Optical module

Abstract

The embodiment of the utility model discloses an optical module, which is provided with a first direction and comprises a main circuit board, which is provided with a first surface and a second surface which are oppositely arranged in the first direction; the substrate comprises a first connecting part, a second connecting part and a heat dissipation part, at least part of the first connecting part is connected to the first surface of the main circuit board, and the heat dissipation part and the first connecting part are arranged in a staggered mode in the direction, facing the second surface, of the first direction; the heat dissipation part is provided with a bearing surface and a heat dissipation surface which are oppositely arranged in the first direction, and the heat dissipation surface and the second surface are in the same direction; and the light emitting assembly is arranged on the bearing surface of the heat dissipation part, and the light emitting assembly is electrically connected with the main circuit board. According to the optical module, the overall layout of the electronic elements on the main circuit board is optimized, the integration level of the optical module is improved, and the overall heat dissipation performance of the main circuit board is optimized; meanwhile, the heat dissipation efficiency of the light emitting assembly is improved, and finally the heat dissipation performance of the optical module is improved.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] The optical module is a tool for realizing the mutual conversion of optical and electrical signals and is one of the key components in optical communication equipment.

[0003] With the rapid development of communication technology and the growing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. Optical modules need to work within their defined temperature range, and excellent heat dissipation performance is an indispensable component in the design of high-speed optical modules. Therefore, how to improve the module integration and heat dissipation performance in the design of high-speed optical modules has become an urgent problem to be solved. Utility Model Content

[0004] The embodiments of the present application provide an optical module to improve the heat dissipation performance of the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] In one aspect, an optical module is provided, having a first direction, comprising:

[0007] A main circuit board, the main circuit board having a first surface and a second surface arranged opposite to each other in the first direction;

[0008] A substrate, the substrate comprising: a first connection portion, a second connection portion and a heat dissipation portion, at least part of the first connection portion is connected to the first surface of the main circuit board, the heat dissipation portion is arranged in a direction toward the second surface from the first direction and is offset from the first connection portion, and the heat dissipation portion is connected to the first connection portion through the second connection portion; the heat dissipation portion has a bearing surface and a heat dissipation surface arranged opposite to each other in the first direction, and the heat dissipation surface is in the same direction as the second surface; and

[0009] The optical emission component is arranged on the bearing surface of the heat dissipation part, the optical emission component is electrically connected to the main circuit board, and the optical emission component is used to convert the electrical signal into an optical signal for output.

[0010] In addition to one or more of the features disclosed above, or as an alternative, it also includes: a sub-circuit board, one end of which is overlapped on the second surface of the main circuit board and electrically connected to the transmitter trace on the second surface of the main circuit board, and the other end is electrically connected to the optical transmission component, and the optical transmission component is electrically connected to the transmitter trace on the second surface via the sub-circuit board.

[0011] In addition to or instead of one or more features disclosed above, the second connecting portion extends along the first direction; a connecting hole is provided on the second connecting portion, and at least a portion of the sub-circuit board is passed through the connecting hole to be electrically connected to the optical emitting component.

[0012] In addition to or as an alternative to one or more features disclosed above, the second connection portion includes two connection columns, the connection columns extend along the first direction, one end of the connection column is connected to the first connection portion, and the other end of the connection column is connected to the heat dissipation portion;

[0013] One end of the sub-circuit board is passed through between the two connecting posts to electrically connect the light emitting component.

[0014] In addition to or as an alternative to one or more of the features disclosed above, a receiving opening is provided on the first connecting portion;

[0015] The optical module also includes a light receiving component, which is arranged on the first surface of the main circuit board and accommodated in the receiving port. The light receiving component is electrically connected to the main circuit board and is used to receive optical signals outside the optical module and convert them into electrical signals for transmission to the main circuit board.

[0016] In addition to or as an alternative to one or more of the features disclosed above, the optical module further comprises a light receiving component, the light receiving component is disposed on the first surface of the main circuit board and is electrically connected to the main circuit board; the light receiving component is used to receive an optical signal outside the optical module and convert it into an electrical signal for transmission to the main circuit board;

[0017] The first connecting portion includes at least two connecting arms, the two connecting arms are arranged oppositely on two sides of the light receiving component, and one end of the connecting arm is connected to the second connecting portion.

[0018] In addition to or as an alternative to one or more of the features disclosed above, the first connecting portion further comprises a crossbeam, and two ends of the crossbeam are respectively connected to two adjacent connecting arms;

[0019] The crossbeam includes a first crossbeam located at one side of the light receiving component, or includes a first crossbeam and a second crossbeam located at two opposite sides of the light receiving component, and at least one of the crossbeams is fixedly connected to the first surface of the main circuit board.

[0020] In addition to or as an alternative to one or more of the features disclosed above, the first beam is located on a side of the light receiving component close to the light emitting component;

[0021] The optical module also includes a first optical fiber array and a second optical fiber array. The first optical fiber array is located on the bearing surface of the heat dissipation portion and is used to transmit the optical signal output by the optical emitting component to the outside of the optical module; the second optical fiber array is arranged on the first beam and is used to transmit the optical signal outside the optical module to the optical receiving component.

[0022] In addition to or as an alternative to one or more of the features disclosed above, the substrate is an integrally formed heat-conductive heat sink, and the first connecting portion is thermally connected to the main circuit board.

[0023] In addition to one or more of the features disclosed above, or as an alternative, it also includes: a sealing cover connected to the heat dissipation part, the sealing cover and the heat dissipation part are enclosed to form a receiving cavity, and the light emitting component is received in the receiving cavity.

[0024] In addition to one or more of the features disclosed above, or as an alternative, the second connecting portion includes a closed side wall, which extends along the first direction, the bottom of the closed side wall along the first direction is connected to the bearing surface of the heat dissipation portion, and the top of the closed side wall along the first direction is used to support the sealing cover, and the bearing surface, the closed side wall and the sealing cover enclose the receiving cavity.

[0025] In addition to one or more of the features disclosed above, or as an alternative, a first limiting portion is provided on the closed side wall, and a second limiting portion is provided on the sealing cover, and the first limiting portion cooperates with the second limiting portion to limit the relative position between the sealing cover and the closed side wall.

[0026] In addition to or as an alternative to one or more of the features disclosed above, the sealing cover is bonded to the closed side wall by a sealant;

[0027] The sealing cover is provided with an exhaust hole, the exhaust hole communicates with the receiving cavity and the outside of the sealing cover, and the exhaust hole is provided with a sealing member to seal the exhaust hole.

[0028] In addition to or as an alternative to one or more of the features disclosed above, the optical module further includes a light receiving component, a first optical fiber array and a second optical fiber array; the light receiving component is disposed on the first surface of the main circuit board and is electrically connected to the main circuit board; the first optical fiber array is located on the bearing surface of the heat dissipation portion, and is disposed on a side of the light emitting component relatively away from the first connecting portion, and is used to transmit the optical signal output by the light emitting component to the outside of the optical module; the second optical fiber array is disposed on the first connecting portion, and is used to transmit the optical signal outside the optical module to the light receiving component;

[0029] The closed side walls are respectively located on both sides of the first optical fiber array, the sealing cover is arranged on the closed side walls and the first optical fiber array, and the bearing surface, the closed side walls, the first optical fiber array and the sealing cover together enclose the receiving cavity;

[0030] The sealing cover is provided with an escape groove at the top in the first direction, and the escape groove is used to escape the optical fibers of the second optical fiber array.

[0031] In addition to or as an alternative to one or more of the features disclosed above, the optical module further includes a control chip and a power chip, the control chip and the power chip are both disposed on the second surface of the main circuit board, and the control chip and the power chip are both electrically connected to the main circuit board;

[0032] The optical transmission component includes: a laser chip, a coupling lens and a chip substrate; the chip substrate is arranged on the bearing surface of the heat dissipation part and is electrically connected to the sub-circuit board, the laser chip is arranged on the chip substrate and is electrically connected to the chip substrate, and is electrically connected to the main circuit board via the chip substrate and the sub-circuit board, and the coupling lens is located on the light output side of the laser chip and is used to couple the optical signal output by the laser chip.

[0033] One of the above technical solutions has the following advantages or beneficial effects: in the present application, the heat dissipation part and the first connecting part of the substrate are staggered and the first connecting part is connected to the first surface of the main circuit board at the same time, so that there are more areas on the second surface of the main circuit board to install high-heat generating electronic components, thereby optimizing the overall layout of the electronic components on the main circuit board, which is beneficial to improving the integration of the optical module and optimizing the overall heat dissipation performance of the main circuit board; at the same time, the optical emission component is arranged on the heat dissipation part, and the heat dissipation part of the substrate is used to dissipate the heat generated by the optical emission component, thereby improving the heat dissipation efficiency of the optical emission component, eliminating the influence of heat on the working performance of the optical emission component, and ultimately improving the heat dissipation performance of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0035] Figure 1 is a three-dimensional structural view of an optical module provided according to an embodiment of the present application;

[0036] Figure 2 is a three-dimensional structural view from another perspective of the optical module provided in an embodiment of the present application;

[0037] Figure 3 is an exploded structural view of an optical module provided according to an embodiment of the present application;

[0038] Figure 4 is an exploded structural view of a substrate and a sealing cover provided according to an embodiment of the present application;

[0039] Figure 5 is a cross-sectional view of a substrate and a sealing cover provided according to an embodiment of the present application;

[0040] Figure 6 is a top view of a substrate and a light emitting assembly provided according to an embodiment of the present application;

[0041] Figure 7 is a three-dimensional structural view of a substrate provided according to an embodiment of the present application;

[0042] Figure 8 This is a three-dimensional structural view from another perspective of the substrate provided in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 100. Optical module;

[0045] 110. main circuit board; 111. first surface; 112. second surface;

[0046] 120, substrate; 121, heat dissipation portion; 1211, bearing surface; 1212, heat dissipation surface; 122, first connection portion; 1221, receiving opening; 1222, beam; 12221, first beam; 12222, second beam; 1223, connecting arm; 123, second connection portion; 1231, communicating hole; 1232, closed side wall; 1233, connecting column; 12321, first position limiting portion;

[0047] 130, light emitting component; 131, laser chip; 132, coupling lens; 133, chip substrate;

[0048] 140, sub-circuit board;

[0049] 150. TEC cooler;

[0050] 160, sealing cover; 161, second limiting portion; 162, exhaust hole; 163, avoidance groove; 164, receiving chamber;

[0051] 170. Light receiving component;

[0052] 180. A first optical fiber array. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and beneficial effects of this application more clear, the following further describes this application in detail in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining this application, not for limiting this application.

[0054] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0055] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0057] With the rapid development of 4G communications and the growing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. An optical module is an integrated module that converts optical signals into electrical signals and / or converts electrical signals into optical signals. Optical modules generate a lot of heat when working, and the existing optical modules have unreasonable internal structures and layouts, resulting in poor heat dissipation of high-power components such as internal light sources and chips, which in turn affects the normal operation of optical modules, which is more harmful than beneficial to optical modules.

[0058] In an embodiment of the present application, an optical module 100 is provided. Figures 1 to 8 The optical module 100 has a first direction Z, a second direction X and a third direction Y that intersect each other.

[0059] Specifically, the optical module 100 may include: a housing (not shown), a main circuit board 110, a substrate 120 and an optical emitting assembly 130. The housing includes a first shell (not shown) and a second shell (not shown) that cover each other up and down along a first direction Z, wherein the second shell is a main heat dissipation shell of the housing, and when in use, the second shell is closest to an external heat dissipation device and has the fastest heat dissipation.

[0060] The main circuit board 110, the substrate 120 and the optical emission assembly 130 are accommodated in the housing. The main circuit board 110 has a first surface 111 and a second surface 112 arranged opposite to each other in the first direction Z, wherein the first surface 111 faces the first housing, and the second surface 112 faces the second housing. The substrate 120 comprises: a first connection portion 122, a second connection portion 123 and a heat dissipation portion 121, at least part of the first connection portion 122 is connected to the first surface 111 of the main circuit board 110, the heat dissipation portion 121 is staggered with the first connection portion 122 in the direction facing the second surface 112 in the first direction Z, that is, the heat dissipation portion 121 and the first connection portion 122 are staggered in the first direction Z, and the heat dissipation portion 121 is arranged close to the second surface 112 and the second housing relative to the first connection portion 122 in the first direction Z. The heat dissipation part 121 is connected to the first connection part 122 via the second connection part 123; the heat dissipation part 121 has a bearing surface 1211 and a heat dissipation surface 1212 arranged opposite to each other in the first direction Z, and the heat dissipation surface 1212 is in the same direction as the second surface 112, that is, the heat dissipation surface 1212 and the second surface 112 are both facing the second shell and are thermally connected to the second shell. The above-mentioned optical emission component 130 is arranged on the bearing surface 1211 of the heat dissipation part 121 and is electrically connected to the main circuit board 110. The optical emission component 130 is used to convert electrical signals into optical signals for output. The heat generated by the optical emission component 130 when working is conducted from the heat dissipation surface 1212 of the heat dissipation part 121 to the second shell for heat dissipation through the heat dissipation part 121.

[0061] Specifically, the optical module 100 further includes: a control chip (not shown) and a power chip (not shown), the control chip and the power chip are both disposed on the second surface 112 of the main circuit board 110, and the control chip and the power chip are both electrically connected to the main circuit board 110. The control chip may be a TEC control chip, a DSP (digital signal processing) chip, etc., but is not limited thereto.

[0062] It is understandable that the control chip and the power chip have high power consumption and generate a lot of heat during the operation process. Especially when the control chip and the power chip are used in high-speed optical modules, the semiconductor devices such as the optical transmitting components in the optical modules are sensitive to the ambient temperature and the heat in the optical modules needs to be dissipated in time.

[0063] Since the second surface 112 of the main circuit board 110 faces the second shell of the housing (the main heat dissipation shell of the optical module 100), the main power consumption chips such as the control chip and the power chip are arranged on the second surface 112 of the main circuit board 110, which is closer to the second shell (the main heat dissipation shell of the optical module 100), and heat can be directly dissipated from the second shell. That is, the main functional chips and the optical transmission component 130 on the main circuit board 110 can directly dissipate heat from the second shell of the optical module 100, which can effectively improve the heat dissipation performance of the optical module 100.

[0064] It can be understood that in the present application, the heat dissipation portion 121 and the first connecting portion 122 of the substrate 120 are staggered and the first connecting portion 122 is connected to the first surface 111 of the main circuit board 110, so that there are more areas on the second surface 112 of the main circuit board 110 for installing high-heat generating electronic components, thereby optimizing the overall layout of the electronic components on the main circuit board 110, improving the integration of the optical module, and optimizing the overall heat dissipation performance of the main circuit board 110; at the same time, the optical emission component 130 is arranged on the heat dissipation portion 121, and the heat dissipation portion 121 of the substrate 120 is used to dissipate the heat generated by the optical emission component 130, thereby improving the heat dissipation efficiency of the optical emission component, eliminating the influence of heat on the working performance of the optical emission component, and ultimately improving the heat dissipation performance of the optical module.

[0065] In one embodiment, please refer to Figures 1 to 3 The above-mentioned optical module 100 also includes: a sub-circuit board 140, one end of which is overlapped on the second surface 112 of the main circuit board 110, the sub-circuit board 140 is electrically connected to the transmitting end trace of the second surface 112 of the main circuit board 110, and the other end of the sub-circuit board 140 is electrically connected to the optical transmission component 130, and the optical transmission component 130 is electrically connected to the transmitting end trace of the second surface 112 through the sub-circuit board 140 to provide power and driving signals for the optical transmission component 130.

[0066] The sub-circuit board 140 may be a rigid circuit board, but is not limited thereto.

[0067] It can be understood that in the present application, the electrical connection between the main circuit board 110 and the optical transmission component 130 is achieved through the sub-circuit board 140. On the one hand, most of the devices in the optical module 100 can dissipate heat through the second shell of the outer shell of the optical module 100, effectively improving the heat dissipation performance of the optical module 100; on the other hand, it can improve the routing space of the main circuit board 110, reduce the via routing, and improve the high-frequency performance of the optical module 100.

[0068] Specifically, one end of the above-mentioned sub-circuit board 140 is electrically connected to the transmitting end trace of the second surface 112 of the main circuit board 110 through flip-chip soldering to achieve electrical connection between the two, so as to ensure that the sub-circuit board 140 and the main circuit board 110 are rigidly connected. The other end of the above-mentioned sub-circuit board 140 is electrically connected to the optical emission component 130 through bonding gold wires, so that the sub-circuit board 140 and the optical emission component 130 are electrically connected by bonding gold wires, so that the optical emission component 130 is electrically connected to the transmitting end trace of the second surface 112 of the main circuit board 110, so as to provide power and driving signals for the optical emission component 130. Through the sub-circuit board 140, the transmitting end trace located on the second surface 112 of the main circuit board 110 is guided to the surface of the sub-circuit board 140 on the side facing away from the heat dissipation portion 121, so that the optical emission component 130 can be electrically connected to the transmitting end trace of the second surface 112 of the main circuit board 110 through the sub-circuit board 140, without passing through the conductive via of the main circuit board 110, which can effectively improve the high-frequency performance. At the same time, the optical emission component 130 and the main power consumption chip located on the second surface 112 of the main circuit board 110 are cooled from the second shell of the optical module 100 (the main heat dissipation shell of the optical module 100), which effectively improves the heat dissipation performance of the optical module 100.

[0069] It should be understood that the sub-circuit board 140 in the present application is not limited to being electrically connected to the main circuit board 110 by flip-chip soldering and being electrically connected to the optical emission component 130 by bonding gold wires. Other connection structures, for example, PIN needles, solder pads or gold fingers are provided on the sub-circuit board 140 to achieve plug-in or welding electrical connection between the sub-circuit board 140 and the main circuit board 110 and / or the optical emission component 130. It is also possible to electrically connect the main circuit board 110 and the optical emission component 130 by using the sub-circuit board 140, which should also be regarded as embodiments of the present application.

[0070] In one embodiment, please refer to Figure 3 , Figure 7 and Figure 8The second connection portion 123 extends along the first direction Z, and a communication hole 1231 is provided on the second connection portion 123. At least part of the sub-circuit board 140 is passed through the communication hole 1231 and is electrically connected to the optical emission component 130. In the present application, the communication hole 1231 is provided to avoid the sub-circuit board 140, so as to ensure that the sub-circuit board 140 is normally electrically connected to the optical emission component 130, and at the same time, the overall structure of the optical module 100 is compact, which is conducive to the miniaturization of the optical module 100.

[0071] In one embodiment, please refer again to Figure 3 , Figure 7 and Figure 8 The second connection part 123 includes two connection posts 1233, which extend along the first direction Z. One end of the connection post 1233 is connected to the first connection part 122, and the other end is connected to the heat dissipation part 121. The two connection posts 1233 are arranged at intervals in the second direction X, so that one end of the above-mentioned sub-circuit board 140 is inserted between the two connection posts 1233 to electrically connect the optical emission component 130, so as to provide power and driving signals for the laser chip 131. In the present application, by inserting one end of the sub-circuit board 140 between the two connection posts 1233, the sub-circuit board 140 is avoided to ensure that the sub-circuit board 140 is normally electrically connected to the optical emission component 130, and at the same time, the overall structure of the optical module 100 is compact, which is conducive to the miniaturization of the optical module 100.

[0072] In one embodiment, please refer to Figure 6 The above-mentioned optical emission component 130 includes: a laser chip 131, a coupling lens 132 and a chip substrate 133; the chip substrate 133 is arranged on the bearing surface 1211 of the heat dissipation portion 121 and is electrically connected to the sub-circuit board 140, the laser chip 131 is arranged on the chip substrate 133 and is electrically connected to the chip substrate 133, the laser chip 131 is electrically connected to the main circuit board 110 through the chip substrate 133 and the sub-circuit board 140, so as to provide power and driving signals for the laser chip 131, the coupling lens 132 is located on the light emitting side of the laser chip 131, and the coupling lens 132 is used to couple the optical signal output by the laser chip 131.

[0073] Furthermore, the above-mentioned optical module 100 also includes: a first optical fiber array 180, the first optical fiber array 180 is located on the bearing surface 1211 of the heat dissipation portion 121, the first optical fiber array 180 is arranged on a side of the optical emitting component 130 relatively away from the first connecting portion 122, and the first optical fiber array 180 is used to transmit the optical signal output by the optical emitting component 130 to the outside of the optical module.

[0074] Furthermore, the optical module 100 further includes a TEC cooler 150 . The TEC cooler 150 is located between the chip substrate 133 and the carrying surface 1211 of the heat dissipation portion 121 . The chip substrate 133 is attached to the TEC cooler 150 .

[0075] Since the optical emission component 130 generates a large amount of heat during operation, if the heat is not conducted away in time, the performance of the optical emission component 130 will be significantly affected. Therefore, in the present application, the optical emission component 130 is attached to the TEC cooler 150, so as to use the TEC cooler 150 to further dissipate the heat of the optical emission component 130 and control the temperature of the optical emission component 130, so as to ensure that the optical emission component 130 works in a stable temperature environment, stabilize the performance of the optical emission component 130, and improve the signal quality of the optical module 100. In one embodiment, please refer to Figure 3 , Figure 4 , Figure 7 and Figure 8 The first connecting portion 122 defines a receiving opening 1221 .

[0076] The above-mentioned optical module 100 also includes: a light receiving component 170, which is arranged on the first surface 111 of the main circuit board 110 and is accommodated in the receiving port 1221. The light receiving component 170 is electrically connected to the main circuit board 110. The light receiving component 170 is used to receive the optical signal outside the optical module and convert it into an electrical signal for transmission to the main circuit board 110.

[0077] The above-mentioned light receiving component 170 includes, but is not limited to, electronic components such as TIA (transimpedance amplifier) ​​and PD (photodetector chip).

[0078] It can be understood that the present application provides a receiving opening 1221 on the first connecting portion 122 and arranges the light receiving component 170 in the receiving opening 1221 to reasonably arrange the light emitting component 130 and the light receiving component 170 , which is suitable for the miniaturized design of the optical module 100 .

[0079] Specifically, the optical receiving component 170 is electrically connected to the receiving end trace of the first surface 111 of the main circuit board 110 through a bonding gold wire, and the optical transmitting component 130 is electrically connected to the transmitting end trace of the second surface 112 of the main circuit board 110 using the sub-circuit board 140, so that the optical transmitting component 130 and the optical receiving component 170 are electrically connected to the second surface 112 and the first surface 111 of the main circuit board 110 respectively, so as to prevent electrical crosstalk between the two, improve the high-frequency performance of the optical module 100, facilitate the realization of high-speed optical modules, and ensure high-speed signal quality.

[0080] Specifically, the optical module 100 further includes a second optical fiber array (not shown), which is disposed on the first connecting portion 122 to support the second optical fiber, prevent the second optical fiber array from contacting other components and thus affecting other components, and facilitate the overall layout of components in the optical module 100. Specifically, the second optical fiber array is used to transmit the optical signal outside the optical module to the optical receiving component 170.

[0081] In one embodiment, please refer to Figure 3 , Figure 4 , Figure 6 and Figure 7 The first connecting portion 122 includes at least two connecting arms 1223, and the two connecting arms 1223 are relatively arranged on both sides of the optical receiving component 170. Specifically, the two connecting arms 1223 are relatively arranged on both sides of the optical receiving component 170 in the second direction X, and one end of the connecting arm 1223 is connected to the second connecting portion 123.

[0082] The first connection portion 122 further includes a crossbeam 1222 , and two ends of the crossbeam 1222 are respectively connected to two adjacent connection arms 1223 .

[0083] The connecting arm 1223 and the cross beam 1222 may be integrally formed or fixedly connected. This application does not make any specific restrictions and may be selected according to actual circumstances.

[0084] The present application arranges the optical receiving component 170 between the two connecting arms 1223 to rationally arrange the optical transmitting component 130 and the optical receiving component 170, which is suitable for the miniaturized design of the optical module 100. At the same time, a crossbeam 1222 is provided in the present application to connect two adjacent connecting arms 1223 to enhance the overall strength of the first connecting portion 122 and ensure the connection strength between the first connecting portion 122 and the main circuit board 110.

[0085] Specifically, in one embodiment, the crossbeam 1222 includes a first crossbeam 12221 located on one side of the light receiving assembly 170. Specifically, the first crossbeam 12221 is located on one side of the light receiving assembly 170 in the third direction Y. In the present application, only the first crossbeam 12221 is provided to simplify the structure of the first connecting portion 122 while ensuring the overall strength of the first connecting portion 122, thereby facilitating the processing and forming of the first connecting portion 122 and reducing the production cost.

[0086] In another embodiment, the above-mentioned beam 1222 includes a first beam 12221 and a second beam 12222 respectively located on opposite sides of the optical receiving assembly 170. Specifically, the first beam 12221 and the second beam 12222 are respectively located on opposite sides of the optical receiving assembly 170 in the third direction Y, and at least one beam is fixedly connected to the first surface 111 of the main circuit board 110. Exemplarily, the first beam 12221 and the second beam 12222 are both fixedly connected to the first surface 111 of the main circuit board 110.

[0087] In the present application, a first crossbeam 12221 and a second crossbeam 12222 are provided to connect two adjacent connecting arms 1223 , so as to further enhance the overall strength of the first connecting portion 122 and further ensure the connection strength between the first connecting portion 122 and the main circuit board 110 .

[0088] Further, the first crossbeam 12221 is located on a side of the optical receiving assembly 170 close to the optical transmitting assembly 130. Specifically, the first crossbeam 12221 is located on a side of the optical receiving assembly 170 close to the optical transmitting assembly 130 in the third direction Y. The second optical fiber array is disposed on the first crossbeam 12221 to support the second optical fiber, to prevent the second optical fiber array from contacting other components and thus affecting other components, and to facilitate the overall layout of components in the optical module 100.

[0089] In one embodiment, the substrate 120 is an integrally formed heat-conducting heat sink, such as made of a heat-conducting material, and the first connecting portion 122 is thermally connected to the main circuit board 110. That is, the substrate 120 is thermally connected to the main circuit board 110 as a whole. The substrate 120 can be used to simultaneously dissipate heat from the light receiving component 170 on the main circuit board 110.

[0090] The thermally conductive material may be a thermally conductive metal, such as aluminum, but is not limited thereto.

[0091] It is understandable that the light receiving component 170 will also generate heat when working normally, and the generated heat is conducted to the first connection part 122 through the heat conducting layer of the first surface 111 of the main circuit board 110, and then to the heat dissipation part 121 through the first connection part 122 and the second connection part 123, so as to dissipate heat by the heat dissipation part 121. That is, the light receiving component 170 is dissipated synchronously by the substrate 120, so as to further optimize the overall heat dissipation effect of the optical module 100.

[0092] In one embodiment, please refer to Figures 3 to 5The optical module 100 further includes a sealing cover 160, which is connected to the heat dissipation portion 121. The sealing cover 160 and the heat dissipation portion 121 enclose a receiving cavity 164, and the light emitting component 130 is received in the receiving cavity 164. In the present application, the sealing cover 160 is provided to isolate the light emitting component 130 from the external environment, so as to prevent the surface of the light emitting component 130 from being dirty, and ensure the normal use of the light emitting component 130.

[0093] In one embodiment, please refer to Figure 3 to Figure 4 The above-mentioned second connecting portion 123 includes a closed side wall 1232, which extends along the first direction Z. The bottom of the closed side wall 1232 along the first direction Z is connected to the supporting surface 1211 of the heat dissipation portion 121. The top of the closed side wall 1232 along the first direction Z is used to support the sealing cover 160. The supporting surface 1211, the closed side wall 1232 and the sealing cover 160 enclose a receiving cavity 164.

[0094] Specifically, the closed side walls 1232 are respectively located on both sides of the first optical fiber array 180. Specifically, the closed side walls 1232 are respectively located on both sides of the first optical fiber array 180 in the second direction X. The sealing cover 160 is disposed on the closed side walls 1232 and the first optical fiber array 180. The bearing surface 1211, the closed side walls 1232, the first optical fiber array 180 and the sealing cover 160 together enclose a receiving cavity 164 to receive the optical emission component 130, thereby realizing the packaging of the optical emission component 130.

[0095] Specifically, the closed side wall 1232 is provided with a first limiting portion 12321 , and the sealing cover 160 is provided with a second limiting portion 161 . The first limiting portion 12321 cooperates with the second limiting portion 161 to limit the relative position between the sealing cover 160 and the closed side wall 1232 .

[0096] The first limiting portion 12321 may be a positioning hole, and the second limiting portion 161 may be a positioning column, so as to realize the positioning of the sealing cover 160 and the closed side wall 1232. However, the present invention is not limited thereto, and may also be other positioning structures.

[0097] In the present application, the first limiting portion 12321 cooperates with the second limiting portion 161 to fix the relative position between the sealing cover 160 and the closed side wall 1232, thereby facilitating the fixed connection between the sealing cover 160 and the closed side wall 1232 and improving the assembly efficiency of the optical module 100.

[0098] In one embodiment, the sealing cover 160 and the closed side wall 1232 are bonded by a sealant, so as to realize a quick connection and fixation between the sealing cover 160 and the closed side wall 1232 , thereby improving the assembly efficiency of the optical module 100 .

[0099] For details, please refer to Figure 3 and Figure 5 The sealing cover 160 is provided with an exhaust hole 162 , which communicates the receiving cavity 164 with the outside of the sealing cover 160 .

[0100] It is understandable that since the sealing cover 160 and the closed side wall 1232 are bonded with sealant, the sealant needs to be baked, and moisture and volatiles will be generated during the baking of the sealant. If the moisture and volatiles are not discharged in time, they may affect the light emitting assembly 130. Therefore, in the present application, an exhaust hole 162 is provided on the sealing cover 160 so that the gas generated during the baking of the sealant can be discharged from the exhaust hole 162 to eliminate the effect of the gas on the light emitting assembly 130.

[0101] Furthermore, the exhaust hole 162 is provided with a sealant (not shown) to seal the exhaust hole 162, so that after the sealant is baked, the exhaust hole 162 can be blocked by the sealant to ensure that the light emitting assembly 130 is isolated from the external environment.

[0102] In one embodiment, please refer to Figure 3 The sealing cover 160 is provided with an avoidance groove 163 at the top in the first direction Z, and the avoidance groove 163 is used to avoid the optical fiber of the second optical fiber array, so that the overall structure of the optical module 100 is compact and suitable for the miniaturized design of the optical module 100.

[0103] Among them, the number of the above-mentioned avoidance grooves 163 can be specifically set according to the number of optical fibers in the second optical fiber array. For example, when there is only one second optical fiber array, only one avoidance groove 163 is set on the sealing cover 160; when there are multiple second optical fiber arrays, multiple avoidance grooves 163 are set on the sealing cover 160 to avoid each optical fiber array respectively.

[0104] To summarize, in the present application, the heat dissipation portion 121 and the first connecting portion 122 of the substrate 120 are staggered and the first connecting portion 122 is connected to the first surface 111 of the main circuit board 110, so that there are more areas on the second surface 112 of the main circuit board 110 for installing high-heat generating electronic components, thereby optimizing the overall layout of the electronic components on the main circuit board 110, improving the integration of the optical module, and optimizing the overall heat dissipation performance of the main circuit board 110; at the same time, the optical emission component 130 is arranged on the heat dissipation portion 121, and the heat dissipation portion 121 of the substrate 120 is used to dissipate the heat generated by the optical emission component 130, thereby improving the heat dissipation efficiency of the optical emission component, eliminating the influence of heat on the working performance of the optical emission component, and ultimately improving the heat dissipation performance of the optical module.

[0105] The introduction provided in the above steps is only used to help understand the method, structure and core idea of ​​the present application. For ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An optical module having a first direction, characterized in that: include: A main circuit board, the main circuit board having a first surface and a second surface arranged opposite to each other in the first direction; A substrate, the substrate comprising: a first connection portion, a second connection portion and a heat dissipation portion, at least part of the first connection portion is connected to the first surface of the main circuit board, the heat dissipation portion is arranged in a direction toward the second surface from the first direction and is offset from the first connection portion, and the heat dissipation portion is connected to the first connection portion through the second connection portion; the heat dissipation portion has a bearing surface and a heat dissipation surface arranged opposite to each other in the first direction, and the heat dissipation surface is in the same direction as the second surface; and The optical emission component is arranged on the bearing surface of the heat dissipation part, the optical emission component is electrically connected to the main circuit board, and the optical emission component is used to convert the electrical signal into an optical signal for output.

2. The optical module according to claim 1, wherein: Also includes: A sub-circuit board, one end of which is overlapped on the second surface of the main circuit board and electrically connected to the transmitting end trace of the second surface of the main circuit board, and the other end is electrically connected to the optical transmitting component, and the optical transmitting component is electrically connected to the transmitting end trace of the second surface through the sub-circuit board.

3. The optical module according to claim 2, characterized in that The second connection portion extends along the first direction; a connecting hole is formed on the second connection portion, and at least a portion of the sub-circuit board passes through the connecting hole and is electrically connected to the light emitting component.

4. The optical module according to claim 2, characterized in that: The second connection portion includes two connection columns, each of which extends along the first direction, one end of each connection column is connected to the first connection portion, and the other end of each connection column is connected to the heat dissipation portion; One end of the sub-circuit board is passed through between the two connecting posts to electrically connect the light emitting component.

5. The optical module according to claim 1, wherein: The first connecting portion is provided with a receiving opening; The optical module also includes a light receiving component, which is arranged on the first surface of the main circuit board and accommodated in the receiving port. The light receiving component is electrically connected to the main circuit board and is used to receive optical signals outside the optical module and convert them into electrical signals for transmission to the main circuit board.

6. The optical module according to claim 1, wherein: The optical module further includes a light receiving component, which is disposed on the first surface of the main circuit board and is electrically connected to the main circuit board; the light receiving component is used to receive an optical signal outside the optical module and convert it into an electrical signal for transmission to the main circuit board; The first connecting portion includes at least two connecting arms, the two connecting arms are arranged oppositely on two sides of the light receiving component, and one end of the connecting arm is connected to the second connecting portion.

7. The optical module according to claim 6, characterized in that: The first connecting portion further includes a crossbeam, and two ends of the crossbeam are respectively connected to two adjacent connecting arms; The crossbeam includes a first crossbeam located at one side of the light receiving component, or includes a first crossbeam and a second crossbeam located at two opposite sides of the light receiving component, and at least one of the crossbeams is fixedly connected to the first surface of the main circuit board.

8. The optical module according to claim 7, characterized in that: The first crossbeam is located on a side of the light receiving component close to the light emitting component; The optical module further comprises a first optical fiber array and a second optical fiber array, wherein the first optical fiber array is located on the bearing surface of the heat dissipation portion and is used to transmit the optical signal output by the optical emitting assembly to the outside of the optical module; The second optical fiber array is disposed on the first beam, and is used to transmit the optical signal outside the optical module to the optical receiving component.

9. The optical module according to any one of claims 5 to 8, characterized in that: The substrate is an integrally formed heat-conducting heat sink, and the first connecting portion is thermally connected to the main circuit board.

10. The optical module according to claim 1, wherein: Also includes: The sealing cover is connected to the heat dissipation part. The sealing cover and the heat dissipation part are enclosed to form a receiving cavity. The light emitting component is received in the receiving cavity.

11. The optical module according to claim 10, characterized in that: The second connecting portion includes a closed side wall, which extends along the first direction. The bottom of the closed side wall along the first direction is connected to the bearing surface of the heat dissipation portion. The top of the closed side wall along the first direction is used to support the sealing cover. The bearing surface, the closed side wall and the sealing cover enclose the receiving cavity.

12. The optical module according to claim 11, characterized in that: The closed side wall is provided with a first limiting portion, and the sealing cover is provided with a second limiting portion. The first limiting portion cooperates with the second limiting portion to limit the relative position between the sealing cover and the closed side wall.

13. The optical module according to claim 11, wherein: The sealing cover and the closed side wall are bonded by a sealant; The sealing cover is provided with an exhaust hole, the exhaust hole communicates with the receiving cavity and the outside of the sealing cover, and the exhaust hole is provided with a sealing member to seal the exhaust hole.

14. The optical module according to claim 11, characterized in that: The optical module further comprises an optical receiving assembly, a first optical fiber array and a second optical fiber array; the optical receiving assembly is arranged on the first surface of the main circuit board and is electrically connected to the main circuit board; the first optical fiber array is located on the bearing surface of the heat dissipation portion, and is arranged on a side of the optical transmitting assembly relatively far from the first connecting portion, and is used to transmit the optical signal output by the optical transmitting assembly to the outside of the optical module; the second optical fiber array is arranged on the first connecting portion, and is used to transmit the optical signal outside the optical module to the optical receiving assembly; The closed side walls are respectively located on both sides of the first optical fiber array, the sealing cover is arranged on the closed side walls and the first optical fiber array, and the bearing surface, the closed side walls, the first optical fiber array and the sealing cover together enclose the receiving cavity; The sealing cover is provided with an escape groove at the top in the first direction, and the escape groove is used to escape the optical fibers of the second optical fiber array.

15. The optical module according to claim 2, characterized in that: The optical module further includes a control chip and a power chip, wherein the control chip and the power chip are both disposed on the second surface of the main circuit board, and the control chip and the power chip are both electrically connected to the main circuit board; The optical transmission component includes: a laser chip, a coupling lens and a chip substrate; the chip substrate is arranged on the bearing surface of the heat dissipation part and is electrically connected to the sub-circuit board, the laser chip is arranged on the chip substrate and is electrically connected to the chip substrate, and is electrically connected to the main circuit board via the chip substrate and the sub-circuit board, and the coupling lens is located on the light output side of the laser chip and is used to couple the optical signal output by the laser chip.

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