Receiving and transmitting module assembly with high integration level

Abstract

The utility model discloses a receiving and transmitting module assembly with high integration level, which relates to the technical field of receiving and transmitting modules and comprises a base and a microwave and millimeter wave component, the microwave and millimeter wave component is fixedly connected to the middle of the interior of the base, and receiving modules are fixedly connected to four corners of the upper surface of the interior of the base. Sending modules are fixedly connected to the four edges of the upper surface of the interior of the base, a cover plate is arranged on the upper surface of the base, a cavity is formed in the base, clamping blocks are fixedly connected to the upper surface of the base, positioning holes are formed in the four corners of the upper surface of the base, and heat dissipation holes are formed in the cover plate. Compared with an existing common transceiving module, the receiving and transmitting module assembly with high integration level has the advantages that in order to better meet the customization requirement of a user, microwave and millimeter wave components at a proper frequency are selected, and meanwhile, the receiving module and the transmitting module are matched, so that the purposes of high integration of a W wave band, low noise, high power, low power consumption and small size are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of receiving and transmitting modules, in particular to a receiving and transmitting module component with high integration. Background Art

[0002] According to the frequency classification, millimeter waves generally refer to electromagnetic waves with a wavelength between 1mm and 10mm. Compared with other bands, millimeter waves have a shorter wavelength and a stronger ability to penetrate the ionosphere. They have a stronger ability to penetrate smoke, clouds and other bad weather than infrared and visible light. They can work around the clock, and because of their relatively wide bandwidth, they can achieve point-to-point large-capacity communications and high-resolution imaging.

[0003] For example, a W-band transceiver assembly with application number 201310187853.6 includes a local oscillator power distribution board, a transmitting link, a receiving link, and a local oscillator link. It includes a single-channel receiving module, a three-channel receiving module, an up-conversion module, a power synthesis module, and a frequency multiplication module. Each functional module is vertically connected to the local oscillator power distribution board through a waveguide interface. Each functional module of the present invention is vertically connected to the waveguide type local oscillator power distribution board through a waveguide interface, which reduces the parasitic effects caused by packaging and interconnection; each component in the functional module adopts a three-dimensional structure arrangement, and the components in the radio frequency link and the power printed circuit board are vertically interconnected through insulators, which enhances the isolation of the power supply and components and improves the electromagnetic compatibility of the transceiver assembly. At the same time, different electronic components are installed in different cavity layers, and each component in the same layer is arranged in a planar hybrid integration manner to achieve miniaturization, integration and high reliability of the W-band transceiver assembly, but the production of the transceiver assembly is mainly realized by mixing, which is either large in volume and power consumption, high in cost, or low in signal phase noise and poor in spurious.

[0004] Therefore, in view of this, the shortcomings of the existing structure are studied and improved, and a receiving and transmitting module assembly with high integration is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a receiving and transmitting module assembly with high integration so as to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a highly integrated receiving and transmitting module assembly, comprising a base and microwave millimeter wave components, wherein the microwave millimeter wave components are fixedly connected to the middle part of the interior of the base, and the receiving module is fixedly connected to the four corners of the inner upper surface of the base, the transmitting module is fixedly connected to the four sides of the inner upper surface of the base, and a cover plate is arranged on the upper surface of the base, and a cavity is opened inside the base.

[0007] Preferably, a clamping block is fixedly connected to the upper surface of the base, and positioning holes are provided at four corners of the upper surface of the base.

[0008] Preferably, a heat dissipation hole is opened inside the cover plate, and a positioning rod is fixedly connected to the lower surface of the cover plate.

[0009] Preferably, a card slot is provided on the inner lower surface of the cover plate, and the card block is snap-connected inside the card slot.

[0010] Preferably, a fixing plate is fixedly connected to the outer surface of the cover plate, and a connecting block is fixedly connected to the outer surface of the base, and a fixing hole is provided inside the fixing plate.

[0011] Preferably, a partition block is fixedly connected inside the base, and the partition block is arranged between the microwave and millimeter wave components, the receiving module and the transmitting module.

[0012] Preferably, a connector is fixedly connected to the interior of the partition block, and a shield is fixedly connected to the outer surface of the connector.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model is provided with a base, microwave millimeter wave components, a receiving module and a transmitting module. The module components are mainly composed of a low noise amplifier, a frequency multiplier, a power divider, a mixer, a detector, a waveguide filter, a driving amplifier and a power amplifier. In order to better meet the user's customization requirements, microwave millimeter wave components at a suitable frequency are selected, and the receiving module and the transmitting module are matched at the same time to achieve the purpose of high integration, low noise, high power, low power consumption and small size in the W band;

[0015] 2. The utility model arranges the cover plate, the base, the positioning rod, the positioning hole, the fixing plate, the fixing hole, the connecting block, the clamping block and the clamping slot, so that the positioning rod on the lower surface of the cover plate is clamped and fixed in the positioning hole inside the base, which plays a role of pre-fixation, fixes the clamping block in the clamping slot, and connects the fixing plate and the connecting block through the fixing hole, so as to achieve the purpose of conveniently fixing the cover plate on the top of the base, and the cover plate and the base adopt a new substrate with low dielectric constant, thin thickness and better stability;

[0016] 3. The utility model divides the cavity into different areas through the arrangement of the cavity, microwave and millimeter wave components, receiving module, transmitting module, partition blocks, connectors and shields. The microwave and millimeter wave components, receiving module and transmitting module are arranged inside different areas. The shields and connectors inside the partition blocks are used to prevent the occurrence of cavity effects, maintain the stability of the output signal, and keep interference and spurious signals extremely low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the main body of the utility model;

[0018] Figure 2 It is a three-dimensional unfolded structural schematic diagram of the main body of the utility model;

[0019] Figure 3 It is a three-dimensional cross-sectional structural schematic diagram of the partition block 9 of the utility model;

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the cover plate 1 of the utility model;

[0021] Figure 5 It is a schematic diagram of the principle structure of the utility model.

[0022] In the figure: 1. cover plate; 2. base; 3. heat dissipation hole; 4. fixing plate; 5. fixing hole; 6. connecting block; 7. microwave and millimeter wave components; 8. receiving module; 9. partition block; 10. transmitting module; 11. positioning hole; 12. shielding device; 13. connector; 14. positioning rod; 15. card slot; 16. card block; 17. cavity. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figure 1-Figure 2 As shown, a highly integrated receiving and transmitting module assembly includes a base 2 and a microwave millimeter wave component 7, wherein the microwave millimeter wave component 7 is fixedly connected to the middle part of the interior of the base 2, and the receiving module 8 is fixedly connected to the four corners of the inner upper surface of the base 2, and the transmitting module 10 is fixedly connected to the four sides of the inner upper surface of the base 2, and a cover plate 1 is provided on the upper surface of the base 2, and a cavity 17 is opened inside the base 2. In order to better meet the user's customization requirements, microwave millimeter wave components 7 at appropriate frequencies are selected, and the receiving module 8 and the transmitting module 10 are matched at the same time to achieve the purpose of high integration, low noise, high power, low power consumption and small volume in the W band.

[0025] W-band receiving / transmitting module indicator requirements:

[0026] a) W-band reception technical indicators;

[0027] 1). Input frequency: RF: 92~96GHz, 0.2us~continuous (RF)

[0028] 2). Input local oscillator: LO: 10.5~10.875GHz, step no more than 12.5MHz, internally integrated 8-fold frequency, input power 0~5dBm

[0029] 3). Output intermediate frequency: IF: 8~9GHz

[0030] 4). Instantaneous working bandwidth: 1GHz

[0031] 5). Noise coefficient: ≤8dB

[0032] 6). Receiving channel anti-burning ability: 2W (continuous wave) duration is no more than 30 minutes

[0033] 7). In-band fluctuation (signal bandwidth 1GHz): ≤±1.25dB

[0034] 8). Intermediate frequency signal in-band spurious suppression: ≤-55dBc

[0035] 9). Down-conversion link gain: 31±0.5dB

[0036] 10). Receiving channel input P-1: ≥-35dBm (no attenuation), ≥-10dBm (attenuation)

[0037] 11). Digital controlled attenuator: ≥31dB, step 0.5dB

[0038] 12).Port standing wave: ≤2.5

[0039] 13). Power consumption: ≤10W

[0040] 14). Supply voltage: +6V / 2A, DC-DC and LDO are used internally to generate various voltages, provide negative voltage protection, and timing modulation functions

[0041] 15).Weight: ≤1Kg

[0042] 16). Attenuation control code: TTL level, 6*4=24 bits in total, synchronous serial port

[0043] 17).SP4T control code: TTL level, 2 bits in total, parallel code

[0044] 18). Dynamic detection: The intermediate frequency signal is sent out through the detection output DC level. The system determines the largest amplitude according to the detection level and sends it to the four-to-one switch in the down-conversion to select one output. The detection dynamic range is ≥40dB

[0045] 19). Low frequency connector: J30JS series socket

[0046] 20). RF input: 4×WR10 standard rectangular waveguide, waveguide spacing 36mm

[0047] 21). IF and LO signal input and output: SMA-K

[0048] 22). Use bare chips to meet airtight requirements

[0049] 23). Working temperature: -40-+70℃

[0050] 24). Storage temperature: -50-+80℃

[0051] b) W-band transmitting module indicators:

[0052] 1). Input frequency: IF: 8~9GHz, continuous wave, power: 0~2dBm

[0053] 2). Input local oscillator: LO: 10.5~10.875GHz, step no more than 12.5MHz, internally integrated 8-fold frequency, input power 0~5dBm

[0054] 3). Output frequency: RF: 92~96GHz, continuous wave, output power: ≥32dBm, four-way output

[0055] 4). Output signal fluctuation within the band: ≤2dB, (signal bandwidth: 1GHz)

[0056] 5). Anti-standing wave mismatch: Normal operation: ≤2.5; No damage: ≤5

[0057] 6). Transmitted spurious suppression: ≥55dBc

[0058] 7). Working mode: continuous wave working, pulse working (RF output)

[0059] 8). Waveform drop: ≤1dB (100u pulse width)

[0060] 9). Applicable pulse width range: 0.2us~continuous wave (RF)

[0061] 10) Timing requirements: The four-way final amplifier controls the power supply and switch through external control, and only one way is selected to work at the same time

[0062] 11). Cooling method: air cooling, power amplifier equipped with heat sink

[0063] 12).S signal monitoring: Input signal monitoring: Use coupling + detector to detect 8-9GHz and output DC detection voltage.

[0064] Adopt coupling + detector to detect 92-96GHz and output DC detection voltage.

[0065] 13). Supply voltage: +18V / 4.5A, +6.5V / 0.5A, internally uses DC-DC and LDO to generate various voltages, provides negative voltage protection, and timing modulation functions

[0066] 14).Weight: ≤2.5Kg

[0067] 15). Low frequency connector: J30JS series socket

[0068] 16). RF output: 4×WR10 standard rectangular waveguide, waveguide spacing 36mm

[0069] 17). IF and LO signal input and output: SMA-K

[0070] 18). Use bare chips to meet airtight requirements

[0071] 19). Working temperature: -40-+70℃

[0072] 20). Storage temperature: -50-+80℃

[0073] c) Definition of low frequency interface of W-band receiving module:

[0074]

[0075] d) Definition of low frequency interface of W-band transmitting module:

[0076]

[0077] like Figure 3-Figure 4 As shown, a clamping block 16 is fixedly connected to the upper surface of the base 2, and positioning holes 11 are opened at the four corners of the upper surface of the base 2. The positioning rods 14 on the lower surface of the cover plate 1 are engaged and fixed in the positioning holes 11 inside the base 2 to play a role of pre-fixation.

[0078] Preferably, a heat dissipation hole 3 is opened inside the cover plate 1 , and a positioning rod 14 is fixedly connected to the lower surface of the cover plate 1 , so that the heat dissipation holes 3 can be conveniently used to dissipate the heat of the electronic components inside the base 2 .

[0079] Preferably, a card slot 15 is provided on the inner lower surface of the cover plate 1, and a card block 16 is snap-connected to the inside of the card slot 15, the card block 16 is fixed inside the card slot 15, and the fixing plate 4 is connected to the connecting block 6 through the fixing hole 5, so as to facilitate fixing the cover plate 1 on the top of the base 2.

[0080] Preferably, the outer surface of the cover plate 1 is fixedly connected to a fixing plate 4, and the outer surface of the base 2 is fixedly connected to a connecting block 6, and a fixing hole 5 is opened inside the fixing plate 4, and the fixing plate 4 is connected to the connecting block 6 through the fixing hole 5, so as to facilitate the cover plate 1 to be fixed above the base 2.

[0081] Preferably, a partition block 9 is fixedly connected to the inside of the base 2, and the partition block 9 is arranged between the microwave millimeter wave components 7, the receiving module 8 and the sending module 10. The partition block 9 divides the cavity 17 into different areas, and the microwave millimeter wave components 7, the receiving module 8 and the sending module 10 are arranged inside different areas.

[0082] Preferably, the partition block 9 is fixedly connected to a connector 13, and the outer surface of the connector 13 is fixedly connected to a shield 12, and the shield 12 and the connector 13 inside the partition block 9 are used to prevent the cavity 17 effect from being generated, thereby maintaining the stability of the output signal and extremely low interference and spurious.

[0083] Key technologies:

[0084] 1. 8 times the local oscillator signal:

[0085] Through multiple amplification, frequency doubling and filtering, the local oscillator frequency is multiplied by 8, while the in-band and out-band spurious signals of the local oscillator signal are minimized.

[0086] 2. Frequency conversion of reception and transmission:

[0087] The W-band receiving / transmitting module has frequency conversion for both receiving and transmitting. Receiving is to down-convert the received W-band signal to the X-band for output processing. Transmitting is to up-convert the X-band signal to the W-band for amplification and output. Selecting a suitable mixer can reduce the insertion loss and spurious of frequency conversion. It is also necessary to consider the operating frequency of the mixer, the local oscillator signal and other related technical indicators.

[0088] 3. Spurious suppression:

[0089] By designing a suitable filter through electromagnetic simulation, the remaining useless signals can be effectively suppressed while ensuring the amplitude-frequency response of the useful signal, thereby improving the internal clutter suppression capability and increasing working stability.

[0090] 4. Module power consumption:

[0091] A low-power solution is adopted to reduce the overall power consumption of the entire component. At the same time, thermal analysis methods are used to analyze the heat transfer and heat conduction of the module. Then, a high-efficiency DC-DC conversion chip is used to reduce the overall power consumption of the module and improve the long-term working stability and reliability of the component.

[0092] 5.Weight:

[0093] The module is made of special, low-density aluminum alloy material, and a solid model is established through 3D drawing to simulate and evaluate the weight. At the same time, a stress simulation model is established according to the requirements, and the weight is reduced to the maximum extent possible while ensuring the mechanical strength.

[0094] 6. Electromagnetic compatibility:

[0095] The power supply needs to be converted from DC to DC, so it is necessary to solve the internal electromagnetic interference problem and the electromagnetic compatibility problem between the inside and the outside. The power supply line inside the module integrates a miniaturized electromagnetic compatibility EMI filter, which can effectively suppress the common mode and differential mode signals brought by the power supply, and add an EMI filter to the main power input port.

[0096] Working principle: When using the highly integrated receiving and transmitting module assembly, first of all, the module assembly is mainly composed of a low-noise amplifier, a frequency multiplier, a power divider, a mixer, a detector, a waveguide filter, a driver amplifier, and a power amplifier. In order to better meet the user's customization requirements, microwave and millimeter wave components 7 at appropriate frequencies are selected, and the receiving module 8 and the transmitting module 10 are matched at the same time to achieve the purpose of high integration, low noise, high power, low power consumption, and small volume in the W band. The positioning rod 14 on the lower surface of the cover plate 1 is fixed in the positioning hole 11 inside the base 2 to play a pre-fixing role, and the card block 16 is fixed in the card Inside the groove 15, the fixing plate 4 is connected to the connecting block 6 through the fixing hole 5, so as to facilitate the fixing of the cover plate 1 on the top of the base 2, and the cover plate 1 and the base 2 adopt a new type of substrate with low dielectric constant, thin thickness and better stability. The cavity 17 is divided into different areas by the partition block 9, and the microwave and millimeter wave components 7, the receiving module 8 and the transmitting module 10 are arranged in different areas. The shield 12 and the connector 13 inside the partition block 9 are used to prevent the generation of the cavity 17 effect, keep the output signal stable, and keep the interference and spurious very low. This is the working principle of the highly integrated receiving and transmitting module assembly.

Claims

1. A highly integrated receiving and transmitting module assembly, comprising a base (2) and microwave and millimeter wave components (7), characterized in that: A microwave and millimeter wave component (7) is fixedly connected to the middle of the interior of the base (2), and a receiving module (8) is fixedly connected to the four corners of the interior upper surface of the base (2), and a transmitting module (10) is fixedly connected to the four sides of the interior upper surface of the base (2), and a cover plate (1) is provided on the upper surface of the base (2), and a cavity (17) is opened inside the base (2).

2. The highly integrated receiving and transmitting module assembly according to claim 1, characterized in that: A clamping block (16) is fixedly connected to the upper surface of the base (2), and positioning holes (11) are provided at four corners of the upper surface of the base (2).

3. The highly integrated receiving and transmitting module assembly according to claim 1, characterized in that: The cover plate (1) is provided with heat dissipation holes (3) inside, and a positioning rod (14) is fixedly connected to the lower surface of the cover plate (1).

4. The highly integrated receiving and transmitting module assembly according to claim 1, characterized in that: A card slot (15) is provided on the inner lower surface of the cover plate (1), and a card block (16) is engaged and connected inside the card slot (15).

5. The highly integrated receiving and transmitting module assembly according to claim 1, characterized in that: The outer surface of the cover plate (1) is fixedly connected to a fixing plate (4), and the outer surface of the base (2) is fixedly connected to a connecting block (6), and a fixing hole (5) is provided inside the fixing plate (4).

6. The highly integrated receiving and transmitting module assembly according to claim 1, characterized in that: A partition block (9) is fixedly connected to the interior of the base (2), and the partition block (9) is arranged between the microwave and millimeter wave components (7), the receiving module (8) and the transmitting module (10).

7. The highly integrated receiving and transmitting module assembly according to claim 6, characterized in that: The interior of the partition block (9) is fixedly connected to a connector (13), and the outer surface of the connector (13) is fixedly connected to a shield (12).

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