Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation device comprises a vapor chamber, and the vapor chamber is provided with a first target area and a second target area. A first part of the heat dissipation assembly is connected with the uniform temperature plate, the first target area meets a preset condition so that a second part of the heat dissipation assembly can be located in the first target area, the first target area does not meet the preset condition, and a second part of the heat dissipation assembly is located in the second target area.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] Currently, electronic devices use a vapor chamber as a heat conduction module to dissipate heat.

[0003] However, when single or double baking is used, the heating areas are different, but the internal structures of existing temperature dispersion plates are all fixed in design and cannot meet the heat dissipation requirements in different scenarios.

[0004] Therefore, how to provide a heat dissipation device that is more suitable for different scenarios becomes an urgent problem to be solved. Utility Model Content

[0005] The purpose of the present application is to provide a heat dissipation device and an electronic device.

[0006] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of the present application provides an electronic device, comprising: a temperature vapor chamber, the temperature vapor chamber having a first target area and a second target area;

[0008] A heat dissipation component, wherein the first part of the heat dissipation component is connected to a temperature vapor chamber, the first target area meets a preset condition so that the second part of the heat dissipation component is in the first target area, and the first target area does not meet the preset condition, and the second part of the heat dissipation component is in the second target area.

[0009] In some modified implementations of the first aspect of the present application, the heat dissipation component includes a metal wire mesh, and the metal wire mesh is used for transferring liquid medium and heat.

[0010] In some modified implementations of the first aspect of the present application, a groove structure is provided on the metal wire mesh; and the groove structure is provided with a capillary structure.

[0011] In some modified implementations of the first aspect of the present application,

[0012] The surfaces of the first target area and the second target area are provided with a powder layer and a water plating layer.

[0013] In some modified implementations of the first aspect of the present application, the powder layer is made by sintering copper powder particles;

[0014] The water-plated layer is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer.

[0015] In some modified implementations of the first aspect of the present application, the first target area is a connection area for heat transfer, and the preset condition is 80-90°C. If the first target area meets the preset condition, the second part of the heat dissipation component is deformed, and the second part is connected to the first target area for heat transfer.

[0016] In a second aspect, the present application further provides an electronic device, comprising a first heating element;

[0017] a second heating element;

[0018] A heat dissipation device, the heat dissipation device comprising:

[0019] A temperature averaging plate, the temperature averaging plate having a first target area and a second target area, the first target area is arranged corresponding to the first heating element, and the second target area is arranged corresponding to the second heating element;

[0020] A heat dissipation component, wherein the first part of the heat dissipation component is connected to the temperature homogenizing plate, the first target area meets a preset condition so that the second part of the heat dissipation component is in the first target area, and the first target area does not meet the preset condition, and the second part of the heat dissipation component is in the second target area.

[0021] In some modified implementations of the first aspect of the present application, the heat dissipation device further includes a heat conducting component, a first end of the heat conducting component is connected to the temperature homogenizing plate, and a second end of the heat conducting component is located in the second target area.

[0022] In some modified implementations of the first aspect of the present application, the heat dissipation component includes a memory metal wire mesh; the heat conduction component includes a metal wire mesh.

[0023] In some modified implementations of the first aspect of the present application,

[0024] The surfaces of the first target area and the second target area are provided with a powder layer and a water-plated layer; the powder layer is made by sintering copper powder particles;

[0025] The water-plated layer is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0027] Figure 1A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application when a first target area reaches a preset condition is shown schematically;

[0028] Figure 2 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application when a first target area does not meet a preset condition is shown schematically.

[0029] Description of Figure Numbers:

[0030] Heat dissipation device 1, temperature homogenizing plate 11, first target area 111, second target area 112, first surface 113, second surface 114, heat dissipation component 12, memory metal mesh 120, first part 121, second part 122, thermal conductive component 13, capillary tube 14, powder layer 15, water plating layer 16, first heating element 2, second heating element 3. DETAILED DESCRIPTION

[0031] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0032] like Figure 1 and Figure 2 As shown, the present application provides a heat dissipation device 1, comprising a temperature vaporizer 11, wherein the temperature vaporizer 11 has a first target area 111 and a second target area 112;

[0033] The heat dissipation component 12, the first part 121 of the heat dissipation component 12 is connected to the temperature homogenizing plate 11, the first target area 111 reaches a preset condition so that the second part 122 of the heat dissipation component 12 is in the first target area 111, the first target area 111 does not reach the preset condition, and the second part of the heat dissipation component 12 is in the second target area 112.

[0034] A heat dissipation device 1 provided in an embodiment of the present application includes a temperature averaging plate 11 and a heat dissipation assembly 12. The temperature averaging plate 11 is located above a first heating element 2 and a second heating element 3 to dissipate heat for the first heating element 2 and the second heating element 3. The temperature averaging plate 11 has a first target area 111 and a second target area 112. The first target area 111 corresponds to the first heating element 2, and the second target area 112 corresponds to the second heating element 3. The heat dissipation assembly 12 includes a first portion 121 and a second portion 122. The first portion 121 of the heat dissipation assembly 12 is welded to a first surface 113 of the temperature averaging plate 11. The first surface 113 of the temperature averaging plate 11 is arranged away from the first target area 111 and the second target area 112. The second portion 122 is located on the second surface 114 of the temperature averaging plate 11. The first surface 113 and the second surface 114 of the temperature averaging plate 11 are arranged opposite to each other. The first surface 113 is a top surface, and the second surface 114 is a bottom surface. The second surface 114 of the temperature averaging plate 11 has the first target area 111 and the second target area 112. When the first target area 111 reaches the preset condition, the second part 122 of the heat dissipation component 12 is in the first target area 111, and when the first target area 111 does not reach the preset condition, the second part 122 of the heat dissipation component 12 is in the second target area 112, so that the second part 122 of the heat dissipation component 12 can be switched between the first target area 111 and the second target area 112 according to whether the first target area 111 reaches the preset condition. When the first target area 111 does not reach the preset condition, the heat dissipation demand of the first heating element 2 corresponding to the first target area 111 is not high. At this time, the second part 122 of the heat dissipation component 12 is in the second target area 112 to dissipate heat for the second heating element 3 corresponding to the second target area 112; and when the first target area 111 reaches the preset condition, the heat dissipation demand of the first target area 111 increases. At this time, the second part 122 of the heat dissipation component 12 is in the first target area 111 to dissipate heat for the first heating element 2 corresponding to the first target area 111.

[0035] Therefore, in the heat dissipation device 1 provided in the present application, the second part 122 of the heat dissipation component 12 can adjust its position according to whether the first target area 111 meets the preset conditions, that is, it can adjust its position according to the heat dissipation requirements of different components at different times, so as to match the heat dissipation requirements of different scenes and thus improve the heat dissipation efficiency.

[0036] In the embodiment of the present application, the heat dissipation component 12 includes a metal wire mesh, and the metal wire mesh is used for transferring liquid medium and heat.

[0037] In this embodiment, the heat dissipation device 1 includes a temperature averaging plate 11 and a heat dissipation assembly 12. The temperature averaging plate 11 is located above the first heating element 2 and the second heating element 3 to dissipate heat for the first heating element 2 and the second heating element 3. The temperature averaging plate 11 has a storage space inside, and the heat dissipation assembly 12 is arranged in the storage space. The heat dissipation assembly 12 includes a metal wire mesh. The first part 121 of the metal wire mesh is connected to the first surface 113 of the temperature averaging plate 11 away from the first heating element 2 and the second heating element 3. The second part 122 of the metal wire mesh is in the first target area 111 or the second target area 112, and the metal wire is used to transfer liquid medium and heat, so that the liquid medium is transmitted through the metal wire mesh to the second part 122, so as to absorb heat from the first heating element 2 corresponding to the first target area 111 or the second heating element 3 corresponding to the second target area 112, and transmit heat. Thus, heat dissipation of the first heating element 2 or the second heating element 3 is achieved.

[0038] In the embodiment of the present application, a groove structure is provided on the metal wire mesh; and the groove structure is provided with a capillary structure.

[0039] In this embodiment, the temperature plate 11 is arranged above the first heating element 2 and the second heating element 3, and the temperature plate 11 has a first surface 113 and a second surface 114. The first surface 113 is arranged away from the first heating element 2 and the second heating element 3, and the second surface 114 is arranged close to the first heating element 2 and the second heating element 3. The first surface 113 of the temperature plate 11 is the top surface, and the second surface 114 is the bottom surface. The first heating element 2 needs to dissipate heat when the preset condition is reached, and the second heating element 3 also needs to dissipate heat. The temperature homogenizing plate 11 is provided with a heat dissipation component 12, and the heat dissipation component 12 includes a metal mesh, which is formed by weaving metal wires, and a groove structure is provided between each mesh, and a capillary structure is provided in the groove structure, and the capillary structure transfers the liquid medium to transfer the liquid medium to the first target area 111 or the second target area 112, and the liquid medium absorbs heat from the first target area 111 or the second target area 112, so that the first element corresponding to the first target area 111 or the second element corresponding to the second target area 112 is dissipated, and the liquid medium is converted into vapor during the heat absorption process. The vapor medium moves upward to the second surface 114 of the temperature equalizing plate 11. A fan assembly is provided outside the temperature equalizing plate 11 near the second surface 114. The fan assembly blows air toward the second surface 114 of the temperature equalizing plate 11 to reduce the temperature of the vapor medium so that the vapor medium becomes a liquid medium. A thin layer of Cu powder is also spread on the second part 122 of the metal wire mesh. The liquid medium returns to the capillary of the metal wire mesh through the capillary action of the Cu powder and is transmitted to the second part 122 of the metal wire mesh again to absorb heat from the first target area 111 or the second target area 112, thereby realizing the circulation of the medium.

[0040] In this embodiment, the thickness of the metal mesh may be 2 mm, and the depth of the groove may be 0.3 mm.

[0041] like Figure 1 and Figure 2 As shown, in the embodiment of the present application, the surfaces of the first target area and the second target area are provided with a powder layer 15 and a water plating layer 16;

[0042] The powder layer 15 is connected to the metal wire mesh;

[0043] The water plating layer 16 is disposed between the powder layer 15 and the metal wire mesh.

[0044] In this embodiment, the second surface 114 of the temperature equalizing plate has a first target area and a second target area, and a powder layer 15 and a water coating layer 16 are arranged on the first target area and the second target area. The second part 122 of the metal wire mesh is in the first target area 111 or the second target area 112, and is connected to the powder layer 15. The setting of the powder layer 15 ensures that the liquid medium transported by the metal wire mesh can be spread out quickly, thereby quickly absorbing the heat of the first heating element 2 or the second heating element 3. And the surface of the powder layer 15 has a water coating 16, that is, the second surface 114 of the temperature equalizing plate, the powder layer 15, the water coating 16 and the metal wire mesh are arranged in sequence. The arrangement of the powder layer 15 ensures that the liquid medium transported by the metal wire mesh can be quickly spread out. The surface of the powder layer 15 is provided with a water coating film, and the water coating 16 is the liquid medium, that is, the surface of the powder layer 15 always has the liquid medium, so that it can be ensured that the liquid medium can always be in the second part 122 of the metal wire mesh, so as to continuously perform heat exchange for the first heating element 2 or the second heating element 3 corresponding to the first target area 111 or the second target area 112, thereby ensuring that the liquid medium and heat can be continuously transmitted through the metal wire mesh, thereby ensuring continuous heat dissipation.

[0045] In this embodiment, the thickness of the powder layer 15 may be 0.2 mm, and the thickness of the water-plated layer 16 may be 0.08 mm.

[0046] In the embodiment of the present application, the powder layer 15 is made by sintering copper powder particles;

[0047] The water-plated layer 16 is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer 15 .

[0048] In this embodiment, a powder layer 15 is formed on the second surface 114 of the temperature equalizing plate by sintering copper powder particles. The second surface 114 of the temperature equalizing plate is a metal plate surface. The formation of the powder layer 15 enables the liquid medium transported back by the metal mesh to be quickly spread out, thereby quickly absorbing the heat of the first heating element 2 or the second heating element 3, thereby achieving heat dissipation and cooling of the first heating element 2 or the second heating element 3. In addition, a hydrophilic coating is sprayed on the surface of the powder layer 15 formed by sintering copper powder particles, so that there is always a layer of water film on the surface of the powder layer 15, which is the water plating layer 16, so that the water plating layer 16 on the surface of the powder layer 15 can continuously exchange heat for the first heating element 2 or the second heating element 3 corresponding to the first target area 111 or the second target area 112, thereby ensuring heat dissipation.

[0049] In this embodiment, the thickness of the hydrophilic coating may be 0.02 mm.

[0050] In the embodiment of the present application, the first target area 111 is a connection area for heat transfer, and the preset condition is 80-90°C. If the first target area 111 meets the preset condition, the second part 122 of the heat dissipation component 12 is deformed, and the second part 122 is connected to the first target area 111 for heat transfer.

[0051] In this embodiment, the temperature equalizing plate 11 has a accommodating space, and the accommodating space has a heat dissipation component 12. The temperature equalizing plate 11 also includes a first surface 113 and a second surface 114. The first surface 113 is the top end, and the second surface 114 is the bottom end. The second surface 114 of the temperature equalizing plate 11 has a first target area 111 and a second target area 112. The first surface 113 of the temperature equalizing plate 11 is far away from the first target area 111 and the second target area 112, and the first target area 111 corresponds to the first heating element 2, and the second target area 112 corresponds to the second heating element 3. When the first target area 111 reaches the preset condition, that is, the temperature reaches 80-90°C, the first heating element 2 corresponding to the first target area 111 needs to be cooled. At this time, the second part 122 of the metal mesh included in the heat dissipation component 12 is deformed. The metal mesh is a memory metal. The memory metal is deformed, so that the second part 122 of the memory metal is transformed from the second target area 112 to the first target area 111, thereby transferring heat to the first target area 111, and transferring the heat of the first target area 111 to the first surface 113 of the temperature equalizing plate 11 for heat dissipation. The temperature of the second heating element 3 is higher most of the time. The heat dissipation device 1 also includes a heat conducting component 13. The first surface 113 of the heat conducting component 13 is sintered and connected to the first surface 113 of the temperature equalizing plate 11, and the second surface 114 is always in the second target area 112, and its position will not change, so that the second heating element 3 corresponding to the second target area 112 is always cooled. When the first target area 111 does not meet the preset condition, the second portion 122 of the memory metal wire mesh is in the second target area 112 , thereby also dissipating heat for the second heating element 3 corresponding to the second target area 112 .

[0052] Therefore, when the first target area 111 reaches the preset condition, the second part 122 of the memory metal wire mesh is deformed and connected to the first target area 111, and the first heating element 2 corresponding to the first target area 111 is dissipated, and the second end of the thermal conductive component 13 is connected to the second target area 112, and the second heating element 3 corresponding to the second target area 112 is dissipated; when the first target area 111 does not reach the preset condition, the second part 122 of the memory metal wire mesh does not deform and is connected to the second target area 112, and the second end of the thermal conductive component 13 is also connected to the second target area 112, so that the memory metal wire mesh and the thermal conductive component 13 both dissipate heat for the second heating element 3 corresponding to the second target area 112, thereby further improving the heat dissipation effect and avoiding waste of the heat dissipation device.

[0053] In one embodiment of the present application, the first part 121 of the memory metal wire mesh 120 is connected to the first surface 113 of the heat sink 11, and the second part 122 is a free end. It can be in the first target area 112 when the first target area 111 meets the preset conditions, and can also be in the second target area 112 when the first target area 111 does not meet the preset conditions, so that the second part 122 of the memory metal wire mesh 120 swings to different positions according to whether the preset conditions are met.

[0054] In another embodiment of the present application, the memory wire mesh 120 is a planar structure, which is approximately vertically arranged inside the heat spreader, and the extension direction is approximately vertical to the extension direction from the first target area 111 to the second target area 112. The first edge of the memory wire mesh 120 is fixedly connected to the surface between the first surface 113 and the second surface 114 of the heat spreader 11, and the two ends of the first edge are respectively fixed to the first surface 113 and the second surface 114 of the heat spreader 11, and the second edge and other edges of the memory wire mesh 120 that are arranged opposite to the first edge are free ends, so that the memory wire mesh 120 can swing, and when the first target area 111 meets the preset conditions, it can swing to the first target area 111, and when the first target area 111 does not meet the preset conditions, it can swing to the second target area 112, so that the second part of the memory wire mesh 120 swings to different positions depending on whether the preset conditions are met.

[0055] In this embodiment, the memory metal mesh is made of TiNiNb alloy, and its deformation temperature can be controlled within 80° C.-90° C. by controlling the Nb element content. The heat conducting component 13 is a common metal mesh.

[0056] In this embodiment, the first target area 111 and the second target area 112 are connected via a capillary line 14 to evenly distribute the amount of medium between the first target area 111 and the second target area 112 .

[0057] In this embodiment, the first heat generating component 2 is a GPU, and the second heat generating component 3 is a CPU.

[0058] like Figure 1 and Figure 2 As shown, on the other hand, the present application also provides an electronic device, including a first heating element 2;

[0059] The second heating element 3;

[0060] A heat dissipation device 1, wherein the heat dissipation device 1 comprises:

[0061] A temperature averaging plate 11, wherein the temperature averaging plate 11 has a first target area 111 and a second target area 112, wherein the first target area 111 is arranged corresponding to the first heating element 2, and the second target area 112 is arranged corresponding to the second heating element 3;

[0062] The heat dissipation component 12, the first part 121 of the heat dissipation component 12 is connected to the temperature homogenizing plate 11, the first target area 111 reaches a preset condition so that the second part 122 of the heat dissipation component 12 is in the first target area 111, the first target area 111 does not reach the preset condition, and the second part of the heat dissipation component 12 is in the second target area 112.

[0063] An electronic device provided in an embodiment of the present application includes a first heating element 2, a second heating element 3 and a heat dissipation device 1, wherein the heat dissipation device 1 includes a temperature averaging plate 11 and a heat dissipation assembly 12, wherein the temperature averaging plate 11 is located above the first heating element 2 and the second heating element 3 to dissipate heat for the first heating element 2 and the second heating element 3, wherein the temperature averaging plate 11 has a first target area 111 and a second target area 112, wherein the first target area 111 corresponds to the first heating element 2, and the second target area 112 corresponds to the second heating element 3, wherein the heat dissipation assembly 12 includes a first portion 121 and a second portion 122, wherein the first portion 121 of the heat dissipation assembly 12 is sintered and connected to a first surface 113 of the temperature averaging plate 11, and the second portion 122 is located on a second surface 114 of the temperature averaging plate 11, and the second surface 114 of the temperature averaging plate 11 has the first target area 111 and the second target area 112. When the first target area 111 reaches the preset condition, the second part 122 of the heat dissipation component 12 is in the first target area 111, and when the first target area 111 does not reach the preset condition, the second part 122 of the heat dissipation component 12 is in the second target area 112, so that the second part 122 of the heat dissipation component 12 can switch between the first target area 111 and the second target area 112 according to whether the first target area 111 reaches the preset condition. When the first target area 111 does not reach the preset condition, the heat dissipation demand of the first heating element 2 corresponding to the first target area 111 is not high. At this time, the second part 122 of the heat dissipation component 12 does not deform and is in the second target area 112, and the second heating element 3 corresponding to the second target area 112 is cooled; when the first target area 111 reaches the preset condition, the heat dissipation demand of the first target area 111 increases. At this time, the second part 122 of the heat dissipation component 12 deforms and is in the first target area 111, so as to cool the first heating element 2 corresponding to the first target area 111.

[0064] Therefore, the electronic device provided in the present application can adjust the position according to whether the first target area 111 meets the preset conditions through the second part 122 of the heat dissipation component 12, that is, it can adjust the position according to the heat dissipation requirements of different components at different times, so as to match the heat dissipation requirements of different scenes and thus improve the heat dissipation efficiency.

[0065] In the embodiment of the present application, the heat dissipation device 1 further includes a heat conducting component 13 , a first surface 113 of the heat conducting component 13 is connected to the temperature homogenizing plate 11 , and a second surface 114 of the heat conducting component 13 is located in the second target area 112 .

[0066] In this embodiment, the temperature equalizing plate 11 has a accommodating space, in which there are a heat dissipation component 12 and a heat conducting component 13. The temperature equalizing plate 11 also includes a first surface 113 and a second surface 114. The first surface 113 is the top end, and the second surface 114 is the bottom end. The second surface 114 of the temperature equalizing plate 11 has a first target area 111 and a second target area 112. The first surface 113 of the temperature equalizing plate 11 is far away from the first target area 111 and the second target area 112, and the first target area 111 corresponds to the first heating element 2, and the second target area 112 corresponds to the second heating element 3. When the first target area 111 reaches the preset condition, that is, the temperature reaches 80-90°C, of ​​course, the preset condition can also be other temperatures, which can be set according to the needs. The first heating element 2 corresponding to the first target area 111 needs to be cooled. At this time, the second part 122 of the heat dissipation component 12 included in the heat dissipation component 12 is deformed, and the second part 122 of the heat dissipation component 12 is deformed from the second target area 112 to the first target area 111, so as to transfer heat to the first target area 111, and transfer the heat of the first target area 111 to the first surface 113 of the temperature equalizing plate 11 for heat dissipation. The temperature of the second heating element 3 is higher most of the time, the first surface 113 of the heat conductive component 13 is on the first surface 113 of the temperature equalizing plate 11, and the second surface 114 is always on the second target area 112, and its position will not change, so as to always cool the second heating element 3 corresponding to the second target area 112. When the first target area 111 does not meet the preset condition, the second portion 122 of the memory metal is in the second target area 112 , thereby also dissipating heat for the second heating element 3 corresponding to the second target area 112 .

[0067] Therefore, when the first target area 111 reaches the preset condition, the second part 122 of the memory metal is deformed and connected to the first target area 111, and the first heating element 2 corresponding to the first target area 111 is cooled, and the second end of the thermal conductive component 13 is connected to the second target area 112, and the second heating element 3 corresponding to the second target area 112 is cooled; when the first target area 111 does not reach the preset condition, the second part 122 of the heat dissipation component 12 does not deform and is connected to the second target area 112, and the second end of the thermal conductive component 13 is also connected to the second target area 112, so that the heat dissipation component 12 and the thermal conductive component 13 both cool the second heating element 3 corresponding to the second target area 112, thereby further improving the heat dissipation effect and avoiding waste of the heat dissipation device.

[0068] In the embodiment of the present application, the heat dissipation component 12 includes a memory metal wire mesh; the heat conduction component 13 includes a metal wire mesh.

[0069] In this embodiment, the heat dissipation device 1 includes a temperature averaging plate 11, a heat dissipation component 12 and a heat conducting component 13. The temperature averaging plate 11 is located above the first heating element 2 and the second heating element 3 to dissipate heat for the first heating element 2 and the second heating element 3. The temperature averaging plate 11 has a storage space inside, and the heat dissipation component 12 and the heat conducting component 13 are arranged in the storage space. The heat dissipation component 12 includes a memory metal wire mesh. The first part 121 of the memory metal wire mesh is connected to the first surface 113 of the temperature averaging plate 11 away from the first heating element 2 and the second heating element 3. The second part 122 of the memory metal wire mesh is in the first The target area 111 or the second target area 112, the second part 122 of the memory metal mesh can be deformed according to whether the preset condition is met. If the first target area meets the preset condition, the second part 122 of the memory metal mesh will be deformed to the first target area, and is used to dissipate heat for the first heating element corresponding to the first target area, and the deformation includes changes in shape and length; when the first target area does not meet the preset condition, the second part of the memory metal mesh will not be deformed, and is still in the second target area, and is used to dissipate heat for the second heating element corresponding to the second target area. The thermal conductive component includes a metal mesh, and the metal mesh will not be deformed. The first part 121 of the metal mesh is connected to the first surface 113 of the temperature equalizing plate, and the second part 122 of the metal mesh is located at the second target area, so as to dissipate heat for the second heating element corresponding to the second target area. Thus, in the accommodation space of the inner wall of the temperature-averaging plate, the metal mesh and the capillary structure are used as water vapor circulation channels, and the deformation of the memory metal increases the efficiency of water vapor circulation. Compared with the temperature-averaging plate in the related art, the deformation of the memory metal mesh at high and low temperatures can enhance the internal water vapor transport efficiency under the single baking of the second heating element. In the related art, the water generated in the first target area needs to pass through the first target area and then through the capillary line before it can be transferred to the first target area for evaporation, while the deformation of the memory metal mesh directly transforms the second part 122 of the memory metal mesh to the first target area, thereby reducing the path of water passing through the capillary line, increasing the transport efficiency by 30%, and improving the power consumption by 10%.

[0070] In this embodiment, the memory alloy is TiNiNb alloy, and its deformation temperature can be controlled at 80° C.-90° C. by controlling the Nb element content. The heat conducting component 13 is a metal wire mesh and will not deform.

[0071] In the embodiment of the present application, a groove structure is provided on the metal wire mesh; and the groove structure is provided with a capillary structure.

[0072] In this embodiment, the temperature plate 11 is arranged above the first heating element 2 and the second heating element 3, and the temperature plate 11 has a first surface 113 and a second surface 114. The first surface 113 is arranged away from the first heating element 2 and the second heating element 3, and the second surface 114 is arranged close to the first heating element 2 and the second heating element 3. The first surface 113 of the temperature plate 11 is the top end, and the second surface 114 is the bottom end. The first heating element 2 needs to dissipate heat when the preset condition is reached, and the second heating element 3 also needs to dissipate heat. The temperature homogenizing plate 11 is provided with a heat dissipation component 12, and the heat dissipation component 12 includes a metal mesh, which is formed by weaving metal wires, and a groove structure is provided between each mesh, and a capillary structure is provided in the groove structure, and the capillary structure transfers the liquid medium to transfer the liquid medium to the first target area 111 or the second target area 112, and the liquid medium absorbs heat from the first target area 111 or the second target area 112, so that the first element corresponding to the first target area 111 or the second element corresponding to the second target area 112 is dissipated, and the liquid medium is converted into vapor during the heat absorption process. The vapor medium moves upward to the second surface 114 of the temperature equalizing plate 11. A fan assembly is provided outside the temperature equalizing plate 11 near the second surface 114. The fan assembly blows air toward the second surface 114 of the temperature equalizing plate 11 to reduce the temperature of the vapor medium so that the vapor medium becomes a liquid medium. A thin layer of Cu powder is also spread on the second part 122 of the metal wire mesh. The liquid medium returns to the capillary of the metal wire mesh through the capillary action of the Cu powder and is transmitted to the second part 122 of the metal wire mesh again to transfer heat to the first target area 111 or the second target area 112, thereby realizing the circulation of the medium.

[0073] In this embodiment, the thickness of the metal mesh may be 2 mm, and the depth of the groove may be 0.3 mm.

[0074] In the embodiment of the present application, the surfaces of the first target area and the second target area are provided with a powder layer and a water-plated layer; the powder layer is made by sintering copper powder particles;

[0075] The water-plated layer is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer.

[0076] In this embodiment, a powder layer 15 is formed by sintering copper powder particles outside the shell of the second part 122 of the metal wire mesh. The formation of the powder layer 15 enables the liquid medium transported back by the metal mesh to be quickly spread out, thereby quickly absorbing the heat of the first heating element 2 or the second heating element 3, thereby achieving heat dissipation and cooling of the first heating element 2 or the second heating element 3. In addition, a hydrophilic coating is sprayed on the surface of the powder layer 15 formed by sintering copper powder particles, so that there is always a layer of water film on the surface of the powder layer 15, which is the water plating layer 16, so that the water plating layer 16 on the surface of the powder layer 15 can continuously exchange heat for the first heating element 2 or the second heating element 3 corresponding to the first target area 111 or the second target area 112, thereby ensuring heat dissipation.

[0077] In this embodiment, the thickness of the hydrophilic coating may be 0.02 mm.

[0078] In this embodiment, the heat dissipation medium is water.

[0079] It is understandable that the related features in the above devices can be referenced to each other. In addition, the "first", "second" and the like in the above embodiments are used to distinguish the various embodiments, and do not represent the advantages and disadvantages of the various embodiments.

[0080] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this description.

[0081] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation device, It is characterized in that include: A temperature averaging plate, the temperature averaging plate having a first target area and a second target area; A heat dissipation component, wherein the first part of the heat dissipation component is connected to a temperature vapor chamber, the first target area meets a preset condition so that the second part of the heat dissipation component is in the first target area, and the first target area does not meet the preset condition, and the second part of the heat dissipation component is in the second target area.

2. The heat dissipation device according to claim 1, It is characterized in that The heat dissipation component comprises a metal wire mesh, and the metal wire mesh is used for transferring liquid medium and heat.

3. The heat dissipation device according to claim 2, It is characterized in that The metal wire mesh is provided with a groove structure; the groove structure is provided with a capillary structure.

4. The heat dissipation device according to claim 2, It is characterized in that The surfaces of the first target area and the second target area are provided with a powder layer and a water plating layer.

5. The heat dissipation device according to claim 4, It is characterized in that The powder layer is made by sintering copper powder particles; The water-plated layer is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer.

6. The heat dissipation device according to claim 1, It is characterized in that The first target area is a connection area for heat transfer, and the preset condition is 80-90°C. If the first target area meets the preset condition, the second part of the heat dissipation component is deformed, and the second part is connected to the first target area for heat transfer.

7. An electronic device, It is characterized in that include: a first heating element; a second heating element; A heat dissipation device, the heat dissipation device comprising: A temperature averaging plate, the temperature averaging plate having a first target area and a second target area, the first target area is arranged corresponding to the first heating element, and the second target area is arranged corresponding to the second heating element; A heat dissipation component, wherein the first part of the heat dissipation component is connected to the temperature homogenizing plate, the first target area meets a preset condition so that the second part of the heat dissipation component is in the first target area, and the first target area does not meet the preset condition, and the second part of the heat dissipation component is in the second target area.

8. The electronic device according to claim 7, It is characterized in that The heat dissipation device further includes a heat conducting component, a first end of the heat conducting component is connected to the temperature homogenizing plate, and a second end of the heat conducting component is located in the second target area.

9. The electronic device according to claim 8, It is characterized in that The heat dissipation component includes a memory metal wire mesh; the heat conduction component includes a metal wire mesh.

10. The electronic device according to claim 9, It is characterized in that The surfaces of the first target area and the second target area are provided with a powder layer and a water-plated layer; the powder layer is made by sintering copper powder particles; The water-plated layer is formed by spraying a hydrophilic coating on the surface of the copper powder particles so that a water film is formed between the metal wire mesh and the powder layer.

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