Heat dissipation support and electronic equipment

Abstract

The utility model provides a heat dissipation support and electronic equipment, and relates to the technical field of electronic equipment. The heat dissipation support comprises a support body and a cooling component, the support body is provided with a containing space and comprises a first side and a second side which are opposite to each other, and the first side is used for supporting an electronic equipment body; the cooling part is arranged in the containing space and provided with a first face used for refrigeration and a second face opposite to the first face, and the first face faces the first side and is used for heat dissipation of the electronic equipment body.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation bracket and electronic equipment. Background Art

[0002] The heat dissipation capacity of a laptop will limit its performance, and an external stand that can effectively improve the heat dissipation effect of the laptop is what users need. However, the current heat dissipation stand has limited effect on improving the heat dissipation capacity of the laptop.

[0003] Therefore, how to significantly improve the heat dissipation performance of laptop computers through a heat dissipation bracket is a technical problem that urgently needs to be solved. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation bracket and an electronic device, which mainly provide the following technical solutions:

[0005] A first aspect of the present application provides a heat dissipation bracket and an electronic device, wherein the heat dissipation bracket includes a bracket body and a cooling component, wherein the bracket body has an accommodating space and includes a first side and a second side opposite to each other, wherein the first side is used to support the electronic device body; the cooling component is arranged in the accommodating space, and the cooling component has a first surface for cooling and a second surface arranged opposite to the first surface, wherein the first surface faces the first side and is used for heat dissipation of the electronic device body.

[0006] In some modified embodiments of the first aspect of the present application, the heat dissipation bracket also includes a supporting portion, which is arranged on the surface of the first side of the bracket body, and is used to support the electronic device body. The supporting portion is a strip structure and is semi-enclosed around the edge of the first side to form an air inlet area.

[0007] In some modified embodiments of the first aspect of the present application, the heat dissipation bracket also includes a first heat dissipation component, the first heat dissipation component includes a plurality of cooling fins, and the plurality of cooling fins are spaced apart on the first side of the bracket body; and\or, the second heat dissipation component includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are spaced apart on the second side of the bracket body.

[0008] In some modified implementations of the first aspect of the present application, a plurality of grooves are provided on the side of the cooling fin; and / or a plurality of grooves are provided on the side of the heat dissipation fin.

[0009] In some modified embodiments of the first aspect of the present application, the first side of the bracket body has a first air outlet, the second side of the bracket body has a second air outlet, and the side portion of the bracket body between the first side and the second side is provided with an air inlet; the heat dissipation bracket also includes: at least one first fan assembly, the first fan assembly is arranged in the accommodating space, and the air outlet of the first fan assembly faces the first surface; and\or, at least one second fan assembly, the second fan assembly is arranged in the accommodating space, and the air outlet of the second fan assembly faces the second surface.

[0010] In some modified embodiments of the first aspect of the present application, the cooling component includes at least one semiconductor refrigeration sheet and a thermal insulation sheet; the thermal insulation sheet is arranged in the accommodating space and has a thermal insulation hole adapted to at least one semiconductor refrigeration sheet so that the semiconductor refrigeration sheet can be installed in the corresponding thermal insulation hole, and the outer periphery of the thermal insulation sheet is connected to the inner wall of the bracket body.

[0011] In some modified embodiments of the first aspect of the present application, the first side of the bracket body and the second side of the bracket body have a first angle.

[0012] In some modified implementations of the first aspect of the present application, a wireless connection module is provided in the accommodating space for wireless connection with the electronic device body.

[0013] In some modified implementations of the first aspect of the present application, a Hall sensor is provided in the accommodating space for signal connection with the electronic device body.

[0014] A second aspect of the present application provides an electronic device, which includes a heat dissipation bracket, which is used to support the electronic device body and dissipate heat, and electrically interacts with the electronic device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0016] Figure 1 The overall structure of a heat dissipation bracket provided by the present disclosure is schematically shown;

[0017] Figure 2 A schematic diagram of a three-dimensional structure of a heat dissipation bracket provided by the present disclosure is schematically shown;

[0018] Figure 3 The schematic diagram of the three-dimensional structure of a heat dissipation bracket provided by the present disclosure is schematically shown at another angle;

[0019] Figure 4A partial enlarged schematic diagram of a cooling fin of a heat dissipation bracket provided by the present disclosure is schematically shown;

[0020] Figure 5 The following schematically shows an assembly structure diagram of a heat dissipation bracket provided by the present disclosure;

[0021] Figure 6 The internal structure diagram of a bracket body of a heat dissipation bracket provided by the present disclosure is schematically shown.

[0022] Description of Figure Numbers:

[0023] 1. Bracket body; 11. First side; 12. Second side; 2. Cooling component; 21. First surface; 22. Second surface; 3. Support portion; 4. Cooling fins; 5. Heat dissipation fins; 6. First air outlet; 7. Second air outlet; 8. Air inlet; 9. First fan assembly; 10. Second fan assembly; 13. Electronic device body; 14. Heat insulation sheet; A. First angle; 15. Control board. DETAILED DESCRIPTION

[0024] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0025] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0026] The heat dissipation of the existing electronic device body 13 is mainly carried out by fans to accelerate the air flow to take away the heat in the electronic device body 13. This heat dissipation method brings the wind into the electronic device at the same temperature as the surrounding environment. A solution is to provide the electronic device body 13 with cold air lower than the ambient temperature to quickly cool the electronic device and improve the heat dissipation capacity of the heat dissipation bracket for the notebook.

[0027] Embodiment 1

[0028] Reference Figure 1 -Attached Figure 6Embodiment 1 of the present application proposes a heat dissipation bracket, which includes: a bracket body 1, the bracket body 1 has a containing space, and includes a first side 11 and a second side 12 opposite to each other, the first side 11 is used to support an electronic device body 13; and a cooling component 2, arranged in the containing space, the cooling component 2 has a first surface 21 for cooling, and a second surface 22 arranged opposite to the first surface 21, the first surface 21 faces the first side 11, and is used for heat dissipation of the electronic device body 13.

[0029] Specifically, the heat dissipation bracket provided in this embodiment is at least used to support the electronic device body 13 and dissipate heat for the electronic device body 13. The structure of the heat dissipation bracket specifically includes: a bracket body 1 and a cooling component 2, wherein the bracket body 1 has an accommodating space inside, and the bracket body 1 includes a first side 11 and a second side 12 opposite to each other, wherein the first side 11 can be the top surface of the bracket body 1, used to support the electronic device body 13, and the second side 12 can be the bottom surface of the bracket body 1, which can be placed on a bearing surface such as a desktop, and the surface of the second side 12 of the bracket body can directly contact the bearing surface, or can also be supported by arranging a plurality of columns and other structures at the edge. The cooling component 2 is arranged in the accommodating space and is located close to the first side 11. The cooling component 2 has a first surface 21 and a second surface 22 opposite to each other, and the first surface 21 faces the first side 11 and is used for cooling to dissipate heat for the electronic device body 13 supported by the first side 11 of the bracket body 1.

[0030] The present application provides a heat dissipation bracket and electronic device, wherein a cooling component 2 is arranged in the accommodation space of a bracket body 1, and a first cooling surface 21 of the cooling component 2 faces the first side 11 of the bracket body 1, and the cooling component cools to cool the electronic device body 13 to help it dissipate heat. While supporting the electronic device body 13, the heat dissipation bracket can also improve the heat dissipation performance of the electronic device body 13, and can solve the problem that the current heat dissipation bracket has limited improvement in the heat dissipation capacity of the electronic device body 13 such as a notebook.

[0031] For further information, see Attachment Figure 2 and attached Figure 3 In a specific implementation, the heat dissipation bracket also includes a support portion 3, which is arranged on the surface of the first side 11 of the bracket body 1 and is used to support the electronic device body 13. The support portion 3 is a strip structure and is semi-enclosed around the edge of the first side 11 to form an air inlet area.

[0032] Specifically, in order to form an air intake space between the electronic device body 13 and the surface of the first side 11 of the bracket body 1 to achieve a better heat dissipation effect, in the technical solution adopted in the present application, a support portion 3 is provided on the surface of the first side 11 of the bracket body 1. The support portion 3 is a strip-shaped structure, and its width, thickness and length can be set according to actual needs. The specific material can be rubber. The support portion 3 can be a whole rubber strip and semi-enclosed around the edge of the first side 11, or it can be two rubber strips, which are relatively arranged at the two edges of the surface of the first side 11 of the bracket body 1. As long as the support portion 3 has a certain thickness so that the electronic device body 13 and the surface of the first side 11 of the bracket body 1 form an air intake space, the wind in the air intake space is cooled by the cooling component 2 so that the air intake temperature is lower than the ambient temperature, thereby improving the heat dissipation effect of the heat dissipation bracket on the electronic device body 13. The support body can provide corresponding friction and support force to the electronic device to maintain the placement posture of the electronic device.

[0033] Furthermore, the edge of the first side 11 of the bracket body 1 has a recess for air intake. As long as the recess forms an air intake space relative to the surface of the first side 11, the wind in the air intake space is cooled by the cooling component 2 so that the air intake temperature is lower than the ambient temperature, thereby improving the heat dissipation effect of the heat dissipation bracket on the electronic device body 13.

[0034] For further information, see Attachment Figure 2 , Attachment Figure 4 and attached Figure 5 In a specific implementation, the heat dissipation bracket also includes a first heat dissipation component, the first heat dissipation component includes a plurality of cooling fins 4, and the plurality of cooling fins 4 are spaced apart on a first side 11 of the bracket body 1; and\or, the second heat dissipation component includes a plurality of heat dissipation fins 5, and the plurality of heat dissipation fins 5 are spaced apart on a second side 12 of the bracket body 1.

[0035] Specifically, in order to increase the cooling area and improve the heat dissipation speed, in the technical solution adopted by the present application, a first heat dissipation module including a plurality of cooling fins 4 can be provided on the first side 11 of the bracket body 1, or a second heat dissipation module including a plurality of heat dissipation fins 5 can be provided on the second side 12 of the bracket body 1. Of course, the best solution is to respectively provide the first heat dissipation module and the second heat dissipation module on the first side 11 and the second side 12 of the bracket body 1. After the plurality of cooling fins 4 are provided on the first side 11 of the bracket body 1, the cooling area of ​​the cooling component 2 is increased, and the cold is evenly conducted to the electronic device body 13 through the cooling fins 4; and after the plurality of heat dissipation fins 5 are provided on the second side 12, the contact area between the heat dissipated from the second surface of the cooling component 2 and the bracket body 1 can be increased, that is, the heat conduction area is increased, and the heat dissipation speed is improved. In addition, there is no specific limitation on the spacing distance between two adjacent cooling fins 4 and the spacing distance between two adjacent heat dissipation fins 5, and they can be set according to actual needs. The side of the cooling fin 4 can be provided with multiple grooves, or the side of the heat dissipation fin 5 can be provided with multiple grooves, or the sides of the cooling fin 4 and the heat dissipation fin 5 can be provided with multiple grooves respectively. After providing multiple grooves, the contact area between the cooling fin 4 and the heat dissipation fin 5 and the air can be further increased, thereby further improving the cooling and heat dissipation effect and efficiency.

[0036] For further information, see Attachment Figure 3 or attached Figure 6 In a specific implementation, the first side 11 of the bracket body 1 has a first air outlet 6, the second side 12 of the bracket body 1 has a second air outlet 7, and the side of the bracket body 1 between the first side 11 and the second side 12 is provided with an air inlet 8; the heat dissipation bracket also includes: at least one first fan assembly 9, the first fan assembly 9 is arranged in the accommodating space, and the air outlet of the first fan assembly 9 faces the first surface 21; and\or, at least one second fan assembly 10, the second fan assembly 10 is arranged in the accommodating space, and the air outlet of the second fan assembly 10 faces the second surface 22.

[0037] Specifically, in order to allow air to circulate between the inside of the bracket body 1 and the outside, in the technical solution adopted by the present application, a first air outlet 6 is provided on the first side 11 of the bracket body 1, a second air outlet 7 is provided on the second side 12 of the bracket body 1, and an air inlet 8 is provided on the side between the first side 11 and the second side 12. The size and shape of the first air outlet 6, the second air outlet 7 and the air inlet 8 are not limited here. When the solution of setting a first heat dissipation module including a plurality of cooling fins 4 is adopted, the first air outlet 6 can be formed by the intervals between the plurality of cooling fins 4, and when the solution of setting a second heat dissipation module including a plurality of heat dissipation fins 5 is adopted, the second air outlet 7 can be formed by the intervals between the plurality of heat dissipation fins 5; the air inlet 8 can be connected to the first air outlet 6, or the air inlet 8 can also be connected to the second air outlet 7, or the air inlet 8, the first air outlet 6 and the second air outlet 7 are connected to each other. Of course, the air inlet 8 can also be independently provided relative to the first air outlet 6 and the second air outlet 7, and no specific limitation is made here.

[0038] In order to make the air inside the bracket body 1 and the outside flow faster and accelerate the heat dissipation effect, a first fan assembly 9 can be provided in the accommodation space of the bracket body 1, or a second fan assembly 10 can also be provided in the accommodation space. Optimally, the first fan assembly 9 and the second fan assembly 10 can be provided in the accommodation space at the same time, and the number of fan bodies included in the first fan assembly 9 and the second fan assembly 10 can be 1, 3 or 4 or other numbers. Among them, the air outlet of the first fan assembly 9 faces the first surface 21, which is used to accelerate the coldness of the cooling component 2 from the first air outlet 6 to the electronic device body 13. The air outlet of the second fan assembly 10 faces the second surface 22, and the heat dissipated from the second surface 22 of the cooling component 2 is blown to the outside from the second air outlet 7. In addition, a fin is provided between the second fan assembly 10 and the second surface 22 to increase the heat conduction area and accelerate the heat dissipation of the cooling component 2. In addition, the provision of the first fan assembly 9 and the second fan assembly 10 can also accelerate the air flow and circulation between the air inlet 8, the first air outlet 6 and the second air outlet 7, and accelerate the heat dissipation. In addition, the housings of the first and second fan assemblies for accommodating the fan bodies may be composed of a plurality of fins, so that the fan bodies can remove cold or heat, thereby accelerating the cooling of the electronic device body 13 or the heat dissipation inside the bracket body 1.

[0039] For further information, see Attachment Figure 5 In a specific implementation, the cooling component 2 includes at least one semiconductor refrigeration sheet and a thermal insulation sheet 14; the thermal insulation sheet 14 is arranged in the accommodating space and has a thermal insulation hole adapted to at least one semiconductor refrigeration sheet so that the semiconductor refrigeration sheet can be installed in the corresponding thermal insulation hole, and the outer periphery of the thermal insulation sheet 14 is connected to the inner wall of the bracket body 1.

[0040] Specifically, in order to provide the electronic device body 13 with air volume lower than the ambient temperature, in the technical solution adopted by the present application, the cooling component 2 includes at least one semiconductor cooling sheet and a heat insulation sheet 14, and the heat insulation sheet 14 is used to isolate the semiconductor cooling sheet from the external environment to avoid the waste of cold energy being conducted to the outside. The number and size of the cooling sheets can be set according to the size of the electronic device body 13 and the surface of the first side 11 of the bracket body 1.

[0041] For further information, see Attachment Figure 1 In a specific implementation, the first side 11 of the bracket body 1 and the second side 12 of the bracket body 1 have a first angle A.

[0042] Specifically, in order to improve the user's comfort and enhance the user's experience, in the technical solution adopted in the present application, the first side 11 of the bracket body 1 and the second side 12 of the bracket body 1 have a first angle A to form a support angle, so that when supporting the electronic device body 13, the electronic device body 13 can have a certain inclination angle, which can enhance the user's experience; the first angle A can be any angle, such as: 30°, 40° and other angles, which are not specifically limited here and can be set according to the user's usage habits.

[0043] For further information, see Attachment Figure 1 -Attached Figure 6 In a specific implementation, a wireless connection module is provided in the accommodating space for wireless connection with the electronic device body 13 .

[0044] Specifically, in order to save energy consumption, the heat dissipation bracket automatically identifies the electronic device body 13 and allows the user to select a heat dissipation mode. In the technical solution adopted by the present application, a wireless connection module, such as a Bluetooth connection, is provided in the accommodating space. Through the wireless connection, it is identified whether the electronic device body 13 is placed on the bracket body 1. After being placed on the bracket body 1, the connection is realized. A dialog box may pop up on the laptop computer to allow the user to select a heat dissipation mode. Different heat dissipation modes are determined according to various matching conditions of the fan body and the refrigeration component 2. For example, when the user is using software with high running requirements, the user can switch to a high-performance heat dissipation mode. At this time, the speed of the fan body is the highest and the cooling capacity of the refrigeration component 2 is the largest, thereby accelerating the heat dissipation of the electronic device body 13. Alternatively, various matching conditions of the fan body and the refrigeration component 2 can be selected according to the user's use of the electronic device body 13, such as: the speed of the fan body is reduced, mainly relying on the refrigeration component 2, which can reduce noise, or the speed of the fan body is increased, the refrigeration component 2 is turned off, and the heat dissipation mainly relies on the fan body.

[0045] For further information, see Attachment Figure 1 -Attached Figure 6 In a specific implementation, a Hall sensor is provided in the accommodating space for signal connection with the electronic device body 13 .

[0046] Specifically, in order to further enable the heat dissipation bracket to automatically identify the electronic device body 13 and improve the sensitivity of identification, in the technical solution adopted by the present application, a Hall sensor is arranged in the accommodating space, and its specific setting position can be the inner wall of the first side 11 of the bracket body 1 or the surface of the first side 11 of the bracket body 1. The specific position of the Hall sensor is not limited here and can be set according to actual conditions. The Hall sensor is used for signal connection with the electronic device body 13. The signal connection here can specifically be a wired signal connection or a wireless signal connection. By setting the Hall sensor, it can be more sensitive to identify whether the electronic device body 13 is placed on the bracket body 1.

[0047] In addition, as attached Figure 6 As shown, a control board 15 is provided in the bracket body 1 of the heat dissipation device, and the control board 15 is provided with a type-c interface for connecting to a power source to power at least one of the cooling component 2, the first fan assembly 9, the second fan assembly 10 and the wireless connection module. The type-c interface can be exposed on any side wall between the first side 11 and the second side 12 of the bracket body 1, and no specific limitation is made here. A connector for the cooling component 2 is also provided on the control board 15, and the connector is connected to the cooling component 2 signal to control the opening or closing of the cooling component 2. At the same time, a battery can also be set inside the bracket body 1 to power the cooling component 2, the first fan assembly 9, the second fan assembly 10 and the wireless connection module.

[0048] Embodiment 2

[0049] A second aspect of the present application provides an electronic device, which includes an electronic device body 13 and the above-mentioned heat dissipation bracket, wherein the heat dissipation bracket is used to support the electronic device body 13 and dissipate heat, and electrically interacts with the electronic device body 13.

[0050] Specifically, this embodiment provides an electronic device, which includes an electronic device body 13 and any one of the heat dissipation brackets in Example 1, the heat dissipation bracket is used to support the electronic device body 13 and to dissipate heat for the electronic device body 13, and the heat dissipation bracket and the electronic device body 13 can electrically interact.

[0051] The electronic device provided in the present application includes an electronic device body 13 and a heat dissipation bracket, and the heat dissipation bracket has the same effect as that of Example 1.

[0052] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0054] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation bracket, It is characterized in that include: A bracket body, the bracket body having an accommodating space and comprising a first side and a second side opposite to each other, wherein the first side is used to support the electronic device body; A cooling component is arranged in the accommodating space, the cooling component has a first surface for cooling, and a second surface arranged opposite to the first surface, the first surface faces the first side, and is used for the electronic device body to dissipate heat; The support portion is arranged on the surface of the first side of the bracket body and is used to support the electronic device body. The support portion is in a strip-shaped structure and semi-enclosedly surrounds the edge of the first side to form an air inlet area.

2. The heat dissipation bracket according to claim 1, It is characterized in that Also includes: A first heat dissipation component, the first heat dissipation component includes a plurality of cooling fins, and the plurality of cooling fins are arranged at intervals on a first side of the bracket body; and\or, The second heat dissipation component includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the second side of the bracket body.

3. The heat dissipation bracket according to claim 2, It is characterized in that The cooling fins have a plurality of grooves on their sides; and\or A plurality of grooves are formed on the side of the heat dissipation fin.

4. The heat dissipation bracket according to claim 1 or 2, It is characterized in that The first side of the bracket body has a first air outlet, the second side of the bracket body has a second air outlet, and the side portion of the bracket body between the first side and the second side is provided with an air inlet; The heat dissipation bracket also includes: at least one first fan assembly, the first fan assembly being disposed in the accommodating space, and an air outlet of the first fan assembly being oriented toward the first surface; and\or, At least one second fan assembly is disposed in the accommodating space, and an air outlet of the second fan assembly faces the second surface.

5. The heat dissipation bracket according to claim 1, It is characterized in that The cooling component comprises: At least one semiconductor cooling chip; A heat-insulating plate is arranged in the accommodating space and has a heat-insulating hole adapted to at least one of the semiconductor refrigeration plates so that the semiconductor refrigeration plate can be installed in the corresponding heat-insulating hole. The outer periphery of the heat-insulating plate is connected to the inner side wall of the bracket body.

6. The heat dissipation bracket according to claim 1, It is characterized in that The first side of the bracket body and the second side of the bracket body have a first angle.

7. The heat dissipation bracket according to claim 4, It is characterized in that A wireless connection module is arranged in the accommodating space and is used for wireless connection with the electronic device body.

8. The heat dissipation bracket according to claim 4 or 7, It is characterized in that A Hall sensor is arranged in the accommodating space and is used for signal connection with the electronic equipment body.

9. An electronic device, It is characterized in that include: Electronic device body; The heat dissipation bracket as described in any one of claims 1 to 8 is used to support the electronic device body and dissipate heat, and electrically interacts with the electronic device body.

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