board 24, thereby reducing impurities on the circuit board 24, and playing a role in cleaning the circuit board 24. When the preheated and cleaned circuit board 24 is welded, the temperature difference between the circuit board 24 and the welding temperature is reduced, and the cleanliness of the circuit board 24 is improved, thereby improving the welding quality of the circuit board 24, so that the yield of the circuit board 24 is also improved.

[0064] In addition, compared with the method of preheating the circuit board by blowing hot air, the preheating component 22 of this embodiment can reduce impurities on the circuit board 24.

[0065] As the yield of the circuit board 24 is improved, the yield of the electronic device formed by the circuit board 24 is also improved. The circuit board 24 can be applied to the battery field, and the electronic device can be the battery device 1, so that the yield of the battery device 1 is improved. Of course, the circuit board 24 can also be applied to non-battery fields, such as the display field, the chip field, etc.

[0066] In some embodiments, the heat-conducting structure 223 includes a heat-conducting plate 2232 and a coil 2231; the heat-conducting plate 2232 is fixed on the first surface 212; the pipe of the coil 2231 is a flow channel; the coil 2231 is coiled on the surface of the heat-conducting plate 2232 away from the first surface 212; the first surface 212 is arranged opposite to the surface to be heated 211.

[0067] The heat conducting plate 2232 is fixed on the first surface 212 , which means that the plate surface of the heat conducting plate 2232 is in contact with the first surface 212 and is fixedly connected.

[0068] In some examples, the thermal conductivity of the thermal conductive material of the heat conducting plate 2232 and the coil 2231 is the same; of course, the thermal conductivity of the thermal conductive material of the heat conducting plate 2232 and the coil 2231 may be different. The thermal conductivity of the thermal conductive material of the mounting plate 21 may be the same as or different from the thermal conductivity of the heat conducting plate 2232. For example, the materials of the mounting plate 21, the coil 2231, and the heat conducting plate 2232 may all be copper. The mounting plate 21 and the heat conducting plate 2232 may be flat plates.

[0069] The coiling method of the coil 2231 is not limited. For example, the coil 2231 can be wound in a winding manner or in a folding manner.

[0070] The surface of the heat conducting plate 2232 close to the coil 2231 has a groove, and the coil 2231 is embedded in the groove and fits tightly with the wall of the groove; the surface of the heat conducting plate 2232 away from the coil 2231 is a plane and fits tightly with the first surface 212 of the mounting plate 21.

[0071] In this embodiment, after the medium is introduced into the coil 2231, the heat of the medium is transferred to the coil 2231. The coil 2231 is coiled on the surface of the heat conducting plate 2232 away from the first surface 212, so that the heat of the coil 2231 is transferred to the heat conducting plate 2232. The heat conducting plate 2232 is fixed on the first surface 212, so that the heat on the heat conducting plate 2232 is transferred to the first surface 212 of the mounting plate 21, thereby increasing the temperature of the surface to be heated 211 on the mounting plate 21. The contact area between the heat conducting plate 2232 and the first surface 212 is large, so that the temperature at different positions of the surface to be heated 211 is roughly the same, thereby improving the uniformity of the temperature of the surface to be heated 211, reducing the risk of deformation of the circuit board 24 due to uneven heating, and further improving the yield of the circuit board 24.

[0072] In some embodiments, the preheating assembly 22 further includes an insulation box 224 ; the insulation box 224 is disposed on the first surface 212 and has an opening facing the first surface 212 ; the heat conducting plate 2232 and the coil 2231 are both located in the insulation box 224 through the opening.

[0073] The material of the heat preservation box 224 can be a heat insulation material, for example, the heat insulation material can be foam plastic. Of course, the material of the heat preservation box 224 can be a heat conductive material, but the outer surface of the heat preservation box 224 is coated with a heat insulation layer. Specifically, the heat preservation box 224 includes an annular side wall and a bottom wall, and the top is an open structure, so that the heat conduction plate 2232 and the coil 2231 are exposed.

[0074] In this embodiment, the heat preservation box 224 can improve the utilization rate of the heat of the heat-conducting structure 223 , thereby increasing the rate of preheating the circuit board 24 .

[0075] In some embodiments, the preheating component 22 also includes a liquid storage tank 222 and a water pump 221; the liquid storage tank 222 is used to store and heat liquid; the inlet of the water pump 221 is connected to the liquid storage tank 222; one end of the coil 2231 extends out of the insulation box 224 and is connected to the outlet of the water pump 221; the other end of the coil 2231 extends out of the insulation box 224 and is connected to the liquid storage tank 222.

[0076] The liquid storage tank 222 may be a type of box with a heating function; for example, the liquid storage tank 222 includes a box body and a heater, and the heater is used to heat the liquid in the box body. The heater may be disposed in the box body to directly heat the liquid; of course, the heater may also be disposed outside the box body. The heat preservation box 224 has two pipe openings so that both ends of the coil 2231 extend out of the heat preservation box 224.

[0077] The water pump 221 may be disposed inside the liquid storage tank 222 to reduce heat loss; of course, the water pump 221 may also be disposed outside the liquid storage tank 222 .

[0078] The liquid may be water, which becomes hot water after being heated. The hot water is pumped by the water pump 221 and sent into the coil 2231 for heat exchange. Of course, the liquid may also be an aqueous solution, etc.

[0079] The preheating assembly 22 outside the heat preservation box 224 and the liquid storage tank 222 is heat-insulated to reduce heat loss. For example, the coil 2231 outside the heat preservation box 224 and the water pump 221 outside the liquid storage tank 222 can be provided with a heat-insulating layer.

[0080] In this embodiment, the water pump 221 can be used to transport the liquid in the liquid storage tank 222 to the coil 2231. The coil 2231, the liquid storage tank 222 and the water pump 221 can form a circulation loop to achieve the purpose of reusing the liquid. The liquid storage tank 222 can replenish the heat lost by the liquid, so that the liquid transported to the coil 2231 is always at a relatively stable temperature.

[0081] In some embodiments, see Figure 4 and Figure 7 The cleaning assembly 23 includes a cleaning portion 233, an elastic member 232 and a connecting member 231; the cleaning portion 233 is connected to one end of the elastic member 232, and the other end of the elastic member 232 is connected to the connecting member 231; the connecting member 231 is restricted from moving in a direction perpendicular to the surface to be heated 211; the elastic member 232 is used to provide elastic force to the cleaning portion 233, so that the cleaning portion 233 can always contact the circuit board 24 placed on the surface to be heated 211.

[0082] The cleaning part 233 can be a scraper or a brush. The elastic member 232 can be a spring or an elastic telescopic rod.

[0083] In some examples, the connecting member 231 is fixed, and the circuit board 24 moves relative to the surface to be heated 211, so that the cleaning part 233 cleans the circuit board 24. In other examples, the circuit board 24 is fixed, and the connecting member 231 moves relative to the surface to be heated 211, and the connecting member 231 drives the elastic member 232 and the cleaning part 233 to move as a whole, so that the cleaning part 233 cleans the circuit board 24.

[0084] The connecting member 231 is restricted from moving in a direction perpendicular to the surface to be heated 211. It can be understood that the vertical distance between the connecting member 231 and the surface to be heated 211 is a fixed value and will not change. For example, the connecting member 231 is fixed on the surface to be heated 211. For another example, the connecting member 231 is slidably arranged on the surface to be heated 211, and the sliding direction is parallel to the surface to be heated 211.

[0085] In this embodiment, the elastic member 232 is provided so that the cleaning portion 233 can always contact the circuit board 24 and have a certain contact pressure, so that the cleaning portion 233 can fully clean the circuit board 24, thereby improving the cleaning rate of the circuit board 24 and further improving the welding quality of the circuit board 24.

[0086] In some embodiments, the cleaning component 23 also includes a mounting portion 234 and a sliding portion 235; the mounting portion 234 is arranged on the mounting plate 21 and has a slide groove 2341; the extension direction of the slide groove 2341 is parallel to the surface to be heated 211; the sliding portion 235 is connected to the connecting member 231 and is slidably arranged in the slide groove 2341.

[0087] The mounting portion 234 can be arranged on the surface to be heated 211 of the mounting plate 21, or on the side of the mounting plate 21. The number of the mounting portions 234 is the same as the number of the sliding portions 235, for example, one, or two. The sliding portion 235 is adapted to the slide groove 2341, for example, the sliding portion 235 can be a cross-shaped slider.

[0088] In this embodiment, by utilizing the cooperation between the slide groove 2341 of the mounting portion 234 and the sliding portion 235, the connecting member 231, the elastic member 232 and the cleaning portion 233 can slide as a whole relative to the mounting plate 21, so that the cleaning portion 233 can clean the circuit board 24 placed on the heating surface 211, thereby speeding up the cleaning rate of the circuit board 24.

[0089] In some embodiments, the cleaning assembly 23 further includes a screw mechanism 236 , which is connected to the mounting plate 21 ; the screw mechanism 236 is connected to the sliding portion 235 , driving the sliding portion 235 to slide in the sliding groove 2341 .

[0090] The lead screw mechanism 236 may include a motor, a lead screw, a seat body and a nut. The lead screw is rotatably arranged on the seat body, the electrode is arranged on the seat body and is coaxially connected with the lead screw to drive the lead screw to rotate. The nut is arranged on the lead screw.

[0091] The screw mechanism 236 is connected to the mounting plate 21, which means that the mounting plate 21 is connected to the seat of the screw mechanism 236. In some examples, the screw mechanism 236 is directly fixedly connected to the mounting plate 21. For example, the seat and the mounting plate 21 are an integral structure. In other examples, the screw mechanism 236 is indirectly connected to the mounting plate 21. For example, the screw mechanism 236 can be installed on the side plate 291 of the bracket 29, and the side plate 291 is connected to the mounting portion 234.

[0092] The connection between the lead screw mechanism 236 and the sliding part 235 refers to the connection between the sliding part 235 and the nut of the lead screw mechanism 236. In some examples, the sliding part 235 and the nut are fixedly connected. For example, the sliding part 235 and the nut are an integral structure, thereby simplifying the structure. In other examples, the sliding part 235 and the nut are detachably connected.

[0093] In this embodiment, the lead screw mechanism 236 can be used to drive the sliding part 235 to slide, thereby realizing automatic cleaning.

[0094] In some embodiments, see Figure 4 and Figure 8 The cleaning component 23 also includes a collecting portion 28 and a bracket 29; the mounting plate 21 is fixed on the bracket 29; the collecting portion 28 is arranged opposite to the mounting plate 21; the surface of the mounting plate 21 away from the collecting portion 28 is an inclined heating surface 211; the collecting portion 28 is slidably connected to the bracket 29; the collecting portion 28 can be slid out from the lower end of the heating surface 211 and is used to collect impurities.

[0095] The collecting portion 28 can slide out from the lower end of the surface to be heated 211 and is used to collect impurities. It can be understood that when it is necessary to collect impurities, the collecting portion 28 slides out from the lower end of the surface to be heated 211, and the extended portion is used to collect impurities. When it is not necessary to collect impurities, the collecting portion 28 slides to the bottom of the mounting plate 21 to hide the collecting portion.

[0096] The collecting portion 28 is a structure that can collect impurities, for example, the collecting portion 28 can be a collecting tank.

[0097] The bracket 29 may include two side plates 291 arranged opposite to each other along the first direction X; the mounting plate 21 is fixed to the two side plates 291. For example, the bracket 29 may also include a bottom plate 292, and the two side plates 291 are fixed to the bottom plate 292. The liquid storage tank 222 may be installed on the side plates 291 of the bracket 29.

[0098] The collecting portion 28 and the mounting plate 21 are arranged opposite to each other along the second direction Y; the extending direction of the slide groove 2341 is parallel to the inclined direction of the surface to be heated 211; the first direction X is perpendicular to the second direction Y, the first direction X is parallel to the surface to be heated 211, and the second direction Y intersects the surface to be heated 211. For example, the first direction X is a horizontal direction, and the second direction Y is a vertical direction.

[0099] In some examples, the mounting plate 21 is tilted on the bracket 29, so that the surface 211 to be heated of the mounting plate 21 is tilted. In other examples, the surface 211 to be heated of the mounting plate 21 is an inclined surface. Since the surface 211 to be heated is tilted, the surface 211 to be heated has a relatively higher end and a lower end; that is, along the second direction Y, the higher end is located above the lower end. In some examples, the mounting plate 21 is a flat plate, and the flat plate is tilted, so that the surface 211 to be heated is tilted; in this case, the lower end of the surface 211 to be heated refers to the lower end of the mounting plate 21.

[0100] For example, a slide rail 262 is provided on the collecting portion 28 , and a slider 261 is provided on the bracket 29 . The slider 261 can slide on the slide rail 262 , so that the collecting portion 28 slides relative to the bracket 29 .

[0101] In this embodiment, when cleaning the circuit board 24 placed on the surface to be heated 211, the collecting part 28 is slid out from the lower end of the surface to be heated 211, and the cleaning part 233 allows the impurities on the circuit board 24 to fall onto the surface to be heated 211; the inclined surface to be heated 211 allows the impurities to slide from the surface to be heated 211 to the lower end and fall into the collecting part 28, so that the collecting part 28 plays the role of collecting impurities. After cleaning, the collecting part 28 is slid to the bottom of the mounting plate 21 to hide the collecting part 28, thereby reducing the occupied space.

[0102] In some embodiments, the cleaning assembly 23 further includes a filter portion 27, which is located between the mounting plate 21 and the collecting portion 28; the filter portion 27 is slidably connected to the bracket 29; the filter portion 27 can be slidably extended from the lower end of the heating surface 211 and is used to filter impurities.

[0103] The filter part 27 can slide out from the lower end of the surface to be heated 211 and is used to filter impurities. It can be understood that when it is necessary to filter impurities, the filter part 27 slides out from the lower end of the surface to be heated 211, and the extended part is used to filter impurities. When it is not necessary to collect impurities, the filter part 27 slides to the bottom of the mounting plate 21 to hide the filter part 27.

[0104] The filter unit 27 may be a type of device capable of filtering, for example, the filter unit 27 may be a filter. A slide rail 262 is provided on the filter unit 27, and a slider 261 is provided on the bracket 29. The slider 261 may slide on the slide rail 262, so that the filter unit 27 slides relative to the bracket 29. In some examples, the filter unit 27 is located between two side plates 291 and is slidably connected to the side plates 291.

[0105] In this embodiment, when cleaning the circuit board 24 placed on the surface to be heated 211, the collecting part 28 and the filtering part 27 are both slid out from the lower end of the surface to be heated 211, and the cleaning part 233 allows the impurities on the circuit board 24 to fall onto the surface to be heated 211; the inclined surface to be heated 211 can allow the impurities to slide from the surface to be heated 211 to the lower end and fall into the filtering part 27, and the filtering part 27 filters the larger impurities and leaves them in the filtering part 27, and the smaller impurities fall into the collecting part 28 through the filtering part 27, so that the filtering part 27 plays the role of filtering impurities. After cleaning, the collecting part 28 and the filtering part 27 are both slid to the bottom of the mounting plate 21, which plays the role of hiding the collecting part 28 and the filtering part 27, thereby reducing the occupied space.

[0106] Among them, the larger impurities in the filter part 27 can be transformed into smaller impurities after being processed by masking, crushing, etc., and then fall into the collection part 28 through the filter part 27. Of course, the larger impurities in the filter part 27 can be directly collected and bagged. The smaller impurities in the collection part 28 can be collected and bagged. For example, the collection part 28 has a discharge port, and opening the discharge port allows the impurities in the collection part 28 to flow out from the discharge port.

[0107] The above description is only an implementation method of the present application, and does not limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A preheating cleaning device, characterized in that: include: A mounting plate having a surface to be heated, wherein the surface to be heated is used for placing a circuit board; The preheating component comprises a heat-conducting structure; the heat-conducting structure has a flow channel, and the flow channel is used for the flow of the medium; The heat-conducting structure is arranged on the mounting plate; the heat-conducting structure is used to transfer the heat of the medium in the flow channel to the surface to be heated; The cleaning component is used to clean the circuit board placed on the surface to be heated.

2. The preheating cleaning device according to claim 1, characterized in that: The heat-conducting structure includes a heat-conducting plate and a coil; the heat-conducting plate is fixed on the first surface; the pipe of the coil is the flow channel; the coil is arranged on the surface of the heat-conducting plate away from the first surface; the first surface is arranged opposite to the surface to be heated.

3. The preheating cleaning device according to claim 2, characterized in that: The preheating assembly further includes an insulation box; the insulation box is disposed on the first surface and has an opening facing the first surface; the heat conducting plate and the coil are both located in the insulation box through the opening.

4. The preheating cleaning device according to claim 3, characterized in that: The preheating assembly also includes a liquid storage tank and a water pump; the liquid storage tank is used to store and heat liquid; the inlet of the water pump is connected to the liquid storage tank; one end of the coil extends out of the insulation box and is connected to the outlet of the water pump; the other end of the coil extends out of the insulation box and is connected to the liquid storage tank.

5. The preheating cleaning device according to any one of claims 1 to 4, characterized in that: The cleaning assembly includes a cleaning part, an elastic member and a connecting member; the cleaning part is connected to one end of the elastic member, and the other end of the elastic member is connected to the connecting member; the connecting member is restricted from moving in a direction perpendicular to the surface to be heated; the elastic member is used to provide elastic force to the cleaning part, so that the cleaning part can always contact the circuit board placed on the surface to be heated.

6. The preheating cleaning device according to claim 5, characterized in that: The cleaning assembly also includes a mounting portion and a sliding portion; the mounting portion is arranged on the mounting plate and has a slide groove; the extension direction of the slide groove is parallel to the surface to be heated; the sliding portion is connected to the connecting piece and is slidably arranged in the slide groove.

7. The preheating cleaning device according to claim 6, characterized in that: The cleaning assembly also includes a screw mechanism, which is connected to the mounting plate; the screw mechanism is connected to the sliding part and is used to drive the sliding part to slide in the sliding groove.

8. The preheating cleaning device according to claim 6, characterized in that: The cleaning assembly also includes a collecting portion and a bracket; the mounting plate is fixed on the bracket; the collecting portion and the mounting plate are arranged opposite to each other; the surface of the mounting plate away from the collecting portion is the inclined surface to be heated; the collecting portion is slidably connected to the bracket; the collecting portion can be slid out from the lower end of the surface to be heated and is used to collect impurities.

9. The preheating cleaning device according to claim 8, characterized in that: The cleaning assembly also includes a filter portion, which is located between the mounting plate and the collecting portion; the filter portion is slidably connected to the bracket; the filter portion can be slidably extended from the lower end of the surface to be heated and is used to filter impurities.

10. A battery production system, characterized in that: include: The preheating and cleaning device according to any one of claims 1 to 9; the preheating and cleaning device is used to preheat and clean the circuit board; A soldering device for soldering preheated and cleaned circuit boards; The assembly device is used to assemble the welded circuit board, battery box and battery cells into a battery device.

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