Novel electronic wafer electroplating equipment
By introducing protective covers, filter plates and fixing devices into the electronic wafer electroplating equipment, the problems of liquid dripping and impurities are solved, and more uniform electroplating and efficient impurity cleaning are achieved, which improves the overall efficiency and environmental sanitation of the electroplating equipment.
Patent Information
- Application Number
- CN202420758420.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-12
AI Technical Summary
Existing electronic chip electroplating equipment is prone to liquid dripping problems after the plating is completed, which increases the labor intensity of cleaning. In addition, traditional equipment is exposed, and the contact between the plating solution and the air causes impurities to fall into the plating effect, affecting the plating effect.
A new type of electronic wafer electroplating equipment including a liquid storage tank, a protective cover, a filter plate and a fixing device is designed. The protective cover prevents splashing, and the filter plate blocks impurities. The fixing device achieves uniform electroplating and liquid drying through a rotating rod and a pushing spring. The adjustment device realizes impurity cleaning through the filter and the flow tank.
Effectively prevent liquid dripping and contamination, improve electroplating efficiency, reduce cleaning difficulty, and clean impurities through filter plates and filter systems to maintain the quality of the electroplating solution.
Smart Images
Figure CN222226611U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating equipment, in particular to a novel electronic chip electroplating equipment. Background Art
[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation, improve wear resistance, conductivity, reflectivity, corrosion resistance and enhance aesthetics. In semiconductor manufacturing technology, electroplating is usually performed in a single-chip processor by immersing the chip in an electrolyte.
[0003] However, in the prior art, liquid will adhere to the surface of the electronic chip after the electroplating is completed, which may easily cause the liquid to drip everywhere during the subsequent movement of the electronic chip, thereby increasing the labor intensity of the staff in cleaning the electroplating equipment. In addition, traditional electroplating equipment is often exposed to the outside, and the plating liquid is in contact with the air. Long-term electroplating causes impurities to fall into the plating liquid, resulting in poor electroplating effect, which often requires manual cleaning and is more troublesome. Utility Model Content
[0004] In view of the deficiencies of the prior art, the technical solution adopted by the utility model to solve the technical problems is: a new type of electronic chip electroplating equipment, including a liquid storage tank; a protective cover, the protective cover is used to prevent the electroplating liquid from splashing, the outer wall of the protective cover is rotatably connected to the top of the liquid storage tank; a filter plate, the filter plate is used to block impurities in the electroplating liquid in the liquid storage tank, the outer wall of the filter plate is slidably connected to the inner wall of the liquid storage tank; the new type of electronic chip electroplating equipment also includes: an adjusting device, the adjusting device is used to adjust the height of the filter plate, the adjusting device is located at the bottom of the liquid storage tank; a fixing device, the fixing device is used to fix the electronic chip The fixing device is located at the top of the protective cover; the fixing device includes a rotating rod, the bottom end of the rotating rod is fixedly connected to a fixing frame, the top end of the rotating rod is rotatably connected to a push spring through a spring seat, the bottom end of the push spring is fixedly connected to a load ring, the outer wall of the load ring is fixedly connected to a clamping column, the outer wall of the clamping column is slidably connected to the inner wall of the rotating rod through a spiral groove, the spiral groove is opened in the wall of the rotating rod, the inner wall of the fixing frame is threadedly connected to a screw, and one end of the screw extends to the outside of the fixing frame, the other end of the screw is rotatably connected to a clamping block, and the clamping blocks are symmetrically arranged on both sides of the bottom of the rotating rod. In the process of pressing the rotating rod downward, the guide column on the load ring slides in the spiral groove, so that the rotating rod rotates in the process of moving downward.
[0005] Preferably, the outer wall of the rotating rod is slidably connected to the inner wall of the protective cover, the outer wall of the carrying ring is fixedly connected to the outer wall of the protective cover, and the outer wall of the clamping block is slidably connected to the inner wall of the fixed frame. The screws with threaded connections at both ends are rotated to push the clamping block to slide in the fixed frame until the electronic chip is clamped and fixed, and grooves are provided on the clamping block and the fixed frame to facilitate the entry of the electroplating liquid to electroplate the electronic chip.
[0006] Preferably, the adjusting device comprises an adjusting rod, the outer wall of the adjusting rod is fixedly connected to a pull rod, the end of the pull rod away from the adjusting rod is rotatably connected to a push rod, and torsion springs are symmetrically arranged at both ends of the adjusting rod, and the torsion springs are sleeved on the outside of the adjusting rod. The end of the push rod away from the pull rod is rotatably connected to the outer wall of the filter plate, the outer wall of the torsion spring is fixedly connected to the outer wall of the adjusting rod, and the end of the torsion spring away from the adjusting rod is fixedly connected to the inner wall of the liquid storage tank. The adjusting rod is rotated by a hand wheel, so that the adjusting rod drives the pull rod to rotate, and the pull rod pushes the push rod to move, so that the filter screen rotatably connected thereto slides upward in the liquid storage tank, and the filter screen is observed to reach the top of the liquid storage tank through the observation window on the side of the liquid storage tank, thereby cleaning out impurities in the electroplating solution.
[0007] Preferably, the two end walls of the liquid storage tank are provided with flow slots, the outer wall of the liquid storage tank is fixedly connected to the shell and symmetrically arranged at the two ends of the liquid storage tank, and the outer wall of the shell is fixedly connected to the filter screen. This cleans the impurities on the filter screen and allows them to enter the outer shell through the flow slot at the upper end for collection, and the residual electroplating liquid contained therein passes through the filter screen and returns to the liquid storage tank through the flow slot at the lower end for continued use.
[0008] The beneficial effects of the utility model are as follows:
[0009] 1. The utility model sets a fixing device, presses the rotating rod downward, and slides in the spiral groove of the guide column, so that the rotating rod rotates during the downward movement, so that the fixed electronic chip is mixed with the solution more evenly during the electroplating process; when the pressure on the rotating rod is released, the rotating rod is reset and moved under the action of the push spring, and rotates again to dry the electroplating liquid attached to the surface of the electronic chip, which can effectively speed up the overall efficiency of electroplating and prevent the electronic chip from being directly fished out and the electroplating liquid from dripping on the ground to pollute the working environment.
[0010] 2. The utility model sets a filter plate. When large particles of impurities fall into the liquid storage tank, the filter plate prevents the impurities from entering the electroplating box and accumulating in the electroplating liquid in the liquid storage tank. The filter plate slides upward to clean out the impurities in the electroplating liquid until the top of the liquid storage tank, which is convenient for cleaning the impurities in the electroplating box. The impurities pass through the circulation groove into the external shell, and the residual electroplating liquid contained therein passes through the filter net and returns to the liquid storage tank for continued use. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is the front view of the utility model;
[0012] Figure 2 It is a cross-sectional view of the utility model;
[0013] Figure 3 It is a structural schematic diagram of the adjusting rod of the utility model;
[0014] Figure 4 It is a structural schematic diagram of the fixing device of the utility model.
[0015] In the figure: 1. liquid storage tank; 2. protective cover; 3. fixing device; 301. rotating rod; 302. spiral groove; 303. pushing spring; 304. bearing ring; 305. clamping column; 306. fixing frame; 307. clamping block; 308. screw; 4. filter plate; 5. outer shell; 6. circulation slot; 7. filter screen; 8. adjusting rod; 9. pull rod; 10. push rod; 11. torsion spring; 12. adjusting device. DETAILED DESCRIPTION
[0016] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.
[0017] Example:
[0018] See also Figure 1 - Figure 4The utility model provides a technical solution: a new type of electronic chip electroplating equipment, including a liquid storage tank 1; a protective cover 2, the protective cover 2 is used to prevent the electroplating liquid from splashing, and the outer wall of the protective cover 2 is rotatably connected to the top of the liquid storage tank 1; a filter plate 4, the filter plate 4 is used to block impurities in the electroplating liquid in the liquid storage tank 1, and the outer wall of the filter plate 4 is slidably connected to the inner wall of the liquid storage tank 1; the new type of electronic chip electroplating equipment also includes: an adjusting device 12, the adjusting device 12 is used to adjust the height of the filter plate 4, and the adjusting device 12 is located at the bottom end of the liquid storage tank 1; a fixing device 3, the fixing device 3 is used to fix the electronic chip for electroplating, and the fixing device 3 is located at the top of the protective cover 2; the fixing device 3 includes a rotating rod 301, the bottom end of the rotating rod 301 is fixedly connected with a fixing frame 306, the top end of the rotating rod 301 is rotatably connected with a push spring 303 through a spring seat, the bottom end of the push spring 303 is fixedly connected with a load-bearing ring 304, the outer wall of the load-bearing ring 304 is fixedly connected with a clamping column 305, the outer wall of the clamping column 305 is slidably connected with the inner wall of the rotating rod 301 through a spiral groove 302, the spiral groove 302 is opened in the wall of the rotating rod 301, the inner wall of the fixing frame 306 is threadedly connected with a screw 308, and one end of the screw 308 extends to the outside of the fixing frame 306, and the other end of the screw 308 is rotatably connected with a clamping block 307, and the clamping blocks 307 are symmetrically arranged on both sides of the bottom of the rotating rod 301. The rotating rod 301 is pressed downward to allow the fixed electronic chip to enter the liquid storage tank 1 for electroplating. During this process, the clamping column 305 fixedly connected to the supporting ring 304 slides in the spiral groove 302 opened on the rotating rod 301, causing the rotating rod 301 to rotate during the downward movement.
[0019] The outer wall of the rotating rod 301 is slidably connected to the inner wall of the protective cover 2, the outer wall of the carrying ring 304 is fixedly connected to the outer wall of the protective cover 2, and the outer wall of the clamping block 307 is slidably connected to the inner wall of the fixed frame 306. The screw 308 with threaded connections at both ends is rotated to push the rotatably connected clamping block 307 to slide on the inner wall of the fixed frame 306 until the electronic chip is clamped and fixed.
[0020] The adjusting device 12 includes an adjusting rod 8, the outer wall of which is fixedly connected with a pull rod 9, and the end of the pull rod 9 away from the adjusting rod 8 is rotatably connected with a push rod 10, and torsion springs 11 are symmetrically arranged at both ends of the adjusting rod 8, and the torsion springs 11 are sleeved on the outside of the adjusting rod 8. The end of the push rod 10 away from the pull rod 9 is rotatably connected to the outer wall of the filter plate 4, the outer wall of the torsion spring 11 is fixedly connected to the outer wall of the adjusting rod 8, and the end of the torsion spring 11 away from the adjusting rod 8 is fixedly connected to the inner wall of the liquid storage tank 1. The adjusting rod 8 is rotated by the hand wheel, so that the adjusting rod 8 drives the fixedly connected pull rod 9 to rotate, and the pull rod 9 pushes the rotatably connected push rod 10 to move upward, so that the filter screen 7 rotatably connected thereto slides upward on the inner wall of the liquid storage tank 1, thereby cleaning out impurities in the electroplating solution.
[0021] The liquid storage tank 1 has two end walls with flow slots 6, and the outer wall of the liquid storage tank 1 is fixedly connected to the outer shell 5, which is symmetrically arranged at the two ends of the liquid storage tank 1. The outer wall of the outer shell 5 is fixedly connected to the filter screen 7. The impurities on the filter screen 7 are cleaned and enter the outer shell 5 through the flow slot 6 at the upper end of the liquid storage tank 1. The residual electroplating liquid contained therein passes through the fixedly connected filter screen 7 and returns to the liquid storage tank 1 through the flow slot 6 at the lower end for continued use.
[0022] Working principle:
[0023] When in use, the protective cover 2 is rotated to separate the protective cover 2 from the liquid storage tank 1, and then the electronic chip is placed in the fixed frame 306 through the fixing device 3, and the screw rod 308 with threads at both ends is rotated to push the clamping block 307 to slide in the fixed frame 306 until the electronic chip is clamped and fixed, and then the protective cover 2 is rotated to reset, and then the rotating rod 301 is pressed downward to make the fixed electronic chip enter the liquid storage tank 1 for electroplating. In this process, the clamping column 305 on the carrying ring 304 slides in the spiral groove 302, and the rotating rod 301 rotates during the downward movement, so that the fixed electronic chip is mixed with the solution more evenly during the electroplating process;
[0024] When the electroplating is completed, the pressure on the rotating rod 301 is released, and the rotating rod 301 is reset and moved under the action of the push spring 303, driving the electronic chip to be separated from the liquid storage tank 1, and in the process of resetting, the clamping column 305 slides in the spiral groove 302, and rotates again, driving the electronic chip separated from the liquid storage tank 1 to rotate, and the electroplating liquid attached to the surface of the electronic chip is dried, and the protective cover 2 is used to prevent the electroplating liquid from splashing;
[0025] After long-term use, the adjusting rod 8 is rotated by handwheel through the adjusting device 12, so that the adjusting rod 8 drives the pull rod 9 to rotate, and the pull rod 9 pushes the push rod 10 to move, so that the filter screen 7 rotatably connected thereto slides upward in the liquid storage tank 1, and through the observation window on the side of the liquid storage tank 1, the filter screen 7 is observed to reach the top of the liquid storage tank 1, thereby cleaning out impurities in the electroplating solution until the top of the liquid storage tank 1. At this time, the impurities on the filter screen 7 are cleaned and enter the external housing 5 through the flow groove 6 at the upper end. The electroplating residual liquid contained therein passes through the filter screen 7 and returns to the liquid storage tank 1 through the flow groove 6 at the lower end for continued use. After cleaning, under the action of the torsion spring 11, the adjusting rod 8 is rotated and reset.
[0026] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.
Claims
1. A new type of electronic chip electroplating equipment, comprising: Liquid storage tank(1); A protective cover (2), the protective cover (2) being used to prevent splashing of the electroplating liquid, the outer wall of the protective cover (2) being rotatably connected to the top end of the liquid storage tank (1); A filter plate (4), the filter plate (4) being used to block impurities in the electroplating solution in the liquid storage tank (1), the outer wall of the filter plate (4) being slidably connected to the inner wall of the liquid storage tank (1); It is characterized in that The new electronic wafer electroplating equipment also includes: An adjusting device (12), the adjusting device (12) being used to adjust the height of the filter plate (4), the adjusting device (12) being located at the bottom end of the liquid storage tank (1); A fixing device (3), the fixing device (3) being used to fix and electroplate the electronic chip, the fixing device (3) being located at the top of the protective cover (2); The fixing device (3) comprises a rotating rod (301), the bottom end of the rotating rod (301) is fixedly connected to a fixing frame (306), the top end of the rotating rod (301) is rotatably connected to a push spring (303) via a spring seat, the bottom end of the push spring (303) is fixedly connected to a load-bearing ring (304), the outer wall of the load-bearing ring (304) is fixedly connected to a clamping column (305), the outer wall of the clamping column (305) is slidably connected to the inner wall of the rotating rod (301) via a spiral groove (302), the spiral groove (302) is provided in the wall of the rotating rod (301), the inner wall of the fixing frame (306) is threadedly connected to a screw rod (308), one end of the screw rod (308) extends to the outside of the fixing frame (306), the other end of the screw rod (308) is rotatably connected to a clamping block (307), and the clamping blocks (307) are symmetrically arranged on both sides of the bottom of the rotating rod (301).
2. A novel electronic wafer electroplating equipment according to claim 1, characterized in that: The outer wall of the rotating rod (301) is slidably connected to the inner wall of the protective cover (2), the outer wall of the carrying ring (304) is fixedly connected to the outer wall of the protective cover (2), and the outer wall of the clamping block (307) is slidably connected to the inner wall of the fixed frame (306).
3. A novel electronic wafer electroplating equipment according to claim 1, characterized in that: The adjusting device (12) comprises an adjusting rod (8), the outer wall of the adjusting rod (8) is fixedly connected to a pull rod (9), one end of the pull rod (9) away from the adjusting rod (8) is rotatably connected to a push rod (10), and torsion springs (11) are symmetrically arranged at both ends of the adjusting rod (8), and the torsion springs (11) are sleeved on the outside of the adjusting rod (8).
4. A novel electronic wafer electroplating equipment according to claim 3, characterized in that: One end of the push rod (10) away from the pull rod (9) is rotatably connected to the outer wall of the filter plate (4), the outer wall of the torsion spring (11) is fixedly connected to the outer wall of the adjustment rod (8), and one end of the torsion spring (11) away from the adjustment rod (8) is fixedly connected to the inner wall of the liquid storage tank (1).
5. A novel electronic wafer electroplating equipment according to claim 4, characterized in that: Flow grooves (6) are provided in the two end walls of the liquid storage tank (1), the outer wall of the liquid storage tank (1) is fixedly connected to an outer shell (5) and is symmetrically arranged at the two ends of the liquid storage tank (1), and the outer wall of the outer shell (5) is fixedly connected to a filter screen (7).