High-cleanliness glove box for packaging semiconductor wafers
By designing a high-cleanness glove box, combined with a ten-stage fan filter unit and a nitrogen bathing system, the problem that chip packaging cannot reach ten-stage cleanliness in the existing technology is solved, and higher cleanliness and lower oxidation rates are achieved. Reduces the influence of stress and humidity in the wafer.
Patent Information
- Application Number
- CN202420076347.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-12
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-01-12
AI Technical Summary
The existing semiconductor wafer packaging technology cannot achieve level ten cleanliness, resulting in surface contamination and oxidation of wafers. The multiple operations of the vacuum heat pressing device will cause adverse effects and internal stress on the wafers.
A high-cleanness glove box including glove box, transfer chamber and control system was designed, using a ten-stage fan filter unit, a nitrogen bathing system, a pulse sealing machine, a pressure sensor, a humidity sensor and an oxygen content sensor to ensure that during the packaging process cleanliness, oxygen content and humidity control.
The packaging of ten-level cleanliness is achieved, which slows down the oxidation of the wafer surface, reduces the risk of particle contamination, avoids damage caused by the chip stress, and effectively controls the humidity to protect the quality of the wafer.
Smart Images
Figure CN222200626U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to a high-cleanliness glove box used for semiconductor chip packaging. Background Art
[0002] Semiconductor wafers mainly refer to polished and cleaned wafers produced and processed from semiconductor materials. They are semiconductor substrate materials used for epitaxy and are used to manufacture high value-added semiconductor devices. Since these wafers are ready-to-use substrate materials, they require that the wafer surface must not be contaminated by particles, rapidly oxidized, or have excessive moisture during packaging and transportation.
[0003] The patent with the announcement number CN116119102A discloses an automatic packaging machine for wafer clips. Although the patent uses automated equipment to realize the packaging of wafer clips, the packaging product has good consistency and can reduce the problem of dirt easily generated during manual packaging, the vacuum hot pressing device used can only ensure that the cleanliness level in the packaging bag reaches Class 100, but cannot reach Class 10 cleanliness. There are still small particles in the packaging bag that contaminate the surface of the wafer. In addition, the vacuum hot pressing device must control the oxygen content in the packaging bag to be less than 1.0%, and it must be vacuumed and filled with nitrogen for many times. This operation will cause the wafers in a single-wafer round box or a multi-wafer box to be repeatedly stressed and produce adverse effects; the vacuum hot pressing device cannot control the humidity in the packaging bag to be less than 1.0% RH. Utility Model Content
[0004] The main purpose of the utility model is to provide a high-cleanliness glove box for semiconductor wafer packaging to solve the above problems.
[0005] To achieve the above-mentioned purpose, the utility model provides a high-cleanliness glove box for semiconductor wafer packaging, comprising a glove box, a transfer cabin and a control system;
[0006] The transfer cabin is arranged at both ends of the glove box and is connected to the glove box; an external cabin door and an internal cabin door are respectively arranged at both ends of the transfer cabin, the external cabin door is located outside the glove box, and the internal cabin door is located inside the glove box, the external cabin door and the internal cabin door are sealed and connected to the transfer cabin, and a nitrogen bathing system is arranged in the transfer cabin;
[0007] A ten-stage fan filter unit is arranged on the top of the glove box, a pulse sealer is arranged inside, and a control system is arranged on the external side wall. The ten-stage fan filter unit is used to filter the gas inside the glove box, and the control system is electrically connected to the nitrogen bathing system, the ten-stage fan filter unit and the pulse sealer.
[0008] Furthermore, emergency transfer compartments are provided at both ends of the glove box, and the emergency transfer compartments are communicated with the glove box.
[0009] Furthermore, there are two transfer compartments, which are symmetrically arranged at both ends of the glove box; the internal compartment door is a lifting door, and the lifting door is electrically connected to the control system.
[0010] Furthermore, the lifting door (5) is an electric lifting door or a pneumatic lifting door.
[0011] Furthermore, a pressure sensor, a humidity sensor and an oxygen content sensor are also provided in the glove box, and the pressure sensor, the humidity sensor and the oxygen content sensor are electrically connected to the control system.
[0012] Furthermore, a lighting device is provided on the side wall of the glove box.
[0013] Furthermore, a material storage rack is also provided in the glove box.
[0014] The utility model has the following beneficial effects:
[0015] (1) The packaging cleanliness can reach level 10, and the risk of particles falling on the wafer after packaging is greatly reduced.
[0016] (2) After packaging, the oxygen content can be controlled to below 1.0%, which can effectively slow down the oxidation rate of the wafer surface and increase the storage time of the wafer.
[0017] (3) The humidity content after packaging can be controlled below 1.0% RH, which can effectively prevent the quality degradation of epitaxial wafers caused by excessive humidity.
[0018] (4) The packaging process does not involve vacuum, and the wafer is not subjected to stress during packaging, which can effectively reduce the damage caused by the internal stress of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of a high cleanliness glove box for semiconductor wafer packaging according to the utility model;
[0020] Figure 2 It is a partial cross-sectional view of the left side view of a high cleanliness glove box for semiconductor wafer packaging according to the utility model;
[0021] Figure 3 The utility model is a right side view of a high cleanliness glove box for semiconductor wafer packaging.
[0022] In the figure: 1-glove box; 2-transfer compartment; 3-control system; 4-ten-stage fan filter unit; 5-lifting door; 6-emergency transfer compartment; 7-lighting device; 8-material storage rack. DETAILED DESCRIPTION
[0023] In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the utility model are described in detail with reference to the accompanying drawings for the preferred embodiments of the utility model and their features and functions.
[0024] As attached Figure 1-3 As shown, the utility model provides a high cleanliness glove box for semiconductor wafer packaging, comprising a glove box 1, a transfer cabin 2 and a control system 3;
[0025] A ten-stage fan filter unit 4 connected to the operating space in the glove box 1 is arranged on the top of the glove box 1. The ten-stage fan filter unit 4 is used to filter the gas in the glove box 1 to ensure that the cleanliness of the operating space reaches level ten. A pulse sealer is arranged in the operating space to package the wafers.
[0026] The front of the glove box 1 is made of transparent material, and is equipped with double-station clean butyl rubber dust-free split gloves. The side walls on both sides are symmetrically provided with a transfer cabin 2 connected to the glove box 1. The two ends of the transfer cabin 2 are provided with a lifting door 5 located in the operating space and an external cabin door located outside the operating space. The lifting door 5 can be an electric lifting door or a pneumatic lifting door. The lifting door 5 and the external cabin door are both sealed and connected to the transfer cabin 2. A nitrogen bathing system is provided inside the transfer cabin 2 to clean the interior of the transfer cabin 2 with nitrogen.
[0027] A control system 3 is also provided on the side wall of the glove box 1, and specifically an electronic control board or a PLC controller can be selected. The control system 3 is electrically connected to the pulse sealer, the ten-stage fan filter unit 4, the lifting door 5 and the nitrogen bathing system.
[0028] The operating space is also provided with a pressure sensor, a humidity sensor and an oxygen content sensor which are electrically connected to the control system 3 to detect whether the pressure, oxygen content and humidity in the operating space meet the requirements.
[0029] In actual use, the device is first placed in a Class 100 clean room, and the electronic control board or PLC controller is operated to turn on the ten-level fan filter unit 4 to ensure that the cleanliness in the operating space meets the requirements of Class 10. Then, the external door of the transfer cabin 2 on the right side of the glove box 1 is opened, and the wafers with packaged single-wafer round boxes and multi-wafer crystal boxes are placed in the transfer cabin 2. The external door is closed, and the nitrogen bathing system is started to nitrogen-clean the wafers with packaged single-wafer round boxes and multi-wafer crystal boxes in the transfer cabin 2. After cleaning, the lifting door 5 is opened and the wafers with packaged round boxes and crystal boxes are placed in the operating space. Then, the lifting door 5 is closed, and the wafers with packaged single-wafer round boxes and multi-wafer crystal boxes are nitrogen-cleaned or argon-cleaned according to the set oxygen content and humidity requirements. After cleaning, the operator uses a dust-free split glove to operate a pulse sealing machine to seal and package the wafers with packaged single-wafer round boxes and multi-wafer crystal boxes in inner and outer bags. After packaging, the packaged products are taken out through the transfer cabin 2 on the left.
[0030] In this embodiment, emergency transfer cabins 6 communicating with the glove box 1 are further provided at both ends of the glove box 1 . The emergency transfer cabins 6 can transfer a small number of wafers or other materials of smaller volume.
[0031] In this embodiment, a lighting device 7 is provided on the top of the front of the glove box 1 to ensure the brightness in the operating space.
[0032] In this embodiment, a material storage rack 8 is also provided in the glove box 1 for temporarily storing wafers with packaged single-wafer round boxes and multi-wafer wafer boxes, so that multiple products to be packaged can be placed in the operating space, so that the operator can directly proceed to the next product packaging after completing the packaging of one product, thereby improving work efficiency.
[0033] The above description is only the preferred embodiment of the utility model, not all embodiments. Anyone should be aware that structural changes made under the inspiration of the utility model, and all technical solutions that are the same or similar to the utility model, belong to the protection scope of the utility model.
Claims
1. A high cleanliness glove box for semiconductor wafer packaging, It is characterized in that It comprises a glove box (1), a transfer cabin (2) and a control system (3); The transfer cabin (2) is arranged at both ends of the glove box (1) and is in communication with the glove box (1); an external cabin door and an internal cabin door are respectively arranged at both ends of the transfer cabin (2); the external cabin door is located outside the glove box (1), and the internal cabin door is located inside the glove box (1); the external cabin door and the internal cabin door are sealedly connected to the transfer cabin (2); and a nitrogen bathing system is arranged inside the transfer cabin (2); A ten-stage fan filter unit (4) is arranged on the top of the glove box (1), a pulse sealer is arranged inside, and a control system (3) is arranged on the external side wall. The ten-stage fan filter unit (4) is used to filter the gas inside the glove box (1), and the control system (3) is electrically connected to the nitrogen bathing system, the ten-stage fan filter unit (4) and the pulse sealer.
2. A high cleanliness glove box for semiconductor wafer packaging as claimed in claim 1, It is characterized in that Emergency transfer compartments (6) are also provided at both ends of the glove box (1), and the emergency transfer compartments (6) are in communication with the glove box (1).
3. A high cleanliness glove box for semiconductor wafer packaging as claimed in claim 1, It is characterized in that The transfer compartments (2) are provided with two, symmetrically arranged at the two ends of the glove box (1); the internal compartment door is a lifting door (5), and the lifting door (5) is electrically connected to the control system (3).
4. A high cleanliness glove box for semiconductor wafer packaging as claimed in claim 3, It is characterized in that The lifting door (5) is an electric lifting door or a pneumatic lifting door.
5. A high cleanliness glove box for semiconductor wafer packaging as claimed in any one of claims 1 to 4, It is characterized in that A pressure sensor, a humidity sensor and an oxygen content sensor are also provided in the glove box (1), and the pressure sensor, the humidity sensor and the oxygen content sensor are electrically connected to the control system (3).
6. A high cleanliness glove box for semiconductor wafer packaging as claimed in claim 5, It is characterized in that A lighting device (7) is provided on the side wall of the glove box (1).
7. A high cleanliness glove box for semiconductor wafer packaging as claimed in claim 6, It is characterized in that A material storage rack (8) is also provided in the glove box (1).