Single crystal wafer cleaning device

Abstract

The utility model relates to the technical field of single crystal wafer cleaning, and discloses a single crystal wafer cleaning device which comprises a bottom plate, an ultrasonic vibration cleaning machine is fixedly installed at the upper end of the bottom plate, a first blow-off pipe is fixedly installed at the rear end of the ultrasonic vibration cleaning machine, and a flushing box is fixedly installed at the position, located on the right side of the ultrasonic vibration cleaning machine, of the upper end of the bottom plate. And a cleaning assembly is arranged in front of the flushing tank and comprises a bearing plate, the bearing plate is fixedly installed at the front end of the flushing tank, and a water storage tank is fixedly installed at the upper end of the bearing plate. According to the single crystal wafer cleaning device, the ultrasonic vibration washing machine and the cleaning assembly are installed, so that the cleaning device can conveniently use an ultrasonic vibration washing technology and pure water to wash and clean polishing liquid on the surface of a wafer in a vibration mode, chemical polishing abrasive residues after grinding and polishing can be effectively cleaned, and high-flow cleaning water with impact force is used for flushing the surface of the wafer; and the practicability of the cleaning device during use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of single wafer cleaning, in particular to a single wafer cleaning device. Background Art

[0002] Solar energy utilization technology has made great progress in research and development, commercial production, and market development. Single crystal wafers are the raw materials for manufacturing semiconductor silicon devices and the main materials for manufacturing high-power rectifiers, diodes, switching devices, etc. During the processing of single crystal wafers, single crystal wafers are prone to adhere to particles, organic matter, metals, or adsorb impurity molecules, and need to be cleaned.

[0003] However, the cleaning device of the prior art has a single cleaning method for the single wafer, and the cleaning efficiency is low. It is also difficult to effectively clean the chemical polishing abrasive residue after grinding and polishing, and the practicality of the device is low. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] The utility model aims to provide a single wafer cleaning device to solve the problem in the above background technology that the cleaning efficiency is low and it is difficult to effectively clean the chemical polishing abrasive residue after grinding and polishing.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single-wafer cleaning device, comprising a bottom plate, an ultrasonic vibration washing machine is fixedly installed on the upper end of the bottom plate, a sewage pipe is fixedly installed on the rear end of the ultrasonic vibration washing machine, a flushing box is fixedly installed on the upper end of the bottom plate and located on the right side of the ultrasonic vibration washing machine, a cleaning component is arranged in front of the flushing box, the cleaning component comprises a bearing plate, the bearing plate is fixedly installed on the front end of the flushing box, a water storage tank is fixedly installed on the upper end of the bearing plate, and a replenishing pipe is fixedly installed on the upper end of the water storage tank An output mounting cavity is fixedly provided in the middle of the flushing box, a water pump is fixedly installed in the middle of the output mounting cavity, a liquid inlet end of the front end of the water pump is fixedly connected with an extraction pipe, the water inlet end of the extraction pipe is fixedly connected with the water outlet end of the water storage tank, the water outlet end of the rear end of the water pump is fixedly connected with a delivery pipe, the water outlet end of the delivery pipe is fixedly connected with a water storage frame, the water storage frame is located in the middle of the flushing box, a cleaning nozzle is fixedly connected in the middle of the water storage frame, the cleaning nozzle is located inside the flushing box, and a support assembly is arranged above the ultrasonic vibrating washing machine.

[0008] Preferably, the support assembly includes a support frame, which is movably mounted in the middle of the ultrasonic vibration washer, and a limit plate is fixedly mounted on the outer end of the support frame. The limit plate is located at the upper end of the ultrasonic vibration washer, so that the cleaning device can use ultrasonic vibration technology plus pure water vibration to clean the polishing liquid on the surface of the chip, and can effectively clean the chemical polishing abrasive residue after grinding and polishing, and use high-flow and impact cleaning water to rinse the surface of the chip, thereby improving the practicality of the cleaning device when in use.

[0009] Preferably, a filter is fixedly installed in the middle of the support frame, and a separation box is fixedly installed on the upper end of the bottom plate on the right side of the ultrasonic vibration washing machine to facilitate the storage of single wafers.

[0010] Preferably, a separation assembly is provided in front of the separation box, and the separation assembly includes a mounting plate, and the mounting plate is fixedly mounted on the front end of the separation box, and a separation motor is fixedly mounted on the upper end of the mounting plate, thereby improving the practicability of the cleaning device when in use.

[0011] Preferably, a rotating rod is fixedly mounted on the transmission end of the rear end of the separation motor, and a stirring blade is fixedly mounted on the outer end of the rotating rod located inside the separation box to accelerate the separation speed of the wafer and the paraffin.

[0012] Preferably, a second sewage pipe is fixedly installed at the rear end of the separation box, and a third sewage pipe is fixedly installed at the rear end of the flushing box, so as to facilitate the discharge of dirty liquid after cleaning or separation is completed.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The single-wafer cleaning device is equipped with an ultrasonic vibration washing machine and a cleaning component, so that the cleaning device can use ultrasonic vibration washing technology and pure water vibration washing to clean the polishing liquid on the surface of the wafer, and can effectively clean the chemical polishing abrasive residue after grinding and polishing, and use high-flow and impact cleaning water to rinse the surface of the wafer, thereby improving the practicality of the cleaning device when in use;

[0015] 2. The single wafer cleaning device is convenient for storing single wafers by installing a support assembly, and is convenient for placing and taking out during the cleaning process, thereby enhancing the convenience of cleaning, and improving the efficiency and practicality of cleaning;

[0016] 3. The single-wafer cleaning device is equipped with a separation box and a separation component, so that the cleaning device can use a dewaxing liquid to soak the wafer to separate the wafer from the paraffin. The dewaxing liquid can be stirred during the soaking process to achieve more efficient separation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the flushing box of the utility model;

[0019] Figure 3 This is a schematic diagram of the partial details of the flushing box of the utility model;

[0020] Figure 4 This is a schematic diagram of the enlarged structure of the local details of the support assembly of the utility model;

[0021] Figure 5 It is a schematic diagram of the enlarged structure of the local details of the separation component of the utility model.

[0022] In the figure: 1. bottom plate; 2. ultrasonic vibration washing machine; 3. sewage pipe one; 4. separation box; 5. flushing box; 6. support assembly; 601. support frame; 602. limit plate; 603. filter screen; 7. separation assembly; 701. mounting plate; 702. separation motor; 703. rotating rod; 704. stirring blade; 8. cleaning assembly; 801. load-bearing plate; 802. water storage tank; 803. replenishing pipe; 804. output mounting cavity; 805. water pump; 806. extraction pipe; 807. delivery pipe; 808. water storage frame; 809. cleaning nozzle; 9. sewage pipe two; 10. sewage pipe three. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-Figure 5The utility model provides a technical solution: a single wafer cleaning device, comprising a bottom plate 1, an ultrasonic vibration washing machine 2 is fixedly installed on the upper end of the bottom plate 1, a sewage pipe 3 is fixedly installed at the rear end of the ultrasonic vibration washing machine 2, a washing box 5 is fixedly installed on the upper end of the bottom plate 1 and located on the right side of the ultrasonic vibration washing machine 2, a cleaning component 8 is arranged in front of the washing box 5, and the cleaning component 8 comprises a bearing plate 801, the bearing plate 801 is fixedly installed on the front end of the washing box 5, a water storage tank 802 is fixedly installed on the upper end of the bearing plate 801, a replenishing pipe 803 is fixedly installed on the upper end of the water storage tank 802, and a middle part of the washing box 5 is fixedly provided. An output mounting cavity 804 is provided, a water pump 805 is fixedly installed in the middle of the output mounting cavity 804, the liquid inlet end of the front end of the water pump 805 is fixedly connected to an extraction pipe 806, the water inlet end of the extraction pipe 806 is fixedly connected to the water outlet end of the water storage tank 802, the water outlet end of the rear end of the water pump 805 is fixedly connected to a delivery pipe 807, the water outlet end of the delivery pipe 807 is fixedly connected to a water storage frame 808, the water storage frame 808 is located in the middle of the flushing box 5, the middle of the water storage frame 808 is fixedly connected to a cleaning nozzle 809, the cleaning nozzle 809 is located inside the flushing box 5, and a support assembly 6 is provided above the ultrasonic vibration washing machine 2.

[0025] The support assembly 6 includes a support frame 601, which is movably installed in the middle of the ultrasonic vibration washing machine 2. A limit plate 602 is fixedly installed on the outer end of the support frame 601, and the limit plate 602 is located at the upper end of the ultrasonic vibration washing machine 2. A filter screen 603 is fixedly installed in the middle of the support frame 601. A separation box 4 is fixedly installed at the upper end of the bottom plate 1 on the right side of the ultrasonic vibration washing machine 2. When the cleaning device needs to be used to clean the single wafer, the single wafer to be cleaned is placed in the filter screen 603 of the support frame 601, and then pure water is added to the ultrasonic vibration washing machine 2, and then the ultrasonic vibration washing machine 2 is started, so that the ultrasonic vibration washing machine 2 drives the pure water to vibrate the single wafer. After the initial cleaning is completed, the support frame 601 and the filter screen 603 can be moved upward by using the limit plate 602, so that the support frame 601 and the filter screen 603 drive the single chip to move to the washing box 5, and the limit is completed by the contact between the limit plate 602 and the washing box 5, and then the water pump 805 is started, and the water inlet end of the water pump 805 extracts water from the water storage tank 802 through the extraction pipe 806. After extraction, the water pump 805 transports the water to the delivery pipe 807, and the delivery pipe 807 transports the water to the water storage frame 808. The water level in the water storage frame 808 continues to rise, and after the water pressure continues to increase, it is sprayed out through the cleaning nozzle 809, and the cleaning water passes through the filter screen 603 and sprays onto the single chip to complete the cleaning.

[0026] A separation assembly 7 is provided in front of the separation box 4, and the separation assembly 7 includes a mounting plate 701, which is fixedly mounted on the front end of the separation box 4, a separation motor 702 is fixedly mounted on the upper end of the mounting plate 701, a rotating rod 703 is fixedly mounted on the transmission end at the rear end of the separation motor 702, and a stirring blade 704 is fixedly mounted on the outer end of the rotating rod 703 located inside the separation box 4, a sewage pipe 2 9 is fixedly mounted on the rear end of the separation box 4, and a sewage pipe 3 10 is fixedly mounted on the rear end of the flushing box 5. When it is necessary to remove the paraffin on the single wafer, repeat the above steps to transfer the single wafer to the separation box 4, and then inject dewaxing liquid into the separation box 4 so that the single wafer is immersed in the dewaxing liquid, and then start the separation motor 702, and the transmission end of the separation motor 702 drives the rotating rod 703 to rotate, and the rotation of the rotating rod 703 drives the stirring blade 704 to rotate under the filter 603 to change the flow speed of the dewaxing liquid to complete the dewaxing.

[0027] Working principle: When the cleaning device is needed to clean a single wafer, the single wafer to be cleaned is placed in the filter screen 603 of the support frame 601, and then pure water is added to the ultrasonic vibration washing machine 2, and then the ultrasonic vibration washing machine 2 is started, so that the ultrasonic vibration washing machine 2 drives the pure water to vibrate and wash the single wafer. After the initial cleaning is completed, the support frame 601 and the filter screen 603 can be moved upward by the limit plate 602, so that the support frame 601 and the filter screen 603 drive the single wafer to move to the washing box 5, and the limit is completed by the contact between the limit plate 602 and the washing box 5, and then the water pump 805 is started, and the water inlet end of the water pump 805 extracts water from the water storage tank 802 through the extraction pipe 806. After the water is extracted, Pump 805 transports water to delivery pipe 807, delivery pipe 807 transports water to water storage frame 808, the water level in water storage frame 808 continues to rise, and the water pressure continues to increase before being sprayed out through cleaning nozzle 809, and the cleaning water passes through filter screen 603 and is sprayed onto the single crystal to complete the cleaning, when the paraffin on the single crystal needs to be removed, the above steps are repeated to transfer the single crystal to separation box 4, and then dewaxing liquid is injected into separation box 4 so that the single crystal is immersed in the dewaxing liquid, and then the separation motor 702 is started, and the transmission end of the separation motor 702 drives the rotating rod 703 to rotate, and the rotation of the rotating rod 703 drives the stirring blade 704 to rotate under the filter screen 603 to change the flow speed of the dewaxing liquid to complete the dewaxing.

[0028] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A single wafer cleaning device, comprising a base plate (1), characterized in that: An ultrasonic vibrating washer (2) is fixedly mounted on the upper end of the base plate (1), a sewage discharge pipe (3) is fixedly mounted on the rear end of the ultrasonic vibrating washer (2), a flushing box (5) is fixedly mounted on the upper end of the base plate (1) and located on the right side of the ultrasonic vibrating washer (2), a cleaning assembly (8) is arranged in front of the flushing box (5), the cleaning assembly (8) comprises a bearing plate (801), the bearing plate (801) is fixedly mounted on the front end of the flushing box (5), a water storage tank (802) is fixedly mounted on the upper end of the bearing plate (801), a replenishing pipe (803) is fixedly mounted on the upper end of the water storage tank (802), an output mounting cavity (804) is fixedly mounted in the middle of the flushing box (5), and the output A water pump (805) is fixedly installed in the middle of the installation cavity (804); the liquid inlet end of the front end of the water pump (805) is fixedly connected to an extraction pipe (806); the water inlet end of the extraction pipe (806) is fixedly connected to the water outlet end of the water storage tank (802); the water outlet end of the rear end of the water pump (805) is fixedly connected to a delivery pipe (807); the water outlet end of the delivery pipe (807) is fixedly connected to a water storage frame (808); the water storage frame (808) is located in the middle of the flushing tank (5); the middle of the water storage frame (808) is fixedly connected to a cleaning nozzle (809); the cleaning nozzle (809) is located inside the flushing tank (5); and a support assembly (6) is provided above the ultrasonic vibration washing machine (2).

2. A single wafer cleaning device according to claim 1, characterized in that: The support assembly (6) comprises a support frame (601), the support frame (601) is movably mounted in the middle of the ultrasonic vibration washer (2), a limit plate (602) is fixedly mounted on the outer end of the support frame (601), and the limit plate (602) is located at the upper end of the ultrasonic vibration washer (2).

3. A single wafer cleaning device according to claim 2, characterized in that: A filter screen (603) is fixedly installed in the middle of the support frame (601), and a separation box (4) is fixedly installed at the upper end of the bottom plate (1) on the right side of the ultrasonic vibration washing machine (2).

4. A single wafer cleaning device according to claim 3, characterized in that: A separation assembly (7) is arranged in front of the separation box (4), and the separation assembly (7) comprises a mounting plate (701). The mounting plate (701) is fixedly mounted on the front end of the separation box (4), and a separation motor (702) is fixedly mounted on the upper end of the mounting plate (701).

5. The single wafer cleaning device according to claim 4, characterized in that: A rotating rod (703) is fixedly mounted on the transmission end at the rear end of the separation motor (702), and a stirring blade (704) is fixedly mounted on the outer end of the rotating rod (703) located inside the separation box (4).

6. The single wafer cleaning device according to claim 5, characterized in that: A second sewage pipe (9) is fixedly installed at the rear end of the separation box (4), and a third sewage pipe (10) is fixedly installed at the rear end of the flushing box (5).

Images