Anti-static sheet dismounting adsorption device

Abstract

The utility model relates to the technical field of wafer dismounting adsorption equipment, in particular to an anti-static wafer dismounting adsorption device, which comprises a base, a plurality of groups of hole grooves matched with wafers are formed in the surface of the top end of the base, and a plurality of groups of vertical holes communicated with the hole grooves are formed in the inner side of the base; when the wafer on the inner side of the hole groove needs to be detached, the vacuum pump stops operating, the air pressure in the cavity on the inner side of the base is kept stable, then the electromagnetic pressure release valve on the outer side of the pipe seat on the periphery of the base operates, the pressure on the inner side of the base is released, and the piston in the vertical hole on the inner side of the base is released when the piston sucks tightly without negative pressure. The spring between the two groups of ring bodies between the ring seat and the piston can release the tightened elastic force, and the position of the ring seat is fixed, so that the spring can reversely push the ring bodies and drive the piston to move, the piston ascends and drives the ejector head to move, and the ejector head can eject the wafer in the hole groove in the surface of the base, so that the wafer can be conveniently disassembled.

Description

Technical Field

[0001] The utility model relates to the technical field of chip disassembly and adsorption equipment, and in particular to an anti-static chip disassembly and adsorption device. Background Art

[0002] The production line arrangement station shifts the coating jig cover plate, resulting in poor coating. When the coating jig is opened by the dispensing station, the wafer is adsorbed on the upper cover and needs to be manually sucked out and then put back into the coating jig, which increases labor costs and easily leads to quality risks for the wafers. Patent No. CN202221833030.7 discloses an anti-static wafer removal adsorption device. When the wafer placed inside the wafer matching hole groove needs to be removed, the vacuum pump is controlled to supply air. At this time, the air pressure inside the vacuum chamber increases, and the inner cavity of the piston is The piston head moves upward, and the push rod on the top of the piston head pushes out the wafer placed inside the hole groove, which is convenient and effective for wafer unloading; however, when ejecting the wafer in the hole groove, it is necessary to use a vacuum pump to increase the air pressure inside the fixture base, so that the piston head moves and drives the push rod to eject and remove the wafer inside the hole groove. This requires the use of a vacuum pump when adsorbing and fixing the wafer and ejecting and removing it, resulting in the need for the vacuum pump to operate continuously, which consumes more resources and easily reduces the service life of the vacuum pump. To this end, we propose an anti-static wafer removal adsorption device. Utility Model Content

[0003] In view of the problems in the prior art, the utility model provides an anti-static film removal adsorption device.

[0004] The technical solution adopted by the utility model to solve the technical problem is an anti-static chip removal adsorption device, comprising a base, the top surface of the base is provided with a hole groove for matching the chip, and the hole groove has multiple groups, the inner side of the base is provided with a vertical hole connected with the hole groove, and the vertical hole has multiple groups, the inner side of the vertical hole is provided with a piston for adjustment slidably installed, and the top surface of the piston is equipped with a head located on the inner side of the hole groove, the inner side of the vertical hole is screwed with a ring seat for limiting, and the bottom surface of the piston is integrally constructed with a vertical rod plugged and connected with the ring seat;

[0005] The ring seat and the piston are both equipped with a ring body for support on the opposite side, and a spring is installed between the two groups of ring bodies. The outer peripheral surface of the base is equipped with a pipe seat, and the outer peripheral surface of the pipe seat is equipped with an electromagnetic pressure relief valve.

[0006] By adopting the above technical solution, when it is necessary to adsorb and fix the wafer, the vacuum pump can be used to extract the air pressure inside the base, and the pistons in the multiple groups of vertical holes inside the base are caused to drop as the air pressure decreases. At the same time, the space on the top side of the piston forms a negative pressure and adsorbs the wafer in the hole groove through the gap between the vertical hole and the top head, so that the wafer is adsorbed and fixed, and the situation that the wafer is driven to move when the coating fixture cover plate is displaced is reduced. The displacement of the piston facilitates the mutual insertion and movement between the vertical rod and the ring seat screwed and installed inside the vertical hole, so that the piston can be lifted and lowered more stably inside the vertical hole, which is convenient for reducing the situation that the piston is offset.

[0007] When it is necessary to remove the wafer inside the hole groove, the vacuum pump stops working and the air pressure in the cavity inside the base remains stable, and then the electromagnetic pressure relief valve outside the tube seat outside the base is operated to release the pressure inside the base. At this time, when the piston in the vertical hole inside the base is not tightened by negative pressure, the spring between the two sets of ring bodies between the ring seat and the piston can release the tightened elastic force, and the position of the ring seat is fixed, so that the spring can push the ring body back and drive the piston to move, so that the piston rises and drives the head to move, so that the head can push out the wafer in the hole groove on the surface of the base, making it easy to remove it.

[0008] Specifically, a rubber ring is bonded to the top surface of the ring seat.

[0009] By adopting the above technical solution, the rubber ring can reduce the damage caused by scratches when the ring seat and the vertical hole are in contact.

[0010] Specifically, the outer peripheral surface of the ring seat is provided with concave holes for rotation, and there are multiple groups of concave holes.

[0011] By adopting the above technical solution, the concave hole makes it more convenient to disassemble and assemble the ring seat.

[0012] Specifically, a ceramic ring plug-connected with the vertical rod is bonded to the inner circumferential surface of the ring seat.

[0013] By adopting the above technical solution, the ceramic ring and the vertical rod are inserted and slidably connected with each other, and the ceramic ring has strong lubricity, which is convenient for improving the smoothness of the sliding between the vertical rod and the ceramic ring.

[0014] Specifically, an end of the tube seat away from the base is equipped with an air pipe for connection.

[0015] By adopting the above technical solution, the air pipe is conveniently connected to the vacuum pump, so that the vacuum pump can provide negative pressure.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The technical solution of the present application, through the design of the hole groove, vertical hole, ring seat, piston, vertical rod and top head, can use a vacuum pump to extract the air pressure inside the base when it is necessary to adsorb and fix the wafer, and make the pistons in the multiple groups of vertical holes on the inner side of the base drop as the air pressure decreases. At the same time, the space on the top side of the piston forms a negative pressure and adsorbs the wafer in the hole groove through the gap between the vertical hole and the top head, so that the wafer is adsorbed and fixed, and the situation that the wafer is moved when the coating fixture cover plate is displaced is reduced. The displacement of the piston facilitates the mutual insertion and movement between the vertical rod and the ring seat screwed on the inner side of the vertical hole, so that the piston can be more stably lifted and lowered inside the vertical hole, which is convenient to reduce the situation of piston deviation.

[0018] 2. The technical solution of the present application is designed with a ring body, a spring, a tube seat and an electromagnetic pressure relief valve. When it is necessary to remove the chip inside the hole groove, the vacuum pump stops operating and the air pressure in the cavity inside the base remains stable. Then the electromagnetic pressure relief valve outside the tube seat on the outer periphery of the base is operated to release the pressure inside the base. At this time, when the piston in the vertical hole inside the base is not tightened by negative pressure, the spring between the two groups of ring bodies between the ring seat and the piston can release the tightened elastic force, and the position of the ring seat is fixed, so that the spring can push the ring body back and drive the piston to move, so that the piston rises and drives the head to move, so that the head can push out the chip in the hole groove on the surface of the base, making it easy to remove it. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 It is an axonometric drawing of the utility model;

[0021] Figure 2 It is a schematic diagram of the cross-section of the inner structure of the vertical hole of the utility model;

[0022] Figure 3 This is an exploded view of the connection structure between the ring seat and the piston of the utility model;

[0023] In the figure: 1, base; 2, hole groove; 3, vertical hole; 4, top head; 5, piston; 6, ring seat; 7, vertical rod; 8, ring body; 9, spring; 10, ceramic ring; 11, rubber ring; 12, concave hole; 13, pipe seat; 14, air pipe; 15, electromagnetic pressure relief valve. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] See also Figure 1-3The embodiment of the utility model provides a technical solution: an anti-static chip removal adsorption device, including a base 1, a hole groove 2 for matching the chip is opened on the top surface of the base 1, and the hole groove 2 has multiple groups, a vertical hole 3 connected to the hole groove 2 is opened on the inner side of the base 1, and the vertical hole 3 has multiple groups, a piston 5 for adjustment is slidably installed on the inner side of the vertical hole 3, and a top head 4 located on the inner side of the hole groove 2 is installed on the top surface of the piston 5, a ring seat 6 for limiting is screwed on the inner side of the vertical hole 3, and a vertical rod 7 connected to the ring seat 6 is integrally constructed on the bottom surface of the piston 5; the ring seat 6 and the piston 5 are both equipped with a ring body 8 for support on the opposite side, and a spring 9 is installed between the two groups of ring bodies 8, the outer peripheral surface of the base 1 is equipped with a tube seat 13, and the outer peripheral surface of the tube seat 13 is equipped with an electromagnetic pressure relief valve 15.

[0026] When in use, when it is necessary to adsorb and fix the wafer, the vacuum pump can be used to extract the air pressure inside the base 1, and the pistons 5 in the multiple groups of vertical holes 3 inside the base 1 are made to drop as the air pressure decreases. At the same time, the space on the top side of the piston 5 forms a negative pressure and adsorbs the wafer in the hole groove 2 through the gap between the vertical hole 3 and the top head 4, so that the wafer is adsorbed and fixed, and the situation that the wafer is driven to move when the coating fixture cover plate is displaced is reduced. The displacement of the piston 5 facilitates the mutual insertion and movement between the vertical rod 7 and the ring seat 6 screwed and installed inside the vertical hole 3, so that the piston 5 can be more stably lifted and lowered inside the vertical hole 3, which is convenient for reducing the situation that the piston 5 is offset;

[0027] When it is necessary to remove the chip inside the hole groove 2, the vacuum pump stops working and the air pressure in the inner cavity of the base 1 remains stable, and then the electromagnetic pressure relief valve 15 outside the outer peripheral tube seat 13 of the base 1 is operated to release the pressure inside the base 1. At this time, when the piston 5 in the vertical hole 3 inside the base 1 is tightened without negative pressure, the spring 9 between the two groups of ring bodies 8 between the ring seat 6 and the piston 5 can release the tightened elastic force, and the position of the ring seat 6 is fixed, so that the spring 9 can push the ring body 8 back and drive the piston 5 to move, so that the piston 5 rises and drives the head 4 to move, so that the head 4 can push out the chip in the hole groove 2 on the surface of the base 1, so as to facilitate its removal.

[0028] like Figure 2 As shown, a rubber ring 11 is bonded to the top surface of the ring seat 6 .

[0029] When in use, the rubber ring 11 is convenient for reducing damage caused by scratches when the ring seat 6 and the vertical hole 3 are in contact.

[0030] like Figure 2 and Figure 3 As shown, the outer circumferential surface of the ring seat 6 is provided with concave holes 12 for rotation, and there are multiple groups of concave holes 12.

[0031] When in use, the concave hole 12 makes it easier to assemble and disassemble the ring seat 6 .

[0032] like Figure 2 and Figure 3 As shown, a ceramic ring 10 which is plug-connected with the vertical rod 7 is bonded to the inner circumferential surface of the ring seat 6 .

[0033] When in use, the ceramic ring 10 and the vertical rod 7 are plugged into and slidably connected with each other, and the ceramic ring 10 has strong lubricity, which facilitates improving the smoothness of the sliding between the vertical rod 7 and the ceramic ring 10 .

[0034] like Figure 1 As shown, one end of the tube seat 13 away from the base 1 is equipped with an air pipe 14 for connection.

[0035] When in use, the air pipe 14 is conveniently connected to the vacuum pump so that the vacuum pump can provide negative pressure.

[0036] The working principle and use process of the utility model are as follows: when in use, first install the corresponding structural components in the appropriate position. When it is necessary to adsorb and fix the wafer, the vacuum pump can be used to extract the air pressure inside the base 1, and the pistons 5 in the multiple groups of vertical holes 3 inside the base 1 are made to drop as the air pressure decreases. At the same time, the space on the top side of the piston 5 forms a negative pressure and adsorbs the wafer in the hole groove 2 through the gap between the vertical hole 3 and the top head 4, so that the wafer is adsorbed and fixed, reducing the situation where the wafer is driven to move when the coating fixture cover plate is displaced, and the displacement of the piston 5 facilitates the mutual insertion and movement between the vertical rod 7 and the ring seat 6 screwed and installed inside the vertical hole 3, so that the piston 5 can be more stably lifted and lowered inside the vertical hole 3, which is convenient for To reduce the offset of the piston 5, when it is necessary to remove the chip inside the hole groove 2, the vacuum pump stops working and the air pressure in the cavity inside the base 1 remains stable, and then the electromagnetic pressure relief valve 15 outside the outer peripheral tube seat 13 of the base 1 is operated to release the pressure inside the base 1. At this time, when the piston 5 in the vertical hole 3 inside the base 1 is tightened without negative pressure, the spring 9 between the two groups of ring bodies 8 between the ring seat 6 and the piston 5 can release the tightened elastic force, and the position of the ring seat 6 is fixed, so that the spring 9 can push the ring body 8 back and drive the piston 5 to move, so that the piston 5 rises and drives the head 4 to move, so that the head 4 can push out the chip in the hole groove 2 on the surface of the base 1, which is convenient for its removal.

[0037] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. An anti-static film removal adsorption device, characterized in that: The invention comprises a base (1), wherein the top surface of the base (1) is provided with a hole groove (2) for matching with a wafer, and the hole groove (2) is provided in a plurality of groups, the inner side of the base (1) is provided with a vertical hole (3) connected with the hole groove (2), and the vertical hole (3) is provided in a plurality of groups, a piston (5) for adjustment is slidably mounted in the inner side of the vertical hole (3), and a top surface of the piston (5) is provided with a head (4) located in the inner side of the hole groove (2), a ring seat (6) for limiting is screwedly mounted in the inner side of the vertical hole (3), and a vertical rod (7) plug-connected with the ring seat (6) is integrally constructed on the bottom surface of the piston (5); The ring seat (6) and the piston (5) are both equipped with a ring body (8) for support on the opposite side, and a spring (9) is installed between the two groups of ring bodies (8). The outer peripheral surface of the base (1) is equipped with a pipe seat (13), and the outer peripheral surface of the pipe seat (13) is equipped with an electromagnetic pressure relief valve (15).

2. The anti-static film removal adsorption device according to claim 1, characterized in that: A rubber ring (11) is bonded to the top surface of the ring seat (6).

3. The anti-static film removal adsorption device according to claim 1, characterized in that: The outer peripheral surface of the ring seat (6) is provided with concave holes (12) for rotation, and there are multiple groups of concave holes (12).

4. The anti-static film removal adsorption device according to claim 1, characterized in that: A ceramic ring (10) which is plug-connected with the vertical rod (7) is bonded to the inner peripheral surface of the ring seat (6).

5. The anti-static film removal adsorption device according to claim 1, characterized in that: An end of the tube seat (13) away from the base (1) is equipped with an air pipe (14) for connection.

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