Multi-size wafer suction cup

Abstract

The utility model provides a multi-size wafer sucker, which comprises a sucker body, and the front surface of the sucker body is provided with a first adsorption area, a first adsorption hole, a first adsorption channel, at least one second adsorption area, at least one group of second adsorption holes and at least one group of second adsorption channels. One end of the first adsorption channel is communicated with the first adsorption hole, and the other end of the first adsorption channel is communicated with the first adsorption area; each second adsorption area is annular and is arranged around the first adsorption area, one end of each group of second adsorption channels is communicated with a corresponding group of second adsorption holes, and the other end of each group of second adsorption channels is communicated with a corresponding second adsorption area. According to the utility model, wafers with different sizes can be absorbed and fixed, energy waste during processing of small-size wafers is avoided, and edge warping during processing of large-size wafers is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer suction cups, in particular to a multi-size wafer suction cup. Background Art

[0002] In the process of semiconductor wafer processing, the back of the wafer needs to be fixed on the semiconductor processing equipment. Back suction is a common way to fix the wafer. For wafers of different sizes, it is often necessary to match the corresponding size of the suction cup for fixing. When the semiconductor processing equipment needs to be compatible with two or more wafers of different sizes, due to the difference in the size of the wafer, the area where the wafer contacts the suction cup is also different when the back of the wafer is adsorbed and fixed. If the back-adsorbed integrated suction cup is designed according to the maximum wafer size that the equipment can accommodate, when a small-sized wafer is placed for fixing, the negative pressure pipeline and suction nozzle of the outer ring space of the suction cup will work without load, which will inevitably cause energy waste. If the back-adsorbed integrated suction cup is designed according to the smaller wafer size that the equipment can accommodate, when a large-sized wafer is placed for fixing, the outer ring of the large-sized wafer cannot be adsorbed, and the edge warping may occur, affecting the wafer processing process; even in the wafer detection process, the edge warping of the wafer will cause the detection work to fail to operate normally. Utility Model Content

[0003] The technical problem to be solved by the utility model is: how to adsorb and fix wafers of different sizes to avoid energy waste and edge warping of large-sized wafers.

[0004] The technical solution of the utility model to solve the above technical problems is as follows:

[0005] The utility model provides a multi-size wafer suction cup, comprising a suction cup body, wherein the front side of the suction cup body is provided with a first suction area, a first suction hole, a first suction channel, at least one second suction area, at least one group of second suction holes and at least one group of second suction channels; the first suction area is located in the middle of the suction cup body, one end of the first suction channel is connected to the first suction hole, and the other end is connected to the first suction area; each of the second suction areas is annular and arranged around the first suction area, one end of each group of second suction channels is connected to a corresponding group of second suction holes, and the other end is connected to a corresponding second suction area.

[0006] The beneficial effects of the utility model are:

[0007] By adopting the utility model, through the first adsorption area and the second adsorption area arranged independently of each other, it is possible to adsorb and fix wafers of different sizes, thereby avoiding energy waste during the processing of small-sized wafers and avoiding edge warping during the processing of large-sized wafers; specifically, when adsorbing the smallest-sized wafer, only the first adsorption area works, thereby avoiding energy waste of the outer ring of the suction cup body; when adsorbing larger-sized wafers, the negative pressure of the first adsorption area adsorbs and fixes the middle of the wafer, and the negative pressure of the second adsorption area adsorbs and fixes the outer ring of the wafer, thereby achieving reliable adsorption and fixation of the wafer, avoiding edge warping, and facilitating subsequent processing and detection.

[0008] On the basis of the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, a plurality of first adsorption grooves are provided in the first adsorption region, and the first adsorption grooves are all connected to the first adsorption channel; a plurality of second adsorption grooves are provided in the second adsorption region, and the second adsorption grooves are all connected to the second adsorption channel.

[0010] Through multiple first adsorption grooves, the negative pressure of the first adsorption hole is spread over the first adsorption area; through multiple second adsorption grooves, the negative pressure of the second adsorption hole is spread over the second adsorption area; it is ensured that the adsorption force of each adsorption area is uniform when working, and the wafer has good stability after adsorption.

[0011] Furthermore, the first adsorption grooves are distributed in concentric rings around the first adsorption hole; and the second adsorption grooves are distributed in concentric rings around the second adsorption hole.

[0012] When the wafer does not cover part of the adsorption groove, the exposed part of the adsorption channel is far away from the adsorption hole, so the negative pressure value of the exposed part of the adsorption channel is less than the negative pressure value of the end of the outermost adsorption groove covered by the wafer. After the wafer is placed, there is no leakage in each first adsorption groove and second adsorption groove covered by the wafer, and the adsorption reliability is good. In addition, the adsorption force of each part of each first adsorption groove is uniform, the adsorption force of each second adsorption groove is uniform, and the stress of each part of the wafer is uniform, which avoids deformation and warping, and is easy to process.

[0013] Furthermore, the first adsorption hole is located in the middle of the first adsorption region, and the first adsorption channel extends to the edge of the first adsorption region.

[0014] It is convenient to transfer the negative pressure to each first adsorption groove on the concentric ring in sequence, reduce the path of the negative pressure to the edge of the first adsorption area, reduce the pressure loss, make the negative pressure in the first adsorption area uniform, and facilitate reliable adsorption and fixing of the wafer.

[0015] Furthermore, a plurality of the first adsorption channels are provided, and the plurality of first adsorption channels are distributed around the first adsorption hole.

[0016] It is convenient to transfer negative pressure to the first adsorption area from all directions, so that the negative pressure in the first adsorption area is uniform, ensuring that all parts have greater adsorption force.

[0017] Furthermore, the first adsorption channel extends radially along the first adsorption groove, and the first adsorption grooves are distributed in concentric circles.

[0018] The first adsorption area is circular, which is convenient for adsorbing and fixing the wafer; at the same time, the path for the negative pressure to be transmitted to the edge of the first adsorption area is reduced, and the pressure loss is small.

[0019] Furthermore, each group of second adsorption holes is provided with multiple ones and arranged around the first adsorption holes, the number of second adsorption channels in each group is the same as the number of the corresponding group of second adsorption holes, one end of each second adsorption channel is connected to a corresponding second adsorption hole, and the other end extends to the edge of the second adsorption area.

[0020] By having multiple second adsorption holes working simultaneously, the paths for transmitting the negative pressure to various circumferential parts of the second adsorption area are close, so that the adsorption force of the second adsorption area is uniform and the adsorption reliability of the wafer is good; at the same time, the second adsorption channel transmits the negative pressure to each second adsorption groove on the concentric ring in turn, reducing the negative pressure transmission path and reducing the pressure loss.

[0021] Furthermore, the second adsorption channel extends radially along the second adsorption groove; and the second adsorption grooves are distributed in concentric circles.

[0022] The second adsorption area is circular, which is convenient for adsorbing and fixing the wafer; at the same time, the path for the negative pressure to be transmitted to the edge of the second adsorption area is reduced, and the pressure loss is small.

[0023] Furthermore, an annular spacing area is provided between the first adsorption area and the second adsorption area, and a plurality of suction cup fixing holes are distributed in an annular manner on the spacing area.

[0024] The suction cup body can be fixed on the semiconductor processing equipment by passing the screw through the suction cup fixing hole, which is convenient for installation.

[0025] Furthermore, a chip transfer groove is provided on the front side of the suction cup body, one end of the chip transfer groove extends into the first adsorption area, and the other end extends to the edge of the suction cup body; two chip transfer grooves are provided and are parallel to each other, and the two chip transfer grooves are located on both sides of the first adsorption hole.

[0026] It is convenient to slide the wafer along the direction of the wafer transfer slot for adsorption or removal, and the wafer clamp can be extended into the wafer transfer slot for operation, which is easy to operate; through the two wafer transfer slots, the adsorption force on the wafer is symmetrical, and the two symmetrical positions of the chip can be clamped at the same time for picking and placing, with a small clamping force to avoid wafer damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a front structural schematic diagram of the utility model.

[0028] Figure 2 It is a schematic diagram of the three-dimensional structure.

[0029] In the accompanying drawings, the technical features represented by the reference numerals are as follows:

[0030] 1-suction cup body; 2-first adsorption area; 3-second adsorption area; 4-first adsorption hole; 5-first adsorption channel; 6-second adsorption hole; 7-second adsorption channel; 8-first adsorption groove; 9-second adsorption groove; 10-spacer area; 11-suction cup fixing hole; 12-wafer transfer groove. DETAILED DESCRIPTION

[0031] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0032] This utility model refers to Figure 1-2 .

[0033] The utility model provides a multi-size wafer suction cup, comprising a suction cup body 1, wherein the front side of the suction cup body 1 is provided with a first suction area 2, a first suction hole 4, a first suction channel 5, at least one second suction area 3, at least one group of second suction holes 6 and at least one group of second suction channels 7; the first suction area 2 is located in the middle of the suction cup body 1, one end of the first suction channel 5 is connected to the first suction hole 4, and the other end is connected to the first suction area 2; each of the second suction areas 3 is annular and arranged around the first suction area 2, one end of each group of second suction channels 7 is connected to a corresponding group of second suction holes 6, and the other end is connected to a corresponding second suction area 3.

[0034] principle:

[0035] Explanation of “corresponding”: The number of second adsorption regions 3, the number of groups of second adsorption holes 6, and the number of groups of second adsorption channels 7 are the same, and each corresponding second adsorption region 3 is provided with a group of second adsorption holes 6 and a group of second adsorption channels 7. A group of second adsorption holes 6 can be one or more. A group of second adsorption channels 7 has multiple ones, and one end of each second adsorption channel 7 only needs to be connected to one of the corresponding second adsorption holes 6, and the other end needs to be connected to a corresponding second adsorption region 3.

[0036] In the installed state, the suction cup body 1 is fixed on the wafer processing equipment, and a first negative pressure pipeline is used to connect the first adsorption holes 4 from the back side of the suction cup body 1, and a group of second negative pressure pipelines are used to connect a corresponding group of second adsorption holes 6.

[0037] In the working state, the front of the suction cup body 1 is used to adsorb and fix the wafer, and the wafer is placed in the middle of the suction cup body 1. When the first negative pressure pipeline is turned on, the negative pressure of the first adsorption hole 4 is transmitted to the first adsorption area 2 through the first adsorption channel 5. When the second negative pressure pipeline is turned on, the negative pressure of the second adsorption hole 6 is transmitted to a corresponding second adsorption area 3 through a corresponding group of second adsorption channels 7. When adsorbing the smallest size wafer, only the first negative pressure pipeline is turned on, so that the first adsorption area 2 generates negative pressure to adsorb and fix the wafer; the second adsorption area 3 and the second adsorption hole 6 do not work, avoiding energy waste on the outer ring of the suction cup body 1. When adsorbing a larger size wafer, the first adsorption area 2 and the second adsorption area 3 that the wafer can cover work, and the corresponding first negative pressure pipeline and the corresponding second negative pressure pipeline are turned on. The negative pressure of the first adsorption area 2 adsorbs and fixes the middle of the wafer, and the negative pressure of the second adsorption area 3 adsorbs and fixes the outer ring of the wafer to avoid edge warping.

[0038] Preferably, when used to adsorb and fix a wafer, the suction cup body 1, the first adsorption area 2, and the second adsorption area 3 are all circular; when used to adsorb and fix wafers of other shapes, the suction cup body 1, the first adsorption area 2, and the second adsorption area 3 are all the same shape as the wafer.

[0039] In summary, the utility model can be used to adsorb and fix wafers of different sizes by independently arranging the first adsorption area 2 and the second adsorption area 3, thereby avoiding energy waste during processing of small-sized wafers and edge warping during processing of large-sized wafers; specifically, when adsorbing the smallest-sized wafer, only the first adsorption area 2 works, thereby avoiding energy waste of the outer ring of the suction cup body 1; when adsorbing larger-sized wafers, the negative pressure of the first adsorption area 2 adsorbs and fixes the middle part of the wafer, and the negative pressure of the second adsorption area 3 adsorbs and fixes the outer ring of the wafer, thereby achieving reliable adsorption and fixation of the wafer, avoiding edge warping, and facilitating subsequent processing and detection.

[0040] Furthermore, a plurality of first adsorption grooves 8 are provided in the first adsorption region 2 , and the first adsorption grooves 8 are all connected to the first adsorption channel 5 ; a plurality of second adsorption grooves 9 are provided in the second adsorption region 3 , and the second adsorption grooves 9 are all connected to the second adsorption channel 7 .

[0041] Through multiple first adsorption grooves 8, the negative pressure of the first adsorption hole 4 is spread over the first adsorption area 2; through multiple second adsorption grooves 9, the negative pressure of the second adsorption hole 6 is spread over the second adsorption area 3; it is ensured that the adsorption force of each adsorption area is uniform when working, and the wafer has good stability after adsorption.

[0042] Furthermore, the first adsorption grooves 8 are distributed in concentric rings around the first adsorption hole 4 ; and the second adsorption grooves 9 are distributed in concentric rings around the second adsorption hole 6 .

[0043] Note: The second adsorption hole 6 can be arranged in the first adsorption area 2, and the second adsorption channel 7 passes through the first adsorption area 2; in this case, the first adsorption groove 8 avoids the second adsorption channel 7, that is, the first adsorption groove 8 is disconnected on the path where the second adsorption channel 7 passes, so that the first adsorption groove 8 is isolated from the second adsorption channel 7. The first and second adsorption grooves 9 can also be distributed in a spiral shape, but in this case, if the wafer fails to completely cover the adsorption groove, the outside gas can enter the exposed part of the adsorption groove, resulting in a greatly weakened adsorption force.

[0044] When the wafer does not cover part of the adsorption groove, the exposed part of the adsorption channel is far away from the adsorption hole, so the negative pressure value of the exposed part of the adsorption channel is less than the negative pressure value of the end of the outermost adsorption groove covered by the wafer. After the wafer is placed, there is no leakage in each of the first adsorption grooves 8 and the second adsorption grooves 9 covered by the wafer, and the adsorption reliability is good. In addition, the adsorption force of each part of each first adsorption groove 8 is uniform, the adsorption force of each second adsorption groove 9 is uniform, and the stress of each part of the wafer is uniform, which avoids deformation and warping, and is easy to process.

[0045] Furthermore, the first adsorption hole 4 is located in the middle of the first adsorption region 2 , and the first adsorption channel 5 extends to the edge of the first adsorption region 2 .

[0046] It is convenient to transfer the negative pressure to each first adsorption groove 8 on the concentric ring in sequence, reduce the path of the negative pressure to the edge of the first adsorption area 2, reduce the pressure loss, make the negative pressure of the first adsorption area 2 uniform, and facilitate reliable adsorption and fixing of the wafer.

[0047] Furthermore, a plurality of first adsorption channels 5 are provided, and the plurality of first adsorption channels 5 are distributed around the first adsorption hole 4 .

[0048] It is convenient to transmit negative pressure to the first adsorption area 2 from all directions, so that the negative pressure of the first adsorption area 2 is uniform, ensuring that each part has a greater adsorption force.

[0049] Furthermore, the first adsorption channels 5 extend radially along the first adsorption grooves 8 , and the first adsorption grooves 8 are distributed in concentric circles.

[0050] Preferably, the suction cup body 1 is circular.

[0051] The first adsorption area 2 is circular, which is convenient for adsorbing and fixing the wafer; at the same time, the path for the negative pressure to be transmitted to the edge of the first adsorption area 2 is reduced, and the pressure loss is small.

[0052] Furthermore, each group of second adsorption holes 6 is provided with multiple ones and arranged around the first adsorption hole 4, the number of second adsorption channels 7 in each group is the same as the number of the corresponding group of second adsorption holes 6, one end of each second adsorption channel 7 is connected to the corresponding second adsorption hole 6, and the other end extends to the edge of the second adsorption area 3.

[0053] Note: Attached Figure 1-2 This is a case where there is one second adsorption area 3, one group of second adsorption holes 6, and one group of second adsorption channels 7. Similarly, several second adsorption areas 3 can be arranged on the outer ring of the suction cup body 1, and several groups of second adsorption holes 6 and several groups of second adsorption channels 7 can be arranged accordingly.

[0054] By having multiple second adsorption holes 6 working simultaneously, the paths for transmitting the negative pressure to various circumferential parts of the second adsorption area 3 are close, so that the adsorption force of the second adsorption area 3 is uniform and the adsorption reliability of the wafer is good; at the same time, the second adsorption channel 7 transmits the negative pressure to each second adsorption groove 9 on the concentric ring in turn, which reduces the negative pressure transmission path and reduces the pressure loss.

[0055] Furthermore, the second adsorption channel 7 extends along the radial direction of the second adsorption slots 9; and the second adsorption slots 9 are distributed in concentric circles.

[0056] Preferably, the suction cup body 1 is circular.

[0057] The second adsorption area 3 is circular, which is convenient for adsorbing and fixing the wafer; at the same time, the path for the negative pressure to be transmitted to the edge of the second adsorption area 3 is reduced, and the pressure loss is small.

[0058] Furthermore, an annular spacing area 10 is provided between the first adsorption area 2 and the second adsorption area 3 , and a plurality of suction cup fixing holes 11 are distributed in an annular manner on the spacing area 10 .

[0059] The suction cup body 1 can be fixed on the semiconductor processing equipment by screws passing through the suction cup fixing hole 11, which is convenient for installation.

[0060] Furthermore, a chip transfer groove 12 is also provided on the front side of the suction cup body 1, one end of the chip transfer groove 12 extends into the first adsorption area 2, and the other end extends to the edge of the suction cup body 1; the chip transfer grooves 12 are provided with two and are parallel to each other, and the two chip transfer grooves 12 are located on both sides of the first adsorption hole 4.

[0061] Note: The first adsorption groove 8 of the first adsorption area 2 is disconnected at the position where the wafer transfer groove 12 passes, so that the first adsorption area 2 is not connected to the wafer transfer groove 12. Similarly, the second adsorption groove 9 of the second adsorption area 3 is disconnected at the position where the wafer transfer groove 12 passes, so that the second adsorption area 3 is not connected to the wafer transfer groove 12.

[0062] It is convenient to slide the wafer along the direction of the wafer transfer slot 12 for adsorption or removal, and the wafer clamp can be extended into the wafer transfer slot 12 for operation, which is easy to operate; through the two wafer transfer slots 12, the adsorption force on the wafer is symmetrical, and two symmetrical positions of the chip can be clamped at the same time for picking and placing, and the clamping force is small, thereby avoiding damage to the wafer.

[0063] In the description of the present invention, it should be understood that if there are descriptive terms indicating orientation, direction or positional relationship, such as: "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the referred part, element or whole must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0064] In addition, if there are order description terms, such as "first", "second", etc., their purpose in this specification is to facilitate understanding or simplify description. For example, in order to distinguish multiple technical features of the same type or function, but they have to be mentioned separately, this specification may use prefix or suffix order description terms to distinguish them. Therefore, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] In the present utility model, if the terms describing the relative functional relationship of the structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be a fixed connection, a detachable connection, or an integrated one; can be a mechanical connection or an electrical connection; can be a direct connection or an indirect connection through an intermediate medium, can be the internal connection of two elements or the interaction relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present utility model can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0066] In the present invention, if there are descriptive terms with subsidiary or connecting meanings, for example, the first feature is "on" or "below" the second feature, unless otherwise clearly specified and limited, it should not be interpreted in a restrictive manner. For example, "on" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0067] Furthermore, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of the different embodiments and examples described in this specification without contradiction, and these combinations or combinations shall all fall within the scope summarized by the utility model.

[0069] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and cannot be construed as limitations on the present invention. A person skilled in the art can change, modify, replace and modify the above embodiments within the scope of information available from public channels and in combination with the technical inspiration provided by the present application documents.

Claims

1. A multi-size wafer chuck, characterized in that: The invention comprises a suction cup body (1), wherein the front side of the suction cup body (1) is provided with a first suction area (2), a first suction hole (4), a first suction channel (5), at least one second suction area (3), at least one group of second suction holes (6) and at least one group of second suction channels (7); the first suction area (2) is located in the middle of the suction cup body (1); one end of the first suction channel (5) is connected to the first suction hole (4), and the other end is connected to the first suction area (2); each of the second suction areas (3) is annular and arranged around the first suction area (2); one end of each group of second suction channels (7) is connected to a corresponding group of second suction holes (6), and the other end is connected to a corresponding second suction area (3).

2. The multi-size wafer chuck according to claim 1, characterized in that: A plurality of first adsorption grooves (8) are provided in the first adsorption area (2), and the first adsorption grooves (8) are all connected to the first adsorption channel (5); and a plurality of second adsorption grooves (9) are provided in the second adsorption area (3), and the second adsorption grooves (9) are all connected to the second adsorption channel (7).

3. The multi-size wafer chuck according to claim 2, characterized in that: The first adsorption grooves (8) are distributed in concentric rings around the first adsorption hole (4); and the second adsorption grooves (9) are distributed in concentric rings around the second adsorption hole (6).

4. The multi-size wafer chuck according to claim 3, characterized in that: The first adsorption hole (4) is located in the middle of the first adsorption area (2), and the first adsorption channel (5) extends to the edge of the first adsorption area (2).

5. The multi-size wafer chuck according to claim 4, characterized in that: A plurality of the first adsorption channels (5) are provided, and the plurality of first adsorption channels (5) are distributed around the first adsorption hole (4).

6. The multi-size wafer chuck according to claim 5, characterized in that: The first adsorption channel (5) extends radially along the first adsorption groove (8), and the first adsorption grooves (8) are distributed in concentric circles.

7. The multi-size wafer chuck according to claim 3, characterized in that: Each group of second adsorption holes (6) is provided with a plurality of them and arranged around the first adsorption hole (4); the number of second adsorption channels (7) in each group is the same as the number of the corresponding group of second adsorption holes (6); one end of each second adsorption channel (7) is connected to a corresponding second adsorption hole (6), and the other end extends to the edge of the second adsorption area (3).

8. The multi-size wafer chuck according to claim 7, characterized in that: The second adsorption channel (7) extends radially along the second adsorption groove (9); the second adsorption grooves (9) are distributed in concentric circles.

9. The multi-size wafer chuck according to claim 1, characterized in that: An annular spacing area (10) is provided between the first adsorption area (2) and the second adsorption area (3), and a plurality of suction cup fixing holes (11) are distributed in an annular manner on the spacing area (10).

10. The multi-size wafer chuck according to claim 1, characterized in that: The front side of the suction cup body (1) is also provided with a wafer transfer groove (12), one end of the wafer transfer groove (12) extends into the first adsorption area (2), and the other end extends to the edge of the suction cup body (1).

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