Immersed liquid cooling server
By introducing temperature and flow sensors into the server, dynamic regulation between the immersion liquid cooling server and the immersion cabinet is achieved, and the problems of low efficiency and operation and maintenance in the existing technology are solved, and energy utilization and energy efficiency are improved .
Patent Information
- Application Number
- CN202323387468.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-12
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2033-12-12
AI Technical Summary
The existing server architecture is suitable for air-cooling and heat dissipation, making it difficult to achieve the optimal efficiency of immersion liquid cooling, and is not suitable for liquid cooling deployment in network interconnection and power supply, resulting in less obvious energy-saving and emission reduction effects of liquid cooling technology.
Design an immersion liquid-cooled server. The server body is immersed in liquid and is equipped with a temperature sensor and a flow sensor. The sensor communicates with the server body to control the liquid flow rate and monitor the flow rate parameters to realize the temperature and flow rate between the server and the immersion cabinet. Regulation.
By dynamically adjusting the heat dissipation load, we can improve energy utilization, achieve better energy efficiency, and simplify the operation and maintenance process.
Smart Images

Figure CN222213294U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid cooling servers, in particular to an immersion liquid cooling server. Background Art
[0002] There is a big difference in form between the immersion liquid cooling cabinet and the existing air cooling cabinet. At the current stage, the server architecture is still suitable for air cooling. When adapted to the immersion liquid cooling characteristics, the heat dissipation cannot reach the optimal efficiency point, resulting in a waste of resources. At the same time, it is not suitable for immersion liquid cooling deployment maintenance in terms of network interconnection and power supply, resulting in the energy saving and emission reduction effect of liquid cooling technology is not obvious. Utility Model Content
[0003] In view of this, an object of the present invention is to provide an immersion liquid cooling server to alleviate the above technical problems.
[0004] In a first aspect, an embodiment of the utility model provides an immersion liquid-cooled server, comprising: a server body, and an immersion cabinet; wherein the server body is immersed in the liquid of the immersion cabinet; the immersion cabinet is configured with a first temperature sensor and a flow sensor, and the first temperature sensor and the flow sensor communicate with the server body; the first temperature sensor is used to detect the temperature parameter of the liquid level in the immersion cabinet, and transmit the temperature parameter to the server body; the flow sensor is used to detect the flow rate parameter of the liquid in the immersion cabinet, and transmit the flow rate parameter to the server body; the server body is used to control the flow rate of the liquid according to the temperature parameter, and monitor the flow rate of the liquid through the flow rate parameter.
[0005] In combination with the first aspect, an embodiment of the utility model provides a first possible implementation of the first aspect, wherein the above-mentioned server body includes multiple functional modules, and the functional modules include a motherboard module, and a storage module, an IO module, a PCIE module, and a PSU module connected to the motherboard module; wherein the first temperature sensor and the flow sensor of the immersion cabinet communicate with the BMC control component of the motherboard module.
[0006] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a second possible implementation of the first aspect, wherein the above-mentioned immersion cabinet includes a shell matching each of the functional modules; the functional modules are arranged in a cavity formed by the shell.
[0007] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a third possible implementation of the first aspect, wherein the IO module is arranged on the front side of the server body in a front-placed manner.
[0008] In combination with the third possible implementation of the first aspect, an embodiment of the utility model provides a fourth possible implementation of the first aspect, wherein the above-mentioned storage module, the IO module, the PCIE module and the PSU module are connected to the mainboard module through an onboard interface.
[0009] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a fifth possible implementation of the first aspect, wherein the above-mentioned immersion cabinet is provided with a signal receiver; the signal receiver communicates with the BMC control component of the mainboard module; the signal receiver is also connected to the first temperature sensor and the flow sensor of the immersion cabinet to receive the temperature parameters and the flow rate parameters, and send the temperature parameters and the flow rate parameters to the BMC control component of the mainboard module.
[0010] In combination with the fifth possible implementation of the first aspect, the embodiment of the utility model provides a sixth possible implementation of the first aspect, wherein the signal receiver communicates with the first temperature sensor and the flow sensor using an I2C protocol interface.
[0011] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a seventh possible implementation of the first aspect, wherein the above-mentioned immersion cabinet is also equipped with a power supply copper busbar; the PSU module is connected to the power supply copper busbar.
[0012] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides an eighth possible implementation of the first aspect, wherein the above-mentioned server body is also configured with a second temperature sensor corresponding to the functional module; the second temperature sensor is used to detect the temperature parameters of the functional module and transmit the temperature parameters of the functional module to the server body; the server body is used to control the flow rate of the liquid according to the temperature parameters of the functional module and the temperature parameters of the liquid level in the immersion cabinet.
[0013] In combination with the eighth possible implementation of the first aspect, an embodiment of the utility model provides a ninth possible implementation of the first aspect, wherein the second temperature sensor includes temperature probes corresponding to the mainboard module, the storage module, the IO module, the PCIE module and the PSU module, respectively, to detect the temperature parameters of each functional module.
[0014] In a second aspect, an embodiment of the utility model provides a data center, which is equipped with the immersion liquid cooling server described in the first aspect.
[0015] The embodiments of the present invention bring the following beneficial effects:
[0016] The immersion liquid cooling server provided by the embodiment of the utility model includes a server body and an immersion cabinet; wherein the server body is immersed in the liquid of the immersion cabinet, and a first temperature sensor and a flow sensor are configured in the immersion cabinet, and both the first temperature sensor and the flow sensor communicate with the server body; the first temperature sensor is used to detect the temperature parameter of the liquid level in the immersion cabinet, and transmit the temperature parameter to the server body; the flow sensor is used to detect the flow rate parameter of the liquid in the immersion cabinet, and transmit the flow rate parameter to the server body; so that the server body can control the flow rate of the liquid according to the temperature parameter, and monitor the flow rate of the liquid through the flow rate parameter, and since the server body can obtain the temperature parameter and flow rate parameter of the liquid in the immersion cabinet, the control system of the immersion cabinet can be connected to the server body, and the server body can realize the regulation of the temperature and flow rate of the immersion cabinet, thereby realizing the dynamic adjustment of the heat dissipation load between the server body and the immersion cabinet, which can not only improve the energy utilization rate, but also achieve a better energy efficiency effect.
[0017] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures specifically pointed out in the description, claims and drawings.
[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are some implementation methods of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 A structural block diagram of an immersion liquid cooling server provided by an embodiment of the utility model;
[0021] Figure 2 A structural block diagram of a server body provided by an embodiment of the utility model;
[0022] Figure 3 A cross-sectional view of a server body provided by an embodiment of the utility model;
[0023] Figure 4 A schematic diagram of a PSU module provided by an embodiment of the utility model;
[0024] Figure 5 A schematic diagram of a signal receiver provided in an embodiment of the utility model.
[0025] Figure numerals: 100 - server body; 200 - immersion cabinet; 201 - first temperature sensor; 202 - flow sensor; 101 - mainboard module; 102 - storage module; 103 - IO module; 104 - PCIE module; 105 - PSU module; 301 - Busbar interface; 401 - communication interface female head. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0027] At present, in addition to using air cooling to dissipate heat, servers in data centers also use immersion liquid cooling technology to dissipate heat in order to achieve the goal of energy conservation and emission reduction.
[0028] However, in the currently used immersion liquid cooling technology, the server and the liquid cooling circulation system are often set up separately, resulting in the flow rate and inlet temperature of the liquid in the immersion cabinet being unable to achieve a dynamic heat dissipation balance with the components in the server.
[0029] Based on this, an immersion liquid cooling server provided in an embodiment of the utility model can effectively alleviate the above-mentioned technical problems.
[0030] To facilitate understanding of this embodiment, an immersion liquid cooling server disclosed in an embodiment of the utility model is first introduced in detail.
[0031] In one possible implementation, an embodiment of the utility model provides an immersion liquid-cooled server, wherein the immersion liquid-cooled server is a new type of server based on immersion liquid cooling technology. This new type of server generally includes a server immersed in a special liquid, which immerses the entire server in a special liquid with a high boiling point, insulation, and non-corrosiveness, and then uses the liquid as a medium to carry away the heat generated by electronic components such as the CPU, memory stick, chipset, and expansion card in the server during operation through the heat exchange generated by the flow of liquid.
[0032] Based on the above implementation principle, the immersion liquid cooling server provided in the embodiment of the utility model includes: a server body and an immersion cabinet; wherein the server body is immersed in the liquid of the immersion cabinet.
[0033] For ease of understanding, Figure 1 The structure block diagram of an immersion liquid cooling server is shown, which includes a server body 100 and an immersion cabinet 200 .
[0034] Further, if Figure 1 As shown, the immersion cabinet 200 in the embodiment of the present invention is configured with a first temperature sensor 201 and a flow sensor 202 , and the first temperature sensor 201 and the flow sensor 202 communicate with the server body 100 .
[0035] Specifically, the first temperature sensor 201 is used to detect the temperature parameters of the liquid level in the immersion cabinet 200 and transmit the temperature parameters to the server body 100; the flow sensor 202 is used to detect the flow rate parameters of the liquid in the immersion cabinet 200 and transmit the flow rate parameters to the server body 100.
[0036] The server body 100 is used to control the flow rate of the liquid according to the temperature parameter, and to monitor the flow rate of the liquid through the flow rate parameter.
[0037] In actual use, the immersion liquid cooling server in the embodiment of the utility model refers to the server in the data center, wherein the server in the data center is also called IDC (Internet Data Center) server. Generally, the services provided by the server in the data center can be roughly divided into four types: hosting, resource leasing, value-added services, and application services. Therefore, the server in the data center generally has a significant configuration expansion compared to the standard server. For example, the hard disk will be filled up and the memory will also be greatly increased. Therefore, it is necessary to configure a better heat dissipation function.
[0038] Therefore, in the embodiment of the utility model, an immersion liquid cooling server is adopted, the server body is immersed in the immersion cabinet, and the immersion liquid cooling technology is used to realize the heat dissipation of the server body.
[0039] Furthermore, the immersion cabinet in the embodiment of the utility model is also called an immersion liquid cooling cabinet, which generally includes a main cabinet, and a heat exchange unit, a liquid system and a detection component configured on the main cabinet, wherein the liquid in the immersion cabinet is also called a refrigerant, the heat exchange unit includes a circulation pump, and is supplemented by valves, pipelines, etc., and the detection component is set based on valves or pipelines. The above-mentioned first temperature sensor and flow sensor in the embodiment of the utility model both belong to the detection component.
[0040] Specifically, in the immersion liquid cooling server in the embodiment of the utility model, in order to achieve better heat dissipation effect and realize the purpose of energy conservation and emission reduction, the first temperature sensor and flow sensor of the immersion cabinet communicate with the server body, so that the server body can control the flow rate of the liquid according to the temperature parameters, and monitor the flow rate of the liquid through the flow rate parameters. Moreover, since the server body can obtain the temperature parameters and flow rate parameters of the liquid in the immersion cabinet, the control system of the immersion cabinet can be connected to the server body, and the temperature and flow rate of the immersion cabinet can be regulated by the server body, thereby realizing the function of dynamic adjustment of the heat dissipation load between the server body and the immersion cabinet, which can not only improve the energy utilization rate, but also achieve better energy efficiency.
[0041] In actual use, in order to realize the service functions of the data center, the server body usually includes multiple functional modules, specifically, Figure 2 A structural block diagram of a server body is shown, wherein the functional modules in the embodiment of the utility model include a mainboard module 101, and a storage module 102, an IO module 103, a PCIE (Peripheral Component Interconnect Express) module 104 and a PSU (Power Supply Unit) module 105 connected to the mainboard module 101; that is, in the embodiment of the utility model, the main functions of the server body are modularized, therefore, the immersion liquid cooling server in the embodiment of the utility model is actually a modular immersion liquid cooling server.
[0042] Moreover, in the immersion liquid cooling server, the number of each functional module can be further set according to the actual usage, such as Figure 2 Two storage modules 102 and two PCIE modules 104 are shown in the figure. The specific number can also be set according to actual usage, and the embodiment of the utility model does not limit this.
[0043] Further, based on the above Figure 2 In the server body shown, the first temperature sensor and flow sensor of the immersion cabinet communicate with the BMC control component of the mainboard module 101 .
[0044] In actual use, the above-mentioned storage module motherboard module is usually the core control module of the server body. Therefore, a BMC control component is configured in the motherboard module as the board-level management controller of the server body; the above-mentioned storage module constitutes the memory of the server body and can be expanded according to actual usage requirements; the above-mentioned IO module is used to provide multiple communication interfaces of the server body, such as providing an external access interface of the IPMI protocol, etc.; the above-mentioned PCIE module is used to adopt a high-speed serial computer expansion bus standard to achieve high-speed data transmission of the server body; the above-mentioned PSU module communicates with the external power supply system to obtain electrical energy to power the server body.
[0045] Furthermore, in order to achieve heat dissipation for the above-mentioned functional modules, in an embodiment of the utility model, the above-mentioned immersion cabinet includes a shell matching each functional module; each functional module is arranged in a cavity formed by the corresponding shell, that is, the large cavity of the immersion cabinet is divided into multiple small cavities by the shell, and each cavity corresponds to a liquid pipeline for dissipating heat for each functional module.
[0046] Furthermore, considering that the frequency of replacement and maintenance of the IO module is relatively high, in an embodiment of the utility model, the above-mentioned IO module is arranged on the front side of the server body in a front-placed manner. After being coupled with the immersion cabinet, it can be easily maintained and avoids frequently lifting the server body out of the immersion cabinet, which can help improve the efficiency of operation and maintenance.
[0047] For ease of understanding, Figure 3 A cross-sectional view of a server body is also shown, wherein the outermost layer is equivalent to the immersed cabinet 200, and, Figure 3 In the figure, the method of pre-setting multiple communication interfaces of the IO module 103 is shown, which is convenient for use, replacement and maintenance.
[0048] Furthermore, in the embodiment of the utility model, the above-mentioned storage module, IO module, PCIE module and PSU module are connected to the mainboard module via an onboard interface. At the same time, the onboard interface can also be used for interconnection between the modules to reduce the use of cable. At the same time, the modular functional modules in the embodiment of the utility model can effectively reduce the resistance to liquid flow in the immersion cabinet and the overall size of the server body. At the same time, the use of liquid is saved, which helps to achieve the purpose of energy conservation and emission reduction.
[0049] Furthermore, in order to facilitate the coupling between the server body and the immersion cabinet, in the embodiment of the utility model, the immersion cabinet is also equipped with a power supply copper busbar; the PSU module of the server body is connected to the power supply copper busbar. Specifically, the power supply copper busbar is also called a Busbar interface, one end of which is connected to the external power supply system, and the other end is connected to the PSU module, so as to transmit the power of the external power supply system to the server body, thereby supplying power to the server body. Specifically, Figure 3 The figure also shows a Busbar interface 301, which can be arranged together with the IO interface and arranged on the server body in a front-end arrangement.
[0050] and, Figure 4 A schematic diagram of a PSU module is also shown, wherein: Figure 4 In the figure, a communication interface female connector 401 corresponding to the busbar interface 301 is also shown. In actual use, the position of the busbar interface 301 is usually fixed, and the busbar interface 301 needs to be coupled with the immersion cabinet. The PSU module is usually connected to the busbar interface of the immersion cabinet using a clip connector to power the server body.
[0051] Furthermore, the server body in the embodiment of the utility model is also configured with a second temperature sensor corresponding to the functional module; the second temperature sensor is used to detect the temperature parameters of the functional module and transmit the temperature parameters of the functional module to the server body; the above-mentioned server body is used to control the flow rate of the liquid according to the temperature parameters of the functional module and the temperature parameters of the liquid level in the immersion cabinet.
[0052] In actual use, the above-mentioned second temperature sensor can be equipped with multiple temperature probes, such as temperature probes corresponding to each functional module. Specifically, it can include temperature probes corresponding to the mainboard module, storage module, IO module, PCIE module and PSU module, respectively, to detect the temperature parameters of each functional module and transmit them to the server body.
[0053] Furthermore, in order to enable the server body to obtain the temperature parameters and flow rate parameters of the liquid level in the immersion cabinet, the immersion cabinet in the embodiment of the utility model is provided with a signal receiver; the signal receiver communicates with the BMC control component of the mainboard module of the server body; and the signal receiver is also connected to the first temperature sensor and flow sensor of the immersion cabinet to receive the above-mentioned temperature parameters and flow rate parameters, and send the temperature parameters and flow rate parameters to the BMC control component of the mainboard module.
[0054] In actual use, the signal receiver is equivalent to a signal collection module. As a signal transmission medium, it transmits the temperature parameters and flow rate parameters of the liquid level in the immersion cabinet to the BMC control component of the server body, and finally enables the BMC control component of the server body to control the flow rate of the liquid based on the temperature parameters of the functional module and the temperature parameters of the liquid level in the immersion cabinet, that is, dynamically control and adjust the liquid flow according to the load conditions of the server body.
[0055] In specific implementation, the above-mentioned signal receiver is usually provided with a micro control unit MCU to realize data transmission between the server body and the immersion cabinet.
[0056] Furthermore, the signal receiver in the embodiment of the present invention communicates with the first temperature sensor and the flow sensor using an I2C protocol interface.
[0057] For ease of understanding, Figure 5 A schematic diagram of a signal receiver is shown, wherein only the microcontroller unit MCU of the signal receiver is used for illustration. Figure 5 Only the MCU and the connection diagram of the MCU with the first temperature sensor, flow sensor and BMC control component are shown.
[0058] Specifically, Figure 5 The figure shows a first temperature sensor 201, a flow sensor 202, and a BMC1 pin and a BMC2 pin connected to the BMC control component, wherein the BMC1 pin and the BMC2 pin correspond to different data interfaces on the BMC control component, respectively, to transmit the temperature parameters and flow rate parameters of the liquid level in the above-mentioned immersion cabinet.
[0059] Further, based on the above Figure 2 to Figure 5 , the following is a detailed description of the implementation scheme of the immersion liquid cooling server:
[0060] (1) The server body in the immersion liquid cooling server can be divided into multiple functional modules, including IO module, storage module, motherboard module, PCIE module and PSU module. The IO module, storage module, PCIE module, PSU module and motherboard module are usually connected by onboard connection, which can realize flexible position interchange and CPU LAN allocation of BMC control components as needed, thereby improving configuration flexibility.
[0061] (2) Furthermore, the position of the above-mentioned PSU module is relatively fixed, and needs to be coupled with the immersion cabinet. Usually, the PSU module is connected to the busbar interface of the immersion cabinet using a clip connector, and the above-mentioned PSU module usually includes a female connector of the communication interface.
[0062] (3) The first temperature sensor and flow sensor in the immersion cabinet communicate with the server body, that is, Figure 5 As shown, in the server body, the BMC control component of the mainboard module translates the parameters collected by the sensors in the immersion cabinet through the MCU of the signal receiver, such as temperature parameters, flow parameters, etc., and further, pressure parameters and liquid level parameters, etc., and the MCU of the signal receiver communicates with the sensors of the immersion cabinet through the I2C protocol interface.
[0063] (4) The server body controls the flow rate of the liquid in the immersion cabinet according to the temperature parameters of the above-mentioned functional modules and the temperature parameters of the liquid level in the immersion cabinet through a certain control strategy. For example, when the temperature of the BMC control component of the motherboard module reaches a high temperature, the server body can adjust the liquid flow rate and the heat exchange amount by controlling the speed of the circulation pump in the immersion cabinet, thereby dynamically adjusting to the optimal operating state according to the operating conditions of the server body. That is, the immersion cabinet is controlled by the server body, rather than separating the server and the immersion cabinet as in a traditional immersion liquid cooling server.
[0064] In summary, the immersion liquid cooling server provided by the embodiment of the utility model has the following beneficial effects:
[0065] (1) The overall size of the immersion liquid cooling server can be made smaller, saving the weight of the refrigerant and the immersion cabinet.
[0066] (2) The server body communicates with the submerged cabinet and adopts a new heat dissipation speed control strategy. According to the dynamic heat dissipation needs of the server body, the optimal energy saving of the system can be achieved. The heat dissipation load of the server body and the submerged cabinet can be dynamically adjusted, so that energy utilization is improved and energy efficiency is better.
[0067] (3) The server body adopts a modular design. The functional modules can be flexibly split and configured and can be flexibly replaced according to different scenarios and business needs. In addition, the functional modules are interconnected through onboard interfaces, reducing the use of cables, thereby reducing flow resistance and disturbance, allowing the liquid to fully remove heat from the heat source.
[0068] (4) The IO module is front-mounted, which is easy to maintain and also facilitates the deployment and operation of the submerged cabinet.
[0069] Furthermore, based on the above embodiments, an embodiment of the utility model also provides a data center, which is equipped with the immersion liquid cooling server provided in the above embodiments.
[0070] The data center provided by the embodiment of the utility model has the same technical features as the immersion liquid cooling server provided by the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.
[0071] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the data center described above can refer to the corresponding process in the aforementioned embodiment, and will not be repeated here.
[0072] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0073] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0074] Finally, it should be noted that the above embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.
Claims
1. An immersion liquid cooling server, characterized in that: The immersion liquid cooling server comprises: a server body and an immersion cabinet; wherein the server body is immersed in the liquid of the immersion cabinet; The immersion cabinet is configured with a first temperature sensor and a flow sensor, the first temperature sensor and the flow sensor being in communication with the server body; The first temperature sensor is used to detect the temperature parameter of the liquid level in the immersion cabinet and transmit the temperature parameter to the server body; The flow sensor is used to detect the flow rate parameters of the liquid in the immersion cabinet and transmit the flow rate parameters to the server body; The server body is used to control the flow rate of the liquid according to the temperature parameter, and to monitor the flow rate of the liquid through the flow rate parameter.
2. The immersion liquid cooling server according to claim 1, characterized in that: The server body includes a plurality of functional modules, wherein the functional modules include a mainboard module, and a storage module, an IO module, a PCIE module, and a PSU module connected to the mainboard module; Wherein, the first temperature sensor and the flow sensor of the immersion cabinet communicate with the BMC control component of the mainboard module.
3. The immersion liquid cooling server according to claim 2, characterized in that: The immersion cabinet includes a shell matching each of the functional modules; The functional module is arranged in a cavity formed by the shell.
4. The immersion liquid cooling server according to claim 2, characterized in that: The IO module is arranged on the front side of the server body in a front-end arrangement manner.
5. The immersion liquid cooling server according to claim 4, characterized in that: The storage module, the IO module, the PCIE module and the PSU module are connected to the mainboard module via an onboard interface.
6. The immersion liquid cooling server according to claim 2, characterized in that: The immersion cabinet is provided with a signal receiver; the signal receiver communicates with the BMC control component of the mainboard module; The signal receiver is also connected to the first temperature sensor and the flow sensor of the immersion cabinet to receive the temperature parameter and the flow rate parameter, and send the temperature parameter and the flow rate parameter to the BMC control component of the mainboard module.
7. The immersion liquid cooling server according to claim 6, characterized in that: The signal receiver communicates with the first temperature sensor and the flow sensor using an I2C protocol interface.
8. The immersion liquid cooling server according to claim 2, characterized in that: The immersion cabinet is also equipped with a power supply copper busbar; The PSU module is connected to the power supply copper busbar.
9. The immersion liquid cooling server according to claim 2, characterized in that: The server body is also configured with a second temperature sensor corresponding to the functional module; The second temperature sensor is used to detect the temperature parameters of the functional module and transmit the temperature parameters of the functional module to the server body; The server body is used to control the flow rate of the liquid according to the temperature parameters of the functional module and the temperature parameters of the liquid level in the immersion cabinet.
10. The immersion liquid cooling server according to claim 9, characterized in that: The second temperature sensor includes temperature probes corresponding to the mainboard module, the storage module, the IO module, the PCIE module and the PSU module, respectively, to detect temperature parameters of each functional module.
