Inverted double-layer LED package capable of improving brightness
By using a double-layer design and hollow hole structure of red fluorescent film and green fluorescent glue in flip LED package, the problems of low absorption efficiency and chip offset in the existing technology are solved, and brightness improvement and welding stability are achieved Enhanced.
Patent Information
- Application Number
- CN202323646823.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2033-12-29
AI Technical Summary
In the existing flip LED package, the secondary absorption phenomenon caused by mixed fluorescent glue reduces the light output efficiency, and the solder paste eutectic soldering is likely to cause LED chip offset and dummy soldering.
A double-layer design of red fluorescent film and green fluorescent glue is adopted. The red fluorescent film has hollow holes in the bowl and cup bracket. The hollow hole shape is similar to that of the LED chip. The LED chip is fixed to prevent deviation, while reducing light absorption and improving light output efficiency. .
It improves the brightness of the LED package and prevents chip offset and dummy soldering, and enhances light output efficiency and welding stability.
Smart Images
Figure CN222214205U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LEDs, in particular to an inverted double-layer LED package for improving brightness. Background Art
[0002] Ordinary flip-chip LED packaging includes a bowl-cup bracket, a flip-chip LED chip fixed in the bowl-cup bracket, and fluorescent glue. The existing fluorescent glue uses mixed fluorescent glue, and the fluorescent powder has secondary absorption, which leads to reduced light output efficiency; in addition, the flip-chip is easily offset and poorly soldered during eutectic soldering with solder paste. Summary of the invention
[0003] The technical problem to be solved by the utility model is to provide a flip-chip double-layer LED package with improved brightness, which can improve the brightness and solve the problem of chip offset and cold soldering.
[0004] In order to solve the above technical problems, the technical solution of the utility model is: a flip-chip double-layer LED package for improving brightness, including a bowl-cup bracket and an LED chip arranged in the bowl-cup bracket, a red fluorescent film is arranged at the bottom of the bowl-cup bracket, a hollow hole is arranged in the middle of the red fluorescent film, the LED chip is fixed in the hollow hole, the top surface of the red fluorescent film is not higher than the top surface of the LED chip, and a green fluorescent glue covering the red fluorescent film and the LED chip is arranged in the bowl-cup bracket. Principle of the utility model: the fluorescent layer adopts a double-layer design, and the red fluorescent film and the green fluorescent glue are designed in layers to reduce light absorption, help improve light extraction efficiency, and thus improve brightness; the red fluorescent film not only has an excitation effect, but also the hollow holes arranged therein can constrain the LED chip to prevent the eutectic from offsetting.
[0005] As an improvement, the bowl and cup holder includes a plastic frame, a first electrode plate, a second electrode plate and an insulating tape; the LED chip is a flip chip, and the two electrodes at the bottom of the LED chip are respectively welded to the first electrode plate and the second electrode plate.
[0006] As an improvement, the top surface of the red fluorescent film is a roughened surface.
[0007] As an improvement, the shape of the hollow hole is similar to the shape of the LED chip.
[0008] Compared with the prior art, the utility model has the following beneficial effects:
[0009] The fluorescent layer adopts a double-layer design, with red fluorescent film and green fluorescent glue in a layered design to reduce light absorption, help improve light output efficiency, and thus increase brightness; the red fluorescent film not only has an excitation effect, but the hollow holes it provides can constrain the LED chip to prevent the eutectic from shifting. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 This is a cross-sectional view of the present utility model.
[0011] Figure 2 This is a top view of the present utility model. Embodiment
[0012] The present utility model will be further described below in conjunction with the accompanying drawings of the specification.
[0013] As Figure 1 、 2 shown, a flip-chip double-layer LED package for enhancing brightness includes a bowl cup bracket and an LED chip disposed within the bowl cup bracket. The bowl cup bracket includes a plastic frame 3, a first electrode plate 1, a second electrode plate 2, and an insulating tape 4; the LED chip 6 is a flip-chip, and the two electrodes at the bottom of the LED chip 6 are respectively welded to the first electrode plate 1 and the second electrode plate 2. A red fluorescent film 5 is provided at the inner bottom of the bowl cup bracket, and the area of the red fluorescent film 5 is similar to the bottom area of the bowl cup bracket. The red fluorescent film 5 can be fixed to the bottom of the bowl cup bracket by glue; the red fluorescent film 5 is in a shape of a square frame with a hollow hole in the middle, the shape of the hollow hole 51 is similar to the shape of the LED chip 6, the LED chip 6 is fixedly disposed within the hollow hole 51, and the top surface of the red fluorescent film 5 is not higher than the top surface of the LED chip 6; a green fluorescent glue 7 covering the red fluorescent film 5 and the LED chip 6 is provided within the bowl cup bracket; the top surface of the red fluorescent film 5 is a roughened surface to enhance the bonding with the green fluorescent glue 7. The packaging sequence of the present utility model is: attaching the red fluorescent film 5, fixing the flip-chip, and dispensing the green fluorescent glue 7.
[0014] Principle of the present utility model: The fluorescent layer adopts a double-layer design, with the red fluorescent film 5 and the green fluorescent glue 7 designed in layers, reducing the light absorption phenomenon, contributing to improving the light extraction efficiency, and thus enhancing the brightness; the red fluorescent film 5 not only has an excitation effect, but also the hollow hole 51 provided therein can restrain the LED chip 6 to prevent the eutectic from shifting.
Claims
1. A flip-chip double-layer LED package for improving brightness, comprising a cup holder and an LED chip arranged in the cup holder, Features: A red fluorescent film is provided at the bottom of the bowl and cup holder, a hollow hole is provided in the middle of the red fluorescent film, the LED chip is fixed in the hollow hole, the top surface of the red fluorescent film is not higher than the top surface of the LED chip, and green fluorescent glue covering the red fluorescent film and the LED chip is provided in the bowl and cup holder.
2. A double-layer flip-chip LED package with improved brightness according to claim 1, Features: The bowl and cup support comprises a plastic frame, a first electrode plate, a second electrode plate and an insulating tape; the LED chip is a flip chip, and two electrodes at the bottom of the LED chip are respectively welded on the first electrode plate and the second electrode plate.
3. A double-layer flip-chip LED package with improved brightness according to claim 1, Features: The top surface of the red fluorescent film is a roughened surface.
4. A double-layer flip-chip LED package for improving brightness according to claim 1, Features: The shape of the hollow hole is similar to the shape of the LED chip.