Gateway device

By designing a heat dissipation chamber, heat dissipation copper tube, fan box and limit structure in the gateway equipment, combining rubber pads and heat dissipation ports, the problem of shortening the motherboard life due to the difficulty of heat dissipation in the gateway equipment is solved, and more efficient heat dissipation and Dust protection.

CN222215757UActive Publication Date: 2024-12-20SHANDONG GUOSHENG INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202420955618.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-06
Publication Date
2024-12-20
Estimated Expiration
2034-05-06

AI Technical Summary

Technical Problem

The existing gateway equipment is not easy to dissipate due to heat dissipation during long-term use, resulting in a decrease in the service life of the motherboard.

Method used

A gateway device is designed, including a heat dissipation chamber, a heat dissipation copper tube, a fan box, a limit structure and a protective cover. Through the coordination of the heat dissipation structure and a limit structure, a large area of ​​heat discharge is achieved, and the bottom is accelerated through the rubber pad and the heat dissipation port. Heat is dissipated.

Benefits of technology

It significantly improves the heat dissipation effect of the equipment, extends the service life of the motherboard, and prevents dust from falling into it, simplifying the cleaning process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of network communication equipment, in particular to a gateway device which comprises a machine body, the machine body is provided with a heat dissipation cavity, the outer wall of the machine body is provided with a wiring groove, the bottom end of the inner wall of the wiring groove is provided with a wiring port, and the bottom end of the inner wall of the heat dissipation cavity is fixedly connected with a mainboard. The top end of the outer wall of the mainboard is fixedly connected with a heat dissipation copper pipe, the heat dissipation copper pipe is connected with a fan box through a heat dissipation structure, the bottom end of the inner wall of the heat dissipation cavity is fixedly connected with a mounting column, and the mounting column is connected with a protective cover through a limiting structure. The heat dissipation structure, the limiting structure and the heat dissipation opening are matched with one another, so that the heat dissipation effect of the machine body is greatly improved, the heat dissipation structure exhausts heat generated by the mainboard through the fan through the heat dissipation copper pipe, the limiting structure can open the protective cover on the top, heat can be exhausted from the top, and the heat dissipation effect is improved. And dust on the upper portion can be prevented from falling off, and heat at the bottom can be rapidly discharged through the heat dissipation openings.
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Description

Technical Field

[0001] The utility model relates to the technical field of network communication equipment, in particular to a gateway device. Background Art

[0002] Gateway, also known as network connector or protocol converter, is a device that realizes network interconnection above the network layer. It is mainly used to eliminate the differences between different protocol segments and realize the interconnection of different segments at the transport layer. In actual applications, there are many types of gateways, such as routing gateways and security gateways. Routing gateways are mainly used for data communication between different local area networks or wide area networks. Their main function is to forward and distribute data packets and select the best forwarding path for data packets through routing protocols. Security gateways focus more on network security protection.

[0003] Existing gateways are usually installed in computer rooms or cabinets to serve as a transit network. They are mostly used by large companies and network transit centers. These organizations mostly use gateways 24 hours a day to ensure that company information is not leaked. However, with such long-term use, the motherboard will generate a lot of heat that is not easy to dissipate, which greatly reduces the service life of the motherboard. Utility Model Content

[0004] The utility model aims to provide a gateway device to solve the problem that a large amount of heat is generated by the mainboard during long-term use and is difficult to dissipate, which greatly reduces the service life of the mainboard.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A gateway device comprises a body, wherein the body is provided with a heat dissipation cavity, the outer wall of the body is provided with a wiring groove, the bottom end of the inner wall of the wiring groove is provided with a wiring port, the bottom end of the inner wall of the heat dissipation cavity is fixedly connected to a mainboard, the top end of the outer wall of the mainboard is fixedly connected to a heat dissipation copper tube, the heat dissipation copper tube is connected to a fan box through a heat dissipation structure, the bottom end of the inner wall of the heat dissipation cavity is fixedly connected to a mounting column, and the mounting column is connected to a protective cover through a limiting structure.

[0007] Preferably, the heat dissipation structure includes evenly distributed heat transfer tubes, fans, and dust screens, one end of the heat transfer tubes is fixedly connected to the heat dissipation copper tube, the fan is fixedly connected to the inner wall of the fan box, and the dust screen is fixedly connected to the outer wall of the body.

[0008] Preferably, the other end of the heat transfer tube is connected to a fan, and the outlet of the dust screen faces downward.

[0009] Preferably, the limiting structure includes a slide groove, an L-shaped groove, a slide column, a limiting block, and a rotating cap. The slide groove is arranged on the outer wall of the mounting column, and the L-shaped groove is also arranged on the outer wall of the mounting column and is through-connected with the slide groove.

[0010] Preferably, the sliding column is slidably connected to the protective cover, the limiting block is fixedly connected to the sliding column, the rotating cap is fixedly connected to the top of the sliding column, the sliding column is slidably connected to the mounting column, and the limiting block is slidably connected to the sliding groove and the L-shaped groove respectively.

[0011] Preferably, the bottom end of the body is fixedly connected with rubber pads which are evenly distributed, and the bottom end of the body is provided with a heat dissipation port.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] When the utility model is in use, the heat dissipation effect of the body can be greatly improved through the mutual cooperation between the heat dissipation structure, the limiting structure and the heat dissipation port. The heat dissipation structure discharges the heat generated by the mainboard through the heat dissipation copper tube through the fan. The limiting structure allows the heat to be discharged from the top over a large area when the top protective cover is opened, and can also prevent dust from falling from above. The cooperation between the heat dissipation port and the rubber pad allows the heat at the bottom to be quickly discharged. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the three-dimensional structure of a gateway device proposed by the utility model;

[0015] Figure 2 This is a schematic diagram of the internal three-dimensional structure of a gateway device proposed by the utility model;

[0016] Figure 3 A schematic diagram of a half-cut three-dimensional structure of a gateway device proposed in the utility model

[0017] Figure 4 A schematic diagram of the three-dimensional structure of a limiting structure of a gateway device proposed by the utility model

[0018] Figure 5 The figure is a schematic diagram of the bottom three-dimensional structure of a gateway device proposed by the utility model.

[0019] In the figure: 1 body, 2 heat dissipation cavity, 3 wiring slot, 4 wiring port, 5 mainboard, 6 heat dissipation copper tube, 7 fan box, 8 mounting column, 9 protective cover, 10 heat transfer tube, 11 fan, 12 dust screen, 13 slide slot, 14 L-shaped slot, 15 slide column, 16 limit block, 17 rotating cap, 18 rubber pad, 19 heat dissipation port. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-Figure 5 A gateway device includes a body 1, a heat dissipation cavity 2 is opened in the body 1, a wiring slot 3 is opened on the outer wall of the body 1, a wiring port 4 is opened at the bottom end of the inner wall of the wiring slot 3, a mainboard 5 is fixedly connected to the bottom end of the inner wall of the heat dissipation cavity 2, a heat dissipation copper tube 6 is fixedly connected to the top end of the outer wall of the mainboard 5, the heat dissipation copper tube 6 is connected to a fan box 7 through a heat dissipation structure, a mounting column 8 is fixedly connected to the bottom end of the inner wall of the heat dissipation cavity 2, and the mounting column 8 is connected to a protective cover 9 through a limiting structure.

[0022] It should be noted that the specific models and specifications of the heat dissipation copper tube 6 and the fan 11 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the field, so it is not repeated here.

[0023] Furthermore, the heat dissipation structure includes a uniformly distributed heat transfer tube 10, a fan 11, and a dust screen 12, one end of the heat transfer tube 10 is fixedly connected to the heat dissipation copper tube 6, the fan 11 is fixedly connected to the inner wall of the fan box 7, and the dust screen 12 is fixedly connected to the outer wall of the body 1.

[0024] The heat dissipation structure mainly transmits the heat generated by the mainboard 5 to the fan box 7 through the heat dissipation copper tube 6 through the heat transfer tube 10, and then starts the fan 11, which blows the heat to the outside to achieve a cooling effect.

[0025] Furthermore, the other end of the heat transfer tube 10 is connected to the fan 11, and the outlet of the dust screen 12 faces downward.

[0026] The dust screen 12 not only helps the fan 11 to discharge hot air, but also prevents dust falling from high places from entering the machine body 1, making it easier to clean.

[0027] Furthermore, the limiting structure includes a slide groove 13, an L-shaped groove 14, a slide column 15, a limiting block 16, and a rotating cap 17. The slide groove 13 is arranged on the outer wall of the mounting column 8, and the L-shaped groove 14 is also arranged on the outer wall of the mounting column 8 and is connected to the slide groove 13.

[0028] Among them, the limiting structure realizes the connection of the protective cover 9 by sliding the sliding column 15 on the protective cover 9 and the inner wall of the mounting column 8. The limiting block 16 enters the mounting column 8 through the sliding groove 13, and rotates and forms a restriction when it reaches the position of the lowest end L-shaped groove 14. It can also form a restriction one grid upwards. In this way, the protective cover 9 is in a semi-open state, which can further improve the heat dissipation effect.

[0029] Furthermore, the sliding column 15 is slidably connected to the protective cover 9, the limit block 16 is fixedly connected to the sliding column 15, the rotating cap 17 is fixedly connected to the top of the sliding column 15, the sliding column 15 is slidably connected to the mounting column 8, and the limit block 16 is slidably connected to the sliding groove 13 and the L-shaped groove 14 respectively.

[0030] The position and size of the limit block 16 match those of the slide groove 13 and the L-shaped groove 14 . The mounting column 8 is in a hollow state, and the sliding column 15 matches the size of the mounting column 8 .

[0031] Furthermore, the bottom end of the body 1 is fixedly connected with rubber pads 18 which are evenly distributed, and the bottom end of the body 1 is provided with a heat dissipation port 19 .

[0032] The rubber pad 18 and the heat dissipation port 19 are used together to allow part of the heat of the body 1 to be dissipated from the bottom, thereby greatly improving the heat dissipation effect.

[0033] Working principle: When the gateway is in use, it generates heat, which can be transferred to the fan box 7 through the heat dissipation copper tube 6 and the heat generated by the mainboard 5 through the heat transfer tube 10, and then the fan 11 is started. The fan 11 blows the heat to the outside to achieve the cooling effect. Then, the sliding connection between the sliding column 15 on the protective cover 9 and the inner wall of the mounting column 8 is used to realize the connection of the protective cover 9. The limit block 16 enters the mounting column 8 through the slide groove 13, and rotates and forms a restriction when it reaches the position of the lowest L-shaped groove 14. It can also form a restriction one grid upward, so that the protective cover 9 is in a semi-open state, which can further improve the heat dissipation effect. Finally, the rubber pad 18 and the heat dissipation port 19 arranged at the bottom of the body 1 can allow part of the heat of the body 1 to dissipate from the bottom, greatly improving the heat dissipation effect.

[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A gateway device, comprising a body (1), characterized in that: The machine body (1) is provided with a heat dissipation cavity (2), the outer wall of the machine body (1) is provided with a wiring slot (3), the inner wall bottom end of the wiring slot (3) is provided with a wiring port (4), the inner wall bottom end of the heat dissipation cavity (2) is fixedly connected to a mainboard (5), the outer wall top end of the mainboard (5) is fixedly connected to a heat dissipation copper tube (6), the heat dissipation copper tube (6) is connected to a fan box (7) via a heat dissipation structure, the inner wall bottom end of the heat dissipation cavity (2) is fixedly connected to a mounting column (8), and the mounting column (8) is connected to a protective cover (9) via a limiting structure.

2. A gateway device according to claim 1, characterized in that: The heat dissipation structure comprises a uniformly distributed heat transfer tube (10), a fan (11), and a dust screen (12); one end of the heat transfer tube (10) is fixedly connected to the heat dissipation copper tube (6); the fan (11) is fixedly connected to the inner wall of the fan box (7); and the dust screen (12) is fixedly connected to the outer wall of the machine body (1).

3. A gateway device according to claim 2, characterized in that: The other end of the heat transfer pipe (10) is connected to the fan (11), and the outlet of the dust screen (12) faces downward.

4. A gateway device according to claim 1, characterized in that: The limiting structure comprises a slide groove (13), an L-shaped groove (14), a slide column (15), a limiting block (16), and a rotating cap (17); the slide groove (13) is arranged on the outer wall of the mounting column (8); the L-shaped groove (14) is also arranged on the outer wall of the mounting column (8) and is connected to the slide groove (13).

5. A gateway device according to claim 4, characterized in that: The sliding column (15) is slidably connected to the protective cover (9), the limiting block (16) is fixedly connected to the sliding column (15), the rotating cap (17) is fixedly connected to the top of the sliding column (15), the sliding column (15) is slidably connected to the mounting column (8), and the limiting block (16) is slidably connected to the sliding groove (13) and the L-shaped groove (14) respectively.

6. A gateway device according to claim 1, characterized in that: The bottom end of the machine body (1) is fixedly connected to a rubber pad (18) which is evenly distributed, and the bottom end of the machine body (1) is provided with a heat dissipation port (19).