Computer mainboard with heat dissipation mechanism

Abstract

The utility model provides a computer mainboard with a heat dissipation mechanism, and relates to the technical field of computer mainboards, the computer mainboard comprises a bottom plate, the inner side of the bottom plate is provided with a mainboard body, the inner side of the bottom plate is provided with an air inlet, the inner side of the bottom plate is provided with an air outlet, the inner side of the air inlet is fixedly provided with a motor, and the inner side of the air outlet is fixedly provided with a heat dissipation mechanism. Cooling fins are fixedly installed on the inner side of the bottom plate, and fan blades are fixedly installed at the output end of the motor. According to the computer mainboard, through the arrangement of the bottom plate, the air inlet, the air outlet, the motor, the cooling fins, the fan blades, the belt wheel A, the reciprocating lead screw, the belt wheel B, the belt, the brush plate and the air guide plate, heat can be transferred and dissipated through the cooling fins in the working process of the mainboard body, and the cooling fins can be effectively cooled through airflow; in the working process of the motor, the brush plate can be driven to slide on the surfaces of the cooling fins in a reciprocating mode, dust accumulation is avoided, and meanwhile the cooling effect can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of computer mainboards, in particular to a computer mainboard with a heat dissipation mechanism. Background Art

[0002] The computer motherboard is one of the core components inside the computer, also known as the main board, motherboard or system board. It provides interfaces for connecting various hardware components and is responsible for coordinating the communication and data transmission between them. Publication No. CN206975547U discloses a main board and a computer device, wherein the main board includes a circuit board, the circuit board is a long strip board, the circuit board includes two relatively long sides and two relatively narrow sides, the main board also includes a hard disk, a memory bar slot, a processor and a plurality of interfaces all arranged on the circuit board, the hard disk, the memory bar slot and the processor are arranged in sequence in the extension direction of the long side, and the plurality of interfaces are located on the same side of the hard disk, the memory bar slot and the processor and are arranged adjacent to a long side. The main board of the utility model makes the center of gravity of the all-in-one computer using the main board move downward and reduce the volume. However, this type of computer motherboard is not equipped with a heat dissipation mechanism during actual operation, and computer motherboards currently on the market generally use fans and heat sinks for heat dissipation. However, when the fan works for a long time, dust and impurities in the air may fall on the surface of the heat sink with the air, which may cause excessive dust accumulation on the surface of the heat sink, thereby affecting the heat dissipation effect and ultimately reducing the service life of the motherboard body, which needs to be improved. Utility Model Content

[0003] The purpose of the utility model is to solve the technical problems raised in the above background technology.

[0004] The utility model adopts the following technical scheme: a computer motherboard with a heat dissipation mechanism comprises a base plate, a mainboard body is arranged on the inner side of the base plate, an air inlet is opened on the inner side of the base plate, an air outlet is opened on the inner side of the base plate, a motor is fixedly installed on the inner side of the air inlet, a heat sink is fixedly installed on the inner side of the base plate, a fan blade is fixedly installed on the output end of the motor, a pulley A is fixedly installed on the output end of the motor, a reciprocating screw is rotatably connected to the inner side of the base plate, a pulley B is fixedly installed on the surface of the reciprocating screw, a belt is sleeved on the surface of the pulley B, a brush plate is threadedly connected to the surface of the reciprocating screw, an air guide plate is fixedly installed on the surface of the brush plate, and a slide rod is fixedly installed on the inner side of the base plate.

[0005] Preferably, the pulley B is connected to the pulley A via a belt, and the air guide plate is in an arc shape. Here, by providing the pulley B, the pulley A, and the belt, the reciprocating screw can be driven to rotate during the operation of the motor, and the arc-shaped air guide plate can guide the airflow during the rotation of the fan blade, thereby accelerating the airflow on the surface of the heat sink and improving the heat dissipation effect.

[0006] Preferably, the brush plate is slidably connected to the slide bar, and the brush plate is slidably connected to the heat sink. Here, by providing the slide bar, the brush plate can improve stability during movement, thereby driving the brush plate to effectively clean the heat sink.

[0007] Preferably, the heat sink is made of copper. Here, by providing a copper heat sink, the heat generated during the operation of the motherboard can be effectively conducted under the effect of heat conduction, and can cooperate with the fan blades to achieve an effective heat dissipation effect.

[0008] Preferably, a mounting seat is fixedly mounted on the side of the bottom plate, a stud is threadedly connected to the inner side of the mounting seat, and a wire clamp is fixedly mounted on one end of the stud. Here, by providing the mounting seat, the stud, and the wire clamp, the wire can be fixed and limited by the wire clamp after the motherboard is installed, which can help users organize and manage various connection cables more neatly. It can reduce messy cable wiring, improve air flow, and make it easier to maintain and clean.

[0009] Preferably, the inner side of the mounting seat is provided with threads, and the threads on the inner side of the mounting seat mesh with the threads on the surface of the stud. Here, by providing the threads on the inner side of the mounting seat, the wire clamp can be reinforced for disassembly by rotating the stud, so that the wire clamp can be quickly disassembled and replaced.

[0010] Compared with the prior art, the advantages and positive effects of the utility model are:

[0011] 1. In the utility model, by arranging a bottom plate, an air inlet, an air outlet, a motor, a heat sink, a fan blade, a pulley A, a reciprocating screw rod, a pulley B, a belt, a brush plate, and an air guide plate, the heat can be transferred and dissipated through the heat sink during the operation of the mainboard body, and the heat sink can be effectively cooled by airflow. While the motor is working, the brush plate can be driven to slide back and forth on the surface of the heat sink, thereby avoiding dust accumulation and ensuring the heat dissipation effect.

[0012] 2. In the utility model, by providing a mounting seat, studs, wire clamps, and sliding rods, the wire clamps can be used to fix and limit the wires after the mainboard body is installed, helping users to organize and manage various connecting cables more neatly, reducing messy cable wiring, improving air flow, and making it easier to maintain and clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of a computer motherboard with a heat dissipation mechanism is provided for the utility model;

[0014] Figure 2 A bottom view of a computer motherboard with a heat dissipation mechanism is provided for the utility model;

[0015] Figure 3 The utility model proposes a computer motherboard with a heat dissipation mechanism Figure 2 A in the enlarged view;

[0016] Figure 4 An exploded diagram of a computer motherboard with a heat dissipation mechanism is proposed for the utility model;

[0017] Figure 5 The utility model proposes a computer motherboard with a heat dissipation mechanism Figure 4 The enlarged view of point B in the figure;

[0018] Figure 6 The utility model provides a schematic diagram of the structure of a computer motherboard with a heat dissipation mechanism in a bottom view;

[0019] Figure 7 The utility model proposes a computer motherboard with a heat dissipation mechanism Figure 6 Enlarged view of point C in the figure.

[0020] Legend:

[0021] 1. Bottom plate; 2. Main board; 3. Air inlet; 4. Air outlet; 5. Motor; 6. Heat sink; 7. Fan blades; 8. Pulley A; 9. Reciprocating screw; 10. Pulley B; 11. Belt; 12. Brush plate; 13. Air guide plate; 14. Mounting seat; 15. Stud; 16. Wire clamp; 17. Sliding rod. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0024] Embodiment 1

[0025] See also Figure 1-7The utility model provides a technical solution: a computer motherboard with a heat dissipation mechanism, comprising a bottom plate 1, a mainboard body 2 is arranged on the inner side of the bottom plate 1, an air inlet 3 is opened on the inner side of the bottom plate 1, an air outlet 4 is opened on the inner side of the bottom plate 1, a motor 5 is fixedly installed on the inner side of the air inlet 3, a heat sink 6 is fixedly installed on the inner side of the bottom plate 1, the heat sink 6 is made of copper, a fan blade 7 is fixedly installed on the output end of the motor 5, a pulley A8 is fixedly installed on the output end of the motor 5, a reciprocating screw rod 9 is rotatably connected to the inner side of the bottom plate 1, a pulley B10 is fixedly installed on the surface of the reciprocating screw rod 9, the pulley B10 is connected to the pulley A8 through a belt 11, and the surface of the pulley B10 is covered with a leather Belt 11, during the operation of the motor 5, the pulley A8 will be driven to rotate. At the same time, under the action of the belt 11, the pulley A8 will drive the pulley B10 to rotate together, thereby driving the reciprocating screw 9 to rotate. The surface of the reciprocating screw 9 is threadedly connected with a brush plate 12, and the brush plate 12 is slidably connected to the slide bar 17. During the rotation of the reciprocating screw 9, under the action of the thread, the reciprocating screw 9 will drive the brush plate 12 to slide back and forth along the slide bar 17, thereby cleaning the dust and impurities remaining on the surface of the heat sink 6. The brush plate 12 is slidably connected to the heat sink 6, and an air guide plate 13 is fixedly installed on the surface of the brush plate 12. The shape of the air guide plate 13 is arc-shaped, and a slide bar 17 is fixedly installed on the inner side of the base plate 1.

[0026] Embodiment 2

[0027] See also Figure 4-5 A mounting seat 14 is fixedly mounted on the side of the bottom plate 1. The inner side of the mounting seat 14 is provided with threads. The threads on the inner side of the mounting seat 14 mesh with the threads on the surface of the stud 15. The inner side of the mounting seat 14 is threadedly connected with the stud 15. A wire clamp 16 is fixedly mounted on one end of the stud 15. The setting of the wire clamp 16 can help users organize and manage various connection cables more neatly. It can reduce messy cable wiring, improve air flow, and make maintenance and cleaning easier. When the wire clamp 16 is damaged, the stud 15 can be rotated and driven to be pulled out from the inner side of the mounting seat 14 under the action of the threads, and then a new wire clamp 16 can be replaced.

[0028] Working principle: The main body 2 generates a large amount of heat during operation. Under the action of heat conduction, the heat is transferred to the surface of the heat sink 6 through the bottom plate 1. At this time, the motor 5 is started and the fan blades 7 are driven to rotate. Under the action of the fan blades 7, the external airflow is blown into the inner side of the bottom plate 1 through the air inlet 3. Then, under the action of the air guide plate 13, the airflow is blown to the surface of the heat sink 6, thereby improving the cooling efficiency of the heat sink 6. During the operation of the motor 5, the pulley A8 is driven to rotate. At the same time, under the action of the belt 11, the pulley A8 drives the pulley B10 to rotate together, thereby driving the reciprocating screw 9 to rotate. Under the action of the thread, the reciprocating screw 9 drives the brush plate 12 By sliding back and forth along the slide bar 17, the dust and impurities remaining on the surface of the heat sink 6 can be cleaned to prevent dust accumulation from affecting the heat dissipation performance of the heat sink 6. During the installation of the mainboard body 2, the wires can be placed in the adjacent wire clamps 16, so that various connecting cables can be organized and managed more neatly. After the wire clamp 16 is damaged, the stud 15 can be rotated and driven to be pulled out from the inner side of the mounting seat 14 by the action of the thread. Then a new wire clamp 16 can be replaced, and the stud 15 is inserted into the inner side of the mounting seat 14 and rotated. The stud 15 is driven to enter the inner side of the mounting seat 14 by the action of the thread, and the replacement of the wire clamp 16 is completed.

[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A computer motherboard with a heat dissipation mechanism, comprising a bottom plate (1), characterized in that: A main board body (2) is arranged on the inner side of the base plate (1), an air inlet (3) is provided on the inner side of the base plate (1), an air outlet (4) is provided on the inner side of the base plate (1), a motor (5) is fixedly installed on the inner side of the air inlet (3), a heat sink (6) is fixedly installed on the inner side of the base plate (1), a fan blade (7) is fixedly installed on the output end of the motor (5), a pulley A (8) is fixedly installed on the output end of the motor (5), a reciprocating screw rod (9) is rotatably connected on the inner side of the base plate (1), a pulley B (10) is fixedly installed on the surface of the reciprocating screw rod (9), a belt (11) is sleeved on the surface of the pulley B (10), a brush plate (12) is threadedly connected to the surface of the reciprocating screw rod (9), an air guide plate (13) is fixedly installed on the surface of the brush plate (12), and a sliding rod (17) is fixedly installed on the inner side of the base plate (1).

2. The computer motherboard with a heat dissipation mechanism according to claim 1, characterized in that: The pulley B (10) is connected to the pulley A (8) via a belt (11), and the air guide plate (13) is in an arc shape.

3. The computer motherboard with a heat dissipation mechanism according to claim 1, characterized in that: The brush plate (12) is slidably connected to the slide rod (17), and the brush plate (12) is slidably connected to the heat sink (6).

4. The computer motherboard with a heat dissipation mechanism according to claim 1, characterized in that: The heat sink (6) is made of copper.

5. The computer motherboard with a heat dissipation mechanism according to claim 1, characterized in that: A mounting seat (14) is fixedly mounted on the side of the base plate (1), a stud (15) is threadedly connected to the inner side of the mounting seat (14), and a wire clamp (16) is fixedly mounted on one end of the stud (15).

6. The computer motherboard with heat dissipation mechanism according to claim 5, characterized in that: The inner side of the mounting seat (14) is provided with threads, and the threads on the inner side of the mounting seat (14) are meshed with threads on the surface of the stud (15).

Images