High-heat-dissipation photovoltaic chip module

Abstract

The utility model discloses a high-heat-dissipation photovoltaic chip module, and relates to a solar power generation assembly. Comprising a protective shell, a lead-out conductor I, a chip and a lead-out conductor II, the bottoms of the lead-out conductor I and the lead-out conductor II are respectively positioned in the packaging cavity, and the tops of the lead-out conductor I and the lead-out conductor II respectively extend upwards and extend out of the packaging cavity; and the leading-out conductor II is directly welded to the front surface above the chip. As the heat source generation position of the Schottky chip is the front surface above the Schottky chip, the heat generated by the chip can be quickly conducted out through the leading-out conductor I and the leading-out conductor II, the junction temperature of the chip is quickly reduced, and the higher bearing current of the junction box is realized.

Description

Technical Field

[0001] The utility model relates to a solar power generation component, in particular to a high heat dissipation photovoltaic chip module. Background Art

[0002] The main function of the photovoltaic junction box is to connect the high current of the photovoltaic module and to provide timely protection when the photovoltaic module has a hot spot effect. The key to this is the automatic protection chip used inside the photovoltaic junction box. As the power of photovoltaic modules increases, their operating current also increases, from a few amperes to dozens of amperes. At this time, the automatic protection chip of the junction box generates a lot of heat when working. How to solve the problem of rapid heat dissipation has become a bottleneck for the current development of photovoltaic modules towards high power.

[0003] Most of the current photovoltaic junction boxes are produced by packaging the automatic protection chip module into components and then assembling it into the junction box body. The automatic protection chip generally adopts the following two packaging schemes, such as Figure 7-8 As shown. After years of feedback from the photovoltaic module market, these two solutions still have problems of stress damage and insufficient heat dissipation capacity. For details, please refer to the following:

[0004] 1) Figure 7 Packaging solution:

[0005] The automatic protection chip is a heat source, and an aluminum strip or aluminum wire is used to connect two copper sheets. In this solution, the aluminum strip or aluminum wire has poor thermal conductivity and poor heat dissipation performance, and cannot achieve the wire box carrying capacity under high current.

[0006] 2) Figure 8 Packaging solution:

[0007] This solution uses two copper pillars to place the automatic protection chip in the center and weld them. Although the copper pillars are in direct contact with the chip and can conduct heat, due to the small diameter of the copper pillars, the heat is difficult to conduct quickly outside the packaged device. Therefore, the wire box still has the problem of being unable to carry large currents due to excessive heat. Utility Model Content

[0008] In view of the above problems, the utility model provides a high heat dissipation photovoltaic chip module with high heat dissipation capability and low packaging stress.

[0009] The technical solution of the utility model is:

[0010] High heat dissipation photovoltaic chip module, including:

[0011] A protective shell having a packaging cavity;

[0012] A lead conductor 1, the bottom of which is located in the packaging cavity; the top of which extends upward and protrudes from the packaging cavity;

[0013] A chip electrically connected to the bottom of the lead conductor 1;

[0014] The second lead-out conductor has a bottom portion located in the packaging cavity and electrically connected to the chip; and a top portion extending upward and extending out of the packaging cavity.

[0015] Specifically, the lead conductor 1 includes:

[0016] A first carrying part, the top surface of which is provided with a first mounting position for mounting the chip;

[0017] The first extension portion extends toward the opening of the protective shell;

[0018] The first outlet portion is located outside the protective shell.

[0019] Specifically, the lead conductor 2 includes:

[0020] The second carrying part has a second mounting position for mounting the chip on its bottom surface;

[0021] The second extension portion extends toward the opening direction of the protective shell;

[0022] The second outlet portion is located outside the protective shell.

[0023] Specifically, the lead conductor 1 is a positive lead conductor;

[0024] The second lead conductor is a negative electrode lead conductor.

[0025] Specifically, the lead-out conductor 1 and the lead-out conductor 2 are respectively provided with hollow parts at the parts extending from the protective shell.

[0026] Specifically, the first lead conductor and the second lead conductor are respectively in a Z-shaped structure.

[0027] Specifically, the top of the protective shell is provided with an opening.

[0028] Specifically, the bottom of the protective shell is in an arc-shaped structure extending downward.

[0029] Specifically, the protective shell is a metal aluminum protective shell or a copper protective shell;

[0030] The first lead-out conductor and the second lead-out conductor are respectively spaced apart from the protective shell.

[0031] Specifically, a plurality of heat sinks are fixedly provided on the outer side of the protective shell;

[0032] The top of the heat sink is connected to the lead-out conductor 1 and / or the lead-out conductor 2, and the bottom extends downward.

[0033] The plastic package encapsulates the lead-out conductor 1, the chip and the lead-out conductor 2 in a protective shell.

[0034] Beneficial effects of the utility model:

[0035] 1. The Schottky chip connection method eliminates the aluminum jumper and aluminum wire connection scheme used in the background technology, and directly welds the lead conductor 2 to the upper front of the chip. Since the heat source of the Schottky chip is generated on the upper front, this method can quickly conduct the heat generated by the chip through the lead conductor 1 and the lead conductor 2, quickly reduce the junction temperature of the chip, and thus achieve a larger carrying current of the junction box.

[0036] 2. After the chip is covered by the upper conductor, the epoxy encapsulation solution of the injection molding process can be used. Due to the coverage of the copper sheet, the high-voltage plastic material cannot impact the Schottky chip body, which greatly reduces the risk of damage by mechanical impact and also reduces the internal stress of the product.

[0037] 3. The chip installation position adopts a groove structure. After the chip is welded, it can be wrapped up and down. Liquid epoxy molding compound can be injected and cured. In this way, the chip is almost not subjected to any force, its stress is lower, and the risk of failure is greatly reduced. At the same time, the metal material of the groove can also quickly conduct the heat of the chip, improving the current carrying capacity of the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a schematic diagram of the utility model in a split state structure.

[0039] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model in an assembled state.

[0040] Figure 3 This is a three-dimensional structural diagram of the assembly state of the lead conductor 1, the lead conductor 2 and the protective shell.

[0041] Figure 4 This is a schematic diagram of the cross-sectional structure of the protective shell Figure 1 ,

[0042] Figure 5 This is a schematic diagram of the cross-sectional structure of the protective shell Figure 2 ,

[0043] Figure 6 This is a schematic diagram of the cross-sectional structure of the protective shell Figure 3 ,

[0044] Figure 7 This is a schematic diagram of the structure of two copper sheets connected by aluminum strips or aluminum wires in the background art.

[0045] Figure 8 It is a schematic diagram of the structure of placing a chip in the center using two copper pillars in the background technology;

[0046] In the figure, 100 is a protective shell.

[0047] 210 is a lead conductor 1, 211 is a bearing portion 1, 212 is an extension portion 1, 213 is a lead portion 1,

[0048] 220 is the lead conductor 2, 221 is the bearing portion 2, 222 is the extension portion 2, 223 is the lead portion 2,

[0049] 230 is a hollow part,

[0050] 300 is the chip,

[0051] 400 is the overflow slot,

[0052] 500 is the limit slot,

[0053] 600 is a high thermal conductivity insulation seat,

[0054] 700 is a box body, and 710 is a heat sink. DETAILED DESCRIPTION

[0055] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0056] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Reference below Figure 1-6 Describe the utility model;

[0059] High heat dissipation photovoltaic chip module, including:

[0060] The protective shell 100 is provided with a packaging cavity;

[0061] The lead conductor 210 has a bottom portion located in the packaging cavity and a top portion extending upward and extending out of the packaging cavity. The lead conductor 210 includes:

[0062] The first carrying part 211 has a first mounting position for mounting the chip 300 on its top surface;

[0063] An extension portion 212 extending toward the opening direction of the protective shell 100;

[0064] The first outlet portion 213 is located outside the protective shell 100 .

[0065] The chip 300 is electrically connected to the bottom of the lead conductor 1 210;

[0066] The second lead conductor 220 has a bottom portion located in the packaging cavity and electrically connected to the chip 300; a top portion extending upward and extending out of the packaging cavity; the second lead conductor 220 includes the following connected in sequence:

[0067] The second carrying part 221 has a second mounting position for mounting the chip 300 on its bottom surface;

[0068] The second extension portion 222 extends toward the opening direction of the protective shell 100;

[0069] The second outlet portion 223 is located outside the protective shell 100 .

[0070] In this case, the lead conductor 1 210 and the lead conductor 2 220 are respectively made of copper sheets, wherein the lead conductor 1 210 is a positive lead conductor, and the lead conductor 2 220 is a negative lead conductor.

[0071] After the chip 300 is covered by the upper supporting part 221, the high-pressure epoxy molding compound cannot directly impact the body of the Schottky chip 300, which greatly reduces the risk of damage by mechanical impact and also reduces the internal stress of the product.

[0072] In this case, the mounting position 1 is a groove-shaped structure adapted to the chip 300. After the chip 300 is welded to the mounting position 1, it is wrapped therein and injected and cured by liquid epoxy molding compound. During the injection, the chip 300 is hardly subjected to any force, and its stress is lower, and the risk of failure is also greatly reduced. At the same time, the lead-out conductor 210 with a groove can also quickly conduct the heat of the chip 300, thereby improving the current-carrying capacity of the junction box.

[0073] At the same time, the bottom surface of the second bearing part 221 is also provided with a groove-shaped structure adapted to the chip 300, which can not only improve the accuracy of positioning and welding of the chip 300, but also reduce the influence of the force when injecting the epoxy molding compound, and further improve the heat dissipation of the product.

[0074] The plastic package (or epoxy plastic package) packages the lead conductor 1 210, the chip 300 and the lead conductor 2 220 in the protective shell 100. The epoxy plastic package material includes a single-component epoxy resin, a two-component epoxy resin, a high-temperature epoxy resin, a liquid epoxy resin, a silicone epoxy resin and the like.

[0075] The connection of the Schottky chip (or automatic protection chip) 300 eliminates the copper jumper and aluminum bonding solution used in the prior art, and directly welds the lead conductor 220 to the upper front surface of the chip 300. Since the heat source of the Schottky chip 300 is generated at the upper front surface, this method can quickly conduct the heat generated by the chip 300 through the lead conductors (including the lead conductor 1 210 and the lead conductor 2 220), quickly reduce the junction temperature of the chip 300, and thus achieve a larger carrying current of the wire box.

[0076] The lead conductor is further defined as:

[0077] The lead conductor 1 210 and the lead conductor 2 220 are respectively in a Z-shaped structure, and the lead conductor 1 210 and the lead conductor 2 220 are respectively provided with a hollow portion 230 at the portion extending from the protective shell 100 (i.e., the lead portion 1 213 and the lead portion 223). The addition of structures such as the bend and the hollow portion 230 on the positive and negative lead conductors further reduces the impact on the chip when external impact occurs.

[0078] The protective case 100 further defines:

[0079] The protective shell 100 is made of a highly thermally conductive metal such as aluminum, copper or a high molecular polymer, with an opening on the top and an arc-shaped structure extending downward on the bottom, which can quickly dissipate the heat generated by the automatic protection chip 300, further improving the heat dissipation performance of the wiring box.

[0080] The lead conductor 1 210 and the lead conductor 2 220 are spaced apart from the protective shell 100 , that is, a gap is provided between the lower part of the lead portion 1 213 and the lower part of the lead portion 223 and the top edge of the protective shell.

[0081] The protective case 100 is further optimized:

[0082] Solution 1: A plurality of heat sinks 710 are fixedly provided on the outer side of the protective shell 100;

[0083] The top of the heat sink 710 is connected to the lead conductor 1 210 and / or the lead conductor 2 220, and the bottom extends downward. The heat sink 710 can be made of aluminum, copper, graphite, ceramic, high molecular polymer plastic, etc. The heat sink material is arranged in the wire box and is fixed in direct contact with the lead conductor 1 210 and the lead conductor 2 220 through the wire box. Figure 2 shown.

[0084] Placing heat dissipation material in the wire box product, which is in contact with the conductor, can further accelerate the conduction of chip heat, reduce its junction temperature, and improve the current carrying capacity of the wire box.

[0085] Option 2: Figure 5 As shown, an overflow groove 400 of an annular structure is provided on the outer side of the top opening of the protective shell 100, and the overflowed epoxy molding compound flows into the overflow groove 400. At the same time, part of the epoxy molding compound is solidified at the top opening position, which effectively prevents the lead-out conductor 1 210 and the lead-out conductor 2 220 from contacting the top opening of the metal protective shell 100 and causing product failure.

[0086] Option 3: Figure 6 As shown, a fixedly arranged high thermal conductivity insulating seat 600, such as a high thermal conductivity ceramic, is provided at the bottom of the packaging cavity of the protective shell 100; the bottom of the lead-out conductor 210 is in contact with the top surface of the high thermal conductivity insulating seat 600, which can not only be used to limit the connection between the lead-out conductor 1 210 and the lead-out conductor 2 220 components of the chip 300, but also quickly conduct the heat generated by the chip 300 to the outside through the lead-out conductor 210 and the high thermal conductivity insulating seat 600.

[0087] Option 4: Figure 6 As shown, the side wall of the protective shell 100 is provided with a limiting groove 500 protruding outward, and the epoxy molding compound flows into the limiting groove 500, which effectively improves the problem of connecting the chip 300 to the lead conductor 1 210 and the lead conductor 2 220 components, and prevents movement in the up and down directions, which affects the product service life and operation stability.

[0088] The preparation method of the photovoltaic chip wire box with high heat dissipation and low stress is prepared by the following steps:

[0089] Step S100, the chip 300 is mounted on the mounting position 1 of the lead conductor 1 210 by soldering;

[0090] Step S200, placing the bottom mounting position 2 of the second lead-out conductor 220 on the front side of the chip 300, and soldering the chip 300 and the second lead-out conductor 220 together with solder;

[0091] Step S300, placing the welding piece formed by the lead conductor 1 210, the lead conductor 220 and the chip 300 into the protective shell 100;

[0092] Step S400, fill the packaging cavity with epoxy molding compound and solidify it. Finally, the product of this case is assembled into a box body 700 to form a photovoltaic wire box product.

[0093] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0094] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0095] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0096] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. High heat dissipation photovoltaic chip module, It is characterized in that include: A protective shell (100) is provided with a packaging cavity; Lead-out conductor 1 (210), the bottom of which is located in the packaging cavity; The top portion extends upward and extends out from the packaging cavity; A chip (300) electrically connected to the bottom of the first lead conductor (210); A second lead conductor (220), the bottom of which is located in the packaging cavity and is electrically connected to the chip (300); The top portion extends upward and extends out from the packaging cavity.

2. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The lead conductor 1 (210) comprises: A first carrying portion (211), the top surface of which is provided with a first mounting position for mounting the chip (300); An extension portion 1 (212) extending towards the opening direction of the protective shell (100); The first outlet portion (213) is located outside the protective shell (100).

3. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The lead conductor 2 (220) includes: A second carrying portion (221), the bottom surface of which is provided with a second mounting position for mounting the chip (300); A second extension portion (222) extending towards the opening direction of the protective shell (100); The second outlet portion (223) is located outside the protective shell (100).

4. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The lead conductor 1 (210) is a positive lead conductor; The second lead conductor (220) is a negative electrode lead conductor.

5. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The lead-out conductor 1 (210) and the lead-out conductor 2 (220) are respectively provided with hollow portions (230) at the portions extending from the protective shell (100).

6. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The lead conductor 1 (210) and the lead conductor 2 (220) are respectively in a Z-shaped structure.

7. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The bottom of the protective shell (100) is in an arc-shaped structure extending downwards.

8. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that The protective shell (100) is a metal aluminum protective shell or a copper protective shell; The lead-out conductor 1 (210) and the lead-out conductor 2 (220) are respectively arranged at intervals from the protective shell (100).

9. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that A plurality of heat sinks (710) are fixedly provided on the outside of the protective shell (100); The top of the heat sink (710) is connected to the lead-out conductor 1 (210) and / or the lead-out conductor 2 (220), and the bottom extends downward.

10. The high heat dissipation photovoltaic chip module according to claim 1, It is characterized in that Also includes: A plastic package encapsulates the lead conductor 1 (210), the chip (300) and the lead conductor 2 (220) in a protective shell (100).

Images