Buffering conductive reworkable foam tape
By introducing conductive network, multi-channel design and conductive protrusions into foam tape, combined with conductive adhesive connection, the problem of low conductivity efficiency of traditional foam tape is solved, and efficient current transmission and mechanical protection is achieved, suitable for a variety of electronics equipment.
Patent Information
- Application Number
- CN202420295616.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-18
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-18
AI Technical Summary
Traditional foam tape leads to low conductivity between electronic components, affecting current transmission.
A buffered conductive re-industrial foam tape is designed, including an adhesive assembly, a conductive assembly and a buffer layer. The conductive path is constructed through the conductive layer and the conductive strip. The conductive network is interwoven by conductive fibers, and multiple conductive channels are provided in the conductive strip. The surface is equipped with conductive protrusions and bonded with antioxidant coating and conductive adhesive.
It significantly improves the conductivity efficiency and current transmission capacity between electronic components, provides mechanical support and protection, enhances the stability and reliability of the tape, and is suitable for various electronic devices.
Smart Images
Figure CN222205107U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of adhesive tapes, and in particular to a buffered conductive reworkable foam adhesive tape. Background Art
[0002] Foam tape is a common electronic component assembly material. Its main function is to provide cushioning and protection, while also having certain insulation properties. Traditional foam tape is usually composed of foam material and adhesive, and is widely used in the internal assembly and repair of electronic products. This tape can effectively fill and fix electronic components, provide mechanical support and shock absorption, thereby protecting electronic components from vibration and external environmental influences.
[0003] However, the foam tape may affect the poor contact between electronic components and cause low conductivity efficiency. Therefore, there is a need for a reworkable foam tape that can improve the effective current transmission between electronic components and buffer the conductiveness. Utility Model Content
[0004] In view of this, it is necessary to provide a conductive reworkable foam tape that improves effective current transmission between electronic components to solve the above problems.
[0005] The embodiment of the present application provides a buffered conductive reworkable foam tape, comprising:
[0006] The adhesive assembly comprises a first adhesive layer and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are tightly connected to the two electronic components respectively;
[0007] A conductive component is located between the first adhesive layer and the second adhesive layer and is bonded to the adhesive component, wherein the conductive component comprises:
[0008] A conductive layer, bonded to the first adhesive layer and located at an end away from the electronic component;
[0009] A conductive strip is bonded to the second adhesive layer and is located at an end away from another electronic component, wherein the current generated in the electronic component passes through the first adhesive layer to the conductive layer, is then transferred to the conductive strip, and then to the second adhesive layer, and the second adhesive layer is transferred to another electronic component to form a conductive path.
[0010] In at least one embodiment of the present application, the buffered conductive reworkable foam tape further includes a buffer layer, one end of the buffer layer is connected to the conductive layer, and the other end of the buffer layer is connected to the conductive strip.
[0011] In at least one embodiment of the present application, the buffer layer is configured as foam.
[0012] In at least one embodiment of the present application, a conductive network is provided inside the foam, and the conductive network is connected with the conductive strip and the conductive layer to form a continuous conductive channel to improve the overall conductive efficiency.
[0013] In at least one embodiment of the present application, the conductive network is interwoven with conductive fibers.
[0014] In at least one embodiment of the present application, an anti-oxidation coating is provided on the surface of the foam.
[0015] In at least one embodiment of the present application, a plurality of conductive channels are provided inside the conductive strip to enhance the current transmission capability.
[0016] In at least one embodiment of the present application, conductive protrusions are provided on the surface of the conductive layer, and the conductive protrusions are evenly distributed on the surface of the conductive layer that is in contact with the electronic component to increase the contact area with the electronic component, thereby improving the conductive efficiency.
[0017] In at least one embodiment of the present application, the conductive protrusions are conductive particles.
[0018] In at least one embodiment of the present application, the bonding connection of the buffered conductive reworkable foam tape is arranged at the conductive adhesive bonding connection.
[0019] The buffered conductive reworkable foam tape provided above is closely connected to two electronic components at one end through the first and second adhesive layers of the adhesive component, and the other end is bonded to the conductive layer and the conductive strip of the conductive component, and the buffer layer located between the conductive layer and the conductive strip constructs a complete conductive path, thereby improving the effective current transmission between the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A three-dimensional diagram of the buffered conductive reworkable foam tape described in this application;
[0021] Figure 2 This is an exploded view of the buffered conductive reworkable foam tape described in this application.
[0022] Main component symbols
[0023] 100. Buffered conductive reworkable foam tape; 10. Adhesive component; 11. First adhesive layer; 12. Second adhesive layer; 13. Buffer layer; 131. Conductive network; 132. Anti-oxidation coating; 20. Conductive component; 21. Conductive layer; 211. Conductive protrusion; 22. Conductive strip; 221. Conductive channel. DETAILED DESCRIPTION
[0024] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0025] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.
[0026] An embodiment of the present application provides a buffered conductive reworkable foam tape, including an adhesive component including a first adhesive layer and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are tightly connected to the two electronic components respectively; it also includes a conductive component, which is located between the first adhesive layer and the second adhesive layer and is adhesively connected to the adhesive component, wherein the conductive component includes a conductive layer and a conductive strip, which is adhesively connected to the first adhesive layer and is located at one end away from the electronic component; the conductive strip is adhesively connected to the second adhesive layer and is located at one end away from the other electronic component, wherein the current generated in the electronic component passes through the first adhesive layer to the conductive layer, and then is transferred to the conductive strip, and then to the second adhesive layer, and the second adhesive layer is transferred to another electronic component to form a conductive path.
[0027] The buffered conductive reworkable foam tape provided above is closely connected to two electronic components at one end through the first and second adhesive layers of the adhesive component, and the other end is bonded to the conductive layer and the conductive strip of the conductive component, and the buffer layer located between the conductive layer and the conductive strip constructs a complete conductive path, thereby improving the effective current transmission between the electronic components.
[0028] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0029] See also Figure 1-Figure 2The embodiment of the present application provides a buffered conductive reworkable foam tape 100, including an adhesive component 10 including a first adhesive layer 11 and a second adhesive layer 12, wherein the first adhesive layer 11 and the second adhesive layer 12 are respectively tightly connected to the two electronic components; it also includes a conductive component 20, which is located between the first adhesive layer 11 and the second adhesive layer 12 and is bonded to the adhesive component 10, wherein the conductive component 20 includes a conductive layer 21 and a conductive strip 22, which is bonded to the first adhesive layer 11 and is located at one end away from the electronic component; the conductive strip 22 is bonded to the second adhesive layer 12 and is located at one end away from the other electronic component, wherein the current generated in the electronic component passes through the first adhesive layer 11 to the conductive layer 21, and is then transferred to the conductive strip 22, and then to the second adhesive layer 12, and the second adhesive layer 12 is transferred to another electronic component to form a conductive path.
[0030] Specifically, the current generated in one electronic component passes through the first adhesive layer 11 to the conductive layer 21, and the conductive layer 21 is transmitted to the conductive strip 22 through the conductive network 131 inside the buffer layer 13, and then transmitted to the second adhesive layer 12 through the conductive path in the conductive strip 22, and the second adhesive layer 12 is transmitted to another electronic component to form a conductive path.
[0031] Furthermore, when a current is generated in the electronic component, the current first passes through the first adhesive layer 11. The first adhesive layer 11 not only serves to connect and fix, but also plays an important role in current transmission. After the current passes through the first adhesive layer 11, it is transmitted to the conductive layer 21. The conductive layer 21 is designed to ensure that the current can be transmitted smoothly and efficiently.
[0032] Furthermore, the conductive layer 21 is tightly fitted with the buffer layer 13. The buffer layer 13 plays two roles here: first, it provides buffer protection for electronic components to reduce damage caused by vibration or impact; second, it helps the current to be transferred from the conductive layer 21 to the conductive strip 22 through the conductive network 131 inside it. The conductive network 131 is made of conductive fibers interwoven to form a continuous conductive channel 221, ensuring that the current can be smoothly transferred from one component to another.
[0033] Furthermore, during the entire process, the various components of the foam tape work together to ensure the smooth transmission of current while providing the necessary buffering protection for electronic components. This design makes the foam tape not only conductive, but also has a certain buffering effect, which can cope with various vibrations and shocks during the use of the equipment.
[0034] In general, this buffered conductive reworkable foam tape 100 achieves conductive connection and buffering protection between electronic components through its unique structure and design, providing a strong guarantee for the stable operation of electronic equipment.
[0035] In a specific implementation example, the buffered conductive reworkable foam tape 100 further includes a buffer layer 13 , one end of the buffer layer 13 is connected to the conductive layer 21 , and the other end of the buffer layer 13 is connected to the conductive strip 22 .
[0036] Specifically, the buffer layer 13 structurally connects the conductive layer 21 and the conductive strip 22 to ensure smooth current transfer between them. This connection not only ensures the continuity of the current, but also enhances the overall stability and reliability of the tape.
[0037] Secondly, the main function of the buffer layer 13 is to provide buffer protection. In electronic devices, due to the influence of various factors, electronic components may be affected by external forces such as vibration and impact. These external forces may cause the connection between electronic components to loosen or be damaged, thereby affecting the normal operation of the device. The buffer layer 13 exists to absorb these external forces, reduce their impact on electronic components and connections, and protect electronic components from potential damage.
[0038] In addition, the buffer layer 13 can also enhance the conductive effect. A conductive network 131 is arranged inside the buffer layer 13. These conductive networks 131 are interwoven with conductive fibers to form continuous conductive channels 221. These conductive channels 221 can not only enhance the current transmission capability, but also improve the overall conductive efficiency, ensuring that the connection between electronic components is more stable and reliable.
[0039] In summary, the buffer layer 13 plays a vital role in buffering the conductive reworkable foam tape 100. It not only connects the conductive layer 21 and the conductive strip 22 to ensure the smooth transmission of current, but also provides necessary buffer protection for electronic components and enhances the overall stability and reliability of the tape. This design makes the application of foam tape in electronic devices more extensive and reliable.
[0040] In a specific implementation example, the buffer layer 13 is made of foam.
[0041] Specifically, the buffer layer 13 is made of foam. As a light, soft and elastic material, foam is widely used in various occasions requiring buffering and shock absorption. In the foam tape, the introduction of the foam buffer layer 13 not only increases the structural stability of the tape, but more importantly, it provides additional protection for electronic components.
[0042] Furthermore, the foam material itself has good cushioning and shock-absorbing properties. When the electronic device is subjected to external impact or vibration, the foam cushioning layer 13 can absorb most of the energy, reduce the direct impact of these external forces on the electronic components, and thus protect the electronic components from potential damage. The introduction of the foam cushioning layer 13 also enhances the overall stability of the tape. Since the foam has a certain elasticity, it can ensure that the tape maintains a stable shape and size during long-term use and is not prone to deformation or loosening.
[0043] Furthermore, foam materials generally have good processability, which means that they can be easily cut, bent, and pasted to accommodate different electronic component shapes and sizes. In addition, foam tape is also highly reworkable, which means that it can be easily removed and reapplied when necessary without damaging the electronic components or the tape itself.
[0044] Furthermore, when the foam tape is used to assemble electronic components, the foam buffer layer 13 will fit tightly to the surface of the electronic components. During the operation of the electronic device, if vibration or impact occurs, the foam buffer layer 13 will first absorb these external forces and disperse the energy to a larger area through its internal pore structure, thereby reducing the direct impact on the electronic components. At the same time, the conductive network 131 inside the foam will ensure that the current can pass smoothly and maintain a stable connection between the electronic components.
[0045] In summary, the application scenarios of the foam buffer layer 13 are very wide, including but not limited to portable electronic devices such as mobile phones, tablet computers, and laptops. These devices are often affected by various external forces during use, such as falling, collisions, etc. By introducing the foam buffer layer 13, not only can the electronic components be protected from damage, but also the overall stability and reliability of the device can be improved. In addition, the foam tape can also be used in the fields of automobiles, aerospace, etc., to provide effective buffer protection for electronic devices in various complex environments.
[0046] In a specific implementation example, a conductive network 131 is provided inside the foam, and the conductive network 131 is connected with the conductive strip 22 and the conductive layer 21 to form a continuous conductive channel 221 to improve the overall conductive efficiency.
[0047] Specifically, the presence of the conductive network 131 provides a more direct and efficient path for the current. Compared with the traditional foam tape, this design can significantly reduce the transmission resistance of the current, allowing the current to flow more smoothly.
[0048] Furthermore, the conductive network 131 is interwoven with conductive fibers, which are not only conductive but also can enhance the structural stability of the foam. Even when impacted by external forces, the conductive network 131 can maintain good integrity, thereby ensuring stable transmission of current. As a buffer material, the foam itself has a good shock-absorbing effect. The addition of the conductive network 131 enables this material to have a conductive function while maintaining buffering properties, thereby achieving a dual improvement in function and performance.
[0049] Furthermore, in practical applications, when current needs to be transferred between electronic components, the current first enters the foam tape through the conductive layer 21. Inside the foam, the conductive network 131 provides a fast channel for the current, allowing it to quickly reach the conductive strip 22. Then, the current is transferred to another electronic component through the conductive strip 22, thus completing the entire conductive process.
[0050] In a specific implementation example, the conductive network 131 is formed by interweaving conductive fibers.
[0051] Specifically, the network formed by the interweaving of electrical fibers provides multiple parallel paths for the current, thereby reducing resistance and improving the transmission efficiency of the current. Since the conductive network 131 is interwoven with fibers, it has strong structural stability. This stability can ensure that when the tape is subjected to external force, the conductive network 131 is not easy to break, thereby maintaining the stability of the conductive performance.
[0052] Furthermore, the presence of the conductive network 131 not only enhances the conductive performance of the foam tape, but also maintains its characteristics as a buffer material. This dual function enables the foam tape to perform well in scenarios where both conductive and buffering requirements need to be met.
[0053] Furthermore, when the foam tape is used to connect two electronic components, the conductive network 131 plays a key role. When the electronic components need to transfer current, the current enters the foam tape through the conductive layer 21. Inside the foam, the conductive network 131 quickly and evenly disperses the current to each conductive fiber, and these fibers transfer the current to the conductive strip 22 like a bridge. Then, the current is transferred to another electronic component through the conductive strip 22, completing the entire conductive process.
[0054] In a specific implementation example, an anti-oxidation coating 132 is provided on the surface of the foam.
[0055] Specifically, the anti-oxidation coating 132 can effectively resist oxidants in the external environment, thereby preventing oxidation reactions from occurring on the foam surface, which can significantly extend the service life of the foam and reduce performance degradation caused by oxidation.
[0056] Furthermore, the conductive network 131 is provided inside the foam, which is the key to its conductive performance. The presence of the anti-oxidation coating 132 can effectively prevent oxygen from corroding the conductive network 131, thereby maintaining the stability of the conductive performance. This is particularly important for electronic devices that require long-term stable operation.
[0057] Furthermore, the anti-oxidation coating 132 can also enhance the overall reliability of the foam material and reduce the risk of material damage or failure due to oxidation, which is crucial for electronic devices that need to withstand complex environmental conditions and long-term use.
[0058] Furthermore, when the foam tape is used to connect electronic components, the anti-oxidation coating 132 will play its protective role. When the foam tape is exposed to air or affected by other oxidants, the anti-oxidation coating 132 will first react with the oxidants, thereby preventing the oxidants from further corroding the foam surface and the conductive network 131. In this way, the foam tape can maintain its original conductive properties and structural stability, ensuring reliable connection between electronic components.
[0059] In a specific implementation example, a plurality of conductive channels 221 are provided inside the conductive strip 22 to enhance the current transmission capability.
[0060] Specifically, the multi-channel design enables the current to be transmitted through multiple paths inside the conductive strip 22, effectively reducing the obstacles to the current and improving the conductive efficiency of the conductive strip 22. The presence of multiple conductive channels 221 disperses the current, reduces the current density on a single channel, thereby reducing the generation of resistance, which is conducive to the smooth transmission of the current.
[0061] Furthermore, the multi-channel design can also improve the structural stability of the conductive strip 22. Even if a channel fails or is damaged, other channels can still remain conductive, ensuring stable current transmission. The multi-channel design enables the conductive strip 22 to adapt to the connection of electronic components of different specifications and requirements, and meet the conductivity requirements in different scenarios.
[0062] Furthermore, when the current needs to be transferred between electronic components, the current enters the conductive strip 22 through the conductive layer 21. Since the conductive strip 22 is provided with multiple conductive channels 221, the current can be transferred through these channels in a dispersed manner, thus avoiding the problem of overloading a single channel. The multiple conductive channels 221 work together to ensure efficient and stable transfer of the current, and finally transfer the current to another electronic component through the second adhesive layer 12, thus completing the establishment of the conductive path.
[0063] In a specific implementation example, the surface of the conductive layer 21 is provided with conductive protrusions 211, and the conductive protrusions 211 are evenly distributed on the surface of the conductive layer 21 that contacts the electronic component to increase the contact area with the electronic component, thereby improving the conductive efficiency.
[0064] Specifically, the design of the conductive protrusion 211 can form multiple contact points between the conductive layer 21 and the electronic component, thereby effectively increasing the contact area between the two. This helps to reduce the resistance during the current transfer process and improve the conductivity efficiency. Due to the increase in the contact area, the current transfer between the conductive layer 21 and the electronic component will be smoother, reducing energy loss. This helps to improve the conductivity efficiency of the entire conductive path and ensure the stable transfer of current.
[0065] Furthermore, the design of the conductive protrusion 211 can also enhance the connection reliability between the conductive layer 21 and the electronic component. Even under the influence of external vibration or temperature change, the conductive protrusion 211 can still maintain close contact with the electronic component to ensure the stability of the conductive path. The design of the conductive protrusion 211 enables the conductive layer 21 to adapt to electronic components of different shapes and sizes. Regardless of whether the surface of the electronic component is flat, the conductive protrusion 211 can form a good contact with it, ensuring the effectiveness of the conductive path.
[0066] Furthermore, when the conductive layer 21 is attached to the electronic component, the conductive protrusions 211 will first contact the surface of the electronic component. Since the conductive protrusions 211 are evenly distributed, they can form a plurality of conductive channels 221 between the conductive layer 21 and the electronic component. When the current passes through the conductive layer 21, these conductive channels 221 will work together to ensure efficient transmission of the current. At the same time, the conductive protrusions 211 can also effectively disperse the current and reduce the potential damage of the current to the electronic component.
[0067] In a specific implementation example, the conductive protrusions 211 are conductive particles.
[0068] Specifically, the presence of the conductive particles significantly increases the contact area between the conductive layer 21 and the electronic components. Compared with planar contact, the granular conductive protrusions 211 can provide more contact points within the same surface area, thereby optimizing the current transfer effect.
[0069] Furthermore, due to the increase in contact area, the current transfer between the conductive layer 21 and the electronic component will be smoother, reducing resistance and energy loss, which helps to improve the conduction efficiency of the entire conductive path and ensure stable current transfer.
[0070] In a specific implementation example, the bonding connection of the buffered conductive reworkable foam tape 100 is arranged at a conductive adhesive bonding connection.
[0071] Specifically, as a special adhesive, conductive adhesive has excellent adhesion and strength, which can effectively bond the foam tape and electronic components tightly together to prevent them from falling off or loosening during use. Conductive adhesive not only has the bonding function, but also has conductivity. Therefore, using conductive adhesive to bond the foam tape and electronic components can ensure that the current is not hindered when it is transmitted between the electronic components, maintaining the continuity of the conductive path.
[0072] Furthermore, by using conductive adhesive bonding, a firm connection between the foam tape and the electronic components and the establishment of a conductive path can be achieved without adding additional process steps, thereby simplifying the overall production process. The use of conductive adhesive can enhance the connection reliability between the foam tape and the electronic components, reduce the risk of failure due to poor connection, and improve the overall reliability of the product.
[0073] Further, the conductive adhesive is evenly applied to the adhesive layer of the foam tape, and then the foam tape is attached to the corresponding position of the electronic component. Through appropriate pressure and temperature treatment, the conductive adhesive quickly solidifies and forms a strong adhesive connection. At the same time, the conductive components in the conductive adhesive ensure that the current can be smoothly transmitted between the foam tape and the electronic component.
[0074] Furthermore, conductive adhesive bonding connection has a wide range of application scenarios, especially in situations where high-reliability conductive connection is required. For example, in the fields of automotive electronics, aerospace, etc., the connection between electronic components must be very reliable to ensure the normal operation and safety of the equipment. In these fields, the buffered conductive reworkable foam tape 100 connected by conductive adhesive bonding can effectively meet the conductivity and connection requirements and improve the overall performance of the product.
[0075] Thus, the buffered conductive reworkable foam tape 100 provided above is tightly connected to two electronic components at one end through the first and second adhesive layers 12 of the adhesive component 10, and the other end is bonded and connected to the conductive layer 21 and the conductive strip 22 of the conductive component 20, and the buffer layer 13 located between the conductive layer 21 and the conductive strip 22 constructs a complete conductive path, thereby improving the effective current transmission between the electronic components.
[0076] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.
Claims
1. A buffered conductive reworkable foam tape for assembling electronic components. It is characterized in that include: The adhesive assembly comprises a first adhesive layer and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are tightly connected to the two electronic components respectively; A conductive component is located between the first adhesive layer and the second adhesive layer and is bonded to the adhesive component, wherein the conductive component comprises: A conductive layer, bonded to the first adhesive layer and located at an end away from the electronic component; A conductive strip is bonded to the second adhesive layer and is located at an end away from another electronic component, wherein the current generated in the electronic component passes through the first adhesive layer to the conductive layer, is then transferred to the conductive strip, and then to the second adhesive layer, and the second adhesive layer is transferred to another electronic component to form a conductive path.
2. A buffered conductive reworkable foam tape according to claim 1, It is characterized in that The buffered conductive reworkable foam tape further comprises a buffer layer, one end of the buffer layer is connected to the conductive layer, and the other end of the buffer layer is connected to the conductive strip.
3. A buffered conductive reworkable foam tape according to claim 2, It is characterized in that The buffer layer is configured as foam.
4. A buffered conductive reworkable foam tape according to claim 3, It is characterized in that A conductive network is provided inside the foam, and the conductive network is connected with the conductive strip and the conductive layer to form a continuous conductive channel to improve the overall conductive efficiency.
5. A buffered conductive reworkable foam tape according to claim 4, It is characterized in that The conductive network is formed by interweaving conductive fibers.
6. A buffered conductive reworkable foam tape according to claim 1, It is characterized in that The surface of the foam is provided with an anti-oxidation coating.
7. A buffered conductive reworkable foam tape according to claim 1, It is characterized in that A plurality of conductive channels are arranged inside the conductive strip to enhance the current transmission capability.
8. The buffered conductive reworkable foam tape according to claim 1, It is characterized in that Conductive protrusions are arranged on the surface of the conductive layer, and the conductive protrusions are evenly distributed on the surface of the conductive layer that is attached to the electronic component, so as to increase the contact area with the electronic component, thereby improving the conductive efficiency.
9. A buffered conductive reworkable foam tape according to claim 8, It is characterized in that The conductive protrusions are conductive particles.
10. The buffered conductive reworkable foam tape according to claim 1, It is characterized in that The bonding connection of the buffered conductive reworkable foam tape is arranged at the conductive adhesive bonding connection.