Silicon wafer carrying device for silicon wafer sorting machine
By using air blow holes and positioning bumps in the handling device of the silicon wafer sorter, combined with rubber buffer blocks, the problem of silicon wafer debris fall is solved, and the clamping stability and regularity of the silicon wafer material stack is improved, ensuring that The continuity and quality of the silicon wafer sorting process are achieved.
Patent Information
- Application Number
- CN202420916078.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-29
AI Technical Summary
The existing silicon wafer sorting machines often have silicon wafer fragment problems during the material collection process, which causes silicon wafer fragments to fall off on the jaws, affecting the subsequent material collection process.
A silicon wafer handling device including a clamping mechanism, a lifting mechanism and a translation mechanism is designed. By setting air blowing holes and positioning bumps on the support plate, combined with rubber buffer blocks, the flat clamping and stability of the silicon wafer pallet are ensured. to avoid silicon chip fragments affecting clamping effect.
The upper end surface of the support plate and positioning bumps is purged through the air blow hole to ensure flatness. Combined with the buffering effect of the rubber buffer block, the clamping stability and regularity of the silicon wafer material pile are improved, and the silicon wafer fragments are avoided affecting the clamping Hold the effect.
Smart Images
Figure CN222203980U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer conveying device for a silicon wafer sorting machine. Background Art
[0002] A silicon wafer sorter is a device used to sort and inspect silicon wafers. Its working principle is: first, the silicon wafers to be sorted are placed into the sampling port of the silicon wafer sorter, and the lighting system starts working to form reflected light on the surface of the silicon wafer; the photography system captures the reflected light on the surface of the silicon wafer, converts it into a digital signal, and sends it to the image processing system for processing; the image processing system processes the digital signal, divides and grades the silicon wafers through analysis of the image data, and marks unqualified points, lines and surfaces, etc. Finally, the silicon wafers are sorted into different material boxes according to their grading.
[0003] The existing sorting machine receiving jaws often have the problem of silicon wafer fragments during the material taking process. The silicon wafer fragments will fall on the jaws, thus affecting the subsequent material taking. Utility Model Content
[0004] The technical problem to be solved by the utility model is to overcome the disadvantages of the prior art and provide a silicon wafer conveying device for a silicon wafer sorting machine.
[0005] In order to solve the above technical problems, the technical solution of the utility model is as follows:
[0006] A silicon wafer handling device for a silicon wafer sorting machine, comprising:
[0007] The clamping mechanism comprises a first clamping jaw and a second clamping jaw arranged opposite to each other and a clamping jaw driving member for driving the first clamping jaw and the second clamping jaw to move closer to or farther from each other, wherein the first clamping jaw and the second clamping jaw each comprise a clamping plate and a supporting plate fixedly arranged at the lower end of the clamping plate, wherein the supporting plate is used to support a silicon wafer supporting plate, and wherein a plurality of first blowing holes for blowing a supporting surface of the supporting plate are provided on the supporting plate;
[0008] A lifting mechanism, used for driving the clamping mechanism to lift and lower;
[0009] The translation mechanism is used to drive the clamping mechanism to translate.
[0010] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine of the utility model, wherein: the two opposite side walls on the silicon wafer support plate are provided with positioning grooves, the support plate is provided with positioning protrusions at positions corresponding to the positioning grooves, and the positioning protrusions are fixedly arranged on the support surface, and the support plate is provided with a plurality of second blowing holes for blowing the upper end surfaces of the positioning protrusions.
[0011] As a preferred solution of the silicon wafer handling device for the silicon wafer sorter of the utility model, wherein: a support plate is fixedly provided on one side of the two clamping plates facing each other, and the two support plates are parallel to the vertical plane.
[0012] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine of the utility model, wherein: the clamping mechanism further comprises a mounting base plate, a clamping slide rail is fixedly arranged on the mounting base plate, and the first clamping jaw and the second clamping jaw are both slidably arranged on the clamping slide rail;
[0013] The clamping jaw driving member comprises a bidirectional electric cylinder fixedly mounted on the mounting base plate, and two output ends of the bidirectional electric cylinder are respectively connected to the first clamping jaw and the second clamping jaw.
[0014] As a preferred solution of the silicon wafer handling device for the silicon wafer sorter of the utility model, a buffer block is fixedly provided on the side of the supporting plate that contacts the side of the silicon wafer supporting plate.
[0015] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine of the utility model, wherein: the clamping mechanism also includes a pressure plate assembly for crimping on the silicon wafer pile, the pressure plate assembly includes a mounting plate fixedly mounted on the mounting base plate, a guide sleeve fixedly mounted on the mounting plate, a guide rod movably inserted in the guide sleeve, and a silicon wafer pressure plate fixedly mounted at the lower end of the guide rod, the axis of the guide sleeve extends in the vertical direction, a limit plate is fixedly mounted on the upper end of the guide rod, and the diameter of the limit plate is larger than the diameter of the guide sleeve, and the spacing between the silicon wafer pressure plate and the first clamping jaw is equal to the spacing between the silicon wafer pressure plate and the second clamping jaw.
[0016] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine described in the utility model, wherein: the lifting mechanism includes a lifting frame, a first lifting slide rail fixedly installed on the lifting frame, a lifting seat slidably installed on the first lifting slide rail, and a lifting drive component for driving the lifting seat to lift and lower along the first lifting slide rail, and the mounting substrate is fixedly installed on the lifting seat.
[0017] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine of the utility model, second lifting rails are fixedly arranged on both sides of the first lifting rail on the lifting frame, and the lifting seat is slidably installed on the second lifting rails.
[0018] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine of the utility model, wherein: a silicon wafer positioning mechanism is arranged on the lifting seat, and the silicon wafer positioning mechanism comprises a fixed frame fixedly mounted on one side of the lifting seat and a positioning camera fixedly mounted on the fixed frame, and the positioning camera shoots vertically downward.
[0019] As a preferred solution of the silicon wafer handling device for the silicon wafer sorting machine described in the utility model, wherein: the translation mechanism includes a translation slide rail perpendicular to the first lifting slide rail, a translation seat slidably mounted on the translation slide rail, and a translation drive component for driving the translation seat to slide along the translation slide rail, and the lifting frame is fixedly mounted on the translation seat.
[0020] The beneficial effects of the utility model are:
[0021] (1) The utility model has a plurality of first air holes on the support plate and a plurality of second air holes on the support plate. Before clamping the silicon wafer pile, the support surface of the support plate and the upper end surface of the positioning protrusion are purged through the first air holes and the second air holes to ensure the flatness of the two planes, thereby ensuring the clamping effect of the clamping mechanism on the silicon wafer pile.
[0022] (2) The utility model has positioning grooves on two opposite side walls of the silicon wafer support plate, and positioning protrusions are fixedly arranged on the support plate. When the two support plates are supported on both sides of the silicon wafer support plate, the two positioning protrusions extend into the two positioning grooves respectively. Through the cooperation between the positioning protrusions and the positioning grooves, the horizontal position of the silicon wafer support plate can be limited, thereby ensuring the stability of the silicon wafer support plate in the horizontal direction after the clamping mechanism clamps the silicon wafer support plate.
[0023] (3) The utility model further provides a cylindrical rubber buffer block fixedly disposed on the side of the support plate that contacts the side of the silicon wafer support plate. The buffer block can play a buffering role when the support plate contacts the silicon wafer support plate, thereby preventing the silicon wafer support plate from vibrating when the support plate contacts the silicon wafer support plate and affecting the regularity of the silicon wafer material pile.
[0024] (4) The utility model is provided with a plurality of lifting slide rails on the lifting frame, which can prevent the lifting seat from shaking left and right during the lifting process, thereby improving the stability of the lifting seat during the lifting process. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0026] Figure 1 A schematic diagram of the structure of a silicon wafer handling device for a silicon wafer sorting machine provided by the utility model;
[0027] Figure 2A schematic diagram of the structure of the silicon wafer handling device for the silicon wafer sorting machine provided by the utility model from another perspective;
[0028] Figure 3 This is a schematic diagram of the structure of the clamping mechanism in the silicon wafer handling device for the silicon wafer sorting machine provided by the utility model;
[0029] Figure 4 for Figure 3 The enlarged schematic diagram of point A in the middle;
[0030] Figure 5 It is a structural schematic diagram of the pressure plate assembly in the clamping mechanism;
[0031] Figure 6 It is a schematic diagram of a clamping mechanism clamping a silicon wafer pallet;
[0032] Figure 7 This is a schematic diagram of the structure of the lifting mechanism in the silicon wafer handling device for the silicon wafer sorting machine provided by the utility model;
[0033] Among them: 100, clamping mechanism; 200, lifting mechanism; 300, translation mechanism; 110, first clamping jaw; 120, second clamping jaw; 130, clamping plate; 140, supporting plate; 141, first blowing hole; 142, positioning convex block; 143, second blowing hole; 144, buffer block; 150, mounting base plate; 160, clamping slide rail; 170, clamping jaw driving member; 180, pressure plate assembly; 181, mounting plate ; 182, guide sleeve; 183, guide rod; 184, silicon wafer pressure plate; 185, limit plate; 210, lifting frame; 220, first lifting slide rail; 230, lifting seat; 240, second lifting slide rail; 250, fixed frame; 260, positioning camera; 310, translation slide rail; 320, translation seat; 330, triangular connecting plate; 400, silicon wafer pile; 500, silicon wafer support plate; 510, positioning groove. DETAILED DESCRIPTION
[0034] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below according to specific implementation methods and in combination with the accompanying drawings.
[0035] Figure 1 A schematic diagram of the structure of a silicon wafer handling device for a silicon wafer sorting machine provided in an embodiment of the present application. The device includes a clamping mechanism 100, a lifting mechanism 200, and a translation mechanism 300. Among them, the clamping mechanism 100 is used to clamp a silicon wafer pile 400. The lifting mechanism 200 is used to drive the clamping mechanism 100 to rise and fall. The translation mechanism 300 is used to drive the lifting mechanism 200 and the clamping mechanism 100 to translate synchronously, thereby realizing the handling of the silicon wafer pile 400.
[0036] For details, see Figure 3The clamping mechanism 100 includes a mounting substrate 150. A clamping slide rail 160 is fixedly mounted on the mounting substrate 150, and the clamping slide rail 160 extends along the length direction of the mounting substrate 150. A first clamping jaw 110 and a second clamping jaw 120 are slidably mounted on the clamping slide rail 160, and the first clamping jaw 110 and the second clamping jaw 120 are arranged opposite to each other. A clamping jaw driving member 170 for driving the first clamping jaw 110 and the second clamping jaw 120 to move closer to or away from each other is also fixedly mounted on the mounting substrate 150. When the clamping jaw driving member 170 is in operation, it will drive the first clamping jaw 110 and the second clamping jaw 120 to move synchronously, and the moving directions of the first clamping jaw 110 and the second clamping jaw 120 are opposite. When the clamping jaw driving member 170 drives the first clamping jaw 110 and the second clamping jaw 120 to move closer to each other, the distance between the first clamping jaw 110 and the second clamping jaw 120 gradually decreases, thereby achieving the clamping of the silicon wafer stack 400. When the clamp driving member 170 drives the first clamp 110 and the second clamp 120 to move away from each other, the distance between the first clamp 110 and the second clamp 120 gradually increases, thereby releasing the clamping of the silicon wafer stack 400 .
[0037] In this embodiment, the clamping jaw driving member 170 is a bidirectional electric cylinder, and the two output ends of the bidirectional electric cylinder are respectively connected to the first clamping jaw 110 and the second clamping jaw 120. The two output ends of the bidirectional electric cylinder can be synchronously extended outward or retracted inward to achieve the first clamping jaw 110 and the second clamping jaw 120 moving away from each other or approaching each other.
[0038] The first clamping jaw 110 and the second clamping jaw 120 each include a clamping plate 130 and a supporting plate 140 fixedly mounted at the lower end of the clamping plate 130. The silicon wafer stack 400 is placed on the silicon wafer support plate 500, and the supporting plate 140 is used to support the silicon wafer support plate 500. The supporting plate 140 mounted on the first clamping jaw 110 is located on the side of the first clamping jaw 110 facing the second clamping jaw 120, and the supporting plate 140 mounted on the second clamping jaw 120 is located on the side of the second clamping jaw 120 facing the first clamping jaw 110. In addition, a support plate is fixedly mounted on one side of the two clamping plates 130 facing each other, and the two support plates are parallel to the vertical plane, and the support plates are made of flexible materials, such as rubber.
[0039] When the clamp driving member 170 drives the first clamp 110 and the second clamp 120 to approach each other, the supporting plates 140 on the two clamps approach each other and are finally supported on both sides of the silicon wafer support plate 500. At this time, the clamping mechanism 100 realizes the clamping of the silicon wafer support plate 500, so that the silicon wafer support plate 500 will rise and fall synchronously with the clamping mechanism 100. At the same time, the spacing between the two supporting plates is equal to the width of the silicon wafer material pile 400, so the two supporting plates are respectively abutted on both sides of the silicon wafer material, ensuring the regularity of the silicon wafer material pile 400.
[0040] Better, see Figure 6, positioning grooves 510 are provided on two opposite side walls of the silicon wafer support plate 500. Correspondingly, positioning protrusions 142 are fixedly provided on the supporting plate 140 at positions corresponding to the positioning grooves 510, and the positioning protrusions 142 are fixedly provided on the supporting surface. When the two supporting plates 140 are respectively supported on both sides of the silicon wafer support plate 500, the two positioning protrusions 142 extend into the two positioning grooves 510 respectively. Through the cooperation between the positioning protrusions 142 and the positioning grooves 510, the horizontal direction of the silicon wafer support plate 500 can be limited, thereby ensuring the horizontal stability of the silicon wafer support plate 500 after the clamping mechanism 100 clamps the silicon wafer support plate 500.
[0041] See also Figure 4 A plurality of first air blowing holes 141 are provided on the supporting plate 140, and these first air blowing holes 141 are used to blow the supporting surface of the supporting plate 140. At the same time, a plurality of second air blowing holes 143 are provided on the supporting plate 140, and these second air blowing holes 143 are used to blow the upper end surface of the positioning protrusion 142. Both the first air blowing holes 141 and the second air blowing holes 143 are connected to an external air source through an air blowing pipe.
[0042] It is understandable that there may be silicon chip fragments in the silicon chip material. When the clamping mechanism 100 clamps the silicon chip material pile 400, the silicon chip fragments will fall onto the supporting surface of the supporting plate 140 and the upper end surface of the positioning protrusion 142. At the same time, when the clamping mechanism 100 clamps the silicon chip material pile 400, the supporting surface on the supporting plate 140 will fit with the lower end surface of the silicon chip support plate 500. If there are silicon chip fragments on the supporting surface of the supporting plate 140, it will cause the silicon chip support plate 500 to tilt after lifting, thereby causing the silicon chip material pile 400 to tilt, thereby affecting the quality of the silicon chip. In addition, the silicon chip fragments accumulated on the upper end surface of the positioning protrusion 142 will also affect the silicon chip material pile 400. Therefore, by blowing the supporting surface of the supporting plate 140 and the upper end surface of the positioning protrusion 142 through the first blowing hole 141 and the second blowing hole 143, the flatness of the two planes can be ensured, thereby preventing silicon wafer fragments from affecting the clamping effect of the clamping mechanism 100 on the silicon wafer pile 400.
[0043] Preferably, the clamping mechanism 100 further includes a pressing plate assembly 180 for pressing against the silicon wafer stack 400. Figure 5The pressure plate assembly 180 includes a mounting plate 181 fixedly mounted on the mounting substrate 150. A guide sleeve 182 is fixedly penetrated at both ends of the mounting plate 181 in the length direction, and the axis of the guide sleeve 182 extends in the vertical direction. A guide rod 183 is movably penetrated in the guide sleeve 182. A limit plate 185 is fixedly disposed at the upper end of the guide rod 183, and the diameter of the limit plate 185 is greater than the diameter of the guide sleeve 182. A silicon wafer pressure plate 184 is fixedly mounted at the lower end of the guide rod 183, and the silicon wafer pressure plate 184 is arranged parallel to the horizontal plane, and is located between the first clamping jaw 110 and the second clamping jaw 120, and the spacing between the silicon wafer pressure plate 184 and the first clamping jaw 110 is equal to the spacing between the silicon wafer pressure plate 184 and the second clamping jaw 120.
[0044] In addition, a cylindrical rubber buffer block 144 is fixedly provided on the side of the supporting plate 140 that contacts the side of the silicon wafer pallet 500. The buffer block 144 can play a buffering role when the supporting plate 140 contacts the silicon wafer pallet 500, so as to prevent the silicon wafer pallet 500 from vibrating when the supporting plate 140 contacts the silicon wafer pallet 500, thereby affecting the regularity of the silicon wafer stack 400.
[0045] The lifting mechanism 200 is used to drive the clamping mechanism 100 to move up and down. Figure 7 The lifting mechanism 200 includes a lifting frame 210. A first lifting rail 220 and a second lifting rail 240 extending in the vertical direction are fixedly installed on the lifting frame 210. Among them, two second lifting rails 240 are provided, which are respectively located on both sides of the first lifting rail 220. A lifting seat 230 is slidably installed on the lifting frame 210 through the first lifting rail 220 and the second lifting rail 240. The lifting seat 230 is driven by a lifting drive member, and the first lifting rail 220 is lifted and lowered, and the second rail is lifted and lowered. The above-mentioned mounting base 150 is fixedly installed on the lifting seat 230, so that the lifting seat 230 can drive the clamping mechanism 100 to rise and fall synchronously as a whole. The above-mentioned lifting drive member can adopt a lifting cylinder.
[0046] It is understandable that the first lifting rail 220 is a main lifting rail, and the second lifting rail 240 is an auxiliary lifting rail. By providing multiple lifting rails, the lifting seat 230 is prevented from shaking left and right during the lifting process, thereby improving the stability of the lifting seat 230 during the lifting process.
[0047] See also Figure 2The translation mechanism 300 includes a translation rail 310, which extends in the horizontal direction. A translation seat 320 is slidably mounted on the translation rail 310, and the translation seat 320 is driven by a translation drive member and translates along the translation rail 310. The translation drive member can be a driving electric cylinder or other components. Two connecting tripods are fixedly mounted on the translation seat 320. The lifting frame 210 is fixedly mounted on the two connecting tripods. The installation stability of the lifting frame 210 on the translation seat 320 is effectively improved by connecting the tripods.
[0048] Also, see Figure 2 A silicon wafer positioning mechanism is provided on the lifting platform 230. The silicon wafer positioning mechanism includes a fixed frame 250 fixedly mounted on one side of the lifting platform 230 and a positioning camera 260 fixedly mounted on the fixed frame 250. The positioning camera 260 shoots vertically downward to position the silicon wafer pile 400 below, so as to facilitate the clamping mechanism 100 to adjust to a suitable position to clamp the pile.
[0049] When the silicon wafer handling device for the silicon wafer sorter is in operation, the translation seat 320 is first driven to translate along the translation slide rail 310 by the translation drive, and in the process, the position of the silicon wafer pile 400 is photographed and identified by the positioning camera 260, and finally the clamping mechanism 100 is located directly above the silicon wafer pile 400. Then, the clamping mechanism 100 is synchronously lowered with the lifting seat 230 by the lifting drive. In this process, the silicon wafer pressing plate 184 will first be pressed on the top of the silicon wafer pile 400 to ensure the stability of the silicon wafer pile 400. Then, the clamping mechanism 100 continues to move downward until the supporting surface of the supporting plate 140 in the first clamping jaw 110 and the second clamping jaw 120 is slightly lower than the lower end surface of the silicon wafer support plate 500. At this time, the first clamping jaw 110 and the second clamping jaw 120 are located on both sides of the silicon wafer support plate 500. The first blowing hole 141 and the second blowing hole 143 blow the supporting surface of the supporting plate 140 and the upper end surface of the positioning protrusion 142 to ensure the flatness of the two planes. Then, the first clamping jaw 110 and the second clamping jaw 120 are driven to approach each other by the clamping jaw driving member 170 to clamp the silicon wafer support plate 500 and the silicon wafer material pile 400. After that, the clamping mechanism 100 and the silicon wafer material pile 400 are driven to rise by the lifting driving member, and the silicon wafer material pile 400 is transported to the preset position in cooperation with the translation mechanism 300.
[0050] Therefore, the technical solution of the present application can ensure the flatness of the supporting surface by blowing the supporting surface of the supporting plate 140 through the blowing holes, thereby ensuring the clamping effect of the clamping mechanism 100 on the silicon wafer pile 400.
[0051] In addition to the above embodiments, the present invention may also have other implementation modes; any technical solutions formed by equivalent replacement or equivalent transformation shall fall within the protection scope required by the present invention.
Claims
1. A silicon wafer handling device for a silicon wafer sorting machine, characterized in that: include: The clamping mechanism (100) comprises a first clamping jaw (110) and a second clamping jaw (120) which are arranged opposite to each other, and a clamping jaw driving member (170) for driving the first clamping jaw (110) and the second clamping jaw (120) to move closer to or farther from each other, wherein the first clamping jaw (110) and the second clamping jaw (120) each comprise a clamping plate (130) and a supporting plate (140) fixedly arranged at the lower end of the clamping plate (130), wherein the supporting plate (140) is used to support a silicon wafer supporting plate (500), and the supporting plate (140) is provided with a plurality of first blowing holes (141) for blowing the supporting surface of the supporting plate (140); A lifting mechanism (200), used for driving the clamping mechanism (100) to lift and lower; The translation mechanism (300) is used to drive the clamping mechanism (100) to translate.
2. The silicon wafer handling device for a silicon wafer sorting machine according to claim 1, characterized in that: The two opposite side walls of the silicon wafer support plate (500) are each provided with a positioning groove (510), a positioning protrusion (142) is provided on the support plate (140) at a position corresponding to the positioning groove (510), and the positioning protrusion (142) is fixedly arranged on the support surface, and a plurality of second blowing holes (143) for blowing the upper end surface of the positioning protrusion (142) are provided on the support plate (140).
3. The silicon wafer handling device for a silicon wafer sorter according to claim 1, characterized in that: A support plate is fixedly arranged on one side of the two clamping plates (130) facing each other, and the two support plates are parallel to the vertical plane.
4. The silicon wafer handling device for a silicon wafer sorter according to claim 1, characterized in that: The clamping mechanism (100) further comprises a mounting base plate (150), a clamping slide rail (160) being fixedly arranged on the mounting base plate (150), and the first clamping jaw (110) and the second clamping jaw (120) are both slidably arranged on the clamping slide rail (160); The clamping jaw driving member (170) comprises a bidirectional electric cylinder fixedly mounted on the mounting base plate (150), and two output ends of the bidirectional electric cylinder are respectively connected to the first clamping jaw (110) and the second clamping jaw (120).
5. The silicon wafer handling device for a silicon wafer sorting machine according to claim 4, characterized in that: A buffer block (144) is fixedly provided on the side of the supporting plate (140) that contacts the side of the silicon wafer supporting plate (500).
6. The silicon wafer handling device for a silicon wafer sorting machine according to claim 4, characterized in that: The clamping mechanism (100) further comprises a pressure plate assembly (180) for crimping onto the silicon wafer pile (400), the pressure plate assembly (180) comprising a mounting plate (181) fixedly mounted on the mounting substrate (150), a guide sleeve (182) fixedly mounted on the mounting plate (181), a guide rod (183) movably inserted into the guide sleeve (182), and a silicon wafer pressure plate (184) fixedly mounted at the lower end of the guide rod (183), the axis of the guide sleeve (182) extending in the vertical direction, a limiting plate (185) fixedly mounted on the upper end of the guide rod (183), and the diameter of the limiting plate (185) being larger than the diameter of the guide sleeve (182), and the spacing between the silicon wafer pressure plate (184) and the first clamping jaw (110) being equal to the spacing between the silicon wafer pressure plate (184) and the second clamping jaw (120).
7. The silicon wafer handling device for a silicon wafer sorting machine according to claim 4, characterized in that: The lifting mechanism (200) comprises a lifting frame (210), a first lifting slide rail (220) fixedly mounted on the lifting frame (210), a lifting seat (230) slidably mounted on the first lifting slide rail (220), and a lifting driving member for driving the lifting seat (230) to move up and down along the first lifting slide rail (220); the mounting base (150) is fixedly mounted on the lifting seat (230).
8. The silicon wafer conveying device for a silicon wafer sorting machine according to claim 7, characterized in that: Second lifting rails (240) are fixedly arranged on the lifting frame (210) at both sides of the first lifting rails (220), and the lifting seat (230) is slidably mounted on the second lifting rails (240).
9. The silicon wafer handling device for a silicon wafer sorting machine according to claim 7, characterized in that: The lifting seat (230) is provided with a silicon wafer positioning mechanism, which comprises a fixed frame (250) fixedly mounted on one side of the lifting seat (230) and a positioning camera (260) fixedly mounted on the fixed frame (250), and the positioning camera (260) is vertically downward for shooting.
10. The silicon wafer conveying device for a silicon wafer sorting machine according to claim 7, characterized in that: The translation mechanism (300) comprises a translation rail (310) perpendicular to the first lifting rail (220), a translation seat (320) slidably mounted on the translation rail (310), and a translation driving member for driving the translation seat (320) to slide along the translation rail (310); the lifting frame (210) is fixedly mounted on the translation seat (320).