Heat dissipation mechanism for chassis main drive controller of low-speed automatic driving trolley of high-pressure system
The heat dissipation mechanism for main drive controllers in low-speed autonomous driving vehicles with high-voltage systems addresses structural complexity and poor performance by enhancing heat transfer efficiency and area through integrated components, resulting in improved manufacturability and heat management.
Patent Information
- Application Number
- CN202420525465.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-19
AI Technical Summary
Existing heat dissipation mechanisms for main drive controllers in low-speed autonomous driving vehicles with high-voltage systems are structurally complex, making them difficult to manufacture and have poor heat dissipation performance.
A heat dissipation mechanism comprising a shell, detachable box cover, control board, ceramic sheets, heat dissipation fins, and heat dissipation glue, which enhance heat transfer efficiency and increase the effective heat dissipation area through integration with the box cover and fins, using surface-mount silicon carbide components and ceramic sheets with coatings.
The mechanism achieves improved heat dissipation performance with a simplified structure that is easier to process and manufacture, ensuring effective heat management for the main drive controller.
Smart Images
Figure CN222216296U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat dissipation mechanism of a main drive controller of a chassis of a low-speed automatic driving car with a high-voltage system, belonging to the technical field of automatic driving cars. Background Art
[0002] Self-driving cars are also called driverless cars, computer-driven cars or wheeled mobile robots. Self-driving cars rely on artificial intelligence, visual computing, radar, monitoring devices and global positioning systems to work together to allow computers to automatically and safely operate motor vehicles without any human active operation. The main drive controller is an indispensable and important component of the low-speed self-driving car with a high-voltage system. As the self-driving car is updated from a low-voltage system to a high-voltage system. Having a low-cost chassis main drive controller cooling solution with good heat dissipation performance will undoubtedly provide great help for the self-driving car to open up the sales market.
[0003] The existing heat dissipation mechanism of the main drive controller of the chassis of the autonomous driving vehicle is usually complex in structure, which makes it difficult to manufacture and process, and the heat dissipation effect is poor, affecting the practicability of the device. Utility Model Content
[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and to provide a heat dissipation mechanism for a main drive controller of a chassis of a low-speed autonomous driving vehicle with a high-voltage system, so as to solve the problem that the heat dissipation mechanism of the main drive controller of the chassis of the existing autonomous driving vehicle is usually complex in structure, which makes it difficult to manufacture and process, and has poor heat dissipation effect.
[0005] In order to solve the above technical problems, the utility model is implemented by adopting the following technical solutions:
[0006] The utility model provides a heat dissipation mechanism for a main drive controller of a chassis of a low-speed automatic driving vehicle with a high-voltage system, comprising a shell, a box cover detachably connected to the top of the shell, a control board detachably connected to the inside of the shell, a plurality of power components are arranged at the bottom of the control board, a plurality of ceramic sheets are arranged at the top of the control board, a heat dissipation fin is arranged at the top of the box cover, a heat dissipation mechanism is arranged at the bottom of the box cover, the heat dissipation mechanism is used to contact the tops of the plurality of ceramic sheets at the same time, and the heat dissipation fin is located on one side of the heat dissipation mechanism.
[0007] Furthermore, the power component is a surface-mount silicon carbide.
[0008] Furthermore, the outer wall of the ceramic sheet is provided with a coating.
[0009] Furthermore, the shell and the box cover are detachably connected via bolts.
[0010] Furthermore, a heat dissipation glue is provided on an outer wall of the heat dissipation mechanism on one side of the ceramic sheet.
[0011] Furthermore, the heat dissipation mechanism is a boss, and the boss is arranged at the bottom of the box cover.
[0012] Furthermore, the heat dissipation fins and the box cover are integrally formed.
[0013] Furthermore, the heat dissipation mechanism and the box cover are integrally formed.
[0014] Compared with the prior art, the utility model has the following beneficial effects:
[0015] The heat dissipation mechanism of the chassis main drive controller of the low-speed automatic driving car of the high-voltage system increases the effective heat dissipation area of the device through the cooperation of the heat dissipation mechanism, the box cover and the heat dissipation fins, thereby ensuring that the main drive controller has good heat dissipation performance. At the same time, the overall structure of the device is relatively simple, which is easy to process and manufacture, and ensures the practicability of the device.
[0016] The utility model reduces contact thermal resistance through heat dissipation glue, improves the heat transfer efficiency between the control board and the heat dissipation mechanism, and ensures the heat dissipation effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is an exploded schematic diagram of a heat dissipation mechanism of a main drive controller of a chassis of a low-speed autonomous driving vehicle with a high-voltage system provided according to an embodiment of the utility model.
[0018] In the figure: 1. housing; 2. power component; 3. control board; 4. ceramic plate; 5. box cover; 51. heat sink fins. DETAILED DESCRIPTION
[0019] The utility model is further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and cannot be used to limit the protection scope of the utility model.
[0020] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.
[0022] like Figure 1 As shown, the utility model provides a heat dissipation mechanism of a main drive controller of a chassis of a low-speed automatic driving vehicle with a high-voltage system, comprising a shell 1, a box cover 5 is detachably connected to the top of the shell 1, a control board 3 is detachably connected to the inner side of the shell 1, a plurality of power components 2 are arranged at the bottom of the control board 3, a plurality of ceramic sheets 4 are arranged at the top of the control board 3, a heat dissipation fin 51 is arranged at the top of the box cover 5, a heat dissipation mechanism is arranged at the bottom of the box cover 5, the heat dissipation mechanism is used to contact the tops of the plurality of ceramic sheets 4 at the same time, and the heat dissipation fin 51 is located on one side of the heat dissipation mechanism.
[0023] Specifically, as the main drive controller works, the temperature of the control board 3 rises, and it needs to be cooled to ensure the normal operation of the main drive controller. During the heat dissipation, the ceramic sheet 4 acts as an insulator and a heat conductor for the control board 3, thereby transferring the heat on the control board 3 to the heat dissipation mechanism to dissipate heat for the control board 3. The present application is provided with heat dissipation fins 51 on one side of the heat dissipation mechanism. The heat on the control board 3 can be transferred to the box cover 5 through the heat dissipation mechanism, and then transferred to the heat dissipation fins 51, thereby increasing the effective heat dissipation area and further ensuring the heat dissipation effect of the main drive controller; the present application cooperates with the heat dissipation mechanism, the box cover 5 and the heat dissipation fins 51 to increase the effective heat dissipation area of the device, ensuring that the main drive controller has good heat dissipation performance. At the same time, the overall structure of the device is relatively simple, which is convenient for processing and manufacturing, and ensures the practicability of the device; optionally, the heat dissipation mechanism, the box cover 5 and the heat dissipation fins 51 are made of aluminum or copper.
[0024] In one embodiment, the power component 2 is a surface-mounted silicon carbide chip, which is mounted on the control board 3. Optionally, a ceramic chip 4 is mounted on the control board 3.
[0025] In one embodiment, the outer wall of the ceramic sheet 4 is provided with a coating, the coating is nickel-plated, silver-plated, gold-plated or tin-plated, and the coating layer is attached to the control board 3 .
[0026] In one embodiment, the housing 1 and the box cover 5 are detachably connected via bolts, thereby ensuring flexibility when the box cover 5 is disassembled.
[0027] In one embodiment, the outer wall of the heat dissipation mechanism is provided with heat dissipation glue on one side of the ceramic plate 4, and the heat dissipation mechanism is a boss, and the boss is arranged at the bottom of the box cover 5; the heat dissipation glue is used to reduce the contact thermal resistance and improve the heat transfer efficiency between the control board 3 and the heat dissipation mechanism to ensure the heat dissipation effect of the present device; optionally, the heat dissipation mechanism is a boss, and the boss is used to transfer the heat on the control board 3 to the box cover 5 and the heat dissipation fins 51, thereby increasing the effective heat dissipation area and ensuring the heat dissipation effect of the present device.
[0028] In one embodiment, the heat dissipation fins 51 are integrally formed with the box cover 5, and the heat dissipation mechanism is integrally formed with the box cover 5, so that the device is easy to process and mold, thereby ensuring the manufacturability of the device and reducing the manufacturing cost.
[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A heat dissipation mechanism for the chassis main drive controller of a low-speed automatic driving vehicle with a high-voltage system, characterized in that: The invention comprises a shell (1), the top of the shell (1) being detachably connected to a box cover (5), the inner side of the shell (1) being detachably connected to a control board (3), the bottom of the control board (3) being provided with a plurality of power components (2), the top of the control board (3) being provided with a plurality of ceramic sheets (4), the top of the box cover (5) being provided with a heat dissipation fin (51), the bottom of the box cover (5) being provided with a heat dissipation mechanism, the heat dissipation mechanism being used to contact the tops of the plurality of ceramic sheets (4) at the same time, and the heat dissipation fin (51) being located on one side of the heat dissipation mechanism.
2. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a high-voltage system low-speed automatic driving vehicle is characterized in that: The power component (2) is a surface-mount silicon carbide.
3. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a high-voltage system low-speed automatic driving vehicle is characterized in that: The outer wall of the ceramic sheet (4) is provided with a coating.
4. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a low-speed automatic driving vehicle with a high-voltage system, characterized in that: The housing (1) and the box cover (5) are detachably connected via bolts.
5. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a high-voltage system low-speed automatic driving vehicle is characterized in that: The outer wall of the heat dissipation mechanism is provided with heat dissipation glue on one side of the ceramic sheet (4).
6. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a high-voltage system low-speed automatic driving vehicle is characterized in that: The heat dissipation mechanism is a boss, and the boss is arranged at the bottom of the box cover (5).
7. According to claim 1, a heat dissipation mechanism for a chassis main drive controller of a low-speed automatic driving vehicle with a high-voltage system, characterized in that: The heat dissipation fins (51) and the box cover (5) are integrally formed.
8. According to claim 6, a heat dissipation mechanism for a chassis main drive controller of a high-voltage system low-speed automatic driving vehicle is characterized in that: The heat dissipation mechanism and the box cover (5) are integrally formed.