Optical module circuit board assembly and optical module

Abstract

The utility model discloses an optical module circuit board assembly and an optical module, and belongs to the technical field of photoelectric communication, the optical module circuit board assembly comprises a multi-layer circuit board, an integrated circuit chip and a photoelectric chip, the multi-layer circuit board is provided with a first surface and a second surface which are oppositely arranged, and is provided with an electric connection part used for being electrically connected with external equipment; an internal embedding cavity, a conductive via hole and a conductive circuit are arranged in the multilayer circuit board; the integrated circuit chip is embedded in the internal embedding cavity and is electrically connected with the electric connecting part (15); the photoelectric chip is inversely arranged on the first surface and is electrically connected with the integrated circuit chip through inversion. According to the invention, the integration level of the optical module circuit board assembly is improved, the impedance between the integrated circuit chip and the photoelectric chip is reduced, and the high-frequency performance of the optical module circuit board assembly is improved.

Description

[0001] Case information

[0002] This application is a divisional application of the Chinese utility model patent application with application number 202322397902.0 filed on September 5, 2023, and entitled “An optical module circuit board assembly and optical module”. Technical Field

[0003] The present application belongs to the field of optoelectronic communications, and specifically relates to an optical module circuit board assembly and an optical module. Background Art

[0004] With the development of the Internet and artificial intelligence, the optical communication rate is also required to increase rapidly, and the rate of its core component optical module is also constantly increasing. On the one hand, a higher optical module rate can be achieved by integrating more channels, and on the other hand, it can also be achieved by increasing the single-channel rate. Increasing the single-channel rate requires an optoelectronic chip with a corresponding rate. The increase in the number of channels is usually doubled, but the size of the optical module cannot be changed due to standard restrictions. The number of devices integrated in a limited space doubles, which poses a higher challenge to the design of circuit board layout and device layout. It is necessary to solve problems such as crosstalk between channels, high power consumption, and more difficult heat dissipation. Moreover, whether it is an increase in the number of channels or an increase in the single-channel rate, higher requirements are placed on the high-frequency performance of its lines.

[0005] In addition, at present, in order to eliminate the power consumption and cost impact of digital signal processing chips (Digital Signal Processing, referred to as DSP) on optical modules, the solution of relocating digital signal processing chips has emerged. That is, digital signal processing chips are no longer used in optical modules, leaving only linear drivers (Driver, referred to as DRV) and trans-impedance amplifiers (Trans-Impedance Amplifier, referred to as TIA). Therefore, this solution also puts forward better requirements on the high-frequency performance of its circuit board. Utility Model Content

[0006] Purpose of the utility model: The embodiment of the present application provides an optical module circuit board assembly, aiming to solve at least one of the above-mentioned technical problems; the embodiment of the present application also provides an optical module using the above-mentioned optical module circuit board assembly.

[0007] Technical solution: The optical module circuit board assembly described in the embodiment of the present application includes:

[0008] A multilayer circuit board, the multilayer circuit board having a first surface and a second surface arranged opposite to each other, and an internal buried cavity is provided in the multilayer circuit board;

[0009] an integrated circuit chip, wherein the integrated circuit chip is embedded in the internal embedding cavity;

[0010] an optoelectronic chip, wherein the optoelectronic chip is flip-mounted on the first surface, and the optoelectronic chip is electrically connected to the integrated circuit chip through the flip-mounting;

[0011] A heat conducting portion is disposed in the multilayer circuit board and is located on a side of the integrated circuit chip away from the first surface. The heat conducting portion contacts the integrated circuit chip and is at least partially exposed on the second surface.

[0012] In some embodiments, the integrated circuit chip includes a transimpedance amplifier chip, the optoelectronic chip includes a photodetector chip, and the photodetector chip is flip-chip mounted on the first surface relative to the transimpedance amplifier chip.

[0013] In some embodiments, the integrated circuit chip includes a laser driver chip, the optoelectronic chip includes a laser chip, and the laser chip is flip-chip mounted on the first surface relative to the laser driver chip.

[0014] In some embodiments, the integrated circuit chip includes a driver chip, the optoelectronic chip includes a photonic integrated chip, and the photonic integrated chip is flip-chip mounted on the first surface relative to the driver chip.

[0015] In some embodiments, the heat conductive part includes a heat conductive metal block, which is buried in the multilayer circuit board and thermally connected to the integrated circuit chip, and a side of the heat conductive metal block facing away from the integrated circuit chip is exposed on the second surface.

[0016] In some embodiments, the heat conductive part includes a laser stacked hole provided in the multilayer circuit board and a heat conductive layer provided on the second surface, the laser stacked hole penetrates the second surface, and the laser stacked hole is filled with a heat conductive material, and the heat conductive material is heat conductively connected to the heat conductive layer.

[0017] In some embodiments, a conductive via is provided in the multilayer circuit board between the integrated circuit chip and the optoelectronic chip, the integrated circuit chip is electrically connected to the optoelectronic chip through the conductive via, and the dimension of the conductive via of the optical module circuit board assembly in a direction perpendicular to the first surface is D, and satisfies D≤40μm.

[0018] In some embodiments, the multilayer circuit board is provided with an electrical connection portion for electrically connecting to an external device, and the electrical connection portion is electrically connected to the integrated circuit chip.

[0019] Accordingly, an optical module according to an embodiment of the present application includes the above-mentioned optical module circuit board assembly, and further includes:

[0020] A housing, wherein the housing has a placement cavity, and the optical module circuit board assembly is arranged in the placement cavity;

[0021] An optical path processing unit, the optical path processing unit is arranged in the placement cavity, and one end of the optical path processing unit is optically coupled to the optoelectronic chip;

[0022] An optical interface is provided at one end of the placement cavity, and the other end of the optical path processing unit is optically coupled to the optical interface, and the optical interface is used to transmit optical signals between the optical path processing unit and the outside of the optical module.

[0023] In some embodiments, the optical path processing unit includes:

[0024] A lens assembly, the lens assembly being disposed on one side of the first surface of the multilayer circuit board and optically coupled to the optoelectronic chip;

[0025] An optical fiber optically connects the optical interface and the lens assembly to transmit an optical signal between the lens assembly and the optical interface.

[0026] Beneficial effects: By burying the integrated circuit chip in the multi-layer circuit board, it is beneficial to reduce the surface layout area of ​​the multi-layer circuit board occupied by the integrated circuit chip, freeing up more layout space for the multi-layer circuit board, and facilitating the integration of more channel lines on the multi-layer circuit board to achieve a higher-speed optical module; in addition, the optoelectronic chip is flip-chip mounted on the first surface and electrically connected to the integrated circuit chip, so that a shorter electrical connection can be formed between the optoelectronic chip and the integrated circuit chip, thereby helping to reduce the impedance between the integrated circuit chip and the optoelectronic chip and improve the high-frequency performance of the optical module circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 This is a schematic diagram of the structure of the optical module circuit board assembly of Example 1 of the present application;

[0029] Figure 2 This is a schematic diagram of the structure of the optical module circuit board assembly facing the first surface in Example 1 of the present application;

[0030] Figure 3 It is a schematic diagram of the structure of the optical module of Example 1 of the present application;

[0031] Figure 4It is a schematic diagram of the exploded structure of the optical module of Example 1 of the present application;

[0032] Figure 5 is a schematic structural diagram of the optical fiber connector viewed from the front along the length direction of Example 1 of the present application;

[0033] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure along line AA;

[0034] Figure 7 yes Figure 6 A partial enlarged view of part B;

[0035] Figure 8 This is a schematic diagram of the structure of the optical module circuit board assembly of Example 2 of the present application;

[0036] Fig. 9 This is a schematic diagram of the structure of the optical module circuit board assembly facing the first surface in Example 2 of the present application;

[0037] Fig.10 This is a schematic diagram of the structure of the optical module circuit board assembly of Example 3 of the present application;

[0038] Fig.11 It is a schematic diagram of the structure of the laser chip moved outward in Example 3 of the present application.

[0039] Figure numerals: 1. optical module circuit board assembly; 10. multilayer circuit board; 100. internal buried cavity; 101. first surface; 102. second surface; 103. conductive via; 104. conductive circuit; 11. integrated circuit chip; 110. transimpedance amplifier chip; 111. laser driver chip; 112. driver chip; 12. optoelectronic chip; 120. photodetector chip; 121. laser chip; 122. photon integrated chip; 13. filling glue; 14. heat conduction part; 140. heat conduction metal block; 141. laser stacking hole; 142. heat conduction material; 143. heat conduction layer; 15. electrical connection part; 16. lens assembly; 17. optical fiber; 18. optical fiber connector; 19. heat conduction pad; 2. shell; 20. placement cavity; 21. first shell; 22. second shell; 23. pull ring; 24. optical interface; X, thickness direction; Y, length direction; Z, width direction. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0041] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating positions or positional relationships, are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, "multiple" means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined.

[0042] An embodiment of the present application discloses an optical module circuit board assembly.

[0043] Embodiment 1:

[0044] Reference Figure 1 and Figure 2 The optical module circuit board assembly 1 has a thickness direction X, a length direction Y and a width direction Z. The optical module circuit board assembly 1 includes a multilayer circuit board 10. In this embodiment, the thickness direction X is parallel to the thickness direction X of the multilayer circuit board 10, and the length direction Y is parallel to the width direction Z. Figure 1 The extending direction of the longer side of the multilayer circuit board 10, the width direction Z is parallel to Figure 1 The extending direction of the shorter side of the multilayer circuit board 10.

[0045] An internal buried cavity 100 is provided in the multilayer circuit board 10, and the multilayer circuit board 10 has a first surface 101 and a second surface 102 arranged opposite to each other in the thickness direction X; an integrated circuit chip 11 is buried in the internal buried cavity 100, and an optoelectronic chip 12 is flip-mounted on the first surface 101, and the optoelectronic chip 12 is electrically connected to the integrated circuit chip 11 by flip-mounting; in addition, a heat conducting portion 14 is provided in the multilayer circuit board 10 on the side of the integrated circuit chip 11 away from the first surface 101, the heat conducting portion 14 contacts the integrated circuit chip 11, and the heat conducting portion 14 is at least partially exposed on the second surface 102.

[0046] It should be noted that, in this embodiment, the digital signal processing chip (DSP) is outsourced as an example, that is, the digital signal processing chip (DSP) is not set in the multi-layer circuit board 10. In other embodiments, the digital signal processing chip (DSP) can also be set on the multi-layer circuit.

[0047] By burying the integrated circuit chip 11 in the multi-layer circuit board 10, it is beneficial to reduce the surface layout area of ​​the multi-layer circuit board 10 occupied by the integrated circuit chip 11, freeing up more layout space for the multi-layer circuit board 10, and facilitating the integration of more channel circuits on the multi-layer circuit board 10 to achieve a higher-speed optical module; in addition, the optoelectronic chip 12 is flip-chip mounted on the first surface 101 and electrically connected to the integrated circuit chip 11, so that a shorter electrical connection can be formed between the optoelectronic chip 12 and the integrated circuit chip 11, thereby helping to reduce the impedance between the integrated circuit chip 11 and the optoelectronic chip 12, and improving the high-frequency performance of the optical module circuit board assembly 1. At the same time, a heat conductive portion 14 is provided between the integrated circuit chip 11 and the surface of the multi-layer circuit board 10 to improve the heat dissipation effect of the optical module circuit board assembly 1.

[0048] In some embodiments, reference Figure 1 and Figure 2 The integrated circuit chip 11 includes a transimpedance amplifier chip 110 (TIA), and the optoelectronic chip 12 includes a photodetector chip 120 (PD). The photodetector chip 120 is flip-chip mounted on the first surface 101 relative to the transimpedance amplifier chip 110 .

[0049] In some embodiments, reference Figure 1 and Figure 2 The integrated circuit chip 11 includes a laser driver chip 111 (DRV), and the optoelectronic chip 12 includes a laser chip 121 (LD). The laser chip 121 is flip-chip mounted on the first surface 101 relative to the laser driver chip 111 .

[0050] It should be noted that the integrated circuit chip 11 in the multilayer circuit board 10 in this embodiment includes a transimpedance amplifier chip 110 and a laser driver chip 111, which are embedded in the internal embedded cavity 100 of the multilayer circuit board 10. Correspondingly, the optoelectronic chip 12 on the first surface 101 includes a photodetector chip 120 and a laser chip 121, wherein the photodetector chip 120 is electrically connected to the transimpedance amplifier chip 110, and the laser driver chip 111 is electrically connected to the laser chip 121. It can be understood that the optoelectronic chip 12 on the multilayer circuit board 10 can be one or a combination of the photodetector chip 120 and the laser chip 121, and the corresponding integrated circuit chip 11 can be one or a combination of the transimpedance amplifier chip 110 and the laser driver chip 111, and the functional requirements of the multilayer circuit board 10 can be flexibly set.

[0051] Reference Figure 1 and Figure 2In this embodiment, the laser chip 121 and the photodetector chip 120 are arranged in sequence in the width direction Z, and a lens is provided on the first surface 101 outside the laser chip 121 and the photodetector chip 120 to couple light. Since the laser driver chip 111 and the transimpedance amplifier chip 110 are both buried inside the multi-layer circuit board 10, the lens structure only needs to cover the outside of the laser chip 121 and the photodetector chip 120. Compared with the existing solution in which the laser driver chip 111 and the transimpedance amplifier chip 110 are attached to the first surface 101, the solution of this embodiment reduces the lens size, thereby reducing the surface area occupied by the multi-layer circuit board 10, which is conducive to leaving more wiring space.

[0052] In order to further reduce the connection distance between the optoelectronic chip 12 and the transimpedance amplifier chip 110 and the laser driver chip 111, in some embodiments, referring to Figure 1 and Figure 2 The laser chip 121 is flipped on the first surface of the multilayer circuit board relative to the laser driver chip 111 in the thickness direction X, and the photodetector chip 120 is flipped on the first surface 101 of the multilayer circuit board 10 relative to the transimpedance amplifier chip 110 in the thickness direction X. The electrodes of the transimpedance amplifier chip 110 and the laser driver chip 111 face the first surface 101. Conductive vias 103 are provided between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120 in the multilayer circuit board 10. The laser driver chip 111 and the laser chip 121, and the transimpedance amplifier chip 110 and the photodetector chip 120 are electrically connected through the conductive vias 103, that is, the conductive vias 103 lead the electrodes of the laser driver chip 111 and the transimpedance amplifier chip 110 to the first surface 101 and weld the corresponding pins of the laser chip 121 and the photodetector chip 120, so that there is a shortest conductive path between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120. In addition, a filling glue 13 is provided between the laser chip 121, the photodetector chip 120 and the first surface 101 of the multilayer circuit board 10 to protect the flip-chip pins and solder joints of the laser chip 121 and the photodetector chip 120 and to form insulation protection.

[0053] In addition, after the laser driver chip 111 and the transimpedance amplifier 110 are embedded, the conductive vias 103 between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120 only need to penetrate the circuit board stack between the internal embedded cavity 100 and the first surface 101. Compared with the vias that penetrate the first surface 101 and the second surface 102 of the entire multilayer circuit board 10, the conductive vias 103 of this embodiment are shorter, and their dimension in the thickness direction X is D, satisfying D≤40μm. That is, in the multilayer circuit board 10 of the optical module, the length of the conductive vias 103 between the laser driver chip 111 and the laser chip 121, and between the transimpedance amplifier chip 110 and the photodetector chip 120 can be shortened to 40μm or shorter. Furthermore, in some embodiments, the value of D can be controlled between 30μm and 40μm, that is, D can be any one of 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm or a range of any two of them.

[0054] In addition, it should be noted that, referring to Figure 1 In addition to the conductive vias 103 in the multilayer circuit board 10, conductive circuits 104 need to be arranged on each layer to cooperate with the conductive vias 103 to achieve electrical connection of various parts, which will not be described in detail here.

[0055] In some embodiments, reference Figure 1 and Figure 2 The heat conducting portion 14 includes a heat conducting metal block 140. The heat conducting metal block 140 can be a heat conducting copper block or a tungsten-copper alloy block. The heat conducting metal block 140 is attached to the bottom large surface of the laser driver chip 111. In some embodiments, the heat conducting metal block 140 can also be attached to the laser driver chip 111 and the transimpedance amplifier chip 110 at the same time. The surface of the heat conducting metal block 140 away from the laser driver chip 111 is exposed to the second surface 102, which is conducive to quickly conducting heat to the optical module housing, so as to improve the heat dissipation effect and performance of the transimpedance amplifier chip 110 and the laser driver chip 111.

[0056] In some embodiments, the multilayer circuit board 10 is further provided with an electrical connection portion 15 at one end in the length direction Y. The electrical connection portion 15 is used to electrically connect to an external device. In this embodiment, the electrical connection portion 15 uses a gold finger, which can be distributed on the first surface 101 and the second surface 102. In other embodiments, the electrical connection portion 15 can also use an electrical contact plate. The laser driver chip 111 and the transimpedance amplifier chip 110 are electrically connected to the gold finger through the conductive circuit 104 and the conductive via 103 in the multilayer circuit board 10, and then electrically connected to external devices such as servers, switches, etc. through the gold finger.

[0057] The implementation principle of Example 1 is:

[0058] An internal embedding cavity 100 is provided in the layer where the laser driver chip 111 and the transimpedance amplifier chip 110 are to be embedded, and the laser driver chip 111 and the transimpedance amplifier chip 110 are embedded, and a heat conducting portion 14 is provided in the layer where the heat conducting portion 14 is to be embedded;

[0059] The number of layers of the multilayer circuit board 10 is increased as needed and pressed together so that the heat conducting portion 14 is attached to the bottom large surface of the laser driver chip 111 and the transimpedance amplifier chip 110;

[0060] The pad positioning information of the embedded laser driver chip 111 and the transimpedance amplifier chip 110 can be captured by lithography technology, and then holes can be punched to the laser driver chip 111 and the transimpedance amplifier chip 110 to make conductive vias 103, that is, the electrodes of the laser driver chip 111 and the transimpedance amplifier chip 110 are led out to the first surface 101 through the conductive vias 103;

[0061] The laser chip 121 and the photodetector chip 120 are flip-chip welded on the first surface 101 , so that the laser driver chip 111 and the transimpedance amplifier chip 110 are electrically connected through the conductive vias 103 to form a short-distance high-speed interconnection.

[0062] Correspondingly, an embodiment of the present application also discloses an optical module.

[0063] Reference Figures 1 to 7 The optical module includes the optical module circuit board assembly 1 mentioned above, and also includes a housing 2, an optical processing unit and an optical interface 24. The housing 2 has a placement cavity 20, and the optical module circuit board assembly 1 is arranged in the placement cavity 20.

[0064] Specifically, refer to Figure 3 and Figure 4 The housing 2 is a split structure, and includes a first housing 21 and a second housing 22 arranged in sequence from bottom to top in the thickness direction X, and the first housing 21 and the second housing 22 are opposite to form a placement cavity 20. In addition, a pull ring 23 connected to the first housing 21 is provided on one side of the first housing 21 away from the electrical connection portion 15 in the length direction Y, so as to facilitate the plugging and unplugging of the entire optical module.

[0065] The optical path processing unit is arranged in the housing cavity 20 of the housing 2, one end of which is optically coupled to the optoelectronic chip 12, and the other end is optically coupled to the optical interface 24. The optical interface 24 is located on the side of the optical path processing unit away from the electrical connection portion 15, and is arranged at one end of the housing cavity 20 of the housing 2, and is used to transmit optical signals between the optical path processing unit and the outside of the optical module.

[0066] Specifically, in some embodiments, referring to Figure 4 , Figure 6 and Figure 7 , the optical path processing unit includes a lens assembly 16 and an optical fiber 17. The lens assembly 16 is arranged on the first surface 101 of the multilayer circuit board 10 and optically coupled to the optoelectronic chip 12. It should be noted that in the present embodiment, the optoelectronic chip 12 includes a plurality of photodetector chips 120 arranged in an array and a plurality of laser chips 121 arranged in an array. Correspondingly, the lens assembly 16 includes a plurality of lenses corresponding to the plurality of photodetector chips 120 arranged in an array, and lenses corresponding to the plurality of laser chips 121 arranged in an array. Similarly, a plurality of optical fibers 17 are also arranged and arranged in a corresponding array to be optically coupled with the plurality of photodetector chips 120 arranged in an array and the plurality of laser chips 121 arranged in an array through the lens assembly 16. The other end of the optical fiber 17 is optically connected to the optical interface 24 through the optical fiber connector 18. The principle of optical module signal transmission is a prior art and will not be repeated here.

[0067] In addition, it should be noted that, in other embodiments, the optical fiber 17 can also be replaced by a wavelength division multiplexer / demultiplexer, and the lens assembly 16 is disposed between the wavelength division multiplexer / demultiplexer and the optoelectronic chip 12, and is used for optical coupling between the wavelength division multiplexer / demultiplexer and the optoelectronic chip 12. The multi-channel optical signals emitted by the multiple array-arranged laser chips 121 are multiplexed and then output, and the received external composite optical signals are demultiplexed and then coupled to each photodetector chip 120 arranged in the array. Here, the multiple array-arranged laser chips 121 and the multiple array-arranged photodetector chips 120 can be an array arrangement of multiple laser chips 121 and an array arrangement of multiple photodetector chips 120, or a laser array chip and a photodetector array chip, that is, multiple lasers are arranged in an array on a single chip and multiple photodetectors are arranged in an array on a single chip.

[0068] The specific working process is as follows: the electrical connection part 15 (such as a gold finger) receives an external instruction and transmits it to the laser driver chip 111, the laser driver chip 111 drives the laser chip 121 to work to emit an optical signal, the optical signal is coupled to the optical fiber 17 through the lens assembly 16, the optical fiber 17 is coupled to the optical interface 24 through the optical fiber connector 18, and the optical signal is transmitted to the external transmission optical fiber through the optical interface 24;

[0069] The external transmission optical fiber transmits the optical signal transmitted from the far end to the optical fiber connector 18 and the optical fiber 17 through the optical interface 24. The optical signal is then coupled to the photodetector chip 120 through the lens assembly 16. The photodetector chip 120 converts the received optical signal into an electrical signal and transmits it to the transimpedance amplifier chip 110. After amplification by the transimpedance amplifier chip 110, the optical signal is transmitted to the electrical connection part 15 through the conductive circuit 104 and the conductive via 103 of the multi-layer circuit board 10, and is uploaded to an external device such as a server or a switch by the gold finger.

[0070] Embodiment 2:

[0071] Reference Figure 8 and Fig. 9 The difference between this embodiment and embodiment 1 is that the optoelectronic chip 12 includes a photonic integrated circuit 122 (Photonics Integrated Circuit, PIC for short), the integrated circuit chip 11 includes a driver chip 112 for driving the photonic integrated circuit (PIC) to work, and the photonic integrated circuit 122 has a wider bandwidth and lower energy loss, fast data transmission speed, small size, and low cost.

[0072] It should be noted that the photon integrated chip 122 integrates an optical modulator, so the photon integrated chip 122 needs to be electrically connected to the driver chip 112 so that the photon integrated chip 122 can be driven by the driver chip 112 .

[0073] In some embodiments, the photodetector may be integrated into the photonic integrated chip 122, such as Fig. 9 As shown, at this time, the photon integrated chip 122 also needs to be electrically connected to the transimpedance amplifier chip 110. The optical signal received by the optical fiber 17 of the array from the far end is coupled into the photon integrated chip 122, and transmitted to the photodetector part in the photon integrated chip 122, which is converted into an electrical signal by the photodetector part in the photon integrated chip 122 and then transmitted to the transimpedance amplifier chip 110. In other embodiments, the photodetector chip 120 can also be independently arranged and electrically connected to the transimpedance amplifier chip 110, and the photon integrated chip 122 only needs to be electrically connected to the driver chip 112. The optical signal emitted by the laser chip 121 is coupled into the photon integrated chip 122, modulated by the photon integrated chip 122, and then coupled into the optical fiber 17, transmitted to the optical interface 24 through the optical fiber 17, and output by the optical interface 24.

[0074] The photonic integrated chip 122 is flipped on the first surface 101 of the multilayer circuit board 10 and is opposite to the integrated circuit chip 11 (such as the driver chip 112) in the thickness direction X. The photonic integrated chip 122 is electrically connected to the driver chip 112 through the conductive via 103, thereby shortening the transmission line of the high-speed signal and improving the high-frequency performance of the optical module circuit board assembly 1.

[0075] Embodiment 3:

[0076] Reference Fig.10The difference between this embodiment and the first embodiment is that the heat conducting portion 14 includes a laser stacked hole 141 provided in the multilayer circuit board 10 and a heat conducting layer 143 provided on the second surface 102, the laser stacked hole 141 is located on the side of the integrated circuit chip 11 away from the first surface 101, and the laser stacked hole 141 extends in the thickness direction X and penetrates the second surface 102, and the laser stacked hole 141 is filled with a heat conducting material 142, and the heat conducting material 142 is heat-conductingly connected to the heat conducting layer 143. It should be noted that both the heat conducting material 142 and the heat conducting layer 143 can be made of metal heat conducting materials.

[0077] In order to improve the heat dissipation effect of the laser stacking holes 141 , the arrangement density of the laser stacking holes 141 relative to the integrated circuit chip 11 can be increased, that is, the contact area between the laser stacking holes 141 and the thermal conductive material 142 therein and the integrated circuit chip 11 can be increased.

[0078] In addition, refer to Fig.11 In some embodiments, the laser chip 121 can also be moved out of the multilayer circuit board 10, and electrically connected to the integrated circuit chip 11 in the multilayer circuit board 10 through bonding wires, and only the photodetector chip 120 is retained for flip-chip welding on the first surface 101 of the multilayer circuit board, or the photon integrated chip 122 is retained for flip-chip welding on the first surface 101 of the multilayer circuit board 10, and the optical signal emitted by the laser chip 121 is coupled to the photon integrated chip 122, and then coupled to the optical fiber 17 after being modulated by the photon integrated chip 122, and transmitted to the optical interface 24 through the optical fiber 17, and output by the optical interface 24. At the same time, a thermal pad 19 is provided under the laser chip 121 to improve the heat dissipation effect of the laser chip 121.

[0079] The above is a detailed introduction to an optical module circuit board assembly and an optical module provided in the embodiments of the present application, and the principles and implementation methods of the present application are explained by using specific examples. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. An optical module circuit board assembly, characterized in that: include: A multilayer circuit board, the multilayer circuit board having a first surface and a second surface arranged opposite to each other in a thickness direction thereof, the multilayer circuit board being provided with an internal buried cavity, a conductive via and a conductive circuit, and the multilayer circuit board being provided with an electrical connection portion for electrically connecting to an external device; an integrated circuit chip, wherein the integrated circuit chip is embedded in the internal embedding cavity and electrically connected to the electrical connection portion through a portion of the conductive vias and the conductive lines; The optoelectronic chip is used for converting optoelectronic signals or modulating optical signals. The optoelectronic chip is flipped on the first surface and electrically connected to the integrated circuit chip through the flip-mounting method and part of the conductive vias.

2. The optical module circuit board assembly according to claim 1, characterized in that: It also includes a digital signal processing chip, which is arranged on the multi-layer circuit board.

3. The optical module circuit board assembly according to claim 1, characterized in that: The projections of the optoelectronic chip and the integrated circuit chip on the first surface of the multilayer circuit board at least partially overlap, and the optoelectronic chip is electrically connected to the integrated circuit chip through a conductive via that vertically penetrates the circuit board stack between the internal buried cavity and the first surface.

4. The optical module circuit board assembly according to claim 3, characterized in that: The conductive via that passes through the circuit board stack between the internal buried cavity and the first surface has a dimension in the thickness direction (X) of the multilayer circuit board that is less than or equal to 40 μm.

5. The optical module circuit board assembly according to claim 1, characterized in that: The electrical connection portion is an electrical contact plate or a gold finger arranged at one end of the multilayer circuit board in the length direction.

6. The optical module circuit board assembly according to claim 1, characterized in that: It also includes a heat conducting portion disposed in the multilayer circuit board, the heat conducting portion is located on a side of the integrated circuit chip away from the first surface and attached to the integrated circuit chip, and the heat conducting portion is at least partially exposed on the second surface.

7. The optical module circuit board assembly according to claim 6, characterized in that: The heat conducting part comprises a heat conducting metal block, which is embedded in the multi-layer circuit board and heat-conductingly connected to the integrated circuit chip, and a side of the heat conducting metal block facing away from the integrated circuit chip is exposed on the second surface.

8. The optical module circuit board assembly according to claim 6, characterized in that: The heat-conducting part includes a laser stacked hole arranged in the multi-layer circuit board and a heat-conducting layer arranged on the second surface. The laser stacked hole penetrates the circuit board stack between the internal buried cavity and the second surface, and the laser stacked hole is filled with a heat-conducting material. The heat-conducting material thermally connects the heat-conducting layer and the integrated circuit chip.

9. The optical module circuit board assembly according to claim 1, characterized in that: The optoelectronic chip includes a plurality of photodetector chips arranged in an array and a plurality of laser chips arranged in an array.

10. The optical module circuit board assembly according to claim 1 or 9, characterized in that: The integrated circuit chip includes a transimpedance amplifier chip and a laser driver chip.

11. The optical module circuit board assembly according to claim 1, characterized in that: The integrated circuit chip includes a driver chip, and the optoelectronic chip includes a photon integrated chip. The photon integrated chip is flipped on the first surface relative to the driver chip.

12. An optical module, characterized in that: The optical module circuit board assembly according to any one of claims 1 to 11 further comprises: A housing, wherein the housing has a placement cavity, the optical module circuit board assembly is arranged in the placement cavity, and the electrical connection portion passes through the housing to be electrically connected to an external device; An optical path processing unit, the optical path processing unit is arranged in the placement cavity, and one end of the optical path processing unit is optically coupled to the optoelectronic chip; An optical interface is provided at one end of the placement cavity, and the other end of the optical path processing unit is optically coupled to the optical interface, and the optical interface is used to transmit optical signals between the optical path processing unit and the outside of the optical module.

13. The optical module according to claim 12, characterized in that: The optical path processing unit comprises: A lens assembly, the lens assembly being disposed on one side of the first surface of the multilayer circuit board and optically coupled to the optoelectronic chip; An optical fiber optically connects the optical interface and the lens assembly to transmit an optical signal between the lens assembly and the optical interface.

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