Backlight heat dissipation structure
By using a combination of aluminum substrate and aluminum castings in the backlight, combined with thermal glue and other optical films, the problem of LED heat accumulation is solved, and effective heat dissipation and optical performance improvement is achieved.
Patent Information
- Application Number
- CN202420330390.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-21
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-21
AI Technical Summary
In backlights using Local Dimming technology, LEDs are large in number and closely arranged, which leads to easy accumulation of heat, which may cause short circuit risk.
Aluminum substrate is used as PCB board and aluminum castings as brackets, combined with thermally conductive glue to form an effective heat dissipation path, ensuring that heat is transmitted to the bracket through PCB board and thermally conductive glue, avoiding heat accumulation, and optimized through diffusion plate, light-enhancing film and reflective film. Light transmittance and heat dissipation effect.
Effectively prevent heat accumulation, reduce the risk of short circuit, and improve the heat dissipation efficiency and light transmittance of the backlight.
Smart Images
Figure CN222213153U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, in particular to a backlight heat dissipation structure. Background Art
[0002] Local Dimming is a regional dimming technology that can independently control the backlight brightness or color of a specified area, and can also modulate the control signal of the LCD display, effectively saving power consumption and improving contrast while maintaining image brightness.
[0003] In the related art, the LEDs in the backlight using the Local Dimming technology are large in number and arranged closely, which easily leads to heat accumulation. Utility Model Content
[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a backlight heat dissipation structure which can effectively dissipate the backlight and prevent heat accumulation.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] The first aspect of the present application provides a backlight heat dissipation structure, comprising: a bracket and a heat-conducting component, the heat-conducting component comprising a PCB board, an LED lamp and a thermally conductive adhesive, the LED lamp is arranged on the PCB board, one end of the thermally conductive adhesive is connected to the PCB board, and the other end of the thermally conductive adhesive is connected to the bracket.
[0007] The PCB board is an aluminum substrate.
[0008] The bracket is an aluminum casting.
[0009] The invention also comprises a diffusion plate, wherein the diffusion plate is arranged at the opening position of the bracket.
[0010] It also includes a diffusion film, which is arranged on the diffusion plate.
[0011] It also includes a first brightness enhancement film, which is arranged on the diffusion film.
[0012] It also includes a second brightness enhancement film, which is arranged on the first brightness enhancement film.
[0013] The diffusion plate and the bottom of the bracket form a heat dissipation cavity.
[0014] It also includes a colloid, which is arranged on the PCB board.
[0015] The invention also comprises a reflective film, wherein the reflective film is arranged on the colloid.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] By setting a PCB board, a bracket and a thermal conductive adhesive, wherein the bracket is an aluminum casting and the PCB board is an aluminum substrate, the heat generated by the LED lamp passes through the PCB board, the thermal conductive adhesive, and finally is discharged to the bracket, thereby effectively preventing heat accumulation and avoiding the risk of short circuit. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 It is a structural schematic diagram of a backlight heat dissipation structure in one embodiment of the utility model. DETAILED DESCRIPTION
[0020] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0022] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] In the related art, the LEDs in the backlight using the Local Dimming technology are large in number and arranged closely, which easily leads to heat accumulation.
[0024] In view of the above problems, the embodiments of the present application provide a backlight heat dissipation structure, which can effectively dissipate the heat of the backlight and prevent heat accumulation.
[0025] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.
[0026] See also Figure 1 A backlight heat dissipation structure includes: a bracket 100 and a heat-conducting component 200, the heat-conducting component 200 includes a PCB board 210, an LED lamp 220 and a heat-conducting adhesive 230, the LED lamp 220 is arranged on the PCB board 210, one end of the heat-conducting adhesive 230 is connected to the PCB board 210, and the other end of the heat-conducting adhesive 230 is connected to the bracket 100.
[0027] It should be noted that the PCB board 210 is an aluminum substrate, and the bracket 100 is an aluminum casting. The aluminum substrate has good thermal conductivity and can carry higher currents than traditional circuit boards; and the aluminum casting has higher strength and better thermal conductivity than traditional aluminum sheet metal parts. In this way, by setting the PCB board 210, the bracket 100 and the thermal conductive adhesive 230, wherein the bracket 100 is an aluminum casting and the PCB board 210 is an aluminum substrate, the heat generated by the LED lamp 220 passes through the PCB board and the thermal conductive adhesive, and finally is discharged to the bracket 100, thereby effectively preventing heat accumulation and avoiding the risk of short circuit.
[0028] See also Figure 1 In one embodiment, a diffuser plate 300 is further included, and the diffuser plate 300 is disposed at the opening position of the bracket 100. It should be noted that the diffuser plate 300 plays a role in improving light transmittance.
[0029] See also Figure 1 In one embodiment, a diffusion film 400 is further included, and the diffusion film 400 is disposed on the diffusion plate 300 .
[0030] It should be noted that the diffusion film 400 plays a role in correcting the diffusion angle, which will increase the light radiation area.
[0031] See also Figure 1 In one embodiment, the first brightness enhancement film 500 is further included, and the first brightness enhancement film 500 is disposed on the diffusion film 400. Specifically, the second brightness enhancement film 600 is further included, and the second brightness enhancement film 600 is disposed on the first brightness enhancement film 500.
[0032] It should be noted that the brightness enhancement film is used to increase the brightness and is assembled in front of the backlight source.
[0033] See also Figure 1In one embodiment, the diffuser 300 and the bottom of the bracket 100 form a heat dissipation cavity 700. It should be noted that by providing the heat dissipation cavity 700, it is possible to avoid heat accumulation around the LED lamp 220, and the heat can be dissipated into the heat dissipation cavity 700 and conducted through the bracket 100, thereby playing a role in auxiliary heat dissipation.
[0034] See also Figure 1 In one embodiment, the colloid 800 is further included, and the colloid 700 is disposed on the PCB board 210. Figure 1 In one embodiment, a reflective film 900 is further included, and the reflective film 800 is disposed on the colloid 800 .
[0035] It should be noted that the colloid 800 is a double-sided adhesive, which is used to fix the reflective film on the PCB board 210. The reflective film 900 plays a role in improving the reflectivity of light.
[0036] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.
[0037] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A backlight heat dissipation structure, characterized in that: include: Bracket; and The heat-conducting component comprises a PCB board, an LED lamp and a heat-conducting adhesive, wherein the LED lamp is arranged on the PCB board, one end of the heat-conducting adhesive is connected to the PCB board, and the other end of the heat-conducting adhesive is connected to the bracket.
2. The backlight heat dissipation structure according to claim 1, characterized in that: The PCB board is an aluminum substrate.
3. The backlight heat dissipation structure according to claim 1, characterized in that: The bracket is an aluminum casting.
4. The backlight heat dissipation structure according to claim 1, characterized in that: The invention also comprises a diffusion plate, wherein the diffusion plate is arranged at the opening position of the bracket.
5. The backlight heat dissipation structure according to claim 4, characterized in that: It also includes a diffusion film, which is arranged on the diffusion plate.
6. The backlight heat dissipation structure according to claim 5, characterized in that: It also includes a first brightness enhancement film, which is arranged on the diffusion film.
7. The backlight heat dissipation structure according to claim 6, characterized in that: It also includes a second brightness enhancement film, which is arranged on the first brightness enhancement film.
8. The backlight heat dissipation structure according to claim 6, characterized in that: The diffusion plate and the bottom of the bracket form a heat dissipation cavity.
9. The backlight heat dissipation structure according to claim 8, characterized in that: It also includes a colloid, and the colloid is arranged on the PCB board.
10. The backlight heat dissipation structure according to claim 9, characterized in that: The invention also comprises a reflective film, wherein the reflective film is arranged on the colloid.