Solder adhesion equipment and solder adhesion production line

Abstract

The utility model relates to the field of processing and production, and discloses a welding flux adhesion device and a welding flux adhesion production line, the welding flux adhesion device comprises a rack, a transfer device, an adhesive device and a welding flux adhesion device, and the rack is provided with an adhesive station and a welding flux adhesion station. And the gluing device is arranged corresponding to the gluing station. And the solder bonding device is arranged corresponding to the solder bonding station. According to the utility model, the workpieces to be processed can be glued on the gluing station through the gluing device and can be glued on the welding flux bonding station through the welding flux bonding device in sequence. The whole technological process is high in automation degree, the machining and manufacturing efficiency and quality are effectively improved, waste of human resources is greatly reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the field of processing and production, and specifically relates to a solder bonding device and a solder bonding production line. Background Art

[0002] In production and life, there are some scenarios where solder needs to be adhered to the workpiece, such as the production of the grinding layer of the grinding wheel rod. The head of the grinding wheel rod is provided with a grinding layer, which is mainly used for grinding the surface of parts. The production of the grinding layer can adopt the process of bonding solder with glue. Specifically, glue is glued to the head of the grinding wheel rod, and then the solder is adhered by glue, so that a grinding layer is formed on the head of the grinding wheel rod. In the existing technology, the above-mentioned process methods are all completed by manual operation, and there are problems such as low efficiency and quality of processing and production, more human resources are required, and the production cost is high. Of course, not only the production of the grinding layer of the grinding wheel rod, but also the bonding solder process of other workpieces may also have similar situations and problems. Utility Model Content

[0003] In view of the above-mentioned deficiencies or defects in the prior art, the utility model provides a solder bonding device and a solder bonding production line, aiming to solve the technical problems of low efficiency and quality in the manual processing of solder bonding to workpieces, requiring more human resources and high production costs.

[0004] To achieve the above object, the utility model provides a solder bonding device, comprising:

[0005] The rack has a gluing station and a soldering station;

[0006] The transfer device comprises a transfer mechanism and a workpiece carrying fixture, wherein the transfer mechanism is arranged on the frame, and the workpiece carrying fixture is arranged on the transfer mechanism and can sequentially pass through the gluing station and the soldering station under the drive of the transfer mechanism;

[0007] A gluing device, which is arranged on the frame and corresponds to the gluing station;

[0008] The solder sticking device is arranged on the frame and corresponds to the solder sticking station.

[0009] Optionally, the solder bonding device comprises:

[0010] A multi-axis driving mechanism is arranged on the frame;

[0011] A first rotating clamping jaw is drivingly connected to the multi-axis driving mechanism;

[0012] The striking mechanism is arranged on the multi-axis driving mechanism, and the clamping end of the first rotating clamping jaw is located within the striking range of the striking mechanism.

[0013] Optionally, the striking mechanism comprises:

[0014] A striking driving member, arranged on the multi-axis driving mechanism;

[0015] A plurality of striking assemblies are respectively arranged on the rotating output shaft of the striking driving member, and the clamping end of the first rotating clamping jaw is located in the rotating path of the striking assembly.

[0016] Optionally, the striking component has an elastic deformation amount.

[0017] Optionally, the solder bonding device further comprises:

[0018] A mounting seat, arranged on the multi-axis driving mechanism;

[0019] The swing component is arranged on the mounting seat, and the output end of the swing component is connected to the first rotating clamp.

[0020] Optionally, the solder bonding device further comprises:

[0021] A mobile driving assembly, arranged on the mounting seat;

[0022] The second rotating jaw is arranged on the mobile driving component, and the rotation axis of the clamping end is perpendicular to the rotation axis of the clamping end of the first rotating jaw. There is a loading and unloading position on the moving path of the second rotating jaw. The clamping end of the second rotating jaw at the loading and unloading position is arranged opposite to the clamping end of the first rotating jaw.

[0023] Optionally, the gluing device includes a gluing mechanism, which includes a glue box, a rotary driving member and a docking clamp, the rotary driving member is located on one side of the glue box, the docking clamp is arranged on the rotating output shaft of the rotary driving member, and the docking clamp has a material unloading handover position on the rotation path.

[0024] Optionally, the gluing device also includes a glue-spinning mechanism, which includes a glue-spinning drive assembly and a glue-spinning clamp, wherein the glue-spinning clamp is arranged on the output shaft of the glue-spinning drive assembly, and the glue-spinning clamp has a loading handover position on the rotation path, and the clamping end of the glue-spinning clamp at the loading handover position is arranged opposite to the clamping end of the connecting clamp at the unloading handover position.

[0025] Optionally, the frame also has a drying station, and the solder bonding equipment also includes a drying device arranged on the frame and corresponding to the drying station. The workpiece carrying fixture passes through the gluing station, the drying station, and the solder bonding station in sequence under the drive of the transfer mechanism.

[0026] The utility model also provides a solder bonding production line, comprising:

[0027] The above solder bonding equipment;

[0028] A feeding device, comprising a feeding conveyor belt and a feeding robot, wherein the movement range of the feeding robot covers the feeding conveyor belt and the gluing device;

[0029] The unloading device comprises an unloading conveyor belt and an unloading robot, wherein the motion range of the unloading robot covers the unloading conveyor belt and the transfer mechanism.

[0030] Through the above technical solution, the workpiece to be processed can be carried on the workpiece carrying fixture, and the workpiece carrying fixture is driven by the transfer mechanism to pass through the gluing station and the soldering station in sequence, and the gluing station is correspondingly arranged with a gluing device, and the soldering station is correspondingly arranged with a soldering device. In this way, the workpiece to be processed can be glued in the gluing station by the gluing device, and soldered in the soldering station by the soldering device. The entire process has a high degree of automation, which effectively improves the efficiency and quality of processing and production, greatly reduces the waste of human resources, and reduces production costs.

[0031] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation to the present invention. In the accompanying drawings:

[0033] Figure 1 This is a schematic diagram of the structure of the solder bonding production line of the utility model;

[0034] Figure 2 for Figure 1 The structural diagram of the solder bonding production line after omitting the loading and unloading manipulators;

[0035] Figure 3 for Figure 1 The schematic diagram of the structure of the transfer device and the drying device;

[0036] Figure 4 for Figure 1 The structural diagram of the medium adhesive device;

[0037] Figure 5 for Figure 1 Schematic diagram of the structure of the transfer robot;

[0038] Figure 6 for Figure 1A schematic diagram of the structure of the solder sticking device;

[0039] Figure 7 for Figure 6 A schematic diagram of the structure of the solder sticking device from another perspective;

[0040] Figure 8 for Figure 6 A schematic diagram of the structure of the rotating plate and multiple striking components;

[0041] Fig. 9 It is a structural schematic diagram of the grinding wheel rod being inserted into the material tray.

[0042] Description of reference numerals:

[0043] 100 racks

[0044] 101 working surface

[0045] 200 Transfer Device

[0046] 201 Turntable 202 Workpiece carrying fixture

[0047] 203 Turntable drive

[0048] 300 Gluing device

[0049] 301 adhesive support seat 302 adhesive box

[0050] 303 Rotary drive 304 Connecting claw

[0051] 305 Spinning glue support seat 306 Turntable

[0052] 307 Glue throwing drive 308 Glue throwing clamp

[0053] 309 Transfer robot body 310 Transfer gripper

[0054] 311 Annular protective cover 312 Protective cover drive

[0055] 400 Drying device

[0056] 401 Oven 402 Heat Insulation Board

[0057] 500 Soldering Device

[0058] 501 solder box 502 multi-axis drive mechanism

[0059] 503 Mounting seat 504 Swing drive element

[0060] 505 Swing seat 506 First rotating clamp

[0061] 507 second rotating clamp 508 moving driving member

[0062] 509 striking driving member 510 rotating plate

[0063] 511 Beating rod 512 Tension adjustment block

[0064] 513 Elastic parts

[0065] 600 Loading device

[0066] 601 Feeding conveyor belt 602 Feeding robot

[0067] 700 Feeding device

[0068] 701 Unloading conveyor belt 702 Unloading robot

[0069] 800 Grinding Wheel Rod DETAILED DESCRIPTION

[0070] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0071] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features thereof may be combined with each other.

[0072] In the present invention, unless otherwise specified, directional words such as "up, down, top, bottom" are usually used with reference to the directions shown in the drawings or are used to describe the relative positional relationships of components in the vertical, perpendicular or gravity direction.

[0073] The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0074] The utility model first provides a solder bonding device. The solder bonding device is mainly used for solder bonding of rod-shaped workpieces. Fig. 9 As shown, taking the grinding wheel rod 800 as an example, the grinding wheel rod 800 needs to form a grinding layer at one end. Therefore, during the solder adhesion process, one end of the grinding wheel rod 800 is the processing part that needs to adhere the solder, and the other end is used for clamping by the clamp during the processing process, and can also be used to be inserted into the workpiece carrying fixture or material tray.

[0075] In one embodiment, referring to Figure 1 and attached Figure 2As shown, the solder bonding equipment includes a frame 100, a transfer device 200, a gluing device 300 and a soldering device 500. The frame 100 has a gluing station and a soldering station. The transfer device 200 includes a transfer mechanism and a workpiece carrying fixture. The transfer mechanism is arranged on the frame 100, and the workpiece carrying fixture is arranged on the transfer mechanism. Under the drive of the transfer mechanism, it can pass through the gluing station and the soldering station in sequence. The gluing device 300 is arranged on the frame 100 and arranged corresponding to the gluing station. The soldering device 500 is arranged on the frame 100 and arranged corresponding to the soldering station.

[0076] By means of the solder bonding device of this embodiment, the workpiece to be processed can be carried on the workpiece carrying fixture 202, and the workpiece carrying fixture 202 is driven by the transfer mechanism to sequentially pass through the gluing station and the soldering station, and the gluing station is correspondingly provided with a gluing device 300, and the soldering station is correspondingly provided with a soldering device 500. With such a configuration, the workpiece to be processed can be sequentially glued at the gluing station by the gluing device 300, and soldered at the soldering station by the soldering device 500. The entire process has a high degree of automation, which effectively improves the efficiency and quality of processing and manufacturing, greatly reduces the waste of human resources, and reduces production costs.

[0077] In one embodiment, referring to Figure 1 To Attachment Figure 3 As shown, the frame 100 has a horizontally arranged working surface 101, and the working surface 101 is provided with a gluing station, a soldering station and a blanking station. The transfer mechanism includes a turntable 201 arranged parallel to the working surface 101 and a turntable driving component 203 drivingly connected to the turntable 201. The gluing station, the soldering station and the blanking station are arranged in sequence along the circumference of the turntable 201. The workpiece carrying fixture is arranged on the turntable 201. The turntable 201 rotates around its own axis under the drive of the turntable driving component 203 to drive the workpiece carrying fixture 202 to pass through the gluing station, the soldering station and the blanking station in sequence.

[0078] Further, see Attachment Figure 3As shown, the transfer mechanism includes a transfer support seat fixedly mounted on the working surface 101, and the turntable 201 is rotatably mounted on the transfer support seat. The turntable 201 may include a central rotating portion and multiple extension portions, and the multiple extension portions are distributed at intervals along the circumference of the turntable 201, and extend radially outward from the central rotating portion respectively. A workpiece carrying fixture 202 is fixedly provided at the end of each extension portion, and the intervals of the multiple extension portions are set to correspond to the intervals of the gluing station, the soldering station, and the blanking station. In this way, the turntable 201 can make the workpiece carrying fixtures 202 on the multiple extension portions enter the next station respectively each time it rotates under the drive of the turntable driving member 203. In this way, the processes of the gluing station, the soldering station, and the blanking station can be carried out simultaneously, effectively improving the processing efficiency. In addition, the workpiece carrying position on the workpiece carrying fixture 202 can be set to multiple, so that the workpiece carrying fixture 202 can carry multiple workpieces at the same time, which can further improve the processing efficiency.

[0079] Specifically, the turntable driving member 203 can be a driving member such as a driving motor, and is drivingly connected to the central rotating part of the turntable 201 through a transmission mechanism such as a gear transmission mechanism.

[0080] Furthermore, the transfer mechanism may also include a detection component, the detection component includes a detection bracket and a plurality of workpiece sensors, the detection bracket includes a longitudinal rod and three transverse rods, the first end of the longitudinal rod is fixedly mounted on the transfer support seat, the second end axially penetrates the central rotating part of the turntable 201 and is provided with a central through hole, the three transverse rods extend from the second end of the longitudinal rod to the gluing station, the soldering station and the unloading station respectively, the ends of the three transverse rods are respectively provided with sensor carriers, each of the sensor carriers is provided with a plurality of workpiece sensors, the plurality of workpiece sensors are arranged one by one corresponding to the plurality of workpiece carrying positions on the workpiece carrying fixture 202 on the corresponding station, so that the plurality of workpiece sensors can respectively detect the plurality of workpiece carrying positions to determine whether there are workpieces on the workpiece carrying positions.

[0081] In one embodiment, referring to Figure 2 and attached Figure 6 As shown, the solder bonding device 500 includes a multi-axis driving mechanism 502, a first rotating jaw 506 and a tapping mechanism. The multi-axis driving mechanism 502 is arranged on the frame 100, the first rotating jaw 506 is drivingly connected to the multi-axis driving mechanism 502, the tapping mechanism is arranged on the multi-axis driving mechanism 502, and the clamping end of the first rotating jaw 506 is located within the tapping range of the tapping mechanism.

[0082] In actual application, the soldering device 500 also includes a solder box 501 arranged side by side on the frame 100. The multi-axis driving mechanism 502 drives the first rotating clamp 506 to clamp the workpiece on the workpiece carrying fixture 202 located at the soldering station, and insert the workpiece into the solder box 501 through the soldering port of the solder box 501 to achieve solder adhesion, thereby forming a polishing layer.

[0083] In this embodiment, the solder bonding device 500 includes a tapping mechanism. After the first rotating jaw 506 clamps the workpiece to complete the bonding, the tapping mechanism can intermittently tap the clamping end of the first rotating jaw 506, so that the workpiece is indirectly tapped and shaken, causing excess solder on the workpiece to fall off, effectively ensuring the uniform distribution of the solder on the workpiece.

[0084] In this embodiment, the multi-axis driving mechanism 502 is a three-axis driving mechanism, including an X-axis driving unit, a Y-axis driving unit and a Z-axis driving unit. The X-axis driving unit is arranged on the frame 100, the Y-axis driving unit is arranged on the X-axis driving unit, and the Z-axis driving unit is arranged on the Y-axis driving unit. The first rotating jaw 506 is drivingly connected to the Z-axis driving unit. In this way, the multi-axis driving mechanism 502 can drive the first rotating jaw 506 to move in three mutually perpendicular directions of X, Y and Z, and the movement is flexible and smooth.

[0085] In one embodiment, referring to Figure 2 and attached Figure 6 As shown, the solder bonding device 500 further includes a mounting seat 503 and a swing assembly. The mounting seat 503 is arranged on the multi-axis driving mechanism 502, the swing assembly is arranged on the mounting seat 503, the output end of the swing assembly is connected to the first rotating jaw 506, and the first rotating jaw 506 swings under the drive of the output end of the swing assembly.

[0086] In actual application, the rotation axis of the clamping end of the first rotating jaw 506 is set to deviate from and not coincide with the swing axis of the first rotating jaw 506, so that the clamping end of the first rotating jaw 506 can swing when driven by the swing assembly.

[0087] In this embodiment, after the first rotating jaw 506 clamps the workpiece to be bonded, it can be inserted into the solder box 501 through the bonding port of the solder box 501 under the drive of the multi-axis driving mechanism 502. At this time, the swing component drives the first rotating jaw 506 to swing around the swing axis. At the same time, the clamping end of the first rotating jaw 506 rotates, so that the workpiece to be bonded can rotate and swing in the solder box 501, so as to fully contact with the solder in the solder box 501. In this way, the quality of bonding is effectively improved, thereby improving the processing quality of the workpiece.

[0088] In this embodiment, refer to the attached Figure 6As shown, the swing assembly includes a swing driving member 504 disposed on a mounting seat 503 and a swing seat 505 disposed on the rotation output shaft of the swing driving member 504. The first rotating jaw 506 is disposed on the swing seat 505, and the rotation axis of the clamping end is perpendicular to the rotation output shaft axis of the swing driving member 504. The swing seat 505 drives the first rotating jaw 506 to swing around the rotation output shaft axis of the swing driving member 504 under the drive of the swing driving member 504.

[0089] Specifically, the swing driving member 504 may be a driving member such as a servo motor.

[0090] In one embodiment, referring to Figure 6 and attached Figure 7 As shown, the solder bonding device 500 also includes a mobile driving component and a second rotating jaw 507. The mobile driving component is arranged on the mounting base 503, and the second rotating jaw 507 is arranged on the mobile driving component, and the rotation axis of the clamping end is perpendicular to the rotation axis of the clamping end of the first rotating jaw 506. The second rotating jaw 507 moves under the drive of the mobile driving component, and has a loading and unloading position on the moving path. The clamping end of the second rotating jaw 507 at the loading and unloading position is arranged relative to the clamping end of the first rotating jaw 506.

[0091] In actual application, the second rotating jaw 507 can clamp the workpiece on the workpiece carrying fixture 202 located at the soldering station, and the second rotating jaw 507 can be driven to move by the mobile driving component, so that the second rotating jaw 507 moves to the loading and handover position, and the workpiece is transferred to the first rotating jaw 506. Since the rotation axis of the clamping end of the second rotating jaw 507 is perpendicular to the rotation axis of the clamping end of the first rotating jaw 506, the workpiece can be clamped and rotated by the second rotating jaw 507, and the part of the workpiece required for bonding can be rotated to the required angle and position before the workpiece is transferred to the first rotating jaw 506, so as to avoid the part of the workpiece required for bonding that is transferred to the first rotating jaw 506 being blocked in the clamping of the first rotating jaw 506, thereby affecting the bonding effect.

[0092] In this embodiment, specifically, the mobile driving assembly may include a sliding seat slidably connected to the mounting seat 503 and a mobile driving member 508 installed on the mounting seat 503, the second rotating jaw 507 is installed on the sliding seat, the mobile driving member 508 is connected to the sliding seat, and drives the sliding seat to move, thereby driving the second rotating jaw 507 on the sliding seat to move.

[0093] In one embodiment, referring to Figure 6 To Attachment Figure 8As shown, the knocking mechanism includes a knocking drive 509 and a plurality of knocking components. The knocking drive 509 is arranged on the multi-axis drive mechanism 502, and the plurality of knocking components are respectively arranged on the rotating output shaft of the knocking drive 509. The clamping end of the adhesive clamping mechanism is located within the rotation path of the knocking component.

[0094] Specifically, the striking driving member 509 may be disposed on the swing seat 505 , and a plurality of striking assemblies intermittently strike the clamping end of the first rotating clamping jaw 506 under the drive of the striking driving member 509 .

[0095] By setting up a knocking mechanism, after the first rotating jaw 506 clamps the workpiece and completes the bonding, the knocking mechanism can intermittently knock the clamping end of the first rotating jaw 506, so that the workpiece is indirectly knocked and shaken, causing excess solder on the workpiece to fall off, effectively ensuring the uniform distribution of the solder on the workpiece.

[0096] In one embodiment, the striking assembly has an elastic deformation amount, and the rotary output shaft of the striking driving member 509 is connected with a rotating plate 510, and a plurality of striking assemblies are arranged at intervals along the circumference of the rotating plate 510. When the clamping end of the first rotating clamp 506 is struck, elastic deformation occurs so as to give way to the clamping end of the first rotating clamp 506. After the clamping end of the adhesive material clamp mechanism passes through the striking assembly completely, the striking assembly is quickly reset. The striking assembly includes a striking rod 511 and an elastic member 513, the striking rod 511 is hinged on the rotating plate 510 and has a striking position, in the striking position, the rotation path of the striking rod 511 covers the clamping end of the adhesive material clamp mechanism, and the elastic member 513 is connected to the striking rod 511 to provide the striking rod 511 with an elastic force to remain in the striking position.

[0097] Specifically, the rotation output shaft of the striking driver 509 can be arranged side by side with the clamping end of the first rotating clamp 506 , and the rotating plate 510 is coaxially connected to the rotation output shaft of the striking driver 509 .

[0098] Specifically, the elastic member 513 can be a tension spring or a compression spring, and the striking assembly can also include a tension adjustment block 512. One end of the striking rod 511 in the striking position is hinged to the rotating plate 510, and the other end extends to the outer peripheral side of the rotating plate 510. The tension adjustment block 512 is fixed to the rotating plate 510 and is spaced apart from the striking rod 511 in the circumferential direction of the rotating plate 510. One end of the elastic member 513 is connected to the striking rod 511, and the other end is connected to the tension adjustment block 512. Of course, the elastic member 513 can also be other elastic components with elasticity, such as elastic sheets.

[0099] It can be understood that, since the beating rod 511 is connected to the rotating plate 510 in a hinged manner, and under the elastic force of the elastic member 513, the beating rod 511 has a certain buffer when striking the clamping end of the first rotating clamp 506, avoiding the situation where the first rotating clamp 506 is quickly damaged due to rigid contact. And under the elastic force of the elastic member 513, the beating rod 511 can be quickly reset after striking.

[0100] In order to adjust the elastic force of the elastic member 513 on the beating rod 511, the tension adjustment block 512 can be set to be adjustable in position along the circumference of the rotating plate 510, so that the elastic force of the elastic member 513 on the beating rod 511 can be adjusted by adjusting the position of the tension adjustment block 512. Specifically, the tension adjustment block 512 can be detachably connected to the rotating plate 510 through the structure of bolts and waist-shaped holes to achieve adjustable position along the circumference of the rotating plate 510.

[0101] In one embodiment, referring to Figure 2 and attached Figure 4 As shown, the gluing device 300 includes a gluing mechanism, which includes a gluing box 302, a rotary driving member 303 and a docking clamp 304. The rotary driving member 303 is located on one side of the gluing box 302, and the docking clamp 304 is arranged on the rotating output shaft of the rotary driving member 303. The docking clamp 304 can rotate under the drive of the rotary driving member 303 and has a material unloading handover position.

[0102] In actual application, the workpiece to be glued can be inserted into the glue box 302 through the glue opening of the glue box 302 to achieve gluing, and then the glued workpiece can be clamped on the docking clamp 304. This gluing operation can be performed manually or by a robot (for details, please refer to the subsequent implementation method). Then, the docking clamp 304 is driven by the rotary drive member 303 to rotate to the unloading handover position to enter the subsequent processing flow.

[0103] Specifically, the glue mechanism may include a glue support seat 301 , which is fixedly mounted on the frame 100 , a glue box 302 disposed on the glue support seat 301 and having a glue port connected to the inside, and a rotary drive member 303 disposed on the glue support seat 301 .

[0104] In one embodiment, referring to Figure 2 and attached Figure 4As shown, the gluing device 300 also includes a glue-spinning mechanism, which includes a glue-spinning drive assembly and a glue-spinning clamp 308. The glue-spinning clamp 308 is arranged on the glue-spinning drive assembly and can rotate under the drive of the glue-spinning drive assembly. The glue-spinning clamp 308 has a loading and unloading handover position on the rotation path, and the clamping end of the glue-spinning clamp 308 at the loading and unloading handover position is arranged opposite to the clamping end of the connecting clamp 304 at the unloading handover position.

[0105] During the actual application process, the connecting clamp 304 at the unloading handover position is connected with the glue-spinning clamp 308 at the loading handover position, and the workpiece after gluing can be transferred to the glue-spinning clamp 308. After the handover is completed, the connecting clamp 304 is driven by the rotary drive member 303 to rotate to a position to avoid the glue-spinning clamp 308. At this time, the glue-spinning clamp 308 is driven by the glue-spinning drive component to rotate at a high speed, so that the glue-spinning clamp 308 can hold the workpiece after gluing and rotate at a high speed, so that the excess glue on the workpiece after gluing is thrown off during the high-speed rotation, and then the glue distribution on the workpiece is more even and appropriate.

[0106] Specifically, the glue-spinning driving assembly may include a turntable 306 and a glue-spinning driving member 307, the glue-spinning driving member 307 is drivingly connected to the turntable 306, and the glue-spinning clamp 308 is arranged on the turntable 306. The turntable 306 can rotate around its own axis under the drive of the glue-spinning driving member 307 to drive the glue-spinning clamp 308 to rotate, thereby realizing glue-spinning.

[0107] Specifically, the glue-spinning driving assembly may include a glue-spinning support seat 305 , which is fixedly mounted on the frame 100 , and a turntable 306 is disposed on the glue-spinning support seat 305 .

[0108] In order to improve the effect of glue spinning, the clamping end of the glue spinning claw 308 can be arranged at the edge of the turntable 306 .

[0109] Of course, in order to improve the efficiency of glue spinning, a plurality of glue spinning jaws 308 may be arranged at intervals along the circumferential direction on the turntable 306, so that the glue spinning operation can be performed on a plurality of glued workpieces at the same time.

[0110] Specifically, the glue-spinning driving member 307 can be a driving member such as a driving motor, and is drivingly connected to the turntable 306 through a transmission mechanism such as a gear transmission mechanism.

[0111] In one embodiment, referring to Figure 4 As shown, the glue-spinning mechanism further includes an annular protective cover 311 and a protective cover driving member 312. The protective cover driving member 312 is drivingly connected to the annular protective cover 311; wherein the annular protective cover 311 can move under the drive of the protective cover driving member 312, and has a protective position surrounding the outer peripheral side of the rotation path of the glue-spinning clamp 308 on the moving path.

[0112] By providing the annular protective cover 311, when the glue-spinning jaws 308 rotate to perform the glue-spinning operation, the annular protective cover 311 can be in a protective position to block and collect the glue that is spun out, thereby preventing the glue that is spun out from scattering and polluting the environment.

[0113] In this embodiment, the glue-spinning driving assembly specifically includes a turntable 306 and a glue-spinning driving member 307, and the glue-spinning clamp 308 is arranged on the turntable 306. The annular protective cover 311 is specifically arranged to be arranged around the turntable 306, and can be switched between a protective position and an avoidance position under the drive of the protective cover driving member 312. In the protective position, the annular protective cover 311 surrounds the outer peripheral side of the turntable 306, thereby surrounding the outer peripheral side of the rotation path of the glue-spinning clamp 308. In the avoidance position, the annular protective cover 311 is staggered with the turntable 306 in the axial direction.

[0114] Specifically, the shield driving member 312 is a telescopic driving member such as a cylinder or an oil cylinder, supported between the annular shield 311 and the frame 100, and the annular shield 311 can be driven to move axially through the telescopic action of the shield driving member 312 to have a protective position and an avoidance position. Of course, in order to ensure the reliability of the structure, multiple shield driving members 312 can be set between the annular shield 311 and the frame 100.

[0115] In one embodiment, referring to Figure 2 and attached Figure 5 As shown, the gluing device 300 also includes a transfer robot, which includes a transfer robot body 309 disposed on the frame 100 and a transfer clamp 310 disposed at the end of the transfer robot body 309, and the transfer clamp 310 moves between the glue-spinning mechanism and the transfer mechanism under the drive of the transfer robot body 309. The workpiece after glue-spinning can be transferred to the workpiece carrying fixture 202 at the gluing station by the transfer robot to enter the next station.

[0116] In one embodiment, the frame 100 also has a drying station, and the solder bonding equipment also includes a drying device 400, which is arranged on the frame 100 and corresponds to the drying station arrangement, wherein the workpiece carrying fixture can sequentially pass through the gluing station, the drying station, and the soldering station under the drive of the transfer mechanism. In this way, after the workpiece is glued, it will pass through the drying station and be dried by the drying device 400 before entering the soldering station for soldering operations, thereby effectively improving the quality effect of soldering.

[0117] See attached Figure 3As shown, the drying device 400 includes an oven 401, which is fixedly mounted on the frame 100 and has an inlet and an outlet, which are respectively located on opposite sides of the oven 401 in the circumferential direction of the turntable 201 and are respectively connected to the interior of the oven 401. The workpiece carrying fixture 202 enters the interior of the oven 401 from the inlet under the drive of the turntable 201 and exits the interior of the oven 401 from the outlet. With this arrangement, the workpiece after gluing can be directly put into the oven 401.

[0118] In order to prevent the heat of the oven 401 from overflowing, the drying device 400 may further include two heat insulation plates 402 which are arranged at corresponding intervals on two opposite sides of the oven 401 in the circumferential direction of the turntable 201 .

[0119] The invention also provides a solder bonding production line.

[0120] In one embodiment, referring to Figure 1 and attached Figure 2 As shown, the solder bonding production line includes the above-mentioned solder bonding equipment, a loading device 600 and a unloading device 700. The loading device 600 includes a loading conveyor belt 601 and a loading robot 602. The motion range of the loading robot 602 covers the loading conveyor belt 601 and the gluing device 300. The unloading device 700 includes a unloading conveyor belt 701 and a unloading robot 702. The motion range of the unloading robot 702 covers the unloading conveyor belt 701 and the transfer mechanism.

[0121] In one embodiment, the feeding conveyor belt 601 is arranged on the frame 100. The feeding robot 602 includes a feeding robot body arranged on the frame 100 and a feeding clamping claw arranged at the end of the feeding robot body, and the feeding clamping claw moves between the feeding conveyor belt 601 and the gluing mechanism under the drive of the feeding robot body.

[0122] In actual application, the loading conveyor belt 601 can transport the loading tray carrying multiple workpieces to be processed to a position adjacent to the gluing mechanism, and the loading robot 602 can grab the workpieces on the loading tray and transfer them to the gluing box 302 for gluing, and clamp the gluing workpieces on the docking clamp 304. In this way, the automation of loading is realized, the automation degree of the solder bonding equipment is further improved, and the processing efficiency is improved.

[0123] In one embodiment, referring to Figure 1 and attached Figure 2As shown, the frame 100 also has a material unloading station, which is located downstream of the soldering station. The material unloading conveyor belt 701 is arranged on the frame 100 and corresponds to the material unloading station. The material unloading manipulator 702 includes a material unloading manipulator body arranged on the frame 100 and a material unloading clamping claw arranged at the end of the material unloading manipulator body. The material unloading clamping claw moves between the material unloading conveyor belt 701 and the turntable 201 under the drive of the material unloading manipulator body.

[0124] In actual application, a material unloading tray is provided on the unloading conveyor belt 701. After the first rotating jaw 506 clamps the workpiece and completes the bonding, the workpiece after bonding can be transferred to the second rotating jaw 507 again. The workpiece after bonding is placed on the workpiece carrying fixture 202 located at the soldering station through the second rotating jaw 507. Finally, the unloading manipulator can grab the workpiece on the workpiece carrying fixture 202 located at the soldering station, and transfer the workpiece after bonding to the unloading tray on the unloading conveyor belt 701 to realize unloading. In this way, the automation of unloading is realized, the automation degree of solder bonding equipment is further improved, and the processing efficiency is improved.

[0125] The above are only preferred implementation modes of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0126] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present utility model will not further describe various possible combinations.

[0127] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A solder bonding device, characterized in that: include: The frame (100) has a gluing station and a soldering station; A transfer device (200) comprises a transfer mechanism and a workpiece carrying jig, wherein the transfer mechanism is arranged on the frame (100), and the workpiece carrying jig is arranged on the transfer mechanism and can sequentially pass through the gluing station and the soldering station under the drive of the transfer mechanism; A gluing device (300) is arranged on the frame (100) and corresponds to the gluing station; The soldering device (500) is arranged on the frame (100) and corresponds to the soldering station arrangement.

2. The solder bonding device according to claim 1, characterized in that: The solder bonding device (500) comprises: A multi-axis driving mechanism (502) is arranged on the frame (100); A first rotating clamp (506) is drivingly connected to the multi-axis driving mechanism (502); The striking mechanism is arranged on the multi-axis driving mechanism (502), and the clamping end of the first rotating clamping jaw (506) is located within the striking range of the striking mechanism.

3. The solder bonding device according to claim 2, characterized in that: The striking mechanism comprises: A striking driving member (509) is arranged on the multi-axis driving mechanism (502); A plurality of striking components are respectively arranged on the rotating output shaft of the striking driving member (509), and the clamping end of the first rotating clamping jaw (506) is located within the rotating path of the striking component.

4. The solder bonding device according to claim 3, characterized in that: The striking component has an elastic deformation amount.

5. The solder bonding device according to claim 2, characterized in that: The solder bonding device (500) further comprises: A mounting seat (503) is arranged on the multi-axis driving mechanism (502); A swing assembly is arranged on the mounting seat (503), and an output end of the swing assembly is connected to the first rotating clamp (506).

6. The solder bonding device according to claim 5, characterized in that: The solder bonding device (500) further comprises: A mobile driving assembly, arranged on the mounting seat (503); The second rotating jaw (507) is arranged on the mobile driving component, and the rotation axis of the clamping end is perpendicular to the rotation axis of the clamping end of the first rotating jaw (506). The moving path of the second rotating jaw (507) has a loading and unloading position. The clamping end of the second rotating jaw (507) at the loading and unloading position is arranged opposite to the clamping end of the first rotating jaw (506).

7. The solder bonding device according to claim 1, characterized in that: The gluing device (300) comprises a gluing mechanism, which comprises a glue box (302), a rotary drive member (303) and a docking clamp (304), wherein the rotary drive member (303) is located at one side of the glue box (302), the docking clamp (304) is arranged on the rotating output shaft of the rotary drive member (303), and the docking clamp (304) has a material unloading handover position on the rotation path.

8. The solder bonding device according to claim 7, characterized in that: The gluing device (300) further comprises a glue-spinning mechanism, the glue-spinning mechanism comprising a glue-spinning driving assembly and a glue-spinning clamp (308), the glue-spinning clamp (308) being arranged on the output shaft of the glue-spinning driving assembly, the glue-spinning clamp (308) having a loading and unloading handover position on the rotation path, the clamping end of the glue-spinning clamp (308) at the loading and unloading handover position is arranged opposite to the clamping end of the connecting clamp (304) at the unloading and unloading handover position.

9. The solder bonding device according to claim 1, characterized in that: The frame (100) also has a drying station, and the solder bonding equipment also includes a drying device (400) arranged on the frame (100) and corresponding to the drying station. The workpiece carrying fixture passes through the gluing station, the drying station, and the solder bonding station in sequence under the drive of the transfer mechanism.

10. A solder bonding production line, characterized in that: include: The solder bonding device according to any one of claims 1 to 9; A feeding device (600), comprising a feeding conveyor belt (601) and a feeding robot (602), wherein the movement range of the feeding robot (602) covers the feeding conveyor belt (601) and the gluing device (300); The unloading device (700) comprises an unloading conveyor belt (701) and an unloading robot (702). The movement range of the unloading robot (702) covers the unloading conveyor belt (701) and the transfer mechanism.

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