Digital and analog quantity module board-level hardware testing device

Abstract

The utility model discloses a digital and analog quantity module board-level hardware testing device, which comprises a testing mainboard, the testing mainboard comprises an MCU and a communication testing interface, the MCU is electrically connected with the communication testing interface, and the communication testing interface comprises a CANFD communication interface and a Modbus-RTU communication interface; the utility model discloses a Modbus-RTU network adapter, which comprises an MCU (Microprogrammed Control Unit), a Modbus-RTU communication interface, a Modbus-RTU network adapter and an extended IO (Input / Output) module of the Modbus-RTU network adapter, the Modbus-RTU network adapter is in communication connection with the MCU through the Modbus-RTU communication interface, and the Modbus-RTU network adapter is in communication connection with an IO module for testing through the extended IO module. According to the testing device, testing of different modules can be achieved by adopting the same testing mainboard, the situation that different testing devices need to be adopted for testing different modules is avoided, and the testing cost is effectively reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of digital quantity / analog quantity module testing, and in particular relates to a digital and analog quantity module board-level hardware testing device. Background Art

[0002] Existing digital and analog module testing technologies can be mainly divided into three categories: manual testing, semi-automatic equipment testing and fully automatic equipment testing.

[0003] Among them, manual testing is mainly based on manual operation by testers. The test results are easily affected by human factors, with low accuracy and reliability, long test time and low test efficiency.

[0004] Semi-automatic equipment testing is mainly based on test equipment, supplemented by test personnel. The test results are more accurate, saving time and labor costs and improving test efficiency. However, different test equipment needs to be used to test different modules, which increases equipment costs.

[0005] Fully automatic testing equipment is mainly based on testing equipment, with accurate test results, saving time and labor costs, and high testing efficiency. However, different testing equipment is required to test different modules, which increases equipment costs, has low portability, and occupies a large area. Summary of the invention

[0006] In order to solve the problem that different testing equipment is needed to be used to test different modules in the existing testing technology, resulting in high equipment cost, the present invention provides a digital and analog module board-level hardware testing device. The present invention adopts a test mainboard that is compatible with different test modules, and only needs to select the output source according to different modules to be tested, thereby effectively solving the problem that different testing equipment is needed to be used to test different modules in the existing testing technology, resulting in high equipment cost.

[0007] The present invention is achieved through the following technical solutions:

[0008] A digital and analog module board-level hardware testing device, the testing device comprising:

[0009] A test mainboard, wherein the test mainboard comprises an MCU and a communication test interface, wherein the MCU is electrically connected to the communication test interface, and the communication test interface comprises a CANFD communication interface and a Modbus-RTU communication interface; the MCU is communicatively connected to the module to be tested via the CANFD communication interface;

[0010] and a Modbus-RTU network adapter and an extended IO module thereof, wherein the Modbus-RTU network adapter is communicatively connected to the MCU via the Modbus-RTU communication interface, and the Modbus-RTU network adapter is communicatively connected to an IO module matching the module to be tested via the extended IO module.

[0011] The existing digital and analog module testing technology requires different testing equipment to test different modules, which has high equipment cost, low equipment portability and large floor space. The test device proposed in the present invention uses a test mainboard combined with Modbus-RTU communication and CAN communication to connect different IO module input / output sources according to the function of the module to be tested, so as to be compatible with the test of different modules. Therefore, the test device proposed in the present invention can realize the test of different modules by using the same test mainboard, avoiding the need to use different test equipment to test different modules, effectively reducing the test cost. At the same time, the test device proposed in the present invention has a high degree of integration, small floor space, and is easy to transfer to various application scenarios, with a wide range of applications.

[0012] As a preferred embodiment, the Modbus-RTU network adapter of the present invention adopts a CN-8011 network adapter;

[0013] The extended IO module adopts CT-623F module.

[0014] As a preferred embodiment, the test mainboard of the present invention further includes a display screen, which is electrically connected to the MCU and is used to display the current test progress and test results to achieve human-computer interaction.

[0015] As a preferred embodiment, the test mainboard of the present invention further includes a power input interface, and the power input interface is used to supply power to the MCU and the Modbus-RTU network adapter.

[0016] As a preferred embodiment, the testing device of the present invention also includes a power test interface, the MCU is electrically connected to the power test interface, the power test interface includes an input and an output, wherein the power test interface outputs power to power the module to be tested, and the power test interface input is used to receive the power status of the module to be tested for power detection.

[0017] As a preferred embodiment, the test mainboard of the present invention further includes a button group, and the button group includes three buttons: start, stop and reset.

[0018] As a preferred embodiment, the testing device of the present invention further comprises a capacitive proximity switch;

[0019] The power supply end of the capacitive proximity switch is electrically connected to the power input interface, and the high level output end of the capacitive proximity switch is electrically connected to the extended IO module. The present invention triggers the MCU to start testing by setting a capacitive proximity switch, thereby improving test efficiency.

[0020] As a preferred embodiment, the MCU of the present invention adopts ATSAME54.

[0021] As a preferred embodiment, the testing device of the present invention also includes a Modbus debugging interface and / or a CAN modulation interface, wherein the Modbus debugging interface is used for an external debugging device to perform Modbus-TRU communication interface fault debugging, and the CAN debugging interface is used for an external debugging device to perform CANFD communication interface fault debugging.

[0022] As a preferred embodiment, the testing device of the present invention further comprises: a pin header for plugging in an IO module required for testing.

[0023] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0024] 1. The test device proposed in the present invention can test a variety of modules to be tested by using the same test mainboard, and only needs to select the corresponding IO module input / output source according to the performance of the module to be tested, thereby overcoming the defect that different test equipment is required to test different modules in the prior art, resulting in high test costs;

[0025] 2. The test device proposed by the present invention has a high degree of integration, occupies a small area, is easy to move to various application occasions, and has a wide range of uses;

[0026] 3. The test device proposed in the present invention can also be used to automatically trigger the MCU to start testing by setting a capacitive proximity switch, thereby reducing manual operation steps and improving test efficiency;

[0027] 4. The test device proposed in the present invention also facilitates fault debugging of the communication interface by setting a debugging interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0029] Figure 1 The figure is a principle block diagram of a testing device according to an embodiment of the present invention.

[0030] Figure 2 4 is a circuit schematic diagram of a testing device according to an embodiment of the present invention.

[0031] Figure 3 Schematic diagram of a pin header according to an embodiment of the present invention.

[0032] Figure 4 Schematic diagram of a digital quantity module (module to be tested) and its corresponding IO module according to an embodiment of the present invention.

[0033] Figure 5 Schematic diagram of an analog quantity module (module to be tested) and its corresponding IO module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] Hereinafter, the term "include" or "may include" used in various embodiments of the present invention indicates the presence of the invented function, operation or element, and does not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0035] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0036] The expressions (such as "first", "second", etc.) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first element and the second element indicate different elements, although both are the same components. For example, without departing from the scope of various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0037] It should be noted that if it is described that one component element is “connected” to another component element, the first component element may be directly connected to the second component element, and a third component element may be “connected” between the first component element and the second component element. Conversely, when one component element is “directly connected” to another component element, it can be understood that there is no third component element between the first component element and the second component element.

[0038] The terms used in various embodiments of the present invention are only used for the purpose of describing specific embodiments and are not intended to limit various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise limited, all terms used here (including technical terms and scientific terms) have the same meaning as the meaning generally understood by those of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as the terms defined in the dictionary generally used) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in various embodiments of the present invention.

[0039] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0040] Example:

[0041] The existing digital and analog module testing technology requires different testing equipment to test different modules, which has high equipment cost, low equipment portability and large floor space. In view of the above problems, this embodiment proposes a digital and analog module board-level hardware testing device. The testing device proposed in this embodiment adopts a new testing motherboard with strong compatibility, and combines Modbus-RTU communication and CAN communication to realize the use of different IO module input / output sources according to the function of the module to be tested, so as to be compatible with the testing of different modules, overcoming the defect of the prior art that different testing equipment is required to test different modules, resulting in increased testing costs.

[0042] The test device proposed in this embodiment specifically includes: a test mainboard and a Modbus-RTU network adapter and its extended IO module.

[0043] like Figure 1 As shown, the test mainboard includes MCU and communication test interface, etc. Among them, the communication test interface provides 1 CANFD communication interface, 1 Modbus-RTU communication interface and token line interface. The Modbus-RTU network adapter communicates with the MCU through the Modbus-RTU communication interface, and the Modbus-RTU network adapter communicates with the IO module of the module to be tested through the extended IO module; the MCU communicates with the module to be tested through the CANFE communication interface. Specifically, Figure 2As shown, the Modbus-RTU communication interface of the test mainboard includes pins 019, 018 and 017, and the CANFD communication interface of the test mainboard includes pins 004, 005 and 001 (output token line interface) for sending data, and pins 009 (input token line interface), 012 and 013 for receiving data; the CANFD communication interface is responsible for communicating with the module to be tested, and the Modbus-RTU communication interface is responsible for communicating with CT-8011 (CN-8011 network adapter supports standard Modbus-RTU communication), and can monitor the communication status of the IO module in real time. The MCU adopts ATSAME54, the PB20 pin of the MCU is electrically connected to the 018 pin (i.e. B) of the Modbus-RTU communication interface, the PB21 pin of the MCU is electrically connected to the 019 pin (i.e. A) of the Modbus-RTU communication interface, the PC19 pin of the MCU is electrically connected to the 001 pin (i.e. TLOA) of the token line interface, the PB14 pin of the MCU is electrically connected to the 004 pin (i.e. AH) and the 012 pin (i.e. BH) of the CANFD communication interface, the PB15 pin of the MCU is electrically connected to the 005 pin (i.e. AL) and the 013 pin (i.e. BL) of the CANFD communication interface, and the PC18 pin of the MCU is electrically connected to the 009 pin (i.e. TLIA) of the token line interface.

[0044] Furthermore, the Modbus-RTU network adapter of this embodiment can adopt CN-8011 network adapter, which is a device independently developed by our company and supports the standard Modbus-RTU communication protocol. The expansion IO module can adopt CT-623F module, which is a device independently developed by our company and is an 8-channel 24V high-level digital output and 8-channel 24V high-level digital input module. Figure 2 As shown, the A+ pin of the CN-8011 network adapter is connected to the 019 pin of the test mainboard, the B- pin of the CN-8011 network adapter is connected to the 018 pin of the test mainboard, and the SGND pin of the CN-8011 network adapter is connected to the 017 pin of the test mainboard; the CN8011 network adapter is powered by DC 24V.

[0045] Furthermore, the test mainboard of the present embodiment also includes: a display screen, a power supply test interface, a power supply input interface and / or a button group, wherein the display screen is used to display the current test progress and test results to realize human-computer interaction; the power supply test interface provides the required field power supply DC 24V and system power supply DC 5V for the module to be tested on the one hand, and on the other hand, determines whether the field power supply DC 24V and system power supply DC 5V of the tested module are short-circuited through different detection states, and the power supply test interface includes both input and output; the power supply input interface is used to access the input power required by the test mainboard; the button group provides a total of three buttons: start, stop, and reset. Specifically, Figure 2 As shown, the power input interface of the test mainboard includes a 24V2 pin and a GND2 pin; the power test interface output of the test mainboard includes a 002 pin and a 003 pin (for outputting 5V), and a 006 pin and a 007 pin (for outputting 24V), and the power test interface input of the test mainboard includes a 014 pin and a 015 pin (for measuring 24V), and a 010 pin and a 011 pin (for measuring 5V); the buttons of the test mainboard include K1, K2, and K3, which correspond to reset, stop, and start buttons, respectively; the PB00 pin, PB01 pin, and PB02 pin of the MCU are electrically connected to K1, K2, and K3, respectively; the PA02 pin, PA04 pin, PA05 pin, and PA06 pin of the MCU are electrically connected to BLK, MOSI, SCLK, and MISO of the display, respectively.

[0046] Furthermore, the testing device of this embodiment also includes:

[0047] Capacitive proximity switch, the capacitive proximity switch is connected to the power input interface and CT-623F, as shown below Figure 2 As shown, the positive and negative ends of the power supply of the capacitive proximity switch are respectively connected to the high voltage end and the ground end of the power input interface, and the capacitive proximity switch is powered by DC 24V; the output end of the capacitive proximity switch is connected to the DI0 channel of CT-623F. The test device can trigger the MCU to start the test by manually closing the capacitive proximity switch; it can also detect the installation status of the module to be tested, and when the module to be tested is installed, it automatically closes to trigger the MCU to start the test. The triggering principle is: when the capacitive proximity switch is closed, a 24V high level will be generated, which is detected by CT-623F and the data is transmitted to the CN-8011 network adapter. The CN-8011 network adapter transmits the data to the MCU through the Modbus-RTU communication interface, thereby achieving the purpose of triggering the start of the test. This embodiment can avoid the user from operating the start button on the test mainboard by adding a capacitive proximity switch, which is easy to operate and improves the test efficiency.

[0048] Furthermore, the test device of this embodiment also includes a Modbus debugging interface, which is used for external debugging equipment to debug Modbus-RTU communication interface faults. The test device of this embodiment also includes a CAN debugging interface, which is used for external debugging equipment to debug CANFD communication interface faults.

[0049] Furthermore, the testing device of this embodiment also includes a switch button, which is arranged between the power input interface and the testing mainboard and is used to control whether the power input interface supplies power to the testing mainboard.

[0050] Furthermore, the test device of this embodiment further comprises: a pin header for inserting the module to be tested, such as Figure 3 shown.

[0051] The working principle of the test device proposed in this embodiment is: the MCU controls the relay to hit the output voltage of the power test interface output terminal, and the voltage returns to the input terminal of the power test interface after passing through the module to be tested. The MCU uses a comparator to determine whether the voltage is normal, thereby determining whether the power supply of the module to be tested is normal; the MCU controls the CANFD communication interface to send request data, and the module to be tested transmits the data back to the CANFD communication interface after receiving the data, and finally the MCU determines whether the recovered data packet is correct, thereby determining whether the communication of the module to be tested is normal; different IO module input / output sources are used according to the function of the module to be tested, for example, if the module to be tested is an analog input module, an analog output source needs to be selected; if the module to be tested is a digital input module, a digital output module needs to be selected; if the module to be tested is a digital output module, a digital input module needs to be selected, etc. That is, the test mainboard proposed in this embodiment is compatible with the test of different digital and analog modules, and only needs to select the output source according to different modules to be tested, thereby effectively reducing the equipment cost and reducing the floor space at the same time, and can be set at will in different application sites, with strong portability.

[0052] The test device of this embodiment is used to test a digital quantity module (module to be tested). The digital quantity module is CT-121F, which is a 16-channel 24V high-level digital quantity input module. Therefore, the IO module is selected as the digital quantity output module, which can be specifically CT-222F, which is a 16-channel 24V high-level digital quantity output module. The CT-222F and CT-121F channels are connected one-to-one, as shown in FIG. Figure 4 As shown in the figure, the capacitive proximity switch is closed, generating a 24V high level. At this time, the CT-623F detects the high level and transmits it to the CN-8011 network adapter. The CN-8011 network adapter transmits it to the MCU of the test mainboard through the Modbus-RTU communication interface, thereby triggering the start of the test.

[0053] After the test starts, power supply test, communication test and channel test can be performed. Among them, the power supply test principle is as follows: MCU controls the relay to output 24V and 5V voltages at the output end of the power supply test interface. After passing through the module to be tested, the voltage passes through the input end of the power supply test interface to perform a power supply status test. The communication test principle is as follows: MCU sends request data to the module to be tested through the CANFD communication interface and token line. After processing, the module to be tested returns data to the MCU through the CANFD communication interface and token line to perform a communication status test. The channel test principle is as follows: MCU controls CN-8011 and CT-623F through the Modbus-RTU communication interface to make all channels of CT-222F output 24V high level. At this time, after the module to be tested detects the 24V high level, it outputs the corresponding status and then uploads the status to the MCU through the CANFD communication interface for channel status test.

[0054] The test device of this embodiment is used to test an analog module (module to be tested). The analog module is CT-4154, which is a 4-channel voltage output module that can be selected according to the range and has a maximum output voltage of ±10V. Based on this, the IO module is selected as the analog input module, which can be specifically CT-3168, which is an 8-channel voltage input module that can be selected according to the range and has a maximum input voltage of ±10V. The first four channels of CT-4154 and CT-3168 are connected one by one, as shown in FIG. Figure 5 As shown. This test step is basically the same as the above digital module test step. The difference is that when testing the analog module channel function, the MCU of the test mainboard sends instructions to the module under test through the CANFD communication interface and the token line to make the module under test output voltage, such as channel 1 outputs -10V, channel 2 outputs -5V, channel 3 outputs 5V, and channel 4 outputs 10V. Then, the input voltage of the four channels of the CT-3186 module is obtained through CN-8011 and CT-623F and transmitted to the MCU through the Modbus-RTU communication interface for channel status testing.

[0055] According to the above examples, the test device of this embodiment can use the same test motherboard to test multiple modules to be tested. It only needs to select the corresponding IO module output source or input source according to the performance of the module to be tested, which overcomes the problem that different test equipment is required to test different modules to be tested in the prior art, resulting in high test costs. At the same time, the test device of this embodiment has a high degree of integration, a small footprint, and is convenient to be transferred to various application occasions, with a wide range of applications.

[0056] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A digital and analog module board-level hardware testing device, characterized in that: The testing device comprises: A test mainboard, wherein the test mainboard comprises an MCU and a communication test interface, wherein the MCU is electrically connected to the communication test interface, and the communication test interface comprises a CANFD communication interface and a Modbus-RTU communication interface; the MCU is communicatively connected to the module to be tested via the CANFD communication interface; and a Modbus-RTU network adapter and an extended IO module thereof, wherein the Modbus-RTU network adapter is communicatively connected to the MCU via the Modbus-RTU communication interface, and the Modbus-RTU network adapter is communicatively connected to an IO module matching the module to be tested via the extended IO module.

2. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The Modbus-RTU network adapter adopts a CN-8011 network adapter; The extended IO module adopts CT-623F module.

3. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The test mainboard also includes a display screen, which is electrically connected to the MCU and is used to display the current test progress and test results to achieve human-computer interaction.

4. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The test mainboard also includes a power input interface, and the power input interface is used to supply power to the MCU and the Modbus-RTU network adapter.

5. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The testing device also includes a power test interface, the MCU is electrically connected to the power test interface, the power test interface includes an input and an output, wherein the power test interface outputs power to power the module to be tested, and the power test interface input is used to receive the power status of the module to be tested for power detection.

6. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The test mainboard also includes a button group, which includes three buttons: start, stop and reset.

7. A digital and analog module board-level hardware testing device according to claim 4, characterized in that: The test device also includes a capacitive proximity switch; The power supply end of the capacitive proximity switch is electrically connected to the power input interface, and the high level output end of the capacitive proximity switch is electrically connected to the extended IO module.

8. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The MCU adopts ATSAME54.

9. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The test device also includes a Modbus debugging interface and / or a CAN debugging interface. The Modbus debugging interface is used to connect an external debugging device to perform Modbus-TRU communication interface fault debugging. The CAN debugging interface is used to connect an external debugging device to perform CANFD communication interface fault debugging.

10. A digital and analog module board-level hardware testing device according to claim 1, characterized in that: The testing device also includes: a pin header for plugging in an IO module required for the test.

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