Heat dissipation module

Abstract

The utility model discloses a heat dissipation module which comprises a fan and a heat dissipation assembly, and the fan is provided with an air outlet. The heat dissipation assembly is provided with a fin set arranged at the air outlet, the fin set comprises a plurality of heat dissipation fins which are sequentially arranged at intervals in the preset direction, and a heat dissipation channel communicated with the air outlet is formed between every two adjacent heat dissipation fins. Besides, at least part of the heat dissipation fins in the fin group are obliquely arranged, so that the size of the heat dissipation channel is increased, and the fin group integrally forms a plurality of airflow diffusion directions. The heat dissipation module is novel and reasonable in structure, large in heat dissipation area and large in heat dissipation channel size, and the heat dissipation efficiency is improved; and the heat dissipation module can disperse heat, so that the use environment of the electronic product is optimized, and the working performance and the service life of the electronic product are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation modules, in particular to a heat dissipation module applied to electronic products. Background Art

[0002] As we all know, a common problem faced by electronic products is that as long as they work, they will inevitably generate heat. And if the heat is not removed in time, the temperature of the electronic product itself will rise, which will lead to the performance of the electronic product being reduced or damaged. Therefore, a heat dissipation module is usually installed on the electronic product.

[0003] The existing heat dissipation module generally includes a fan, a heat absorbing plate attached to the heat generating electronic component (a component on an electronic product), and a heat dissipation fin group connected to the heat absorbing plate through a heat conducting pipe, and the heat dissipation fin group includes two parallel mounting plates and a plurality of fins A200a vertically connected between the two mounting plates, and a heat dissipation channel A201a is formed between each adjacent two fins A200a. Figure 7 When working, the heat pipe transfers the heat from the heat generating electronic components to the heat dissipation fin group, and dissipates the heat into the surrounding air through the fan.

[0004] However, with the development of high speed, high frequency and integration of electronic products, the existing heat sink fin group cannot effectively and efficiently remove the heat generated by the heat-generating electronic components, and thus cannot well meet the development needs of electronic products.

[0005] In view of this, the present utility model is proposed. Summary of the invention

[0006] In order to overcome the above-mentioned defects, the utility model provides a heat dissipation module, which, on the one hand, has a novel and reasonable structure, a large heat dissipation area, and a large heat dissipation channel volume, thereby improving the heat dissipation efficiency; on the other hand, it can disperse the heat, optimize the use environment of electronic products, and ensure the working performance and service life of electronic products.

[0007] The technical solution adopted by the utility model to solve the technical problem is: a heat dissipation module for heat dissipation on electronic products; comprising:

[0008] A fan having an air outlet;

[0009] A heat dissipation component is provided with a fin group arranged at the air outlet; the fin group includes a plurality of heat dissipation fins arranged in sequence and at intervals along a predetermined direction, and a heat dissipation channel communicating with the air outlet is formed between each two adjacent heat dissipation fins; in addition, at least part of the heat dissipation fins in the fin group are inclined to increase the volume of the heat dissipation channel, and at the same time, the fin group as a whole forms a plurality of airflow diffusion directions.

[0010] As a further improvement of the present invention, the fin group is further provided with two support plates which are spaced apart and arranged in parallel, a plurality of the heat dissipation fins are fixedly arranged between the two support plates, and one of the support plates is also fixedly connected to the air outlet.

[0011] As a further improvement of the present invention, based on the horizontal placement of the support plates, the heat dissipation fins are vertically or vertically inclined between the two support plates.

[0012] As a further improvement of the present invention, a plurality of the heat dissipation fins in the fin group are all inclined in the same direction.

[0013] As a further improvement of the utility model, the plurality of heat dissipation fins are divided into three fin units, which are respectively defined as: a first fin unit, a second fin unit and a third fin unit;

[0014] Wherein, the first fin unit and the second fin unit are both composed of a plurality of heat dissipation fins arranged obliquely in the same direction, and the inclination direction of the heat dissipation fins in the first fin unit is opposite to the inclination direction of the heat dissipation fins in the second fin unit;

[0015] The third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of the heat dissipation fins arranged vertically.

[0016] As a further improvement of the utility model, a plurality of the heat dissipation fins are integrally connected to the two support plates.

[0017] As a further improvement of the present invention, the support plate connected to the air outlet does not completely cover the plurality of heat dissipation fins.

[0018] As a further improvement of the utility model, the fan is a centrifugal fan.

[0019] As a further improvement of the utility model, the heat dissipation assembly is further provided with a heat conducting pipe, which is connected to the fin group and is also arranged on the fan housing.

[0020] The beneficial effects of the utility model are as follows: ① Compared with the fin A in the prior art that is vertically arranged, the utility model increases the heat dissipation area of ​​the heat dissipation fins by designing the heat dissipation fins to be inclined, and increases the volume of the heat dissipation channel, and increases the amount of air flowing through, thereby improving the heat dissipation efficiency of the heat dissipation module. Moreover, compared with the "straight forward" airflow diffusion method (heat diffusion method) of the heat dissipation channel A in the prior art, the airflow (heat) flowing out through the heat dissipation channel of the utility model can have multiple diffusion directions, so that the heat can be more dispersed into the air, optimizing the use environment of electronic products, and further ensuring the working performance and service life of electronic products. ② The heat dissipation module of the utility model is novel, concise, reasonable, easy to manufacture, and has a low manufacturing cost, and is easy to produce and implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a structural schematic diagram of the heat dissipation module of the utility model at a first viewing angle;

[0022] Figure 2 This is a structural schematic diagram of the heat dissipation module of the utility model at a second viewing angle;

[0023] Figure 3 It is a three-dimensional structural schematic diagram of the fin group of the utility model;

[0024] Figure 4 This is a schematic diagram of the top view of the fin group of the utility model;

[0025] Figure 5 It is a side view structural diagram of the fin group of the utility model;

[0026] Figure 6 for Figure 5 An enlarged structural schematic diagram of part A is shown;

[0027] Figure 7 It is a schematic diagram comparing the layout of existing heat dissipation fins and the layout of the heat dissipation fins described in the utility model.

[0028] Combined with the accompanying drawings, the following description is given:

[0029] 1. Fan; 10. Air outlet; 2. Heat dissipation component; 20. Fin group; 200. Heat dissipation fin; 201. Heat dissipation channel; 202. Support plate; 21. Heat pipe; 200a. Fin A; 201a. Heat dissipation channel A. DETAILED DESCRIPTION

[0030] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0031] Example:

[0032] This embodiment provides a heat dissipation module, which is used for heat dissipation in electronic products (such as laptop computers).

[0033] Please refer to the attached Figure 1 To Attachment Figure 6 As shown, the heat dissipation module provided in this embodiment mainly includes a fan 1 and a heat dissipation component 2, wherein the fan 1 is provided with an air outlet 10, and the heat dissipation component 2 is provided with a fin group 20 arranged at the air outlet 10, and the fin group 20 includes a plurality of heat dissipation fins 200 arranged in sequence and at intervals along a predetermined direction, and a heat dissipation channel 201 (also understood as an "air volume channel") that passes through the air outlet 10 is formed between each two adjacent heat dissipation fins 200; in particular, at least part of the heat dissipation fins 200 in the fin group 20 are inclined to increase the heat dissipation area of ​​the heat dissipation fins 200 themselves, while also increasing the volume of the heat dissipation channel 201 (even if the air volume flowing therethrough is increased), and also allowing the fin group 20 as a whole to form multiple airflow (heat) diffusion directions.

[0034] Understandable, combined with Figure 3 and attached Figure 7 As shown, compared with the fin A200a in the prior art that is vertically arranged, the utility model increases the heat dissipation area of ​​the heat dissipation fin 200 itself by designing the heat dissipation fin 200 to be inclined, thereby increasing the volume of the heat dissipation channel 201 and the amount of air flowing through, thereby improving the heat dissipation efficiency of the heat dissipation module. Moreover, compared with the "straight forward" airflow diffusion method (heat diffusion method) shown by the heat dissipation channel A201a in the prior art, the airflow (heat) flowing out of the heat dissipation channel 201 of the utility model can have multiple diffusion directions, thereby achieving a more dispersed heat dissipation into the air, optimizing the use environment of electronic products, and further ensuring the working performance and service life of electronic products.

[0035] The structure of the fin group 20 in the heat dissipation module of the present invention is described in detail below.

[0036] First, the heat dissipation fins 200 are described as being arranged in an inclined manner.

[0037] Please continue to refer to the attached Figure 1 To Attachment Figure 6 As shown, in this embodiment, the fin group 20 is also provided with two support plates 202 that are spaced apart and arranged in parallel, and a plurality of the heat dissipation fins 200 are fixedly arranged between the two support plates 202 in sequence and spaced apart along a predetermined direction, and one of the support plates 202 is also fixedly connected to the air outlet 10.

[0038] In addition, if the support plates 202 are placed horizontally as a reference, the heat dissipation fins 200 can be vertically vertical or vertically inclined between the two support plates 202 .

[0039] When the heat dissipation fins 200 are arranged in a vertically inclined manner, the inclination direction and inclination angle can be determined according to product design requirements, and the utility model patent does not make any limiting requirements. The following only provides several implementation methods for explanation.

[0040] For example: Method ①: The plurality of heat dissipation fins 200 in the fin group 20 are all arranged tilted in the same direction. Figure 5 As shown; and the inclination angle of the heat dissipation fins 200 may preferably be 10° to 80°, and further preferably 30° to 45°.

[0041] From the above analysis, it can be seen that the layout of the heat sink fins 200 provided in this method ① can improve the heat dissipation efficiency of the heat dissipation module while dissipating the heat, thereby optimizing the use environment of the electronic product and ensuring the working performance and service life of the electronic product.

[0042] Method ②: Divide a number of the heat sink fins 200 into three fin units, which are defined as: a first fin unit, a second fin unit and a third fin unit; wherein the first fin unit and the second fin unit are respectively composed of a plurality of the heat sink fins 200 arranged obliquely in the same direction, and the inclination direction of the heat sink fins 200 located in the first fin unit is opposite to the inclination direction of the heat sink fins 200 located in the second fin unit; the third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of vertically arranged heat sink fins 200.

[0043] It is understandable that the plurality of heat sink fins 200 in the first fin unit are all tilted to the left and have the same tilt angle; the plurality of heat sink fins 200 in the second fin unit are all tilted to the right and have the same tilt angle. Further preferably, the heat sink fins 200 in the first fin unit and the heat sink fins 200 in the second fin unit can be designed to be arranged in a mirror-symmetrical manner. Taking the heat sink fins 200 in the second fin unit as an example, the tilt angle can be optimally controlled to be 70° to 80°.

[0044] As described above, the layout of the heat sink fins 200 provided in this method ② can not only improve the heat dissipation efficiency of the heat dissipation module, but also disperse the heat, optimize the use environment of the electronic product, and ensure the working performance and service life of the electronic product.

[0045] Next, the forming method and other features of the fin assembly 20 are described.

[0046] In this embodiment, a plurality of the heat dissipation fins 200 are integrally connected to the two support plates 202. That is, the fin group 20 is an integral structure as a whole, which is convenient for processing and assembly.

[0047] In addition, in this embodiment, the support plate 202 connected to the air outlet 10 does not completely cover the plurality of heat dissipation fins 200, which can not only increase the effective volume of the heat dissipation channel 201, but also further expand the diffusion direction of the airflow (heat) to achieve a better heat dissipation effect.

[0048] In addition, in this embodiment, the fan 1 is a centrifugal fan. The heat dissipation assembly 2 is also provided with a heat pipe 21, which is connected to the fin group 20 and is also provided on the housing of the fan 1; Figure 1 and attached Figure 2 shown.

[0049] When the heat dissipation module is working, the heat pipe 21 can conduct the heat from the heat-generating electronic components of the electronic product to the fin group 20, and dissipate the heat into the surrounding air through the fan 1.

[0050] To sum up, the heat dissipation module of the utility model has a novel and reasonable structure, a large heat dissipation area, and a large heat dissipation channel volume, which improves the heat dissipation efficiency; and the heat dissipation module can disperse the heat, optimize the use environment of electronic products, and ensure the working performance and service life of electronic products.

[0051] In the above description, many specific details are described to facilitate a full understanding of the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited by the specific implementation disclosed above. At the same time, any person familiar with the technical field can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A heat dissipation module, used for heat dissipation of electronic products; characterized in that: include: A fan (1) provided with an air outlet (10); A heat dissipation component (2), comprising a fin group (20) arranged at the air outlet (10); the fin group (20) comprises a plurality of heat dissipation fins (200) arranged in sequence and at intervals along a predetermined direction, and a heat dissipation channel (201) communicating with the air outlet (10) is formed between each two adjacent heat dissipation fins (200); In addition, at least part of the heat dissipation fins (200) in the fin group (20) are arranged at an angle, so that the volume of the heat dissipation channel (201) is increased, and at the same time, the fin group (20) as a whole is formed with multiple airflow diffusion directions.

2. The heat dissipation module according to claim 1, characterized in that: The fin group (20) is also provided with two support plates (202) that are spaced apart and arranged in parallel, a plurality of the heat dissipation fins (200) are fixedly arranged between the two support plates (202), and one of the support plates (202) is also fixedly connected to the air outlet (10).

3. The heat dissipation module according to claim 2, characterized in that: Taking the support plate (202) being in a horizontally placed state as a reference, the heat dissipation fins (200) are arranged vertically or vertically inclined between the two support plates (202).

4. The heat dissipation module according to claim 3, characterized in that: The plurality of heat dissipation fins (200) in the fin group (20) are all arranged to be inclined in the same direction.

5. The heat dissipation module according to claim 3, characterized in that: Dividing the plurality of heat dissipation fins (200) into three fin units, which are respectively defined as: a first fin unit, a second fin unit and a third fin unit; Wherein, the first fin unit and the second fin unit are both composed of a plurality of heat dissipation fins (200) arranged obliquely in the same direction, and the inclination direction of the heat dissipation fins (200) located in the first fin unit is opposite to the inclination direction of the heat dissipation fins (200) located in the second fin unit; The third fin unit is arranged between the first fin unit and the second fin unit, and the third fin unit is composed of a plurality of the heat dissipation fins (200) arranged vertically.

6. The heat dissipation module according to claim 2, characterized in that: The plurality of heat dissipation fins (200) are integrally connected to the two support plates (202).

7. The heat dissipation module according to claim 2, characterized in that: The support plate (202) connected to the air outlet (10) does not completely cover the plurality of heat dissipation fins (200).

8. The heat dissipation module according to claim 1, characterized in that: The fan (1) is a centrifugal fan.

9. The heat dissipation module according to claim 1, characterized in that: The heat dissipation component (2) is also provided with a heat conduction pipe (21), which is connected to the fin group (20) and is also arranged on the outer casing of the fan (1).

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