Chip mounting device for integrated circuit processing

Abstract

The utility model discloses a chip mounting device for integrated circuit processing, which relates to the technical field of integrated circuit processing, and comprises a chip mounting device body suitable for chip mounting of integrated circuit processing, the chip mounting device body comprises a chip mounting table, the outer surfaces of the two sides of the chip mounting table are welded with limiting support columns, and the limiting support columns are arranged on the outer surfaces of the two sides of the chip mounting table. A chip mounting unit is arranged above the chip mounting table, a buffer unit is arranged at the bottom end of the chip mounting unit, and the chip mounting unit comprises a placement groove formed in the left side of the top of the chip mounting table and a chip mounting groove formed in the right side of the top of the chip mounting table. When the suction cup is attached to a circuit board, the piston columns on the periphery of the bottom end of the suction cup drive the abutting balls to make contact with the periphery of the top of the patch groove firstly, when a patch is extruded and attached, the piston columns are matched to move in the buffer sleeves and extrude the buffer springs, and the extrusion force can be reduced through the elastic potential energy of the buffer springs; the buffer effect is achieved, and the circuit board is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing, in particular to a patch device for integrated circuit processing. Background Art

[0002] An integrated circuit is a miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. After the integrated circuit is made, the circuit needs to be packaged. There are two packaging methods, direct plug-in type and surface mount type. Direct plug-in is to make the pins into pins that can be inserted into the PCB board and then welded. The surface mount is to make the pins into a small metal plate and mount it on the PCB board using high-temperature reflow soldering.

[0003] Currently, the existing patch devices for integrated circuits on the market cannot perform patching automatically and need manual operation, which is time-consuming and labor-intensive. In addition, when taking the chip, the chip is easily offset and the chip cannot be easily adsorbed for patching operation, which affects the patching efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a chip mounting device for integrated circuit processing to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A patch device for integrated circuit processing comprises a patch device body, which is suitable for use in integrated circuit processing patch. The patch device body comprises a patch platform, and limiting pillars are welded on the outer surfaces of both sides of the patch platform.

[0007] A patch unit is arranged above the patch platform, and a buffer unit is arranged on the bottom end of the patch unit.

[0008] A further improvement of the technical solution of the utility model is that the patch unit includes a placement groove arranged on the left side of the top of the patch platform, a patch groove on the right side of the top of the patch platform, a connecting block is fixedly installed on the top of the limiting pillar, and a fixed cross bar is fixedly installed on the inner side of the connecting block.

[0009] A further improvement of the technical solution of the utility model is that a sliding block is slidably sleeved on the outer surface of the fixed cross bar, and fixing rings are fixedly sleeved on the outer surface of the fixed cross bar on both sides of the sliding block, and an electric push rod is fixedly installed on the outer surface of the bottom end of the sliding block, and the fixing rings on both sides can enable the sliding block to move accurately above the placement groove and the patch groove.

[0010] A further improvement of the technical solution of the utility model is that a vacuum pump is fixedly installed on the other end of the electric push rod, a gas pipeline is fixedly installed on the bottom of the vacuum pump, a suction cup is fixedly installed on the other end of the gas pipeline, and the vacuum pump draws air to cause the patch to be adsorbed on the suction cup.

[0011] A further improvement of the technical solution of the utility model is that: a bracket is fixedly sleeved on the outer surface of the vacuum pump, telescopic rods are fixedly installed on the outer surfaces of both sides of the bracket, a limiting block is fixedly installed on the other end of the telescopic rod, the limiting block is slidably sleeved on the outer surface of the limiting support, and the telescopic rod can cooperate with the telescopic processing when the vacuum pump moves left and right.

[0012] A further improvement of the technical solution of the utility model is that the buffer unit includes a buffer sleeve fixedly installed around the bottom of the suction cup, a piston column is movably inserted into the bottom end of the buffer sleeve, and a resistance ball is fixedly installed on the bottom end of the piston column.

[0013] A further improvement of the technical solution of the utility model is that a buffer spring is fixedly installed on the top of the piston column, and the other end of the buffer spring is fixedly installed on the inner top end of the buffer sleeve.

[0014] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0015] 1. The utility model provides a patch device for integrated circuit processing, which is provided with a sliding block to fit with a left fixed ring. At this time, an electric push rod pushes the vacuum pump downward to make the suction cup fit with the patch inside the placement groove, and the vacuum pump is started to evacuate air, and the patch is adsorbed by the suction cup. Then, the sliding block is moved to fit with the right fixed ring. At this time, the suction cup is located above the patch groove, and the electric push rod is used to push the suction cup to fit on the top of the circuit board again. At this time, the vacuum pump stops working, so that the patch and the circuit board are accurately fitted.

[0016] 2. The utility model provides a patch device for integrated circuit processing. When the suction cup is attached to the circuit board, the piston columns around the bottom of the suction cup drive the resistance ball to contact the top of the patch groove first. When the patch is pressed and attached, the piston column moves inside the buffer sleeve and squeezes the buffer spring. The buffer spring can reduce the extrusion force, achieve the buffering effect, and prevent the circuit board from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the patch platform of the utility model;

[0019] Figure 3 This is a schematic diagram of the fixed crossbar structure of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the vacuum pump of the utility model;

[0021] Figure 5 This is a schematic diagram of the structure of the buffer sleeve of the utility model.

[0022] In the figure: 1. Patch device body; 2. Patch table; 21. Placement slot; 22. Patch slot; 3. Limiting pillar; 31. Connecting block; 32. Fixed cross bar; 33. Sliding block; 34. Fixed ring; 35. Electric push rod; 36. Vacuum pump; 37. Gas pipeline; 38. Suction cup; 39. Buffer sleeve; 391. Piston column; 392. Resistance ball; 393. Buffer spring; 310. Bracket; 311. Telescopic rod; 312. Limiting block. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1

[0025] like Figure 1-5As shown, the utility model provides a patch device for integrated circuit processing, including a patch device body 1, which is suitable for use in integrated circuit processing patch, the patch device body 1 includes a patch stage 2, both sides of the patch stage 2 are welded with limiting pillars 3 on the outer surfaces, a patch unit is arranged above the patch stage 2, a buffer unit is arranged on the bottom end of the patch unit, the patch unit includes a placement groove 21 arranged on the left side of the top of the patch stage 2, a patch groove 22 on the right side of the top of the patch stage 2, a connecting block 31 is fixedly installed on the top of the limiting pillar 3, a fixed cross bar 32 is fixedly installed on the inner side of the connecting block 31, and a sliding sleeve is slidably sleeved on the outer surface of the fixed cross bar 32 The outer surfaces of the movable block 33 and the fixed cross bar 32 are fixedly sleeved with fixing rings 34 on both sides of the sliding block 33, an electric push rod 35 is fixedly installed on the outer surface of the bottom end of the sliding block 33, a vacuum pump 36 is fixedly installed on the other end of the electric push rod 35, a gas pipeline 37 is fixedly installed on the bottom of the vacuum pump 36, a suction cup 38 is fixedly installed on the other end of the gas pipeline 37, a bracket 310 is fixedly sleeved on the outer surface of the vacuum pump 36, telescopic rods 311 are fixedly installed on the outer surfaces of both sides of the bracket 310, a limit block 312 is fixedly installed on the other end of the telescopic rod 311, and the limit block 312 is slidably sleeved on the outer surface of the limit support 3.

[0026] Furthermore, by placing the patch and the circuit board inside the placement groove 21 and the patch groove 22 respectively, and then engaging with the left fixing ring 34 by moving the sliding block 33, the electric push rod 35 pushes the vacuum pump 36 downward, causing the suction cup 38 to engage with the patch inside the placement groove 21, and starting the vacuum pump 36 to evacuate air, and cooperating with the suction cup 38 to adsorb the patch, and then engaging with the right fixing ring 34 by moving the sliding block 33, the suction cup 38 is now located above the patch groove 22, and the suction cup 38 is again pushed to engage with the top of the circuit board by the electric push rod 35, and the vacuum pump 36 stops working, so that the patch and the circuit board are accurately fitted, and the patch processing is completed.

[0027] Example 2

[0028] like Figure 1-5 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the buffer unit includes a buffer sleeve 39 fixedly mounted on the bottom of the suction cup 38, a piston column 391 is movably inserted into the bottom end of the buffer sleeve 39, a resistance ball 392 is fixedly mounted on the bottom end of the piston column 391, a buffer spring 393 is fixedly mounted on the top of the piston column 391, and the other end of the buffer spring 393 is fixedly mounted on the inner top end of the buffer sleeve 39.

[0029] Furthermore, when the suction cup 38 is fitted with the circuit board, the piston column 391 around the bottom end of the suction cup 38 drives the resistance ball 392 to first contact the top of the patch groove 22. When the patch is squeezed and fitted, the piston column 391 moves inside the buffer sleeve 39 to squeeze the buffer spring 393. The buffer spring 393 can reduce the squeezing force, achieve a buffering effect, and prevent the circuit board from being damaged.

[0030] The working principle of the chip mounting device for integrated circuit processing will be described in detail below.

[0031] like Figure 1-5 As shown, when in use, the patch and the circuit board are placed in the placement groove 21 and the patch groove 22 respectively, and then the sliding block 33 is moved to fit with the left fixing ring 34. At this time, the electric push rod 35 pushes the vacuum pump 36 downward to make the suction cup 38 fit with the patch in the placement groove 21. The vacuum pump 36 is started to evacuate air, and the suction cup 38 is used to adsorb the patch. Then, the sliding block 33 is moved to fit with the right fixing ring 34. At this time, the suction cup 38 is located above the patch groove 22, and the electric push rod 35 is used to push the suction cup 38 again. The disk 38 fits on the top of the circuit board, and the vacuum pump 36 stops working at this time, so that the patch and the circuit board are accurately fitted together to complete the patch processing. At the same time, when the suction cup 38 fits on the circuit board, the piston column 391 around the bottom of the suction cup 38 drives the resistance ball 392 to first contact the top of the patch groove 22. When the patch is squeezed and fitted, the piston column 391 moves inside the buffer sleeve 39 to squeeze the buffer spring 393. The buffer spring 393 can reduce the extrusion force, achieve a buffering effect, and prevent the circuit board from being damaged.

[0032] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A chip mounting device for integrated circuit processing, comprising a chip mounting device body (1), suitable for use in integrated circuit processing chip mounting, characterized in that: The patch device body (1) comprises a patch platform (2), and limiting pillars (3) are welded on the outer surfaces of both sides of the patch platform (2); A patch unit is arranged above the patch platform (2), and a buffer unit is arranged at the bottom end of the patch unit; The patch unit comprises a placement slot (21) arranged on the left side of the top of the patch platform (2), a patch slot (22) on the right side of the top of the patch platform (2), a connection block (31) fixedly mounted on the top of the limiting support (3), and a fixed cross bar (32) fixedly mounted on the inner side of the connection block (31); A sliding block (33) is slidably sleeved on the outer surface of the fixed cross bar (32), a fixing ring (34) is fixedly sleeved on both sides of the outer surface of the fixed cross bar (32) of the sliding block (33), and an electric push rod (35) is fixedly installed on the outer surface of the bottom end of the sliding block (33); A vacuum pump (36) is fixedly mounted on the other end of the electric push rod (35), a gas pipeline (37) is fixedly mounted on the bottom of the vacuum pump (36), and a suction cup (38) is fixedly mounted on the other end of the gas pipeline (37); A bracket (310) is fixedly sleeved on the outer surface of the vacuum pump (36), telescopic rods (311) are fixedly mounted on the outer surfaces of both sides of the bracket (310), and a limiting block (312) is fixedly mounted on the other end of the telescopic rod (311), and the limiting block (312) is slidably sleeved on the outer surface of the limiting support (3).

2. The chip mounting device for integrated circuit processing according to claim 1, characterized in that: The buffer unit comprises a buffer sleeve (39) fixedly mounted on the bottom periphery of the suction cup (38), a piston column (391) is movably inserted into the bottom end of the buffer sleeve (39), and a resistance ball (392) is fixedly mounted on the bottom end of the piston column (391).

3. The chip mounting device for integrated circuit processing according to claim 2, characterized in that: A buffer spring (393) is fixedly mounted on the top of the piston column (391), and the other end of the buffer spring (393) is fixedly mounted on the inner top end of the buffer sleeve (39).

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