Ultrasonic module and ultrasonic module packaging structure

Abstract

The utility model relates to an ultrasonic module and an ultrasonic module packaging structure. The ultrasonic module packaging structure comprises a flexible circuit board, two ceramic substrates, an ultrasonic transmitting assembly and an ultrasonic receiving assembly. The ceramic substrate is arranged on the surface of the flexible circuit board. The ultrasonic transmitting assembly is packaged on one of the two ceramic substrates and is electrically connected with the flexible circuit board. The ultrasonic receiving assembly is packaged on the other one of the two ceramic substrates and is electrically connected with the flexible circuit board. The ultrasonic transmitting assembly and the ultrasonic receiving assembly are arranged on the ceramic substrate, vibration of the flexible circuit board caused by ultrasonic signals generated by the ultrasonic transmitting assembly or reflected waves is reduced through rigidity provided by the ceramic substrate, more accurate judgment can be achieved, and the ultrasonic sensing device can be applied to close-range sensing.

Description

Technical Field

[0001] The present application relates to the field of sensing, and in particular to an ultrasonic module and an ultrasonic module packaging structure using the same. Background Art

[0002] Traditionally, ultrasonic modules are mainly used in vehicles for long-distance ranging sensing. However, as the technical bottleneck of ultrasonic sensing has been broken through, ultrasonic waves can be applied to places where optical sensing cannot be applied, such as reflective and transparent materials. Therefore, various sensing applications are gradually adopting ultrasonic methods.

[0003] With the continuous breakthrough of current technology and the miniaturization of size, ultrasonic modules can be lightly and flatly attached to circuit boards. At present, by using a specific angle, it is possible to sense a distance of less than ten centimeters, but there is still a problem of insufficient stability, which requires a technological breakthrough. Utility Model Content

[0004] In order to solve the problems faced by the prior art, an ultrasonic module packaging structure is provided. In some embodiments, the ultrasonic module packaging structure includes a flexible circuit board, two ceramic substrates, an ultrasonic transmitting component, and an ultrasonic receiving component. The ceramic substrate is mounted on the surface of the flexible circuit board. The ultrasonic transmitting component is packaged on one of the two ceramic substrates and electrically connected to the flexible circuit board. The ultrasonic receiving component is packaged on the other of the two ceramic substrates and electrically connected to the flexible circuit board.

[0005] In some embodiments, a plurality of grooves are formed on the upper surface and at least one side wall of the ceramic substrate, and the ultrasonic transmitting component or the ultrasonic receiving component is connected to the flexible circuit board via a plurality of wires arranged along the grooves.

[0006] In some embodiments, each ceramic substrate includes a plurality of through holes, and the ultrasonic transmitting component or the ultrasonic receiving component is connected to the flexible circuit board via a plurality of wires arranged along the through holes.

[0007] In some embodiments, the upper surface of each ceramic substrate includes multiple contacts, and the lower surface of each ceramic substrate includes multiple welding pads, the contacts are electrically connected to the welding pads, the welding pads are connected to the flexible circuit board, the ultrasonic transmitting component or the ultrasonic receiving component is welded to the contacts and electrically connected to the flexible circuit board through the ceramic substrate.

[0008] In some embodiments, the ultrasonic receiving component includes one or more ultrasonic receivers. In more detail, in some embodiments, the ultrasonic transmitting component includes one or more ultrasonic transmitters.

[0009] Here, an ultrasonic module is also provided. In some embodiments, the ultrasonic module includes a ceramic substrate and an ultrasonic component. The ultrasonic component is packaged on the upper surface of the ceramic substrate.

[0010] In some embodiments, a plurality of grooves are formed on the upper surface and the side wall of the ceramic substrate, and a plurality of connecting wires are arranged along the grooves to connect the ultrasonic components.

[0011] In some embodiments, the ceramic substrate includes a plurality of through holes, and a plurality of wires are arranged along the through holes to connect the ultrasonic components.

[0012] In some embodiments, the upper surface of the ceramic substrate includes a plurality of contacts, and the lower surface of the ceramic substrate includes a plurality of solder pads, the contacts are electrically connected to the solder pads, and the ultrasonic component is soldered to the contacts.

[0013] It can be understood from the aforementioned embodiments that by disposing the ultrasonic transmitting component and the ultrasonic receiving component on a ceramic substrate, the rigidity provided by the ceramic substrate can reduce the vibration of the flexible circuit board caused by the ultrasonic signal generated by the ultrasonic transmitting component or the reflected wave, thereby achieving more accurate judgment and being applicable to short-range sensing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional diagram of the ultrasonic module packaging structure.

[0015] Figure 2 FIG. 4 is a partial stereoscopic diagram of a first embodiment of an ultrasonic module.

[0016] Figure 3 FIG. 4 is a cross-sectional view of a second embodiment of an ultrasonic module.

[0017] Figure 4 FIG. 4 is a cross-sectional view of a third embodiment of an ultrasonic module.

[0018] Figure 5 It is a partial top view of the first embodiment of the ultrasonic module packaging structure.

[0019] Figure 6 FIG. 4 is a partial top view of a second embodiment of an ultrasonic module packaging structure.

[0020] Figure 7 FIG. 4 is a partial top view of a second embodiment of an ultrasonic module packaging structure.

[0021] Description of reference numerals:

[0022] 1: Ultrasonic module;

[0023] 10: Flexible circuit board;

[0024] 10A: first surface;

[0025] 20: ceramic substrate;

[0026] 20A: upper surface;

[0027] 20B: side wall;

[0028] 20C: lower surface;

[0029] 21: Contact;

[0030] 23: welding pad;

[0031] 25: groove;

[0032] 27: through hole;

[0033] 29: Metal column;

[0034] 31: ultrasonic transmitting component;

[0035] 311: ultrasonic transmitter;

[0036] 33: ultrasonic receiving component;

[0037] 331: ultrasonic receiver;

[0038] 35: wire;

[0039] 100: Ultrasonic module packaging structure. DETAILED DESCRIPTION

[0040] In the following description, the terms "first", "second", "third" are used only to distinguish one component, part, region, layer or part from another component, part, region, layer or part, rather than to indicate a necessary order of precedence. In addition, relative terms such as "lower" and "upper", "inner" and "outer" may be used herein to describe the relationship between one component and another component, and it should be understood that the relative terms are intended to include different orientations of the device in addition to the orientation shown in the figure. For example, if a device in a figure is turned over, the component described as being on the "lower" side of the other components will be oriented on the "upper" side of the other components. This only indicates a relative orientation relationship, not an absolute orientation relationship.

[0041] In the accompanying drawings, the width of some components, regions, etc. is exaggerated for clarity. The same reference numerals represent the same components throughout the specification. It should be understood that when, for example, a component is referred to as being "on" or "connected to" another component, it may be directly on or connected to another component, or an intermediate component may also exist. On the contrary, when a component is referred to as being "directly on" or "directly connected to" another component, there is no intermediate component.

[0042] The applicant has found through experiments that, as current electronic components are becoming thinner and lighter, the thickness of the circuit board is reduced and the design is flexible. When a planar ultrasonic module is used for close-range sensing, the circuit board is easily resonated by the ultrasonic signal generated by the ultrasonic transmitting component, or vibrates due to the reflected wave of the ultrasonic signal. As a result, the receiving end of the ultrasonic module is easily affected by the vibration of the circuit board and stops receiving signals. This phenomenon is more obvious when the ultrasonic sensing signal is emitted densely, which leads to instability in close-range sensing.

[0043] Figure 1 This is a three-dimensional diagram of the ultrasonic module packaging structure. Figure 1 As shown, the ultrasonic module packaging structure 100 includes a flexible circuit board 10, two ceramic substrates 20, an ultrasonic emitting component 31, and an ultrasonic receiving component 33. The ceramic substrate 20 is mounted on the first surface 10A of the flexible circuit board 10, which refers to the upper surface. The ultrasonic emitting component 31 and the ultrasonic receiving component 33 are respectively packaged on the two ceramic substrates 20 and electrically connected to the flexible circuit board 10. Here, the ceramic substrate 20 and the ultrasonic component (i.e., the ultrasonic emitting component 31 or the ultrasonic receiving component 33) can constitute an ultrasonic module 1 (see Figures 2 to 4 ).

[0044] In order to prevent the ultrasonic signal emitted by the ultrasonic transmitting component 31 or the reflected wave of the ultrasonic signal from causing the flexible circuit board 10 to vibrate and cause the ultrasonic receiving component 33 to stop working, a rigid ceramic substrate 20 is used to support the ultrasonic transmitting component 31 and the ultrasonic receiving component 33 to maintain the sensitivity of signal reception.

[0045] Figure 2 FIG. 1 is a partial stereogram of the first embodiment of the ultrasonic module. Figure 2 As shown, a plurality of grooves 25 are provided on the upper surface 20A and at least one side wall 20B of the ceramic substrate 20 . The electrodes of the ultrasonic transmitting component 31 or the ultrasonic receiving component 33 are connected to the flexible circuit board 10 via a plurality of wires 35 provided along the grooves 25 .

[0046] In other words, the ceramic substrate 20 of the first embodiment may not actually have a circuit, but simply provide a rigid hard substrate, and the ultrasonic transmitting component 31 or the ultrasonic receiving component 33 is connected by bonding to maintain electrical conduction.

[0047] Figure 3 FIG. 2 is a cross-sectional view of a second embodiment of an ultrasonic module. Figure 3As shown, the ceramic substrate 20 includes a plurality of through holes 27, and the ultrasonic emitting component 31 or the ultrasonic receiving component 33 is connected to the flexible circuit board 10 through a plurality of wires 35 arranged along the through holes 27. In other words, the ultrasonic emitting component 31 or the ultrasonic receiving component 33 can pass through the ceramic substrate 20 in the form of long pins and be connected to the flexible circuit board 10.

[0048] Figure 4 2 is a cross-sectional view of the third embodiment of the ultrasonic module. The upper surface 20A of the ceramic substrate 20 includes a plurality of contacts 21, and the lower surface 20C of each ceramic substrate 20 includes a plurality of pads 23. The contacts 21 are electrically connected to the pads 23, and the pads 23 are connected to the flexible circuit board 10. The ultrasonic transmitting component 31 or the ultrasonic receiving component 33 is soldered to the contacts 21, and the flexible circuit board 10 is electrically connected through the ceramic substrate 20. Here, it can be understood that the ceramic substrate 20 is not only a carrier substrate, but also a circuit substrate. The ceramic substrate 20 can have a double-layer or multi-layer circuit, and the contacts 21 are electrically connected to the pads 23 as Figure 4 As shown, the upper circuit with the contact 21 and the lower circuit with the pad 23 are connected by the metal column 29. Furthermore, a redistribution layer and other circuits may be provided to adjust different hole pitches.

[0049] Figure 5 It is a partial top view of the first embodiment of the ultrasonic module packaging structure. Figure 6 FIG. 4 is a partial top view of a second embodiment of an ultrasonic module packaging structure. Figure 7 FIG. 1 is a partial top view of the second embodiment of the ultrasonic module packaging structure. Figure 5 As shown, the ultrasonic transmitting component 31 and the ultrasonic receiving component 33 respectively include a single ultrasonic transmitter 311 and an ultrasonic receiver 331 , that is, the ultrasonic transmitter 311 and the ultrasonic receiver 331 are arranged one-to-one.

[0050] like Figure 6 As shown, the ultrasonic transmitting component 31 includes a plurality of ultrasonic transmitters 311, and the ultrasonic receiving component 33 includes a single ultrasonic receiver 331, thus forming a many-to-one arrangement. Figure 7 As shown, the ultrasonic transmitting component 31 and the ultrasonic receiving component 33 respectively include a plurality of ultrasonic transmitters 311 and ultrasonic receivers 331, that is, the ultrasonic transmitters 311 and the ultrasonic receivers 331 are arranged in a many-to-many configuration. However, the above is only an example and not intended to be limiting. In fact, the number and proportion of the ultrasonic transmitting components 31 and the ultrasonic receiving components 33 can be adjusted according to the specifications.

[0051] Through the above detailed description, it can be understood from the aforementioned embodiments that by disposing the ultrasonic transmitting component 31 and the ultrasonic receiving component 33 on the ceramic substrate 20, the rigidity provided by the ceramic substrate 20 can reduce the vibration of the flexible circuit board 10 caused by the ultrasonic signal generated by the ultrasonic transmitting component 31 or the reflected wave, so that more accurate judgment can be achieved and it can be applied to short-range sensing.

Claims

1. An ultrasonic module packaging structure, characterized in that: Include: Flexible printed circuit board; Two ceramic substrates are mounted on the surface of the flexible circuit board; An ultrasonic transmitting component is packaged on one of the two ceramic substrates and electrically connected to the flexible circuit board; and The ultrasonic receiving component is packaged on the other of the two ceramic substrates and electrically connected to the flexible circuit board.

2. The ultrasonic module packaging structure according to claim 1, characterized in that: A plurality of grooves are formed on the upper surface and at least one side wall of each of the ceramic substrates, and the ultrasonic transmitting component or the ultrasonic receiving component is connected to the flexible circuit board via a plurality of wires arranged along the plurality of grooves.

3. The ultrasonic module packaging structure according to claim 1, characterized in that: Each of the ceramic substrates includes a plurality of through holes, and the ultrasonic transmitting component or the ultrasonic receiving component is connected to the flexible circuit board via a plurality of wires arranged along the plurality of through holes.

4. The ultrasonic module packaging structure according to claim 1, characterized in that: The upper surface of each of the ceramic substrates includes a plurality of contacts, and the lower surface of each of the ceramic substrates includes a plurality of soldering pads, the plurality of contacts are electrically connected to the plurality of soldering pads, the plurality of soldering pads are connected to the flexible circuit board, the ultrasonic transmitting component or the ultrasonic receiving component is welded to the plurality of contacts, and is electrically connected to the flexible circuit board through the ceramic substrate.

5. The ultrasonic module packaging structure according to claim 1, characterized in that: The ultrasonic receiving component includes one or more ultrasonic receivers.

6. The ultrasonic module packaging structure according to claim 5, characterized in that: The ultrasonic transmitting component includes one or more ultrasonic transmitters.

7. An ultrasonic module, characterized in that: Include: Ceramic substrates; and The ultrasonic component is packaged on the upper surface of the ceramic substrate.

8. The ultrasonic module according to claim 7, characterized in that: The upper surface and at least one side wall of the ceramic substrate are provided with a plurality of grooves, and a plurality of wires are arranged along the plurality of grooves to connect the ultrasonic components.

9. The ultrasonic module according to claim 7, characterized in that: The ceramic substrate comprises a plurality of through holes, and a plurality of conducting wires are arranged along the plurality of through holes to connect the ultrasonic components.

10. The ultrasonic module according to claim 7, characterized in that: The upper surface of the ceramic substrate includes a plurality of contacts, and the lower surface of the ceramic substrate includes a plurality of solder pads. The plurality of contacts are electrically connected to the plurality of solder pads, and the ultrasonic component is soldered on the plurality of contacts.

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