Detection device for semiconductor cleaning agent

Abstract

The utility model provides a semiconductor cleaning agent detection device which comprises a workbench and a placing frame arranged at the top end of the workbench, and the placing frame is used for placing a semiconductor cleaning agent to be detected; wherein a first enclosure and a second enclosure are arranged at the top end of the working table, the first enclosure and the second enclosure are detachably installed on the working table, and the first enclosure and the second enclosure are used for protecting semiconductor cleaning agent detection on the upper surface of the working table. The workbench can be protected through the first fence and the second fence, safety accidents caused by flowing of a semiconductor cleaning agent in the detection process are avoided, meanwhile, a limiting plate is arranged, a placement frame can be located in the limiting plate, the placement frame and the workbench are of a detachable structure, and when the workbench is cleaned, the placement frame can be conveniently placed on the workbench. And the placing frame is separated from the workbench, so that the workbench is cleaned more thoroughly, and the problem of incomplete cleaning caused by dead angle positions is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning agents, in particular to a detection device for semiconductor cleaning agents. Background Art

[0002] Semiconductor water-based cleaning agents are mainly used to clean surfaces contaminated with paraffin, grease, grease-like polymer compounds, and surfaces contaminated with metal atoms and metal ions, etc. They can completely replace the cleaning fluid used in traditional semiconductor cleaning processes in semiconductor discrete devices and medium and small-scale integrated circuits.

[0003] When testing semiconductor cleaning agents, a testing table is used to test the semiconductor cleaning agents to be tested. A testing reagent tube placement rack is provided on the surface of a traditional testing table, but the reagent tube placement rack is fixedly connected to the testing table, and a plurality of placement holes are provided inside the reagent tube placement rack. It is inconvenient to clean the inside of the placement holes during the cleaning process, and during the testing process, if the testing table is hit or the experimenter accidentally touches it, causing the semiconductor cleaning agent to be tested to fall over, it will flow from the surface of the testing table, causing a safety hazard to the tester. Utility Model Content

[0004] In order to overcome the existing problems, the embodiment of the present application provides a detection device for semiconductor cleaning agents, wherein a first enclosure and a second enclosure are provided above the workbench, and the first enclosure and the second enclosure can protect the workbench, thereby avoiding the occurrence of safety accidents caused by the flow of semiconductor cleaning agents during the detection process. The workbench is provided with a limit plate on one side of the placement rack, and the connection method between the limit plate and the workbench is spot welding. When the placement rack is connected to the workbench, one end of the placement rack is in contact with the side of the limit plate, and the placement rack is limited by the limit plate. At the same time, a limit plate is provided, and the placement rack can be located inside the limit plate. The placement rack and the workbench are detachable structures. When cleaning the workbench, the placement rack is separated from the workbench, and the workbench is cleaned more thoroughly, and there will be no problem of incomplete cleaning due to residual dead corners.

[0005] The technical solution adopted by the embodiment of the present application to solve the technical problem is:

[0006] A semiconductor cleaning agent detection device comprises a workbench and a placement rack arranged on the top of the workbench, a support rack is arranged at the bottom of the workbench, the support rack is used to support the workbench, the support rack is connected to the workbench in a fixed manner, a cross brace is arranged inside the support rack, and through the arrangement of the cross brace, the cross brace can connect the two sections of the support rack to improve the stability of the support rack, and the placement rack is used to place the semiconductor cleaning agent to be detected;

[0007] Among them, a first enclosure and a second enclosure are provided on the top of the workbench, the height of the first enclosure is greater than that of the second enclosure, the first enclosure and the second enclosure are an integrated structure, the first enclosure and the second enclosure are detachably installed on the workbench, and are used to protect the semiconductor cleaning agent detection on the upper surface of the workbench. A first enclosure and a second enclosure are provided above the workbench, and the first enclosure and the second enclosure can protect the workbench, thereby avoiding the occurrence of safety accidents caused by the flow of semiconductor cleaning agent during the detection process.

[0008] Preferably, a baffle is provided on the other side of the placement rack at the top of the workbench, and the baffle is located inside the first enclosure and the second enclosure. A damping rod is slidably connected to one end of the baffle, and a top plate is provided at the other end of the damping rod. The top plate and the damping rod are connected by being fixedly connected by screws. The damping rod is contracted by squeezing the top plate so that the baffle is located inside the first enclosure and the second enclosure, and then the top plate is released. Through the lifting of the damping rod, one end of the baffle and one end of the top plate are respectively in contact with the first enclosure and the second enclosure. At the same time, the installation position of the baffle can be changed inside the first enclosure and the second enclosure to adapt to the placement of structures of different sizes.

[0009] Preferably, the length of the limiting plate is smaller than the length of the placing rack, and a plurality of placing holes are provided inside the placing rack, and the placing holes penetrate the placing rack. Thus, when the placing rack needs to be cleaned, the placing rack is separated from the workbench, and the placing holes provided inside the placing rack can be thoroughly cleaned to avoid the problem of impurity accumulation.

[0010] The advantages of the embodiments of the present application are:

[0011] 1. A first enclosure and a second enclosure are provided above the workbench, which can protect the workbench and avoid safety accidents caused by the flow of semiconductor cleaning agent during the detection process. At the same time, a limit plate is provided, and the placement rack can be located inside the limit plate. The placement rack and the workbench are detachable structures. When cleaning the workbench, the placement rack is separated from the workbench, and the workbench is cleaned more thoroughly, and there will be no problem of incomplete cleaning due to residual dead corners.

[0012] 2. A damping rod is provided at one end of the baffle, and a top plate is provided at the other end of the damping rod. When installing the baffle, the damping rod is contracted by squeezing the top plate, so that the baffle is located inside the first enclosure and the second enclosure. Through the lifting of the damping rod, one end of the baffle and one end of the top plate are respectively in contact with the first enclosure and the second enclosure, and the installation position of the baffle can be changed to adapt to the placement of structures of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0014] Figure 1 This is a schematic diagram of the overall structure of the detection device for semiconductor cleaning agent of the utility model;

[0015] Figure 2 This is a schematic diagram of the overall structure of the workbench in the detection device of the semiconductor cleaning agent of the utility model;

[0016] Figure 3 This is a schematic diagram of the overall structure of the placement rack in the semiconductor cleaning agent detection device of the utility model;

[0017] Figure 4 The utility model is a schematic diagram of the overall structure of the baffle in the detection device of the semiconductor cleaning agent.

[0018] Description of main reference numerals:

[0019] 1. Support frame; 2. Workbench; 3. Baffle; 4. Limit plate; 5. Placement frame; 6. First enclosure; 7. Second enclosure; 8. Placement hole; 9. Damping rod; 10. Top plate. DETAILED DESCRIPTION

[0020] The embodiment of the present application solves the problems in the prior art by providing a detection device for semiconductor cleaning agents. A first enclosure and a second enclosure are provided above the workbench. The first enclosure and the second enclosure can protect the workbench and avoid safety accidents caused by the flow of semiconductor cleaning agents during the detection process. A limit plate is provided at the same time, and the placement rack can be located inside the limit plate. The placement rack and the workbench are detachable structures. When cleaning the workbench, the placement rack is separated from the workbench to clean the workbench more thoroughly, and there will be no dead corners and the problem of incomplete cleaning. A damping rod is provided at one end of the baffle plate, and a top plate is provided at the other end of the damping rod. When installing the baffle plate, the damping rod is contracted by squeezing the top plate, so that the baffle plate is located inside the first enclosure and the second enclosure. Through the lifting of the damping rod, one end of the baffle plate and one end of the top plate are in contact with the first enclosure and the second enclosure respectively, and the installation position of the baffle plate can be changed to adapt to the placement of structures of different sizes.

[0021] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows: Example

[0022] This embodiment provides a specific structure of a semiconductor cleaning agent detection device, such as Figure 1-4As shown, it includes a workbench 2 and a placement rack 5 arranged on the top of the workbench 2, a support rack 1 is arranged at the bottom of the workbench 2, the support rack 1 is used to support the workbench 2, the support rack 1 and the workbench 2 are connected in a fixed manner, a cross brace is arranged inside the support rack 1, and through the arrangement of the cross brace, the cross brace can connect the two sections of the support rack 1, thereby improving the stability of the support rack 1, and the placement rack 5 is used to place the semiconductor cleaning agent to be tested;

[0023] Among them, a first enclosure 6 and a second enclosure 7 are provided on the top of the workbench 2. The height of the first enclosure 6 is greater than that of the second enclosure 7. The first enclosure 6 and the second enclosure 7 are an integrated structure. The first enclosure 6 and the second enclosure 7 are detachably installed on the workbench 2 and are used to protect the semiconductor cleaning agent detection on the upper surface of the workbench 2. The first enclosure 6 and the second enclosure 7 are provided above the workbench 2. The first enclosure 6 and the second enclosure 7 can protect the workbench 2, thereby avoiding the occurrence of safety accidents caused by the flow of semiconductor cleaning agent during the detection process.

[0024] By adopting the above technical solution:

[0025] A first enclosure 6 and a second enclosure 7 are provided above the workbench 2. The first enclosure 6 and the second enclosure 7 can protect the workbench 2 and avoid safety accidents caused by the flow of semiconductor cleaning agent during the detection process. Example

[0026] This embodiment provides a specific structure of a semiconductor cleaning agent detection device, such as Figure 1-4 As shown, the workbench 2 is provided with a limit plate 4 on one side of the placement rack 5, and the limit plate 4 is connected to the workbench 2 by spot welding. When the placement rack 5 is connected to the workbench 2, one end of the placement rack 5 is in contact with the side of the limit plate 4, and the placement rack 5 is limited by the limit plate 4.

[0027] A baffle 3 is provided on the other side of the placement frame 5 at the top of the workbench 2. The baffle 3 is located inside the first enclosure 6 and the second enclosure 7. A damping rod 9 is slidably connected to one end of the baffle 3. A top plate 10 is provided at the other end of the damping rod 9. The top plate 10 is connected to the damping rod 9 by being fixed with screws. The damping rod 9 is contracted by squeezing the top plate 10 so that the baffle 3 is located inside the first enclosure 6 and the second enclosure 7. Then the top plate 10 is released. Through the lifting of the damping rod 9, one end of the baffle 3 and one end of the top plate 10 are respectively in contact with the first enclosure 6 and the second enclosure 7. At the same time, the installation position of the baffle 3 can be changed inside the first enclosure 6 and the second enclosure 7 to accommodate the placement of structures of different sizes.

[0028] The length of the limiting plate 4 is smaller than the length of the placing rack 5. A plurality of placing holes 8 are provided inside the placing rack 5. The placing holes 8 penetrate the placing rack 5. Thus, when the placing rack 5 needs to be cleaned, the placing rack 5 is separated from the workbench 2. The placing holes 8 provided inside the placing rack 5 can be thoroughly cleaned to avoid the problem of impurity accumulation.

[0029] By adopting the above technical solution:

[0030] The damping rod 9 is contracted by squeezing the top plate 10 so that the baffle 3 is located inside the first enclosure 6 and the second enclosure 7. The top plate 10 is then released. Through the lifting of the damping rod 9, one end of the baffle 3 and one end of the top plate 10 are in contact with the first enclosure 6 and the second enclosure 7 respectively. At the same time, the installation position of the baffle 3 can be changed inside the first enclosure 6 and the second enclosure 7 to accommodate the placement of structures of different sizes.

[0031] Working principle: When in use, take out the placement rack 5, and when connecting the placement rack 5 to the workbench 2, make one end of the placement rack 5 contact with the side of the limiting plate 4, and the placement rack 5 is limited by the limiting plate 4, and the semiconductor cleaning agent to be tested is taken out, and the semiconductor cleaning agent is placed inside the test tube, and the test tube is placed inside the placement hole 8. At the same time, the placement hole 8 passes through the placement rack 5. In this way, when the placement rack 5 needs to be cleaned, the placement rack 5 is separated from the workbench 2, and the placement hole 8 opened inside the placement rack 5 can be thoroughly cleaned to avoid the problem of impurity accumulation.

[0032] Meanwhile, a first enclosure 6 and a second enclosure 7 are provided above the workbench 2, which can protect the workbench 2 and avoid safety accidents caused by the flow of semiconductor cleaning agent during the detection process.

[0033] And by squeezing the top plate 10, the damping rod 9 is contracted, so that the baffle 3 is located inside the first enclosure 6 and the second enclosure 7, and then the top plate 10 is released. Through the lifting of the damping rod 9, one end of the baffle 3 and one end of the top plate 10 are respectively in contact with the first enclosure 6 and the second enclosure 7. At the same time, the installation position of the baffle 3 can be changed inside the first enclosure 6 and the second enclosure 7 to adapt to the placement of structures of different sizes.

[0034] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A semiconductor cleaning agent detection device, characterized in that: It comprises a workbench (2) and a placement rack (5) arranged on the top of the workbench (2), the placement rack (5) and the workbench (2) being detachable structures, and the placement rack (5) is used to place a semiconductor cleaning agent to be tested; The workbench (2) is provided with a limit plate (4) on one side of the placement rack (5), and the limit plate (4) is connected to the workbench (2) by spot welding. The top of the workbench (2) is provided with a first enclosure (6) and a second enclosure (7), and the first enclosure (6) and the second enclosure (7) are detachably mounted on the workbench (2) and are used to protect the semiconductor cleaning agent detection on the upper surface of the workbench (2).

2. The semiconductor cleaning agent detection device according to claim 1, characterized in that: The height of the first enclosure (6) is greater than the height of the second enclosure (7), and the first enclosure (6) and the second enclosure (7) are an integrated structure.

3. The semiconductor cleaning agent detection device according to claim 1, characterized in that: A baffle (3) is provided at the top of the workbench (2) on the other side of the placement rack (5), and the baffle (3) is located inside the first enclosure (6) and the second enclosure (7).

4. The semiconductor cleaning agent detection device according to claim 3, characterized in that: One end of the baffle plate (3) is slidably connected to a damping rod (9), and the other end of the damping rod (9) is provided with a top plate (10), and the top plate (10) and the damping rod (9) are connected by screws.

5. The semiconductor cleaning agent detection device according to claim 1, characterized in that: The length of the limiting plate (4) is smaller than the length of the placement rack (5).

6. The semiconductor cleaning agent detection device according to claim 1, characterized in that: A plurality of placement holes (8) are provided inside the placement rack (5).

7. The semiconductor cleaning agent detection device according to claim 1, characterized in that: A support frame (1) is provided at the bottom end of the workbench (2); the support frame (1) is connected to the workbench (2) in a fixed manner; and a cross brace is provided inside the support frame (1).

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