Thermal resistance testing device for flat-plate semiconductor device
By designing the clamping, testing and pushing mechanism of the thermal resistance testing device of flat-panel semiconductor devices, the problems of low testing efficiency and inaccurate data of traditional devices for different sizes and shapes are solved, and rapid clamping, accurate testing and rapid cooling are achieved The effect of the test efficiency and device stability are improved.
Patent Information
- Application Number
- CN202420626541.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-29
AI Technical Summary
Traditional thermal resistance testing devices lack fixed adjustment components when testing semiconductor devices, resulting in low testing efficiency and inaccurate data, and cannot adapt to devices of different sizes and shapes.
A flat-panel semiconductor device thermal resistance testing device is designed, including a clamping mechanism, a testing mechanism and a pushing mechanism. The clamping mechanism clamps the device through sliding grooves, a dual-axis motor and a screw rod. The test mechanism uses a heater to perform thermal resistance testing. , push the mechanism to quickly remove and cool the device through multi-stage cylinders and heat dissipation mechanism.
Improves testing efficiency and data accuracy, adapts to various types of semiconductor devices, ensures stable device position, avoids inaccurate thermal resistance test data, and restores device performance through cooling to ensure stability and reliability.
Smart Images
Figure CN222212876U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device testing equipment, in particular to a flat-plate semiconductor device thermal resistance testing device. Background Art
[0002] With the development of semiconductor technology, more and more semiconductor devices are widely used. These devices will generate a certain amount of heat during operation. If they cannot be dissipated in time, they may have a negative impact on the stable operation of the device. Therefore, it is very necessary to perform thermal resistance testing on semiconductor devices. However, when traditional thermal resistance testing devices test semiconductor devices, the size and shape of the semiconductor devices may be different, and some thermal resistance testing devices lack components for fixing and adjusting the semiconductor devices during testing, which affects the test efficiency and data of the test device. Therefore, the utility model designs a flat-plate semiconductor device thermal resistance testing device. Utility Model Content
[0003] The utility model aims to solve the problems existing in the background technology and proposes a flat-plate semiconductor device thermal resistance testing device.
[0004] The technical solution of the utility model is as follows: a flat-plate semiconductor device thermal resistance testing device comprises a base plate and a support frame installed on the base plate, and also comprises: a clamping mechanism arranged on the support frame for fixing and clamping semiconductor devices of different sizes and shapes; a cylinder box installed on the base plate, the base plate and the cylinder box being provided with a testing mechanism for performing a thermal resistance test on the semiconductor device after cooperating with each other; and a pushing mechanism installed on the cylinder box for taking out the semiconductor device after the test is completed from the testing mechanism.
[0005] Optionally, the clamping mechanism includes a sliding groove opened in the support frame, a dual-axis motor is arranged inside the sliding groove, a pair of output shafts of the dual-axis motor are fixedly connected to a spiral rod, the support frame is slidably connected to a pair of slides corresponding to the spiral rod and spirally connected, the support frame is slidably connected to a pair of telescopic plates corresponding to the slides, the opposite ends of the telescopic plates are fixedly connected to one end of the upper and lower corresponding slides, and the opposite ends of the telescopic plates are fixedly connected to telescopic clamps for clamping semiconductor devices.
[0006] Optionally, the testing mechanism includes a testing module installed in the cylinder box for testing semiconductor devices, and a mounting groove is provided on the upper surface of the base plate, and a heater for heating the semiconductor device is provided inside the mounting groove.
[0007] Optionally, the pushing mechanism includes a multi-stage cylinder installed in a cylinder box, one end of the cylinder box is slidably connected to a push plate, one end of the push plate is fixedly connected to the piston rod of the multi-stage cylinder, the other end of the push plate is fixedly connected to a shovel block for separating the tested semiconductor device from the heater, the upper surface of the base plate is provided with a block for being resisted by one end of the shovel block, and the block is provided with an inclined surface for separating the shovel block from the heater on the base plate.
[0008] Optionally, the shovel block is provided with a plurality of linearly arranged air outlets, the shovel block is fixedly connected with a heat dissipation mechanism, a plurality of cooling fans for generating airflow are arranged inside the heat dissipation mechanism, and the airflow generated by the cooling fans passes through the air outlets and is used to blow toward the semiconductor devices on the shovel block.
[0009] Optionally, a plurality of buffer springs arranged in pairs and linearly are provided inside the telescopic splint, and a protective pad is movably connected to the open end of the telescopic splint, and the protective pad is fixedly connected to one end of the buffer spring.
[0010] Optionally, an anti-drop block fixedly connected to one end of the spiral rod is provided inside the slide plate.
[0011] Compared with the prior art, the utility model has the following beneficial technical effects:
[0012] The utility model utilizes the coordination of structures such as the clamping mechanism, the testing mechanism, the bottom plate and the supporting frame pushing mechanism, and the thermal resistance testing device can quickly clamp semiconductor devices of different sizes and shapes, which can not only save debugging and preparation time, thereby improving the testing efficiency, but also can adapt to various types of semiconductor devices for testing to meet diverse needs. In addition, it can also ensure the stability of the device position during the test, avoiding the problem of inaccurate thermal resistance test data caused by device movement.
[0013] Furthermore, through the design of the clamping mechanism, the testing mechanism and the pushing mechanism, the semiconductor device on the heater is removed in time after the test of the flat semiconductor device is completed, so as to avoid the temperature of the device rising due to continued heating, which leads to the decrease in the accuracy of the thermal resistance test data. At the same time, cooling the flat semiconductor device can restore its original performance state, thereby ensuring the stability and reliability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 A schematic structural diagram of a flat-plate semiconductor device thermal resistance testing device of the utility model is given;
[0015] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure viewed from the left;
[0016] Figure 3 for Figure 2 Schematic diagram of a partial cross-section structure.
[0017] Figure numerals: 1. Base plate; 11. Mounting groove; 12. Heater; 13. Block; 14. Test module; 2. Support frame; 21. Sliding groove; 22. Dual-axis motor; 23. Screw rod; 24. Slide plate; 25. Telescopic plate; 26. Telescopic splint; 27. Protective pad; 28. Buffer spring; 29. Anti-slip block; 3. Cylinder box; 31. Multi-stage cylinder; 32. Push plate; 33. Heat dissipation mechanism; 34. Shovel block; 35. Air outlet. DETAILED DESCRIPTION
[0018] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all of the embodiments.
[0019] The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.
[0020] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.
[0021] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0022] It should be noted that the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] like Figure 1-2 As shown, the flat-plate semiconductor device thermal resistance testing device proposed by the utility model includes a base plate 1 and a support frame 2 installed on the base plate 1, and also includes: a clamping mechanism arranged on the support frame 2 for fixing and clamping semiconductor devices of different sizes and shapes; a cylinder box 3 installed on the base plate 1, and the base plate 1 and the cylinder box 3 are provided with a testing mechanism for performing a thermal resistance test on the semiconductor device after cooperating with each other; a pushing mechanism installed on the cylinder box 3 for taking out the tested semiconductor device from the testing mechanism.
[0025] Further, if Figure 2 As shown, the clamping mechanism includes a sliding groove 21 opened in the support frame 2, a dual-axis motor 22 is arranged inside the sliding groove 21, a pair of output shafts of the dual-axis motor 22 are fixedly connected with a spiral rod 23, the support frame 2 is slidably connected with a pair of slides 24 corresponding to the spiral rod 23 and spirally connected, the slides 24 are provided with anti-slip blocks 29 fixedly connected with one end of the spiral rod 23, a pair of telescopic plates 25 corresponding to the slides 24 are slidably connected on the support frame 2, the opposite ends of the telescopic plates 25 are fixedly connected with one end of the upper and lower corresponding slides 24, and the opposite ends of the telescopic plates 25 are fixedly connected with telescopic clamps 26 for clamping semiconductor devices.
[0026] The test mechanism includes a test module 14 installed in the cylinder box 3 for testing semiconductor devices. The upper surface of the base plate 1 is provided with a mounting groove 11. The mounting groove 11 is provided with a heater 12 for heating the semiconductor device. The heater 12 is a device for heating, usually composed of a heating element and a temperature control device. The function of the heater 12 is to provide a heat source so that the semiconductor device under test reaches the required temperature at high temperature for thermal resistance testing.
[0027] Secondly Figure 2In the embodiment, the pushing mechanism includes a multi-stage cylinder 31 installed in the cylinder box 3, and the multi-stage cylinder 31 has multiple pistons or air chambers, and each air chamber or piston has a cylinder with an independent motion control system. Compared with a single-stage cylinder, the multi-stage cylinder 31 has higher reliability and stability. Since each level has an independent control system, it is easier to achieve independent control and maintenance of each level. A push plate 32 is slidably connected to one end of the cylinder box 3, and one end of the push plate 32 is fixedly connected to the piston rod of the multi-stage cylinder 31. The other end of the push plate 32 is fixedly connected to a shovel block 34 for separating the semiconductor device that has been tested from the heater 12. Three linearly arranged air outlets 35 are provided on the shovel block 34. A heat dissipation mechanism 33 is fixedly connected to the shovel block 34. Three cooling fans for generating airflow are arranged inside the heat dissipation mechanism 33. The cooling fan is used to cool the semiconductor device on the shovel block 34, so as to facilitate the use of the staff. The airflow generated by the cooling fan passes through the air outlet 35 and is used to blow toward the semiconductor device on the shovel block 34. The upper surface of the bottom plate 1 is provided with a stopper 13 for being stopped by one end of the shovel block 34. The stopper 13 is used to create a gap between one end of the shovel block 34 and the upper surface of the heater 12. The stopper 13 is provided with an inclined surface for making the shovel block 34 separate from the heater 12 on the bottom plate 1.
[0028] Going further, Figure 3 A plurality of buffer springs 28 are arranged in pairs and in a linear pattern inside the telescopic clamp 26. A protective pad 27 is movably connected to the open end of the telescopic clamp 26. The protective pad 27 is made of heat-resistant rubber and can absorb and disperse the impact force when impacted, thereby protecting the flat semiconductor device from damage. The protective pad 27 is fixedly connected to one end of the buffer spring 28.
[0029] In this embodiment, when a flat-plate semiconductor device needs to use a thermal resistance test device, such as Figure 1 As shown, after the heater 12 is started, the semiconductor device to be tested is placed on the upper surface of the heater 12, and then the dual-axis motor 22 in the sliding slot 21 is started. The dual-axis motor 22 is an asynchronous motor with two extended shafts, and its main purpose is to facilitate speed measurement and electrical control to achieve speed control, starting, braking and encoding. A pair of output shafts of the dual-axis motor 22 each drive a screw rod 23 to rotate, as shown in FIG. Figure 3As shown, since the spiral rod 23 and one end of the slide plate 24 are spirally connected, the spiral rod 23 drives the corresponding slide plate 24 to move in the same direction, and the other end of a pair of slide plates 24 drives the corresponding telescopic plates 25 to move in the same direction, and the other end of a pair of telescopic plates 25 drives a telescopic clamping plate 26 to slide toward the semiconductor device placed on the heater 12 through the support of the support frame 2, and then the pair of telescopic clamping plates 26 drive the corresponding protective pads 27 to clamp the semiconductor device, and through the buffer spring 28 in the telescopic clamping plate 26, the buffer spring 28 has good elasticity, so that when the pair of protective pads 27 clamp the semiconductor device, the semiconductor device can reduce the impact force and pressure.
[0030] After the semiconductor device is tested by the cooperation of the heater 12 and the test module 14 on the test mechanism, Figure 2 As shown, the multi-stage cylinder 31 in the cylinder box 3 is directly started, and the piston rod of the multi-stage cylinder 31 pushes the push plate 32 to move in the direction of the semiconductor device, and the push plate 32 pushes the shovel block 34 to move. At this time, one end of the shovel block 34 shovels the semiconductor device after the test to its upper surface through the cooperation of the block 13. When one end of the shovel block 34 moves to the inclined surface on the block 13, the shovel block 34 drives the semiconductor device thereon to create a little gap with the heater 12. Finally, the cooling fan in the heat dissipation mechanism 33 can be started, that is, the cold air flow generated by the cooling fan cools the semiconductor device on the shovel block 34 through multiple air outlets 35, which is convenient for the staff to take it out later, and it is simple and easy to operate.
[0031] The preferred embodiments of the utility model of the above utility model are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A flat-plate semiconductor device thermal resistance testing device, comprising a base plate (1) and a support frame (2) mounted on the base plate (1), It is characterized in that Also includes: A clamping mechanism disposed on the support frame (2) for fixing and clamping semiconductor devices of different sizes and shapes; A cylinder box (3) mounted on the base plate (1), wherein the base plate (1) and the cylinder box (3) are provided with testing mechanisms for performing thermal resistance testing on semiconductor devices in cooperation with each other; A pushing mechanism is installed on the cylinder box (3) and is used to take out the semiconductor device after the test from the testing mechanism.
2. The thermal resistance testing device for a flat-plate semiconductor device according to claim 1, It is characterized in that The clamping mechanism comprises a sliding groove (21) provided in the support frame (2), a dual-axis motor (22) being arranged inside the sliding groove (21), a pair of output shafts of the dual-axis motor (22) being fixedly connected to a spiral rod (23), the support frame (2) being slidably connected to a pair of slide plates (24) corresponding to the spiral rod (23) and spirally connected, a pair of telescopic plates (25) corresponding to the slide plates (24) being slidably connected to the support frame (2), the opposite ends of the telescopic plates (25) being fixedly connected to one end of the upper and lower corresponding slide plates (24), and the opposite ends of the telescopic plates (25) being fixedly connected to a telescopic clamping plate (26) for clamping the semiconductor device.
3. The thermal resistance testing device for a flat-plate semiconductor device according to claim 1, It is characterized in that The testing mechanism comprises a testing module (14) installed in a cylinder box (3) for testing semiconductor devices. The upper surface of the base plate (1) is provided with a mounting groove (11), and a heater (12) for heating the semiconductor devices is arranged inside the mounting groove (11).
4. The thermal resistance testing device for a flat semiconductor device according to claim 1, It is characterized in that The pushing mechanism comprises a multi-stage cylinder (31) installed in a cylinder box (3); one end of the cylinder box (3) is slidably connected to a push plate (32); one end of the push plate (32) is fixedly connected to a piston rod of the multi-stage cylinder (31); the other end of the push plate (32) is fixedly connected to a shovel block (34) for detaching a semiconductor device that has been tested from a heater (12); a stop block (13) for being resisted by one end of the shovel block (34) is provided on the upper surface of the base plate (1); and an inclined surface for detaching the shovel block (34) from the heater (12) on the base plate (1) is provided on the stop block (13).
5. The thermal resistance testing device for a flat-plate semiconductor device according to claim 4, It is characterized in that The shovel block (34) is provided with a plurality of linearly arranged air outlets (35), the shovel block (34) is fixedly connected with a heat dissipation mechanism (33), a plurality of cooling fans for generating airflow are arranged inside the heat dissipation mechanism (33), and the airflow generated by the cooling fans passes through the air outlets (35) and is blown toward the semiconductor devices on the shovel block (34).
6. The thermal resistance testing device for a flat semiconductor device according to claim 2, It is characterized in that A plurality of buffer springs (28) arranged in pairs and linearly arranged are arranged inside the telescopic clamp (26); the open end of the telescopic clamp (26) is movably connected to a protective pad (27); and the protective pad (27) is fixedly connected to one end of the buffer spring (28).
7. The thermal resistance testing device for a flat semiconductor device according to claim 2, It is characterized in that The slide plate (24) is provided with an anti-slip block (29) fixedly connected to one end of the spiral rod (23) inside.