Novel surface-mounted pyroelectric infrared sensor

Abstract

The utility model relates to the technical field of infrared sensors, in particular to a novel surface-mounted pyroelectric infrared sensor, which comprises a substrate and a tube cap, the tube cap is adhered to the substrate through adhesive, an integrated circuit chip, a sensitive element and an infrared filter are sequentially arranged in an inner cavity of the tube cap from bottom to top, and the sensitive element is arranged in the inner cavity of the tube cap. A pair of supporting components is arranged in an inner cavity of the pipe cap, the supporting components are clamped between the base plate and the inner wall of the pipe cap, an electronic shielding layer is arranged in the inner cavity of the base plate, the outer wall of the base plate is wrapped with insulating ceramic slurry, a plurality of metal pins are evenly arranged at the bottom of the base plate, the metal pins protrude out of the insulating ceramic slurry, and the insulating ceramic slurry is arranged in the inner cavity of the base plate. According to the novel surface-mounted pyroelectric infrared sensor, the traditional mode that a welding ring is arranged on the surface of the substrate for welding is changed, the working hours are reduced, and the processing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared sensors, in particular to a novel mounted pyroelectric infrared sensor. Background Art

[0002] Pyroelectric infrared sensors are infrared pyroelectric detectors made using the pyroelectric effect, which are widely used in fire warning and alarm, gas detection and analysis, spectral analysis, etc. The existing pyroelectric infrared sensor uses energy storage welding to weld the tube cap and tube socket, which has high precision requirements for tooling and fixtures, and complex production processes. If the welding process parameters are not properly controlled, the welding strength cannot meet the requirements and the airtightness cannot be guaranteed; the cost is high, the sensor is large, and the packaging and micro-assembly process is complex. Utility Model Content

[0003] The utility model aims to solve the shortcomings in the prior art and proposes a new type of mounted pyroelectric infrared sensor.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A novel surface-mount pyroelectric infrared sensor is designed, comprising a substrate and a tube cap, wherein the tube cap is bonded to the substrate by an adhesive, an inner cavity of the tube cap is provided with an integrated circuit chip, a sensitive element, and an infrared filter in sequence from bottom to top, a pair of supporting components are provided in the inner cavity of the tube cap, the sensitive element is fixed on the integrated circuit chip through the supporting components and is in conduction with the integrated circuit chip, an electronic shielding layer is provided in the inner cavity of the substrate, the substrate is a PCB board, the outer wall of the substrate is wrapped with an insulating coating, the substrate is a ceramic board, the outer wall of the substrate is covered with insulating ceramic slurry, a plurality of metal pins are evenly provided on the bottom of the substrate, a metallized pad is provided on the top of the substrate, and the metallized pad and the metal pins are exposed to the outside of the insulating coating or the insulating ceramic slurry.

[0006] The utility model proposes a novel mountable pyroelectric infrared sensor, which has the following beneficial effects:

[0007] 1. The substrate is made of ceramic material, which has good mechanical properties and high high temperature tolerance. It can be used in reflow soldering and wave soldering environments and repeated welding, solving the problem of deformation in high temperature environments, increased internal pressure, poor sealing and inability to repeat welding caused by other processes such as PCB or injection materials.

[0008] 2. The substrate is made of ceramic material and is bonded to the tube cap with an adhesive, which changes the traditional method of setting a welding ring on the surface of the substrate for welding, reducing working hours and processing costs;

[0009] 3. The surface of the substrate is coated with insulating porcelain slurry to achieve insulation, heat insulation, and reduce self-excitation caused by self-heating;

[0010] 4. There is a metal shielding layer inside the substrate to achieve anti-electromagnetic interference;

[0011] 5. The substrate is provided with a circuit to simplify the sensor structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is an exploded diagram of a new type of mounted pyroelectric infrared sensor proposed by the utility model;

[0013] Figure 2 This is a structural schematic diagram of a new type of mounted pyroelectric infrared sensor proposed by the utility model;

[0014] Figure 3 This is a schematic diagram of the upper surface structure of a substrate of a novel mountable pyroelectric infrared sensor proposed by the utility model;

[0015] Figure 4 The utility model provides a schematic diagram of the lower surface structure of a substrate of a novel mountable pyroelectric infrared sensor.

[0016] In the figure: 1 substrate, 2 supporting component, 3 integrated circuit chip, 4 sensitive element, 5 infrared filter, 6 tube cap, 7 metallized pad, 8 metal pin, 9 electronic shielding layer. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0018] Reference Figure 1-4 A novel surface-mounted pyroelectric infrared sensor includes a substrate 1 and a tube cap 6. The tube cap 6 is bonded to the substrate 1 by an adhesive. An integrated circuit chip 3, a sensitive element 4, and an infrared filter 5 are arranged in the inner cavity of the tube cap 6 from bottom to top. A pair of supporting components 2 are arranged in the inner cavity of the tube cap 6. The sensitive element 4 is fixed on the integrated circuit chip 3 through the supporting component 2 and is connected to the integrated circuit chip 3.

[0019] An electronic shielding layer 9 is arranged in the inner cavity of the substrate 1. The substrate 1 is a PCB board. The outer wall of the substrate 1 is wrapped with an insulating coating. The substrate 1 is a ceramic board. The outer wall of the substrate 1 is covered with an insulating porcelain paste. The surface of the substrate 1 is wrapped with the insulating porcelain paste to achieve insulation and heat insulation and reduce self-excitation caused by self-heating. A plurality of metal pins 8 are evenly arranged on the bottom of the substrate 1. A metallized pad 7 is arranged on the top of the substrate 1. The metallized pad 7 and the metal pin 8 are exposed to the outside of the insulating coating or the insulating porcelain paste.

[0020] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A novel surface-mount pyroelectric infrared sensor, comprising a substrate (1) and a tube cap (6), characterized in that: The tube cap (6) is bonded to the substrate (1) by an adhesive. The inner cavity of the tube cap (6) is provided with an integrated circuit chip (3), a sensitive element (4), and an infrared filter (5) in order from bottom to top. A pair of supporting components (2) are provided in the inner cavity of the tube cap (6). The sensitive element (4) is fixed on the integrated circuit chip (3) through the supporting components (2) and is in electrical communication with the integrated circuit chip (3). An electronic shielding layer (9) is provided in the inner cavity of the substrate (1). The substrate (1) is a PCB board. The outer wall of the substrate (1) is wrapped with an insulating coating. The substrate (1) is a ceramic board. The outer wall of the substrate (1) is covered with insulating ceramic slurry. A plurality of metal pins (8) are evenly provided at the bottom of the substrate (1). A metallized pad (7) is provided at the top of the substrate (1). The metallized pad (7) and the metal pins (8) are exposed to the outside of the insulating coating or the insulating ceramic slurry.

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