Drying device used after wafer cleaning

Abstract

The utility model discloses a drying device for cleaned wafers, which belongs to the technical field of wafer processing and comprises a conveying belt, a support frame mounted at the lower end of the conveying belt, a dust-free drying mechanism arranged in the middle of the conveying belt, a bearing mechanism arranged above the conveying belt, a dust-free bin fixedly mounted in the middle of the conveying belt, and a drying mechanism arranged in the dust-free bin. The drying device used after wafer cleaning is composed of a conveying belt, a supporting frame, a dust-free drying mechanism, a bearing mechanism and a wafer body, the dust-free drying mechanism and the bearing mechanism are connected to a wafer processing production line, and the dust-free drying mechanism and the wafer processing production line are completely integrated. According to the wafer cleaning and drying device, the tedious operation that wafers need to be independently taken out for drying in a traditional mode is avoided, the wafer cleaning and drying processes can be seamlessly connected, the production efficiency is improved, the bearing mechanism can convey a large number of wafers on the conveying belt at the same time, the wafer processing efficiency is greatly improved, and the processing cost of a single wafer is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a drying device used for wafers after cleaning. Background Art

[0002] Wafers are key materials in the semiconductor manufacturing process. They are round thin sheets made of high-purity, single-crystal silicon. The main function of wafers is to serve as the substrate for semiconductor devices and integrated circuits (ICs). A series of process steps such as thin film deposition, photolithography, etching and ion implantation are performed on the surface to form semiconductor devices with specific circuit structures and functions. The diameter of wafers is usually between 100 mm and 450 mm, and the most commonly used is 300 mm (12-inch) wafers. The larger the size of the wafer, the more chips can be manufactured on the same wafer, thereby reducing the cost of a single chip. Parameters such as wafer purity, thickness, resistivity, surface roughness and crystal defects have an important impact on the performance and reliability of semiconductor devices.

[0003] The patent document with application number CN202320559026.4 discloses a drying device for wafers after cleaning, which includes: a machine base; a fixed component, fixedly arranged on the machine base, used to place the wafers horizontally; a purge air knife, arranged above the fixed component, the purge air knife has a receiving cavity inside, one end of the purge air knife has an interface for introducing a drying medium into the receiving cavity, the end of the purge air knife away from the interface has a strip air outlet, the interface, the receiving cavity and the strip air outlet are interconnected, the strip air outlet is inclined toward the top surface of the fixed component, and the length direction of the strip air outlet is perpendicular to the groove direction on the surface of the wafer; a translation There are two groups of guide rails symmetrically arranged, and the purge air knife can move horizontally relative to the translational guide rails; however, the existing wafer drying equipment has limitations in terms of integration and is difficult to be fully integrated into the wafer processing production line, resulting in the need to take out and dry the wafers separately after they are cleaned. This processing method increases the complexity of the production process and reduces the processing efficiency of the wafers. It also brings certain uncertainties. In the process of manual processing of wafers, the use of air drying may cause dust to invade the interior of the wafer, causing the wafer to be contaminated, thereby affecting the quality and performance of semiconductor products. Utility Model Content

[0004] The purpose of the utility model is to provide a drying device for wafers after cleaning, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A drying device for wafers after cleaning, comprising a conveyor belt, a support frame is installed at the lower end of the conveyor belt, a dust-free drying mechanism is arranged in the middle of the conveyor belt, a bearing mechanism is arranged above the conveyor belt, the dust-free drying mechanism comprises a dust-free bin, a first dust-proof bin door and a first dust-proof curtain, a dust-free bin is fixedly installed in the middle of the conveyor belt, a first dust-proof bin door is fixedly installed at the left end of the dust-free bin, a first dust-proof curtain is installed inside the first dust-proof bin door, and three groups of the first dust-proof curtains are distributed inside the first dust-proof bin door.

[0007] Optionally, the dust-free drying mechanism further includes a second dust isolation door, a second dust isolation curtain, a first temperature isolation plate, a first heating plate, a second temperature isolation plate and a second heating plate, and three groups of the second dust isolation curtains are distributed inside the second dust isolation door.

[0008] Optionally, a second dust-proof bin door is fixedly installed at the right end of the dust-free bin, and a second dust-proof bin door is installed inside the second dust-proof bin door.

[0009] Optionally, a first temperature insulation plate is fixedly installed at the rear end of the dust-free bin, and a first heating plate is fixedly installed at the upper end of the first temperature insulation plate.

[0010] Optionally, a second temperature insulation plate is fixedly installed at the front end of the dust-free bin, and a second heating plate is fixedly installed at the upper end of the second temperature insulation plate.

[0011] Optionally, the bearing mechanism includes a carrier plate, a first mounting frame, a second mounting frame, a loading mesh plate, a first limiting block, a first limiting rail, a second limiting block and a second limiting rail, and a carrier plate is arranged above the conveyor belt.

[0012] Optionally, a first mounting frame and a second mounting frame are fixedly mounted on the upper end of the carrier plate, and a loading mesh plate is mounted between the first mounting frame and the second mounting frame.

[0013] Optionally, a first limiting block is fixedly installed at the rear ends of the first mounting frame and the second mounting frame, and a second limiting block is fixedly installed at the front ends of the first mounting frame and the second mounting frame.

[0014] Optionally, a first limit rail and a second limit rail are fixedly mounted on the upper end of the conveyor belt, the first limit block is slidably connected to the first limit rail, and the second limit block is slidably connected to the second limit rail.

[0015] Optionally, a wafer body is arranged on the carrier mesh plate.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. In the utility model, a dust-free drying mechanism is provided, and the dust-free drying mechanism is fully integrated with the wafer processing production line, thereby avoiding the tedious operation of taking out the wafers separately for drying in the traditional method, which enables the wafer cleaning and drying processes to be seamlessly connected, thereby improving production efficiency; the interior of the dust-free drying mechanism is provided with a first dust-proof chamber door, a first dust-proof curtain, a second dust-proof chamber door and a second dust-proof curtain, which can effectively isolate external dust and maintain the cleanliness of the dust-free chamber, thereby helping to improve the drying effect of the wafers and reduce the contamination of the wafers by dust particles; since the dust-free drying mechanism is integrated with the production line, the carrying mechanism can directly send the wafers into the dust-free chamber for drying treatment, thereby reducing the manual processing links, thereby helping to reduce the risk of wafer contamination and improving the quality and performance of semiconductor products.

[0018] 2. In the utility model, a carrying mechanism is provided, which can transport a large number of wafers on the conveyor belt at the same time, greatly improving the processing efficiency of the wafers and reducing the processing cost of a single wafer; the carrying mechanism accurately controls the position of the carrier on the conveyor belt through the first limit block, the first limit rail, the second limit block and the second limit rail, ensuring that the wafers can accurately enter the predetermined position when passing through the dust-free drying mechanism, thereby improving the reliability of the drying process; the carrier mesh plate of the carrying mechanism adopts a leaky mesh structure, which is conducive to the rapid evaporation of the liquid on the surface of the wafer during the drying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the utility model in a three-dimensional front view;

[0020] Figure 2 It is a schematic structural diagram of the utility model in a plane front view;

[0021] Figure 3 This is a schematic diagram of the structure of the utility model in a three-dimensional left view;

[0022] Figure 4 The structure of the utility model is shown in a three-dimensional cutaway view. Figure 1 ;

[0023] Figure 5 The structure of the utility model is schematically shown in a three-dimensional cutaway view. Figure 2 ;

[0024] Figure 6 The structure of the utility model is schematically shown in a three-dimensional cutaway view. Figure 3 ;

[0025] Figure 7 For this utility model Figure 3 Schematic diagram of the three-dimensional enlarged structure at point A in the middle.

[0026] In the figure: 1. conveyor belt; 2. support frame; 3. dust-free drying mechanism; 301. dust-free bin; 302. first dust-proof bin door; 303. first dust-proof curtain; 304. second dust-proof bin door; 305. second dust-proof curtain; 306. first temperature insulation board; 307. first heating board; 308. second temperature insulation board; 309. second heating board; 4. bearing mechanism; 401. carrier board; 402. first mounting frame; 403. second mounting frame; 404. carrier mesh plate; 405. first limit block; 406. first limit rail; 407. second limit block; 408. second limit rail; 5. wafer body. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] See also Figures 1 to 7 In an embodiment of the utility model, a drying device for wafers after cleaning comprises a conveyor belt 1, a support frame 2 is installed at the lower end of the conveyor belt 1, a dust-free drying mechanism 3 is arranged in the middle of the conveyor belt 1, a carrying mechanism 4 is arranged above the conveyor belt 1, the dust-free drying mechanism 3 comprises a dust-free bin 301, a first dust-proof bin door 302 and a first dust-proof curtain 303, a dust-free bin 301 is fixedly installed in the middle of the conveyor belt 1, a first dust-proof bin door 302 is fixedly installed at the left end of the dust-free bin 301, a first dust-proof curtain 303 is installed inside the first dust-proof bin door 302, three groups of first dust-proof curtains 303 are distributed inside the first dust-proof bin door 302, and the dust-free drying mechanism 3 also comprises a second dust-proof bin door 301. The warehouse door 304, the second dust-proof curtain 305, the first insulation board 306, the first heating board 307, the second insulation board 308 and the second heating board 309, the three groups of the second dust-proof curtain 305 are distributed inside the second dust-proof warehouse door 304, the second dust-proof warehouse door 304 is fixedly installed on the right end of the dust-free warehouse 301, the second dust-proof curtain 305 is installed inside the second dust-proof warehouse door 304, the first insulation board 306 is fixedly installed at the rear end of the dust-free warehouse 301, the first heating board 307 is fixedly installed on the upper end of the first insulation board 306, the second insulation board 308 is fixedly installed at the front end of the dust-free warehouse 301, and the second heating board 309 is fixedly installed on the upper end of the second insulation board 308;

[0029] The dust-free chamber 301 provides a clean and dry environment for the wafers, reducing the pollution of dust particles to the wafers; the first dust-proof chamber door 302, the first dust-proof curtain 303, the second dust-proof chamber door 304 and the second dust-proof curtain 305 form a dust-proof barrier, blocking the external dust before it enters the dust-free chamber 301, thereby maintaining the cleanliness of the dust-free chamber 301 and preventing the clean air in the dust-free chamber 301 from being lost to the outside, thereby maintaining the temperature and humidity in the dust-free chamber 301 stable; the first heating plate 307 and the second heating plate 309 are heated, thereby increasing the internal temperature of the dust-free chamber 301, and performing the drying operation by high-temperature evaporation;

[0030] The carrying mechanism 4 includes a carrying plate 401, a first mounting frame 402, a second mounting frame 403, a carrying mesh plate 404, a first limiting block 405, a first limiting rail 406, a second limiting block 407 and a second limiting rail 408. The carrying plate 401 is arranged above the conveyor belt 1, and the first mounting frame 402 and the second mounting frame 403 are fixedly installed on the upper end of the carrying plate 401. The carrying mesh plate 404 is installed between the first mounting frame 402 and the second mounting frame 403. A first limit block 405 is fixedly installed at the rear end of the mounting frame 402 and the second mounting frame 403, a second limit block 407 is fixedly installed at the front end of the first mounting frame 402 and the second mounting frame 403, a first limit rail 406 and a second limit rail 408 are fixedly installed at the upper end of the conveyor belt 1, the first limit block 405 is slidably connected to the first limit rail 406, the second limit block 407 is slidably connected to the second limit rail 408, and a wafer body 5 is arranged on the object loading mesh plate 404;

[0031] The carrier mesh plate 404 adopts a leaky mesh structure, which is beneficial to the rapid evaporation of the liquid on the surface of the wafer during the drying process. The first limit block 405, the first limit rail 406, the second limit block 407 and the second limit rail 408 are used together to accurately control the lateral position of the carrier plate 401 on the conveyor belt 1, ensuring that the wafer can accurately enter the predetermined position when passing through the dust-free drying mechanism 3.

[0032] The working principle of the utility model is as follows: the drying device for wafers after cleaning is composed of a conveyor belt 1, a support frame 2, a dust-free drying mechanism 3, a bearing mechanism 4 and a wafer body 5. The dust-free drying mechanism 3 and the bearing mechanism 4 are connected to the wafer processing production line. There is no need to take the wafer body 5 separately for drying operation, and the wafer body 5 on the production line can be directly dried, thereby achieving the effect of efficiently drying the wafer body 5, that is, improving the processing efficiency, and also ensuring that the wafer body 5 will not be contaminated, thereby ensuring the quality of the wafer body 5; before using the drying device for wafers after cleaning, it is necessary to pre-connect the dust-free drying mechanism 3 and the bearing mechanism 4 to the conveyor belt 1 of the wafer processing production line, and connect the first heating plate 307 and the second heating plate 309 to electricity. When using the drying device for wafers after cleaning, the dust-free drying mechanism 3 is enabled, and the first heating plate 307 and the second heating plate 309 are started and heated, thereby increasing the internal temperature of the dust-free bin 301, and the first dust-proof bin door 302, the first dust-proof curtain 303, the second dust-proof bin door 304, the first dust-proof curtain 305, the second dust-proof bin door 306, the first dust-proof curtain 307, the second dust-proof curtain 308, the second dust-proof curtain 309, the first ...8, the first dust-proof curtain 309, the first dust-proof curtain 309, the first dust-proof curtain 309, the first dust-proof curtain 309, the first dust-proof curtain 309, The addition of the dust bin door 304 and the second dust-proof curtain 305 can effectively isolate the external dust from the outside, prevent dust from invading the dust-free bin 301, improve the processing effect of the dust-free drying mechanism 3, and ensure the quality and reliability of the wafer body 5. The carrying mechanism 4 is activated to place the wafer body 5 to be dried on the carrier mesh plate 404. A large number of wafer bodies 5 can be placed on multiple carrier mesh plates 404, and the leakage structure of the carrier mesh plate 404 is also easy to dry the wafer body 5, ensuring the wafer body The bottom layer of 5 can also be exposed to the high temperature in the dust-free chamber 301, thereby being dried; when the drying device for wafer cleaning is started, the supporting mechanism 4 is transported as a whole on the conveyor belt 1, and moves to the inside of the dust-free chamber 301 through the first dust-proof chamber door 302 and the first dust-proof curtain 303. The high temperature environment in the dust-free chamber 301 will quickly evaporate the liquid on the surface of the wafer body 5, and the processed wafer body 5 will move to the wafer processing production line along with the supporting mechanism 4 through the second dust-proof chamber door 304 and the second dust-proof curtain 305.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A drying device for wafers after cleaning, comprising a conveyor belt (1), a support frame (2) being mounted at the lower end of the conveyor belt (1), characterized in that: A dust-free drying mechanism (3) is arranged in the middle of the conveyor belt (1), and a bearing mechanism (4) is arranged above the conveyor belt (1). The dust-free drying mechanism (3) comprises a dust-free bin (301), a first dust-isolating bin door (302) and a first dust-isolating curtain (303). The dust-free bin (301) is fixedly installed in the middle of the conveyor belt (1), and the first dust-isolating bin door (302) is fixedly installed at the left end of the dust-free bin (301). The first dust-isolating bin door (302) is installed inside the first dust-isolating bin door (302), and three groups of the first dust-isolating curtains (303) are distributed inside the first dust-isolating bin door (302).

2. The drying device for wafers after cleaning according to claim 1, characterized in that: The dust-free drying mechanism (3) further comprises a second dust-isolating compartment door (304), a second dust-isolating curtain (305), a first temperature-isolating plate (306), a first heating plate (307), a second temperature-isolating plate (308) and a second heating plate (309), wherein three groups of the second dust-isolating curtains (305) are distributed inside the second dust-isolating compartment door (304).

3. The drying device for wafers after cleaning according to claim 2, characterized in that: A second dust-proof bin door (304) is fixedly mounted on the right end of the dust-free bin (301), and a second dust-proof bin curtain (305) is mounted inside the second dust-proof bin door (304).

4. The drying device for wafers after cleaning according to claim 3, characterized in that: A first temperature insulation plate (306) is fixedly mounted at the rear end of the dust-free bin (301), and a first heating plate (307) is fixedly mounted at the upper end of the first temperature insulation plate (306).

5. The drying device for wafers after cleaning according to claim 4, characterized in that: A second temperature insulation plate (308) is fixedly mounted on the front end of the dust-free bin (301), and a second heating plate (309) is fixedly mounted on the upper end of the second temperature insulation plate (308).

6. The drying device for wafers after cleaning according to claim 1, characterized in that: The bearing mechanism (4) comprises a carrier plate (401), a first mounting frame (402), a second mounting frame (403), a carrier mesh plate (404), a first limiting block (405), a first limiting rail (406), a second limiting block (407) and a second limiting rail (408); the carrier plate (401) is arranged above the conveyor belt (1).

7. The drying device for wafers after cleaning according to claim 6, characterized in that: A first mounting frame (402) and a second mounting frame (403) are fixedly mounted on the upper end of the carrier plate (401), and an object carrying net plate (404) is mounted between the first mounting frame (402) and the second mounting frame (403).

8. The drying device for wafers after cleaning according to claim 6, characterized in that: A first limiting block (405) is fixedly mounted on the rear ends of the first mounting frame (402) and the second mounting frame (403), and a second limiting block (407) is fixedly mounted on the front ends of the first mounting frame (402) and the second mounting frame (403).

9. The drying device for wafers after cleaning according to claim 6, characterized in that: A first limiting rail (406) and a second limiting rail (408) are fixedly mounted on the upper end of the conveyor belt (1); the first limiting block (405) is slidably connected to the first limiting rail (406); and the second limiting block (407) is slidably connected to the second limiting rail (408).

10. The drying device for wafers after cleaning according to claim 6, characterized in that: A wafer body (5) is arranged on the object carrier mesh plate (404).

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