Surface-mounted common-mode inductor

By designing multiple welding melting point grooves and interlaced welding bumps in a chip common mode inductor, combining streamlined welding parts and double-wire current winding, the problem of welding bumps is solved, and the strength of the inductor is improved and The cooling capacity extends the service life and ensures stable operation.

CN222233431UActive Publication Date: 2024-12-24GUANGDONG PRECISION DRAGON ELECTRONIC TECH CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202420965571.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-07
Publication Date
2024-12-24
Estimated Expiration
2034-05-07

AI Technical Summary

Technical Problem

Existing chip common mode inductors are prone to fracture or fatigue of welding bumps during long-term vibration or thermal cycles, affecting their stability and reliability.

Method used

Multiple welding point grooves at the four corners of the bottom of the magnetic core group and interlaced welding bumps, streamlined cross-sections of the welding parts, as well as dual-line current windings and heat dissipation components, enhance welding strength and heat dissipation capabilities.

Benefits of technology

It improves the strength and fatigue resistance of the welding parts, extends the product service life, and ensures the stable operation of the inductor under high power state through effective heat dissipation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222233431U_ABST
    Figure CN222233431U_ABST
Patent Text Reader

Abstract

The utility model provides a patch type common mode inductor, which relates to the technical field of inductors, and comprises a magnetic core group, the four corners of the bottom of the magnetic core group are respectively and fixedly connected with a connecting disc I, the bottom of each connecting disc I is provided with a plurality of welding melting point grooves which are distributed at equal intervals, and the bottom of each connecting disc I is fixedly connected with a plurality of welding bulges; the multiple welding protrusions and the multiple welding melting point grooves are arranged in a staggered mode. Each welding protrusion comprises a reinforcing part, a connecting part and a welding part which are sequentially arranged from top to bottom, the cross section of each welding part is in a streamline shape, according to the patch type common-mode inductor, through the arrangement of the multiple welding protrusions and the streamline cross section design of the welding parts, stress concentration in the welding process can be reduced, the strength and fatigue resistance of the welding parts are improved, and the service life of the patch type common-mode inductor is prolonged. And during thermal circulation and mechanical vibration, the service life of the product is prolonged, the strength of a stress concentration area is enhanced through the reinforcing part and the connecting part, and the situation of root breakage caused by long-term vibration is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of inductors, in particular to a patch type common mode inductor. Background Art

[0002] Chip common-mode inductors are an electromagnetic component designed for surface mount technology. They are widely used in power line filtering, electromagnetic interference suppression, radio frequency interference suppression and other fields. Especially with the trend of miniaturization and high-density integration of electronic equipment, their application range is becoming wider and wider.

[0003] The existing chip common mode inductor improves the efficiency of the chip common mode inductor by opening a welding melting point groove and setting a welding protrusion at the bottom of the second connecting plate, the welding protrusion is in a state of double peak protrusion downward, and the second connecting plate is welded to the welding plate of the connecting end.

[0004] In actual fixation, although the design of the welding protrusion is helpful for welding fixation, the downward state of the double-peak protrusion may be prone to fracture or fatigue in long-term vibration or thermal cycling, especially if the welding material or process is improper, which may affect the long-term stability and reliability of the inductor.

[0005] Therefore, it is necessary to provide a new chip common-mode inductor to solve the above technical problems. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a chip common mode inductor.

[0007] The patch common mode inductor provided by the utility model comprises a magnetic core group, wherein the four corners of the bottom of the magnetic core group are respectively fixedly connected with a connection plate one, a plurality of welding melting point grooves are provided at the bottom of the connection plate one, and the plurality of welding melting point grooves are distributed at equal intervals, a plurality of welding protrusions are fixedly connected with the bottom of the connection plate one, and the plurality of welding protrusions and the plurality of welding melting point grooves are staggeredly arranged;

[0008] The welding protrusion comprises a reinforcing portion, a connecting portion and a welding portion which are arranged in sequence from top to bottom, and the cross section of the welding portion is streamlined.

[0009] Furthermore, the magnetic core group includes a first magnetic core and a second magnetic core, and the top of the second magnetic core is fixedly connected to both ends of the bottom of the first magnetic core.

[0010] Furthermore, a double-wire current winding is provided on the second magnetic core, and the double-wire current winding is twisted together to form a coil assembly and radially surrounds the outside of the second magnetic core, and the two end wires of the coil assembly are respectively welded to the bottom wall surfaces on both sides of the second magnetic core.

[0011] Furthermore, heat dissipation components are respectively arranged at the four corners of the bottom of the magnetic core group, and the heat dissipation components include a second connection plate fixedly connected to the bottom of the second magnetic core, and the second connection plate is welded to the two ends of the wire of the coil assembly to form an electrode end.

[0012] Furthermore, both ends of the second connection disk are respectively fixedly connected with heat dissipation plates, both ends of the heat dissipation plates are bent toward the bottom and fixedly connected to the first connection disk, and a heat dissipation groove is formed between the heat dissipation plate and the first connection disk.

[0013] Furthermore, a plurality of guide plates are fixedly connected in the heat dissipation groove formed by the heat dissipation plate and the connecting plate, and a plurality of heat dissipation holes are formed on the guide plates.

[0014] Compared with the related art, the chip common mode inductor provided by the utility model has the following beneficial effects:

[0015] The chip common-mode inductor has multiple welding protrusions and a streamlined cross-section design of the welding part, which helps to reduce stress concentration during the welding process, improve the strength and fatigue resistance of the welding part, and extend the service life of the product when experiencing thermal cycles and mechanical vibrations. The reinforced part and the connecting part enhance the strength of the stress concentration area and reduce root fractures caused by long-term vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the chip common-mode inductor provided by the utility model;

[0017] Figure 2 A schematic diagram of the structure of the chip common-mode inductor provided by the utility model;

[0018] Figure 3 A schematic diagram of the structure of the heat dissipation assembly provided by the utility model;

[0019] Figure 4 A schematic cross-sectional view of the heat dissipation assembly provided by the utility model;

[0020] Figure 5 for Figure 4 An enlarged schematic diagram of A is shown.

[0021] Numbers in the figure: 1. first magnetic core; 2. second magnetic core; 3. two-wire current winding; 4. second connecting plate; 5. heat sink; 6. guide plate; 7. first connecting plate; 8. welding melting point groove; 9. reinforcement part; 10. connecting part; 11. welding part. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] In the specific implementation process, Figures 1 to 5As shown, the chip common mode inductor includes a magnetic core group, and the four corners of the bottom of the magnetic core group are fixedly connected with a connection plate 7, a plurality of welding melting point grooves 8 are provided at the bottom of the connection plate 7, and the plurality of welding melting point grooves 8 are distributed at equal intervals, and a plurality of welding protrusions are fixedly connected to the bottom of the connection plate 7, and the plurality of welding protrusions and the plurality of welding melting point grooves 8 are staggered. The connection plate 7 is fixed at the four corners of the bottom of the magnetic core group, and the staggered arrangement of the equally spaced welding melting point grooves 8 provided thereon and the welding protrusions provides a stable and uniform contact surface for welding, which is beneficial to improving welding quality and mechanical stability;

[0024] The welding protrusion includes a reinforcement portion 9, a connecting portion 10 and a welding portion 11 which are arranged in sequence from top to bottom. The cross-section of the welding portion 11 is streamlined. The streamlined cross-sectional design of the welding portion 11 helps to reduce stress concentration during welding and improve the strength and fatigue resistance of the welding portion 11, especially when undergoing thermal cycles and mechanical vibrations. It can effectively reduce the generation of welding cracks and extend the service life of the product.

[0025] The magnetic core group includes a first magnetic core 1 and a second magnetic core 2, the top of the second magnetic core 2 is fixedly connected to the two ends of the bottom of the first magnetic core 1, and a two-wire current winding 3 is arranged on the second magnetic core 2. The two-wire current winding 3 is twisted together to form a coil assembly and radially surrounds the outside of the second magnetic core 2 on the outside. The two end wires of the coil assembly are respectively welded to the bottom wall surfaces of the two sides of the second magnetic core 2. The magnetic core group consists of a first magnetic core 1 and a second magnetic core 2. The top of the second magnetic core 2 is fixedly connected to the bottom of the first magnetic core 1. Such a design not only ensures the magnetic circuit integrity of the inductor, but also effectively improves the common mode interference suppression capability through the two-wire current winding 3 on the second magnetic core 2. Heat dissipation components are respectively arranged at the four corners of the bottom of the magnetic core group. The heat dissipation component includes a connecting plate 2 4 fixedly connected to the bottom of the second magnetic core 2. The connecting plate 2 4 and the two end wires of the coil assembly are welded to form an electrode end. Through the combination of the connecting plate 2 4 and the heat dissipation plate 5, not only an electrode port is provided, but also an effective heat dissipation channel is formed;

[0026] The two ends of the connecting disk 2 4 are respectively fixedly connected with heat sinks 5, and the two ends of the heat sink 5 are bent toward the bottom and fixedly connected to the connecting disk 1 7, and a heat dissipation groove is formed between the heat sink 5 and the connecting disk 1 7. A plurality of guide plates 6 are fixedly connected in the heat dissipation groove formed by the heat sink 5 and the connecting disk 1 7, and a plurality of heat dissipation holes are opened on the guide plate 6. The bending design of the heat sink 5 and the heat dissipation groove between the connecting disks 1 7, plus the guide plate 6 and the heat dissipation holes fixed in the groove, constitute a three-dimensional heat dissipation system, which can effectively increase the heat dissipation area, accelerate the conduction and convection of heat, and ensure the stable operation of the inductor under high-power working conditions.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip common mode inductor, comprising a magnetic core group, characterized in that: The four corners of the bottom of the magnetic core group are respectively fixedly connected to a connection plate (7), a plurality of welding melting point grooves (8) are provided at the bottom of the connection plate (7), and the plurality of welding melting point grooves (8) are distributed at equal intervals. A plurality of welding protrusions are fixedly connected to the bottom of the connection plate (7), and the plurality of welding protrusions and the plurality of welding melting point grooves (8) are arranged in a staggered manner; The welding protrusion comprises a reinforcing portion (9), a connecting portion (10) and a welding portion (11) which are arranged in sequence from top to bottom, and the cross section of the welding portion (11) is streamlined.

2. The chip common mode inductor according to claim 1, characterized in that: The magnetic core group comprises a first magnetic core (1) and a second magnetic core (2), wherein the top of the second magnetic core (2) is fixedly connected to both ends of the bottom of the first magnetic core (1).

3. The chip common mode inductor according to claim 2, characterized in that: The second magnetic core (2) is provided with a two-wire current winding (3), the two-wire current winding (3) being twisted together to form a coil assembly and radially surrounding the outside of the second magnetic core (2), the two end wires of the coil assembly being respectively welded to the bottom wall surfaces on both sides of the second magnetic core (2).

4. The chip common mode inductor according to claim 3, characterized in that: The four corners at the bottom of the magnetic core group are respectively provided with heat dissipation components, and the heat dissipation components include a second connection plate (4) fixedly connected to the bottom of the second magnetic core (2), and the second connection plate (4) is welded to the two ends of the coil assembly to form an electrode terminal.

5. The chip common mode inductor according to claim 4, characterized in that: The two ends of the second connection plate (4) are respectively fixedly connected with a heat dissipation plate (5), the two ends of the heat dissipation plate (5) are bent toward the bottom and fixedly connected to the first connection plate (7), and a heat dissipation groove is formed between the heat dissipation plate (5) and the first connection plate (7).

6. The chip common mode inductor according to claim 5, characterized in that: A plurality of guide plates (6) are fixedly connected in the heat dissipation groove formed by the heat dissipation plate (5) and the connecting plate 1 (7), and a plurality of heat dissipation holes are provided on the guide plates (6).

Citation Information

Cited By

  • Vehicle-mounted chassis circuit patch common mode inductor

    CN119993706A