High-power ATX power supply module

Abstract

The invention relates to the technical field of computer power supplies, in particular to a high-power ATX power supply module which comprises a power supply body, a power interface is formed in one end of the power supply body, an output interface is formed in the other end of the power supply body, a vapor chamber is horizontally arranged in the power supply body, and an evaporation end at one end of the vapor chamber is in contact with a heating component in the power supply body. A capillary plate and a supporting column are arranged in the vapor chamber, a conical opening is formed in the bottom of the supporting column, the large end of the conical opening faces downwards, and a plurality of circulating holes are formed in the side wall of the conical opening, so that a liquid working medium evaporated at the bottom of the supporting column is not affected by the supporting column; compared with a traditional supporting column, the supporting column has smaller influence on steam flowing, so that the temperatures of the two ends of the vapor chamber are close, the heat conduction effect of the vapor chamber is improved, and the overall heat dissipation effect of the power module is also improved.

Description

Technical Field

[0001] The present invention relates to the technical field of computer power supply, in particular to a high-power ATX power supply module. Background Art

[0002] A power module is a module that converts electrical energy into the required voltage or current, and is suitable for various electronic devices. A high-power power module is a power module that can output a large current and power, and is commonly used in devices or systems that require high power, such as servers, communication equipment, industrial automation equipment, etc.

[0003] For example, in an assembled desktop computer, the power module of the computer is an important component for supplying power to the computer, and a heat dissipation structure is often required inside the computer to ensure its normal operation. Chinese patent CN113207264A discloses a power heat dissipation device and a power supply. The solution is provided with a heat spreader, so that the heat on the power board can be quickly transferred and diffused to the heat dissipation structure and the cooling pipeline, thereby reducing the heat flux density on the power board.

[0004] The heat spreader in the above scheme is provided with support columns inside, which are used to support the upper and lower plates of the heat spreader. However, the setting of the support columns will hinder the flow of liquid and gas in the steam chamber, resulting in a large temperature difference between the two ends of the heat spreader. In addition, the position of the support columns has a poorer thermal conductivity than other positions, which is not conducive to the heat dissipation of the power module. Summary of the invention

[0005] Based on this, it is necessary to provide a high-power ATX power supply module to address the problem of large temperature difference at both ends of the heat spreader in the current power supply module heat dissipation and poor overall heat dissipation effect.

[0006] The above purpose is achieved through the following technical solutions: A high-power ATX power supply module, comprising: A power supply body, wherein one end of the power supply body is provided with a plurality of output interfaces, and the other end of the power supply body is provided with a power interface; A heat dissipation component, the heat dissipation component includes a vapor chamber and a capillary plate, the vapor chamber is installed in the power supply body, the vapor chamber is hollow inside and is in a negative pressure state, the vapor chamber is filled with a liquid working medium, one end of the vapor chamber is an evaporation end, and the other end of the vapor chamber is a condensation end, the evaporation end absorbs heat and gradually transfers it to the condensation end, the capillary plate is located inside the vapor chamber, and the capillary plate can transport the liquid working medium from the condensation end to the evaporation end to form a cycle; A support column, wherein the support column is located inside the heat spreader, the bottom of the support column has a conical opening, the small end faces upward, the large end faces downward, and a flow hole is opened on the side wall of the conical opening, the large end of the conical opening at the bottom of the support column abuts against the capillary plate, and the upper end of the support column abuts against the inner wall of the heat spreader.

[0007] Furthermore, the heat spreader includes an upper shell plate and a lower shell plate, and the upper shell plate and the lower shell plate are fitted together to form a sealed cavity. A conical groove is provided on the upper surface of the upper shell plate, and the conical groove passes downward through the bottom of the upper shell plate and protrudes a conical tip downward. The small end of the conical tip is connected to the support column, the upper end of the support column cooperates with the conical tip, and the diameter of the support column gradually decreases from bottom to top.

[0008] Furthermore, the support column is made of metallic copper.

[0009] Furthermore, there are a plurality of support columns, which are evenly distributed inside the heat spreader, and connecting rods are provided between adjacent support columns, and the connecting rods connect the plurality of support columns into a whole.

[0010] Furthermore, the capillary plate is a copper powder sintered capillary plate.

[0011] Furthermore, the heat dissipation assembly also includes a heat dissipation fan and heat dissipation fins, the heat dissipation fins are located near the heat spreader, the heat dissipation fan is located above the heat dissipation fins and the heat spreader, and the heat dissipation fan can blow out the heat inside the power supply body.

[0012] Furthermore, a fence slot is provided on the upper end surface of the power supply body, and the heat blown out by the cooling fan passes through the fence slot.

[0013] Furthermore, an end surface of the power supply body where the power supply interface is located is a dustproof mesh plate.

[0014] Furthermore, the dustproof screen plate can be detachably mounted on the power supply body.

[0015] Furthermore, a switch is provided on the power supply body, and the switch can control the on and off of the power supply.

[0016] The beneficial effects of the present invention are: The present invention provides a conical opening at the bottom position where the support column contacts the capillary plate, with the large end of the conical opening facing downward, and a plurality of flow holes are provided on the side wall of the conical opening, so that the liquid working medium evaporated at the bottom of the support column is not affected by the support column, and the steam formed by the liquid working medium passes through the conical opening at the bottom of the support column and enters the cavity of the heat spreader through the flow holes. Compared with the traditional support column, the support column of the present invention has less influence on the steam flow, so that the temperatures at both ends of the heat spreader are similar, thereby improving the thermal conduction effect of the heat spreader, and thus improving the overall heat dissipation effect of the power module.

[0017] The present invention increases the contact area between the upper surface of the upper shell plate and the air by opening a groove on the upper shell plate, so that more heat can be dissipated into the air through convection, conduction and radiation. The larger surface area can accelerate the diffusion of heat from the upper shell plate to the surrounding air, thereby further improving the heat dissipation efficiency.

[0018] The diameter of the support column of the present invention gradually decreases from bottom to top, which further reduces the influence of the support column on the steam flow compared to the cylindrical support column in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a high-power ATX power supply module provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a high-power ATX power supply module from another angle provided by an embodiment of the present invention; Figure 3 A schematic diagram of a portion of the internal structure of a high-power ATX power supply module provided in one embodiment of the present invention; Figure 4 A schematic diagram of the structure of a heat spreader of a high-power ATX power supply module provided by an embodiment of the present invention; Figure 5 A schematic structural diagram of a cross-section of a heat spreader of a high-power ATX power supply module provided by an embodiment of the present invention; Figure 6 for Figure 5 A partial enlarged view of the heat spreader X portion of a high-power ATX power supply module provided in one embodiment.

[0020] in: 100, power supply body; 110, power supply interface; 120, output interface; 130, circuit board; 140, fence slot; 150, dustproof screen; 160, switch; 200, heat sink; 201, evaporation end; 202, condensation end; 210, upper shell; 211, groove; 212, conical tip; 220, lower shell; 221, sealed cavity; 230, capillary plate; 240, support column; 250, conical opening; 251, flow hole; 260, connecting rod; 300. cooling fan; 310. cooling fins. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present invention, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0023] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0024] Refer to the following Figure 1-Figure 6 To describe a high-power ATX power supply module provided by the present invention.

[0025] A high-power ATX power supply module is suitable for power supply of a computer, comprising a power supply body 100. A power interface 110 is arranged on one end of the power supply body 100, and the power interface 110 is connected to a 220V power supply line. A plurality of output interfaces 120 are arranged on the other end of the power supply body 100, and the output interfaces 120 are connected to various power-consuming components of the computer, such as a computer motherboard, a central processing unit (CPU), a graphics card, etc. The voltage output by the output interface 120 is the voltage required by each power-consuming component. A circuit board 130 is arranged inside the power supply body 100, and various components (not shown in the figure) are arranged on the circuit board 130 to perform different functions respectively. These components on the circuit board 130 will generate heat when working normally, and a heat dissipation component is also arranged inside the power supply body 100. The heat dissipation component is used to dissipate the heat generated by these components out of the power supply body 100, thereby preventing the excessive temperature from affecting the normal operation of the power supply body 100.

[0026] The heat dissipation component includes a heat spreader 200 and a capillary plate 230. The heat spreader 200 is located inside the power supply body 100 and is horizontally installed on the circuit board 130. The bottom of the heat spreader 200 is various heat-generating components. The interior of the heat spreader 200 is hollow and is in a negative pressure state. The interior of the heat spreader 200 is filled with liquid working fluid, which is generally pure water. The negative pressure state is to reduce the boiling point of the liquid working fluid so that the liquid working fluid can evaporate at a lower temperature. In this way, even at a relatively low operating temperature (such as the temperature when the components are heated), the liquid working fluid can evaporate quickly and transfer heat. One of the two ends of the heat spreader 200 is an evaporation end 201, and the other end is a condensation end 202. The evaporation end 201 of the heat spreader 200 is in contact with the heat-generating components, while the condensation end 202 is away from the heat-generating components. The evaporation end 201 absorbs the heat of the heating components, and the liquid working medium inside the evaporation end 201 evaporates to generate steam. The steam forms a higher pressure in this area. Since the pressure of the evaporation end 201 is higher than that of the condensation end 202, the steam flows from the evaporation end 201 to the condensation end 202 along the pressure gradient. After reaching the condensation end 202, the steam encounters a lower temperature and condenses into liquid working medium, releasing heat. At the same time, a capillary plate 230 is provided in the heat spreader 200. The function of the capillary plate 230 is to return the condensed liquid working medium to the evaporation end 201, thereby completing the cycle, so that the heat spreader 200 can continuously absorb and release heat.

[0027] A support column 240 is also provided inside the heat spreader 200. The function of the support column 240 is to support the cavity inside the heat spreader 200. Since the inside of the heat spreader 200 is in a negative pressure state, the side walls inside the heat spreader 200 tend to be close to each other. The support column 240 is provided to avoid the side walls from contacting each other and thus hindering the flow of steam. The support column 240 of the present invention has a conical opening 250 at the bottom, with the large end of the conical opening 250 facing downward and the small end facing upward, and a plurality of flow holes 251 are provided on the side wall of the conical opening 250. The flow holes 251 can allow gas or liquid working medium to pass through, and the bottom of the support column 240 is supported on the capillary plate 230, and the upper end of the support plate abuts against the inner wall of the heat spreader 200.

[0028] It should be noted that the conical opening 250 at the bottom of the support column 240 of the present invention will not hinder the evaporation of the liquid working medium in the capillary plate 230. If it is an ordinary support column 240, the bottom surface of the support column 240 is flat and fits on the capillary plate 230. When the liquid working medium in the capillary plate 230 at the contact position of the bottom surface of the support column 240 is heated, the liquid working medium will be blocked by the support column 240 and the evaporation efficiency will be reduced, and the evaporated steam needs to flow through other positions, thereby reducing the efficiency of the steam flow. Since the bottom of the support column 240 of the present invention has a conical opening 250, the contact area between the bottom of the support column 240 and the capillary plate 230 is smaller, so that the liquid working medium at the bottom of the support column 240 can evaporate normally, and a flow hole 251 is provided on the side wall of the conical opening 250, so that the steam can enter the conical opening 250 and be discharged from the flow hole 251 without hindering the flow of steam, thereby improving the steam flow effect in the heat spreader 200, making the temperatures at both ends of the heat spreader 200 similar, thereby improving the heat conduction effect of the heat spreader 200, and thus improving the overall heat dissipation effect of the power module, so that the power supply body 100 can supply power stably.

[0029] Specifically, the heat spreader 200 in this embodiment includes an upper shell plate 210 and a lower shell plate 220, which fit each other to form a sealed cavity 221, and a conical groove 211 is provided on the upper surface of the upper shell plate 210, thereby increasing the contact area between the upper shell plate 210 and the air. It can be understood that the groove 211 provided on the upper surface of the upper shell plate 210 increases the total contact area of ​​the upper surface of the upper shell plate 210 compared to not providing the groove 211, so that more heat can be dissipated into the air by convection, conduction and radiation. A larger surface area can accelerate the diffusion of heat from the upper shell plate 210 to the surrounding air, thereby further improving the heat dissipation efficiency.

[0030] At the same time, the groove 211 penetrates downward to form a tapered tip 212 protruding downward at the bottom of the upper shell plate 210, and the upper end of the support column 240 has a depression that matches the tapered tip 212. When the upper shell plate 210 and the lower shell plate 220 are connected to each other, the tapered tip 212 of the upper shell plate 210 will be inserted into the upper end of the support column 240. When the upper shell plate 210 and the lower shell plate 220 are connected, it is necessary to evacuate the internal sealed cavity 221. At this time, the support column 240 supports the upper shell plate 210 and the lower shell plate 220. The shell plate 220, specifically the capillary plate 230, is fitted with the upper surface of the lower shell plate 220, and the support column 240 is located on the upper surface of the capillary plate 230, and the upper end of the support column 240 cooperates with the conical tip 212 to support the upper shell plate 210 and the lower shell plate 220 to prevent the sealed cavity 221 from being affected by the negative pressure environment, and the diameter of the support column 240 gradually decreases from bottom to top, which further reduces the influence of the support column 240 on the steam flow compared to the cylindrical support column 240 in the prior art.

[0031] It can be understood that the support column 240 of the present invention not only plays a supporting role, but also has little effect on the flow of steam, thereby ensuring smooth flow of steam in the heat sink 200.

[0032] More specifically, the support column 240 in the present invention is made of metallic copper, which has excellent thermal conductivity. Copper has a very high thermal conductivity coefficient and can effectively conduct the heat of the evaporation end 201. The use of copper material in the support column 240 can help transfer heat from the evaporation end 201 to the condensation end 202, further improving the overall thermal conductivity of the heat spreader 200, reducing the temperature difference, and improving the heat dissipation efficiency. At the same time, copper has good mechanical strength and toughness, and can provide stable support inside the heat spreader 200 to prevent deformation. Even under high temperature or cyclic thermal stress environment, the copper support column 240 can maintain the stability of shape and function, extending the service life of the heat spreader 200. In addition, in a sealed vacuum cavity, copper has excellent anti-oxidation and anti-corrosion properties, and is not prone to corrosion, oxidation and other reactions, which helps to keep the inside of the heat spreader 200 clean and the working fluid pure, ensuring long-term stable thermal conductivity.

[0033] It should be noted that the material of the support column 240 in the present invention is not limited to metallic copper, and other materials with better performance are also acceptable, and no specific limitation is made here.

[0034] In a further embodiment, there are several support columns 240, and the several support columns 240 are evenly distributed on the capillary plate 230, and connecting rods 260 are arranged between adjacent support columns 240, and the connecting rods 260 connect the several support columns 240 into a whole. The several connecting rods 260 form a frame to fix the positions of the several support columns 240, so that when the upper shell plate 210 and the lower shell plate 220 are installed, the frame formed by the several connecting rods 260 can fix the positions of the support columns 240, thereby facilitating the connection between the conical tip 212 of the upper shell plate 210 and the support columns 240, thereby improving the assembly efficiency.

[0035] Specifically, the capillary plate 230 in the embodiment of the present invention is a capillary plate 230 sintered with copper powder. The capillary plate 230 sintered with copper powder has a porous structure. The porous structure has good capillary force and can effectively absorb and transport liquid working fluid. In the heat spreader 200, the capillary plate 230 can quickly return the liquid working fluid at the condensation end 202 to the evaporation end 201, ensuring the continuity of the circulation of the liquid working fluid and the efficient operation of the heat spreader 200. At the same time, copper has excellent thermal conductivity. The capillary plate 230 sintered with copper powder can not only provide capillary action, but also effectively conduct heat through the heat conduction path between the metal copper particles. In this way, the capillary plate 230 can help to evenly distribute the heat at the evaporation end 201 and the condensation end 202 to a certain extent, thereby improving the overall heat conduction efficiency.

[0036] It should be noted that the capillary plate 230 sintered with copper powder has uniform pores, which can maintain the separation of the liquid working medium and the steam flow channel, reduce the interference between the liquid working medium and the steam, and make the steam flow smoother, which can improve the heat transfer effect of the heat spreader 200 and make the thermal conductivity more efficient.

[0037] In a further embodiment, the heat dissipation assembly also includes a cooling fan 300 and cooling fins 310. The cooling fins 310 are located near the heat spreader 200. The cooling fins 310 can absorb the heat of the heat spreader 200. At the same time, the cooling fan 300 is arranged above the cooling fins 310 and the heat spreader 200. The cooling fan 300 discharges the heat of the cooling fins 310 and the heat spreader 200 from the power supply body 100, thereby reducing the heat accumulation inside the power supply body 100.

[0038] Specifically, a plurality of fence slots 140 are provided on the upper end surface of the power supply body 100, and the heat dissipation fan 300 is located below the fence slots 140. When the heat dissipation fan 300 rotates, the heat dissipation fan 300 discharges the heat inside the power supply body 100, and the fence slots 140 allow the heat to pass through. The fence slots 140 can also prevent other debris from falling into the power supply body 100, thereby protecting the heat dissipation fan 300 and the power supply body 100.

[0039] More specifically, one end face of a power interface 110 is provided on the power supply body 100, and a detachable dust screen 150 is provided. The dust screen 150 can intercept solid impurities in the outside air and prevent the solid impurities from entering the inside of the power supply body 100. It should be noted that when the cooling fan 300 is started, the outside air passes through the dust screen 150 and enters the power supply body 100, and then is discharged from the power supply body 100 through the fence groove 140, thereby forming an air duct. Solid impurities in the outside air can be intercepted by the dust screen 150. The dust screen 150 can be regularly removed and reinstalled on the power supply body 100 after cleaning, which can avoid heat dissipation problems caused by clogging of the dust screen 150 after long-term use.

[0040] Specifically, a switch 160 is provided below the power interface 110 in this embodiment. The switch 160 is used to control the on and off of the power interface 110. When the power interface 110 is connected to a 220V power cord, the switch 160 can control whether the power interface 110 is connected to the internal power body 100. When not in use for a long time, it is recommended to turn off the switch 160 and unplug the 220V power cord from the power interface 110 to avoid unnecessary safety issues.

[0041] The installation and heat dissipation process of a high-power ATX power supply module provided by the present invention is described in combination with the above embodiments: Install: First, connect the terminals of the various components inside the computer to the output interface 120 on the power supply body 100, and then install the power supply body 100 inside the computer chassis with bolts. After the installation is completed, turn off the switch 160 at the lower end of the power interface 110, and then connect the 220V power cord. After that, you can turn on the switch 160 and the high-power ATX power supply module will start to supply power.

[0042] Heat dissipation: After the power is turned on and the switch 160 is turned on, the cooling fan 300 is powered on. When the cooling fan 300 rotates, the outside air passes through the dustproof mesh plate 150 into the inside of the power supply body 100 and is discharged through the fence groove 140 to form an air flow channel. The various components inside the high-power ATX power supply module start to work. These components will emit heat when working. The heat is first absorbed by the evaporation end 201 of the heat spreader 200. The liquid working medium in the evaporation end 201 absorbs the heat and evaporates. Due to the special arrangement of the support column 240 of the present invention, the bottom surface of the support column 240 has a conical opening 250, so that the liquid working medium on the bottom surface of the support column 240 is not affected by the support column 240 when evaporating into steam. The formed steam enters the conical opening 250 on the bottom surface of the support column 240, and then enters the cavity of the heat spreader 200 through the flow hole 251 on the side wall of the conical opening 250, thereby preventing the steam from being blocked by the support column 240.

[0043] After the liquid working medium in the steam end evaporates, the pressure in the evaporation end 201 increases. Under the action of the pressure difference, the steam gradually flows from the evaporation end 201 to the condensation end 202. After the steam reaches the condensation end 202, it encounters a lower temperature and condenses into liquid working medium. At this time, heat is released and absorbed by the upper shell plate 210. The groove 211 of the upper shell plate 210 increases the contact area between the upper shell plate 210 and the air, so that the upper shell plate 210 can absorb more heat per unit time, thereby increasing the heat exchange efficiency between the upper shell plate 210 and the air. The heat is discharged through the heat dissipation fins 310 and the heat dissipation fan 300. The liquid working medium condensed in the condensation end 202 is transported to the evaporation end 201 under the capillary action of the capillary plate 230, so that the heat can be circulated and evenly dissipated.

[0044] After the power supply is used for a period of time, it needs to be removed and the dust screen 150 needs to be cleaned or replaced with a new one to prevent the dust screen 150 from being blocked and affecting heat dissipation.

[0045] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A high-power ATX power supply module, characterized in that: include: A power supply body, wherein one end of the power supply body is provided with a plurality of output interfaces, and the other end of the power supply body is provided with a power interface; A heat dissipation component, the heat dissipation component includes a vapor chamber and a capillary plate, the vapor chamber is installed in the power supply body, the vapor chamber is hollow inside and is in a negative pressure state, the vapor chamber is filled with a liquid working medium, one end of the vapor chamber is an evaporation end, and the other end of the vapor chamber is a condensation end, the evaporation end absorbs heat and gradually transfers it to the condensation end, the capillary plate is located inside the vapor chamber, and the capillary plate can transport the liquid working medium from the condensation end to the evaporation end to form a cycle; A support column, wherein the support column is located inside the heat spreader, the bottom of the support column has a conical opening, the small end faces upward, the large end faces downward, and a flow hole is opened on the side wall of the conical opening, the large end of the conical opening at the bottom of the support column abuts against the capillary plate, and the upper end of the support column abuts against the inner wall of the heat spreader.

2. The high-power ATX power supply module according to claim 1, characterized in that: The heat spreader includes an upper shell plate and a lower shell plate, which are fitted together to form a sealed cavity. A conical groove is provided on the upper surface of the upper shell plate, and the conical groove passes through the bottom of the upper shell plate downward and has a conical tip protruding downward. The small end of the conical tip is connected to the support column, the upper end of the support column cooperates with the conical tip, and the diameter of the support column gradually decreases from bottom to top.

3. The high-power ATX power supply module according to claim 1, characterized in that: The support column is made of metal copper.

4. The high-power ATX power supply module according to claim 1, characterized in that: There are a plurality of support columns, which are evenly distributed inside the heat spreader. Connecting rods are provided between adjacent support columns, and the connecting rods connect the plurality of support columns into a whole.

5. The high-power ATX power supply module according to claim 1, characterized in that: The capillary plate is a copper powder sintered capillary plate.

6. The high-power ATX power supply module according to claim 1, characterized in that: The heat dissipation assembly also includes a heat dissipation fan and heat dissipation fins. The heat dissipation fins are located near the heat spreader. The heat dissipation fan is located above the heat dissipation fins and the heat spreader. The heat dissipation fan can blow out the heat inside the power supply body.

7. The high-power ATX power supply module according to claim 6, characterized in that: A fence slot is provided on the upper end surface of the power supply body, and the heat blown out by the heat dissipation fan passes through the fence slot.

8. The high-power ATX power supply module according to claim 1, characterized in that: One end surface of the power supply body where the power supply interface is located is a dustproof screen.

9. The high-power ATX power supply module according to claim 8, characterized in that: The dustproof screen plate is detachably mounted on the power supply body.

10. The high-power ATX power supply module according to claim 1, characterized in that: The power source body is provided with a switch, and the switch can control the on and off of the power source.

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