Sticking equipment for cut wafer

Abstract

Some embodiments of the present application provide a re-pasting device for a cut wafer, comprising: a work platform for bearing a cut wafer fixed on an original adhesive tape; the inner platform is arranged along the periphery of the working platform and is provided with a first top surface for bearing a first annular product; the outer platform is arranged along the periphery of the inner platform and is provided with a second top surface for bearing a second annular product; and the cutting device is arranged between the inner platform and the working platform and is used for cutting the original adhesive tape. According to the transfer pasting equipment for the cut wafer, a space does not need to be reserved for the cutting tool above the working platform, and the space above the working platform can be used for arranging other devices.

Description

Technical Field

[0001] An embodiment of the present application relates to a transfer device for cut wafers. Background Art

[0002] Currently, there are very few dedicated equipment in the industry to replace the carrier frame and carrier tape carrier frame for diced wafers. In the past, most wafers were shipped to packaging factories in bare die form, but more and more wafers have been ground and backside metallized (BGBM) before shipment, or have been diced before being sent to packaging factories for packaging.

[0003] It can be seen that the incoming wafers currently used by customers have been ground and thinned, and the wafers (or dies) are cut into single pieces and fixed on tape and transported with a plastic frame or a grip ring frame (i.e., a carrier frame). After that, the cut wafers will be transferred to the standard iron frame in the relevant company and fixed with tape to facilitate subsequent processes. However, the cut wafers are mostly stored on the carrier tape before taking the dies. The die pick-up operation is often limited by the characteristics, type and life of the tape. If the carrier frame and carrier tape can be replaced, the shelf life of the dies can be extended or the operability of taking the dies can be improved. Because the tape period is three months, if the number of incoming cut wafers is large and cannot be completed within the tape period, there is a risk of degradation and residual adhesive left on the cut wafers, so it needs to be replaced regularly. Since replacing the carrier frame and carrier tape involves many steps and is high risk, we evaluated the possibility of developing an automated device based on the transfer equipment, hoping to develop an automated device that can transfer the plastic frame or grip ring to the iron frame.

[0004] Specifically, Figures 1A to 1G The present invention shows a prior art wafer transfer device 10 and its related transfer process, specifically, Figure 1A As shown, the cut wafer 2 is placed on the original tape 3 on the workbench 1 (the original tape 3 is fixed by the grip ring frame 4 placed on the platform 6), and the vacuum is turned on. Figure 1B , use the cutting device 5 to cut the original tape 3, and see Figure 1C , remove the grip ring frame 4, and use a new iron frame 4' placed at a different position on the platform 6. Figure 1C , use a semi-automatic die mounter to mount the first wafer transfer tape 3'. Figure 1D After the first wafer transfer tape 3' is attached, the structure of the original tape 3 with the cut wafer 2 and the first wafer transfer tape 3' is manually turned over and the vacuum is turned on. Figure 1D, manually remove the original tape 3. After that, see Figure 1E , irradiate the first wafer transfer tape 3' with UV 7 (such as manual irradiation), see Figure 1F , place the cut wafer 2 on the workbench 1 with the first wafer transfer tape 3' facing downward and turn on the vacuum. Then, use the roller 8 (or a semi-automatic placement machine) to place the second wafer transfer tape 3", see Figure 1G After the second wafer transfer tape 3" is attached, the structure of the first wafer transfer tape 3' and the second wafer transfer tape 3" with the cut wafer 2 is manually turned over and the vacuum is turned on, and the first wafer transfer tape 3' is manually removed. Finally, the wafer 2 is removed and placed in a lifting frame (not shown).

[0005] In summary, in this application, see Figure 1B First, stick the cut wafer 2 on the original tape 3, and the edge of the original tape 3 is fixed on the grip ring frame 4, turn on the vacuum to suck the tape with the original tape 3 facing the vacuum suction cup, and then cut the original tape 3. Since the original tape 3 is stretched by the expansion sheet and has tension, during the process of cutting the original tape, the vacuum is not enough to absorb the tape, which will cause the tape to shrink and bounce up, and then cause the cut wafer 2 to be bounced off.

[0006] However, if the cutting device 5 is used to cut the old tape (such as the original tape 3) after the new tape (such as the first wafer transfer tape 3') is attached to the other side of the cut wafer 2, although this can prevent the cut wafer 2 from being blown away, the tension of the old tape will cause the old tape to bounce around and stick to the new tape at the moment of separation after cutting.

[0007] It can be seen that the existing methods have the following defects:

[0008] 1) Currently, customers' incoming wafers have been ground, thinned, and back-metallized, or have been cut into individual wafers and transported on carrier tape in plastic frames or grip ring frames. However, the industry currently does not have dedicated equipment that can operate on cut wafers to replace carrier frames and carrier tapes; and

[0009] 2) Manual operations face the problems of being unable to parameterize manual actions, difficulty in training techniques, and a high risk of wafer loss. Utility Model Content

[0010] In order to solve the above problems, the present application solves the problem that the old tape on the first surface will stick to the new tape due to the tension of the old tape after sticking a new tape on the second surface of the cut wafer by lengthening the distance between the free ends of the new tape and the old tape.

[0011] Some embodiments of the present application provide a transfer device for cut wafers, comprising: a working platform for carrying the cut wafers fixed on an original tape; an inner platform, arranged along the periphery of the working platform and having a first top surface for carrying a first ring-shaped product; an outer platform, arranged along the periphery of the inner platform and having a second top surface for carrying a second ring-shaped product; and a cutting device, arranged between the inner platform and the working platform, for cutting the original tape.

[0012] In some embodiments, a distance between the first top surface of the inner platform and the second top surface of the outer platform in the longitudinal direction is variable.

[0013] In some embodiments, when the inner platform moves away from the outer platform in the longitudinal direction, the first top surface is further away from the second top surface.

[0014] In some embodiments, the inner platform is movable in a longitudinal direction.

[0015] In some embodiments, the first top surface of the inner platform is not higher than the second top surface of the outer platform.

[0016] In some embodiments, the first loop product is used to secure an original tape, and the second loop product is used to secure another tape.

[0017] In some embodiments, the working platform has a working top surface, and a height of the working top surface is the same as a height of the second top surface.

[0018] In some embodiments, the height of the working top surface is higher than the height of the first top surface.

[0019] In some embodiments, when the inner platform moves away from the outer platform in the longitudinal direction, the first top surface is further away from the working top surface.

[0020] In some embodiments, the cutting device is farther away from the inner platform than the working platform.

[0021] In some embodiments, when the second annular product is disposed on the second top surface of the outer platform, the outer platform provides a force for fixing the second annular product from the bottom surface of the second annular product.

[0022] In some embodiments, the force for fixing the second annular product is a magnetic force or a vacuum suction force from the outer platform.

[0023] In some embodiments, when the first annular product is disposed on the first top surface of the inner platform, the inner platform provides a force for fixing the first annular product from a bottom surface of the first annular product.

[0024] In some embodiments, the force that fixes the first annular product is a magnetic force or a vacuum suction force from the inner platform.

[0025] In some embodiments, when the inner platform moves away from the outer platform in the longitudinal direction, a first distance between the original tape and the other tape at the inner platform is greater than a second distance between the original tape and the other tape at the working platform.

[0026] In some embodiments, the first annular product has an outer frame edge farther away from the working platform and an inner frame edge disposed within the outer frame edge, wherein a point of application of force for fixing the first annular product is closer to the outer frame edge relative to the inner frame edge.

[0027] In some embodiments, the further tape spans across the first endless product.

[0028] Other embodiments of the present application provide a transfer device for cut wafers, comprising: a working platform for carrying the cut wafers fixed on an original tape; an inner platform, arranged along the periphery of the working platform and having a first top surface; an outer platform, arranged along the periphery of the inner platform and having a second top surface not higher than the first top surface; and a cutting device, arranged between the inner platform and the working platform, for cutting the original tape, wherein a first annular product for fixing the original tape is carried on the first top surface of the inner platform and is movable in a longitudinal direction relative to the outer platform.

[0029] In some embodiments, the cutting device is farther away from the inner platform than the working platform.

[0030] In some embodiments, a second annular product for fixing another adhesive tape is carried on the second top surface of the outer platform.

[0031] The present application provides a transfer device for cut wafers, which does not require space to be reserved for cutting tools above the working platform. The space above the working platform can be used to set up other devices and can avoid the problem of the original tape (old tape) bouncing around and sticking to another tape (new tape) at the moment of separation after cutting due to its tension. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] When read in conjunction with the accompanying drawings, various aspects of the present invention can be best understood from the following detailed description. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, for the sake of clarity of discussion, the size of the various components can be arbitrarily increased or reduced.

[0033] Figures 1A to 1GThe invention shows the transfer equipment of the cut wafer and the related process in the prior art.

[0034] Figure 2 A transfer device for a diced wafer according to some embodiments of the present application is shown.

[0035] Figures 3 to 18 The work flow of a transfer device for a cut wafer according to some embodiments of the present application is shown. DETAILED DESCRIPTION

[0036] The following disclosure provides many different embodiments or examples for realizing different features of the present invention. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. In addition, when "approximately", "about", "substantially", etc. are used to describe a numerical value or a numerical range, unless otherwise specified, the term is intended to cover a numerical value within ±10% of the described numerical value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0037] This application designs a series of mechanical actuation steps based on current work needs to improve the current manual replacement of the carrier frame and the carrier tape, and is expected to eliminate manual risks, stabilize the yield, and increase production capacity in a mechanized manner to achieve the purpose of mass production. Specifically, mechanized steps are used to replace the original manual process of replacing the carrier frame and the carrier tape of the cut wafer, and the life of the carrier tape is updated to extend the storage life of the die or improve the operability of the die (cut wafer) extraction process.

[0038] See also Figure 2 Some embodiments of the present application provide a cut wafer transfer device 100, which includes: a working platform 101 for carrying a cut wafer 102 fixed on an original tape 108; an inner platform 103, which is arranged along the periphery of the working platform 101 and has a first top surface 103t for carrying a first ring-shaped product 106; an outer platform 104, which is arranged along the periphery of the inner platform 103 and has a second top surface 104t for carrying a second ring-shaped product 107; and a cutting device 105, which is arranged between the inner platform 103 and the working platform 101, for cutting the original tape 108. In some embodiments, the distance S between the first top surface 103t of the inner platform 103 and the second top surface 104t of the outer platform 104 in the longitudinal direction D is variable. In an embodiment, the inner platform 103 is movable in the longitudinal direction D. In a further embodiment, when the inner platform 103 moves away from the outer platform 104 in the longitudinal direction D (i.e., along Figure 2In the above embodiment, the working platform 101, the inner platform 103 and the outer platform 104 can be made of the same or different materials, and can be made of any material that can provide support, such as but not limited to metals or metal alloys such as copper. In the above embodiment, the first annular product 106 and the second annular product 107 can be annular products commonly used in the art for fixing the original tape 108 and another tape 108L. Specifically, the first annular product 106 can be an annular product commonly used in the art. In some specific embodiments, the first annular product 106 can be, but not limited to, a grip ring frame, a plastic frame, etc., and can be any other suitable frame that is inexpensive, light in weight and easy to transport. In some embodiments, the second annular product 107 is a metal frame. In the wafer-cutting transfer device 100 provided in the present application, the second ring-shaped product 107 is a standard frame that can be commonly used or accepted by related production equipment, and the standard frame can be made of metal, plastic, etc.

[0039] In addition, if Figure 2 As shown, the first ring-shaped product 106 is used to fix the original tape 108, and the second ring-shaped product 107 is used to fix another tape 108L. In some embodiments, the working platform 101 has a working top surface 101t, and the height of the working top surface 101t is the same as the height of the second top surface 104t. In some other embodiments, the height of the working top surface 101t is higher than the height of the first top surface 103t. In other embodiments, when the inner platform 103 moves away from the outer platform 104 in the longitudinal direction D (i.e., along Figure 2 In the above embodiment, the original tape 108 and the other tape 108L can be tapes commonly used in the art for transferring diced wafers, such as epoxy resin tape.

[0040] See also Figure 2, relative to the working platform 101, the cutting device 105 is farther from the inner platform 103, that is, the cutting device 105 is closer to the working platform 101. In a further embodiment, when the second annular product 107 is arranged on the second top surface 104t of the outer platform 104, the outer platform 104 provides a force to fix the second annular product 107 from the bottom surface 107d of the second annular product 107. Further, the force to fix the second annular product 107 is a magnetic force or vacuum suction from the outer platform 104 or another mechanism (such as an external force-applying mechanism) provides a downward pressure. Similarly, when the first annular product 106 is arranged on the first top surface 103t of the inner platform 103, the inner platform 103 provides a force to fix the first annular product 106 from the bottom surface 106d of the first annular product 106. Similarly, the force to fix the first annular product 106 is a magnetic force or vacuum suction from the inner platform 103 or another mechanism (such as an external force-applying mechanism) provides a downward pressure.

[0041] like Figure 2 When the inner platform 103 shown moves away from the outer platform 104 in the longitudinal direction D, the first distance S1 between the original adhesive tape 108 and the other adhesive tape 108L at the inner platform 103 is greater than the second distance S2 between the original adhesive tape 108 and the other adhesive tape 108L at the working platform 101. In this case, the problem that the original adhesive tape 108 bounces randomly and sticks to the other adhesive tape 108L at the moment of separation after being cut due to its tension can be avoided. Figure 2 , the first ring-shaped product 106 has an outer frame edge 106o farther from the work platform 101 and an inner frame edge 106i disposed inside the outer frame edge 106o, wherein the force point for fixing the first ring-shaped product 106 is closer to the outer frame edge 106o than the inner frame edge 106i. Further, another adhesive tape 108L spans the first ring-shaped product 106. In addition, Figure 2 In the cut wafer transfer apparatus 100 shown, the cutting device 105 is fixed on a concentric circle base 111, and the concentric circle base 111 can rotate along the direction R.

[0042] In summary, the cut wafer transfer device provided in the present application does not need to reserve space for the cutting tool above the working platform, and the space above the working platform can be used to set up other devices.

[0043] See also Figure 2Some other embodiments of the present application further provide a transfer device 100 for a cut wafer, the transfer device 100 for a cut wafer comprising: a work platform 101, for carrying a cut wafer 102 fixed on an original tape 108; an inner platform 103, arranged along the periphery of the work platform 101, and having a first top surface 103t; an outer platform 104, arranged along the periphery of the inner platform 103, and having a second top surface 104t not higher than the first top surface 103t; and a cutting device 105, arranged between the inner platform 103 and the work platform 101, for cutting the original tape 108, wherein a first annular product 106 for fixing the original tape 108 is carried on the first top surface 103t of the inner platform 103, and is movable in the longitudinal direction D relative to the outer platform 104. In some embodiments, the cutting device 105 is farther away from the inner platform 103 relative to the work platform 101. In some embodiments of the present application, a second ring-shaped product 107 for fixing another adhesive tape 108L is carried on the second top surface 104t of the outer platform 104 .

[0044] Refer to the following Figure 3-Figure 12 The working process of the cut wafer transfer device 100 is described in detail.

[0045] See also Figure 3 , the cut wafer 102 is placed on the working platform 101, the first top surface 103t of the inner platform 103 carries the first annular product (grip ring frame) 106, the second top surface 104t of the outer platform 104 carries the second annular product (metal frame) 107, and the first top surface 103t is not higher than the second top surface 104t, and the original tape 108 is fixed between the outer frame edge 106o and the inner frame edge 106i of the first annular product (grip ring frame) 106. Further, the outer platform 104 provides a force to fix the second annular product 107 from the bottom surface 107d of the second annular product 107, and the inner platform 103 provides a force to fix the first annular product 106 from the bottom surface 106d of the first annular product 106, and the force can be a magnetic force or a vacuum suction force from the outer platform 104 and the inner platform 103, respectively. In addition, a cutting device 105 such as a blade group is installed on the concentric circle base 111. In an embodiment, the height of the working top surface 101t is the same as the height of the second top surface 104t. In some other embodiments, the height of the working top surface 101t is higher than the height of the first top surface 103t.

[0046] See also Figure 4, the inner platform 103 moves away from the outer platform 104 along the longitudinal direction D, the first top surface 103t moves further away from the second top surface 104t, and the original tape 108 at the inner platform 103 is lower than the top surface 101t of the working platform 101 but does not contact the cutting device 105. At this time, the distance between the first top surface 103t of the inner platform 103 and the second top surface 104t of the outer platform 104 in the longitudinal direction D is S'.

[0047] Afterwards, see Figure 5 , a first wafer transfer tape 108' is attached to the front side 102f of the cut wafer 102 and the second ring-shaped product (metal frame) 107, such as Figure 5 As shown, the first wafer transfer tape 108' is attached along the direction L using the roller 109. After the first wafer transfer tape 108' is attached, as shown in FIG. Figure 6 As shown, the inner platform 103 is moved along the longitudinal direction D or the concentric circle base 111 equipped with the cutting device 105 is moved in the direction opposite to the longitudinal direction D, so that the cutting device 105 such as a blade assembly pierces the original tape 108 and rotates the concentric circle base 111 along the direction R, so that the cutting device 105 cuts off the entire piece of original tape 108 and the first annular product (grip ring frame) 106. At this time, the distance between the first top surface 103t of the inner platform 103 and the second top surface 104t of the outer platform 104 in the longitudinal direction D is S, and the distance S can be greater than or equal to the distance S'. In addition, the first distance S1 between the original tape 108 and the first wafer transfer tape 108' at the inner platform 103 is greater than the second distance S2 between the original tape 108 and the first wafer transfer tape 108' at the working platform 101.

[0048] Next, see Figure 7 and Figure 8 , turn over the second annular product (metal frame) 107 on the work platform 101 so that the original tape 108 of the back side 102b of the cut wafer 102 faces upward, see Figure 8 , manually or automatically remove the original tape 108. It should be noted that when the original tape 108 (old tape) is torn off, static electricity will be generated, so an ion fan will be arranged, and the ion fan will convey ionized air along the tearing path to eliminate static electricity.

[0049] See also Fig. 9 , a second wafer transfer tape 108" is attached to the back side 102b of the cut wafer 102 and the second ring-shaped product (metal frame) 107. Similarly, a second wafer transfer tape 108" is attached along the direction L using a roller 110. Fig. 9 In the embodiment, the first annular product (grip ring frame) 106 is replaced with the second annular product (metal frame) 107, such as Fig. 9 As shown in area A. Figure 7and Figure 8 Similarly, see Figure 10 to Figure 11 , turn over the second annular product (metal frame) 107 on the work platform 101 so that the first wafer transfer tape 108' of the front side 102f of the cut wafer 102 faces upward, see Fig.11 , manually or automatically remove the first wafer transfer tape 108'. It should be noted that when tearing the first wafer transfer tape 108' (the old tape at this time), static electricity will be generated, so an ion fan will be arranged to transport ionized air along the tearing path to eliminate static electricity.

[0050] Finally, see Fig.12 , remove the cut wafer 102 that has been bonded and put it into the lifting frame, then return the inner platform 103 to the starting position and remove the first ring product (holding ring frame) 106 and discard it. At this point, the bonding of the cut wafer 102 is completed.

[0051] In summary, the cut wafer transfer device 100 provided in the present application is designed with a series of mechanical automation steps to perform the operation of replacing the carrier frame and the carrier tape of the cut wafer 102, that is, replacing the first annular product (grip ring frame) 106 with the second annular product (metal frame) 107, and replacing the original tape 108 with the second wafer transfer tape 108". Therefore, the cut wafer transfer device 100 is designed to be convertible for different types of carrier frames, such as plastic frame to metal frame, grip ring frame to metal frame, metal frame to metal frame, etc., but the present application is not limited to this.

[0052] This application Figure 2 The transfer device 100 of the cut wafer is shown with Figure 1B Compared with the transfer device 10 shown, the details are as follows:

[0053] for Figure 1G The transfer equipment 10 shown: 1) It is necessary to manually cut the tape and replace the carrier frame and perform the placement on a general placement machine; 2) Low output (40 wafers / week), high risk, and difficulty in training operators; 3) There is no mature conversion equipment developed on the market, and the cut wafers (dices) must be taken up one by one and placed in packaging materials of corresponding sizes.

[0054] For this application Figure 2 The transfer device 100 for diced wafers shown has the following advantages:

[0055] 1) Replace the current manual operation with mechanical actuation, reduce errors and make it easier to control, such as automatic cutting and automatic removal (peeling);

[0056] 2) Increased output (80 wafers / week), low risk, and simplified personnel operations;

[0057] 3) Use tape to transfer the cut wafers twice, without designing special packaging materials according to the size of the cut wafers (die);

[0058] 4) To meet the future demand for RF (radio frequency) / Power (power) SiP (integrated circuit system-in-package) products, such as GaN wafers (gallium nitride wafers) will be thinned, the back of the wafer will be metallized and cut (singled) before they are received; and

[0059] 5) If the carrier tape of the diced wafer can be replaced, the shelf life can be extended or the workability of retrieval can be further improved.

[0060] Refer to the following Figure 13-Figure 18 Another working process of the cut wafer transfer device 100 will be described in detail.

[0061] See also Fig.13 , placing the cut wafer 102 on the working platform 101. The difference is that the first top surface 103t of the inner platform 103 does not carry the first annular product 106, while the second top surface 104t of the outer platform 104 carries the second annular product (metal frame) 107, and the first top surface 103t is not higher than the second top surface 104t, and the original tape 108 is fixed on the second annular product (metal frame) 107 and extends across the inner platform 103.

[0062] Afterwards, see Fig.14 , a first wafer transfer tape 108' is attached to the front side 102f of the cut wafer 102 and the second ring-shaped product (metal frame) 107, such as Fig.14 As shown, the first wafer transfer tape 108 ′ is attached along the direction L using the roller 112 .

[0063] Next, see Fig.15 , turn over the second annular product (metal frame) 107 on the work platform 101 so that the original tape 108 of the back side 102b of the cut wafer 102 faces upward, see Fig.16 , manually or automatically remove the original tape 108.

[0064] repeat Figures 13 to 15 For operation, see Fig.17 , manually or automatically remove the first wafer transfer tape 108 '. Finally, see Fig.18 , take out the cut wafer 102 that has completed the bonding and put it into the lifting frame. At this point, the bonding of the cut wafer 102 is completed.

[0065] The above reference Figures 13 to 18The method is to replace the tape on the same second ring-shaped product (metal frame) 107, such as replacing the original tape 108 with the first wafer transfer tape 108', and replacing the first wafer transfer tape 108' with the second wafer transfer tape 108", without using a different ring-shaped product. This method can also avoid the problem that the original tape 108 bounces around and sticks to another tape 108L at the moment of separation after being cut due to its tension.

[0066] The features of several embodiments are summarized above so that those skilled in the art can better understand aspects of the present invention. Those skilled in the art should understand that they can easily use the present invention as a basis to design or modify other processes and structures for implementing the same purpose and / or achieving the same advantages as the embodiments described herein. Those skilled in the art should also appreciate that such equivalent constructions do not deviate from the spirit and scope of the present invention, and that they can make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present invention.

Claims

1. A transfer device for cut wafers, characterized in that: include: A work platform for carrying the cut wafers fixed on the original tape; An inner platform is arranged along the periphery of the working platform and has a first top surface for carrying a first annular product; An outer platform is arranged along the periphery of the inner platform and has a second top surface for carrying a second annular product; as well as A cutting device is arranged between the inner platform and the working platform and is used for cutting the original adhesive tape.

2. The device for transferring a cut wafer according to claim 1, characterized in that: A distance between the first top surface of the inner platform and the second top surface of the outer platform in a longitudinal direction is variable.

3. The device for transferring a cut wafer according to claim 2, characterized in that: When the inner platform moves away from the outer platform in the longitudinal direction, the first top surface moves further away from the second top surface.

4. The device for transferring a cut wafer according to claim 2, characterized in that: The inner platform is movable in a longitudinal direction.

5. The device for transferring a cut wafer according to claim 4, characterized in that: The first top surface of the inner platform is not higher than the second top surface of the outer platform.

6. The device for transferring a cut wafer according to claim 1, characterized in that: The first loop product is used to fix an original adhesive tape, and the second loop product is used to fix another adhesive tape.

7. The device for transferring a cut wafer according to claim 1, characterized in that: The working platform has a working top surface, and the height of the working top surface is the same as the height of the second top surface.

8. The device for transferring a cut wafer according to claim 6, characterized in that: When the inner platform moves away from the outer platform in the longitudinal direction, a first distance between the original tape and the other tape at the inner platform is greater than a second distance between the original tape and the other tape at the working platform.

9. The device for transferring a cut wafer according to claim 8, characterized in that: The further tape spans across the first endless product.

10. A transfer device for cut wafers, characterized in that: include: A work platform for carrying the cut wafers fixed on the original tape; An inner platform is disposed along the periphery of the working platform and has a first top surface; an outer platform, disposed along the periphery of the inner platform and having a second top surface that is not higher than the first top surface; as well as A cutting device is provided between the inner platform and the working platform for cutting the original tape. The first top surface of the inner platform carries a first annular product for fixing the original adhesive tape, and is movable in the longitudinal direction relative to the outer platform.

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