Electronic equipment
By embedding the sealing cavity in the mobile phone case and filling the heat conduction medium, the problem of poor heat dissipation effect of the mobile phone motherboard is solved, efficient heat conduction and dissipation is achieved, and the stable operation and safety of the equipment is ensured.
Patent Information
- Application Number
- CN202420643480.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-29
AI Technical Summary
The heat dissipation effect of existing mobile phone motherboards is poor, especially due to the limitation of graphite material's conductivity, it cannot effectively dissipate heat, affecting the overall performance of the mobile phone.
Design an electronic device, using a sealed cavity embedded in the shell, fills the heat conducting medium and heat-generating element for heat exchange. Through the design and structural optimization of the sealed cavity, it includes the communication and rectangular cross-section of multiple sealed cavity, and uses plastic Material and metal heat dissipation parts ensure rapid conduction and effective dispersion of heat.
It significantly improves heat dissipation efficiency, reduces the working temperature of the heating element, ensures the long-term stable operation of electronic equipment, and avoids interference from graphite materials on antennas and other components, achieving reasonable thermal management and safety.
Smart Images
Figure CN222215772U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art
[0002] Current mobile phones mainly rely on thermal conductive materials to achieve heat dissipation, such as graphite, thermal grease, and metal frames. However, with the increase in power consumption of CPUs, various applications, and game software, current mobile phones cannot meet the heat dissipation needs by relying solely on the above thermal conductive materials, resulting in the heat emitted from the motherboard area not being able to be transferred to other cold areas in time to complete the heat dissipation. In addition, because graphite materials are conductive, graphite materials cannot be set near components such as antennas near the phone frame for heat conduction, further affecting the heat dissipation performance of the phone.
[0003] Therefore, an electronic device is needed to at least solve the above problems. Utility Model Content
[0004] The main purpose of the present application is to provide an electronic device to solve the problem of poor heat dissipation effect in the heat source area on the existing mobile phone motherboard.
[0005] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:
[0006] The present application provides an electronic device, comprising a shell; a circuit board fixed in the shell; wherein the shell comprises: a sealed cavity, the sealed cavity at least shielding a portion of a heating element of the circuit board; a heat-conducting medium located in the sealed cavity, the heat-conducting medium performing heat exchange with a portion of the heating element.
[0007] In some embodiments, the circuit board is disposed on the first surface of the housing; a second surface of the circuit board facing the first surface is provided with a plurality of electronic components, and the plurality of electronic components belong to the heating element.
[0008] In some embodiments, the sealed cavity is connected to the electronic component in contact or in non-contact connection.
[0009] In some embodiments, the thicknesses of the plurality of electronic components are different, there are a plurality of sealed cavities, and the plurality of sealed cavities are adapted to the plurality of electronic components of different thicknesses.
[0010] In some embodiments, the plurality of sealed cavities are connected in sequence.
[0011] In some embodiments, the shell is a plate-type structure, the sealed cavity is embedded in the shell, and the cross-section of the sealed cavity is rectangular.
[0012] In some embodiments, the electronic device further includes: a heat sink, which is disposed between the sealed cavity and the circuit board and covers a portion of at least one of the electronic components, wherein the electronic component, the heat sink and the sealed cavity form a heat dissipation channel.
[0013] In some embodiments, the housing is made of plastic material, and the heat sink is made of metal.
[0014] In some embodiments, at least one of the plurality of sealed cavities is disposed on a side of the electronic component and extends toward the circuit board to a body close to the circuit board.
[0015] In some embodiments, the heat transfer medium is a cooling liquid or a phase change material. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:
[0017] Figure 1 The cross-sectional structure diagram of the electronic device of the present application is schematically shown;
[0018] Figure 2 The internal structure diagram of the electronic device of the present application is schematically shown.
[0019] Description of Figure Numbers:
[0020] 1. Shell; 101. Sealed cavity; 102. Heat-conducting medium; 2. Circuit board; 201. First area; 202. Electronic component; 3. Heat sink; 4. Second area. DETAILED DESCRIPTION
[0021] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0022] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.
[0023] Example 1
[0024] To solve the problems existing in the prior art, such as Figure 1 As shown, an embodiment of the present application provides an electronic device, comprising: a shell 1; a circuit board 2, fixed in the shell 1; wherein the shell 1 comprises: a sealed cavity 101, the sealed cavity 101 at least shields a portion of a heating element of the circuit board 2; a heat-conducting medium 102, located in the sealed cavity 101, and the heat-conducting medium 102 performs heat exchange with a portion of the heating element.
[0025] The electronic device provided in the present application can be a mobile terminal such as a mobile phone or a laptop computer, or a processing device, a display device, etc. The circuit board 2 is arranged inside the housing 1, and the housing 1 fully covers the circuit board 2. A heating element is installed on the circuit board 2. The heating element is arranged as follows: Figure 2 In the first area 201 of the circuit board 2 shown, the heating element generates heat during operation. A sealed cavity 101 is provided inside the housing 1, and a heat-conducting medium 102 is filled in the sealed cavity 101. The sealed cavity 101 can at least shield a portion of the heating element on the circuit board 2, thereby achieving a precise correspondence between the heat-conducting medium 102 and the heating element. The heat-conducting medium 102 absorbs the heat emitted by the heating element by heat conduction or heat convection, so that the heat of the heating element can be quickly conducted to other parts of the housing 1 or an external heat dissipation structure through the heat-conducting medium 102, ensuring that the heat can be quickly and effectively absorbed and transferred.
[0026] The electronic device provided in the present application can at least cover part of the heating element on the circuit board 2 through the sealed cavity 101 filled with the heat-conducting medium 102 on the shell 1, thereby achieving a precise correspondence between the heat-conducting medium 102 and the heating element, so that the heat of the heating element can be quickly transferred to other parts of the shell 1 or the external heat dissipation structure through the heat-conducting medium 102, thereby improving the heat dissipation efficiency.
[0027] In some embodiments, the circuit board 2 is disposed on the first surface of the housing 1 ; a second surface of the circuit board 2 facing the first surface is provided with a plurality of electronic components 202 , and the plurality of electronic components 202 are heating components.
[0028] The electronic components 202 may include, but are not limited to, various basic electronic devices such as memory, capacitors, resistors, transistors, and high-power, high-heat core components such as CPU, GPU, and power management chips.
[0029] The first surface of the housing 1 is arranged opposite to the second surface of the circuit board 2, and the plurality of electronic components 202 are arranged on the second surface of the circuit board 2, so that the plurality of electronic components 202 form a relative relationship with the first surface of the housing 1. The plurality of electronic components 202 are part of the heating element, and the sealed cavity 101 can at least shield part of the heating element, so that the heat-conducting medium 102 is arranged in the direction facing the plurality of electronic components 202 on the circuit board 2, so that the heat-conducting medium 102 can be in close contact with the electronic components 202, thereby realizing close-range and rapid conduction of heat, greatly improving the heat dissipation efficiency, reducing the working temperature of the heating element, and ensuring the long-term stable operation of the electronic equipment.
[0030] In some embodiments, the sealed cavity 101 can fully cover the range of the heating element of the circuit board 2. By fully covering the range of the heating element with the sealed cavity 101, the maximum contact area between the heating element and the heat-conducting medium 102 in the sealed cavity 101 can be ensured, thereby greatly improving the heat conduction efficiency.
[0031] In some embodiments, the sealed cavity 101 is connected to the electronic component 202 in contact or non-contact manner.
[0032] The outer wall surface of the sealed cavity 101 can abut against the side surface of the electronic component 202 facing the first surface of the housing 1. When the electronic component 202 generates heat during operation, the sealed cavity 101 will directly contact the surface of the electronic component 202 without an obvious gap between the two, forming a good thermal contact interface. By eliminating the air gap between the two, the thermal resistance is greatly reduced, so that the heat generated by the electronic component 202 can be transferred to the heat-conducting medium 102 faster and more directly, thereby improving the overall heat dissipation efficiency.
[0033] Alternatively, a small gap may be left between the outer wall surface of the sealed cavity 101 and the first surface of the housing 1 facing the electronic component 202. Since the gap is extremely limited, the thermal resistance effect caused by the gaseous medium such as air in the heat transfer process can still be effectively reduced. At the same time, the non-contact setting may also be combined with the principle of gas flow or natural convection, using the rising flow of hot air formed in the gap to indirectly transfer the heat generated by the electronic component 202 to the sealed cavity 101 and the surrounding heat dissipation structure, thereby achieving effective heat dissipation.
[0034] In some embodiments, the thicknesses of the plurality of electronic components 202 are different, there are a plurality of sealed cavities 101 , and the plurality of sealed cavities 101 are adapted to the plurality of electronic components 202 of different thicknesses.
[0035] Since the multiple electronic components 202 on the circuit board 2 have different thickness characteristics, the sealed cavity 101 is set to be multiple, and the size and shape of each sealed cavity 101 are customized according to the thickness of the corresponding electronic component 202, so that each sealed cavity 101 can fit tightly and completely cover the corresponding electronic component 202, thereby maximizing the contact area between the sealed cavity 101 and each electronic component 202, making the heat conduction path short and the resistance small, so that the heat generated by each heating component can be quickly and effectively transferred away, thereby significantly improving the heat dissipation efficiency.
[0036] In some embodiments, the multiple sealed cavities 101 are connected in sequence.
[0037] The multiple sealed cavities 101 adapted to the electronic components 202 of different thicknesses are not independent, but are interconnected, that is, the adjacent sealed cavities 101 can form a continuous heat dissipation path through internal channels, gaps or integrated design, so that heat can be continuously conducted between the cavities.
[0038] For example, tiny pores, pipes, or connections made of heat-conducting materials may be designed at the bottom or side walls of each sealed cavity 101, so that the heat-conducting medium 102 can flow between the sealed cavities 101, thereby achieving integrated heat transfer within the entire sealed cavity 101 system. Alternatively, an integrated, segmented large cavity structure may be provided inside the shell 1, with each segment corresponding to an electronic component 202 of different thicknesses, but forming a connected heat dissipation channel as a whole. Through the interconnected design of multiple sealed cavities 101, the heat generated by each electronic component 202 can be more evenly propagated inside the shell 1, effectively expanding the heat dissipation area and improving the heat dissipation speed and efficiency.
[0039] In some embodiments, the housing 1 is a plate-type structure, the sealed cavity 101 is embedded in the housing 1 , and the cross section of the sealed cavity 101 is rectangular.
[0040] The housing 1 of the plate-type structure can be detachably connected to the circuit board 2, making maintenance and replacement more convenient. The sealed cavity 101 included in the housing 1 does not exist independently of the housing 1, but becomes a part of the structure of the housing 1. It is embedded into the housing 1 through the manufacturing process to form a fixed structural unit integrally formed with the housing 1. By embedding the sealed cavity 101 into the housing 1, the wall thickness of the sealed cavity 101 on the side close to the electronic component 202 can be thinned. This design greatly improves the heat conduction efficiency, so that the heat generated by the electronic component 202 can be quickly and effectively transferred to the heat-conducting medium 102 in the sealed cavity 101, and further discharged to the outside through the housing 1. And by embedding the sealed cavity 101 into the housing 1, additional assembly steps and space requirements are reduced, which helps to realize the miniaturization and compact design of electronic equipment. The sealed cavity 101 with a rectangular cross-section can contact the electronic component 202 with a larger area, which improves the heat conduction efficiency.
[0041] In some embodiments, the housing 1 is made of plastic material.
[0042] The shell 1 is an integral frame, which is made of plastic material through injection molding, blow molding or other molding processes. The plastic shell 1 is designed with an embedded sealed cavity 101 structure, which can be accurately embedded in the appropriate position of the shell 1 wall according to the layout of the heating element and the heat dissipation requirements. In order to ensure the tight combination between the sealed cavity 101 and the shell 1, technologies such as ultrasonic welding are used for sealing to ensure that the heat-conducting medium 102 inside the sealed cavity 101 will not leak. The plastic shell 1 can provide good electrical insulation performance, effectively isolate the internal circuit from the external environment, and improve the safety of the electronic device. And using plastic material as the main component of the shell 1 can greatly reduce the weight of the electronic device, which is beneficial to the portability and energy-saving effect of the product.
[0043] In some embodiments, the housing 1 can directly adopt an existing structure, such as a plastic housing bracket used to fix the antenna above the existing mobile phone motherboard. On the basis of this structure, at least one sealed cavity 101 is dug inside the housing 1, and then a heat-conducting medium 102 is filled inside the sealed cavity 101. By digging at least one sealed cavity 101 inside the plastic housing bracket above the original mobile phone motherboard, the housing structure that was originally only used for support and fixation has a new thermal management function. The sealed cavity 101 precisely fits the layout of the heating element to ensure that it can effectively wrap and contact the key heating area of the heating element to absorb and conduct heat to the greatest extent.
[0044] In some embodiments, a coating or structure for enhancing heat conduction performance is provided on one side of the sealed cavity 101 in contact with the heating element, and the coating or structure includes but is not limited to heat-conducting materials such as graphene layers and metal foils. Since plastic materials have good insulation properties and a certain degree of thermal insulation capacity, heat-conducting materials may be added between the housing 1 and the heating element or plastics with good thermal conductivity may be used to promote effective heat transfer.
[0045] In some embodiments, at least one of the plurality of sealed cavities 101 is disposed on a side of the electronic component 202 and extends toward the circuit board 2 to a body close to the circuit board 2 .
[0046] The multiple sealed cavities 101 are not all concentrated at the bottom or top of the circuit board 2, but at least one of the sealed cavities 101 is designed at the side of the electronic component 202. The sealed cavity 101 extends along the side of the electronic component 202 and extends toward the circuit board 2 until it approaches the main part of the circuit board 2, making full use of the second vacant area 4 around the electronic component 202. By filling the sealed cavity 101 with a heat-conducting medium 102, the edge of the circuit board 2 is cooled, especially for those electronic components 202 with greater side heat generation, which can more directly contact and absorb the heat generated by the electronic component 202, significantly improving the heat dissipation efficiency.
[0047] When there are no other significant heat-generating components in the vacant second area 4 around the electronic component 202, the sealed cavity 101 here can be used as a cold zone in the heat exchange process. The absorbed heat can be transferred to the cold zone through the connection and flow of the heat-conducting medium 102 between the sealed cavities 101, thereby achieving effective dispersion and discharge of heat.
[0048] In addition, although graphite has excellent thermal conductivity, its electrical conductivity may interfere with sensitive components such as antennas near the frame of electronic equipment, so graphite cannot be used for heat dissipation in these areas. The housing 1 made of plastic material provides good insulation performance. By extending the sealed cavity 101 along the side of the electronic component 202, it can not only avoid components such as antennas, but also provide support for heat dissipation in these special areas, ensuring the rationality and safety of internal thermal management of electronic equipment.
[0049] In some embodiments, the thermally conductive medium 102 is a cooling liquid or a phase change material.
[0050] When the heat-conducting medium 102 is a cooling liquid, the cooling liquid can be circulated inside the shell 1 through a pipeline network or an open cavity design. The cooling liquid has a high heat capacity and good thermal conductivity. Through circulation, it can quickly take away the heat of the heating element and achieve efficient heat dissipation.
[0051] When the heat-conducting medium 102 is a phase change material, the phase change material has the ability to change from solid to liquid or vice versa within a specific temperature range, and can absorb and store a large amount of latent heat. When the heating element is heated up, the phase change material will melt and absorb heat, effectively reducing the temperature of the element; and when the element is cooled down, the phase change material will resolidify and release the absorbed heat, thereby continuously performing heat management.
[0052] The electronic device provided in the present application can at least cover part of the heating element on the circuit board 2 through the sealed cavity 101 filled with the heat-conducting medium 102 on the shell 1, thereby achieving a precise correspondence between the heat-conducting medium 102 and the heating element, so that the heat of the heating element can be quickly transferred to other parts of the shell 1 or the external heat dissipation structure through the heat-conducting medium 102, thereby improving the heat dissipation efficiency.
[0053] Example 2
[0054] The electronic device provided in Example 2 of the present application is different from that in Example 1 in that the sealed cavity 101 is in indirect contact with the electronic component 202 .
[0055] In some embodiments, the electronic device further includes: a heat sink 3, which is disposed between the sealed cavity 101 and the circuit board 2 and covers a portion of at least one electronic component 202, and the electronic component 202, the heat sink 3 and the sealed cavity 101 form a heat dissipation channel.
[0056] The heat sink 3 is placed between the sealed cavity 101 and the circuit board 2, and its purpose is to cover a portion of at least one electronic component 202, thereby forming an effective heat dissipation channel, so that the heat generated by the electronic component 202 can be concentrated and transferred to the sealed cavity 101 through the heat sink 3, and the heat sink 3 can also protect the electronic component 202.
[0057] The heat sink 3 may be a structure with excellent thermal conductivity such as a heat sink, a heat plate, a heat pipe or a heat sink. For example, the heat sink is detachably connected to the circuit board 2 and is arranged on the periphery of the electronic component 202. The surface of the heat sink facing away from the electronic component 202 may abut against the sealed cavity 101. The electronic component 202 quickly conducts heat to the heat-conducting medium 102 in the sealed cavity 101 through the heat sink. The surface of the heat sink 3 that contacts the electronic component 202 and / or the sealed cavity 101 may be coated with a thermal interface material with a high thermal conductivity to reduce the contact thermal resistance and improve the thermal conduction efficiency.
[0058] In some embodiments, the heat sink 3 is made of metal, such as aluminum, copper, aluminum alloy or copper alloy, which has high thermal conductivity. Metal materials can quickly conduct heat from the heating element due to their excellent thermal conductivity, significantly reducing the operating temperature of the electronic component 202 and extending its service life.
[0059] The electronic device provided in the present application is arranged between the sealed cavity 101 and the circuit board 2 through the heat sink 3. The heat sink 3 can not only protect the electronic components 202, but also transfer the heat generated by the electronic components 202 to the heat-conducting medium 102 in the sealed cavity 101 through the heat sink 3, thereby achieving efficient heat dissipation.
[0060] It is understandable that the related features in the above devices can be referenced to each other. In addition, the "first", "second" and the like in the above embodiments are used to distinguish the various embodiments, and do not represent the advantages and disadvantages of the various embodiments.
[0061] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this description.
[0062] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. An electronic device, characterized in that: include: case; A circuit board is fixed in the housing; Wherein, the housing comprises: A sealed cavity, the sealed cavity at least shielding a portion of the heating element of the circuit board; A heat-conducting medium is located in the sealed cavity, and the heat-conducting medium exchanges heat with a portion of the heating element.
2. The electronic device according to claim 1, characterized in that: The circuit board is arranged on the first surface of the housing; A second surface of the circuit board facing the first surface is provided with a plurality of electronic components, and the plurality of electronic components belong to the heating elements.
3. The electronic device according to claim 2, characterized in that: The sealed cavity is in contact connection or non-contact connection with the electronic component.
4. The electronic device according to claim 2, characterized in that: The thicknesses of the plurality of electronic components are different, and there are a plurality of sealed cavities, and the plurality of sealed cavities are adapted to the plurality of electronic components of different thicknesses.
5. The electronic device according to claim 4, characterized in that: The plurality of sealed cavities are connected in sequence.
6. The electronic device according to claim 1, characterized in that: The shell is a plate-type structure, the sealed cavity is embedded in the shell, and the cross section of the sealed cavity is a rectangle.
7. The electronic device according to claim 2, characterized in that: Also includes: A heat sink is disposed between the sealed cavity and the circuit board and covers a portion of at least one of the electronic components. The electronic component, the heat sink and the sealed cavity form a heat dissipation channel.
8. The electronic device according to claim 7, characterized in that: The shell is made of plastic material, and the heat sink is made of metal.
9. The electronic device according to claim 2, characterized in that: At least one of the plurality of sealed cavities is disposed on a side of the electronic component and extends toward the circuit board to a body close to the circuit board.
10. The electronic device according to any one of claims 1 to 9, characterized in that: The heat transfer medium is cooling liquid or phase change material.