Wafer adsorption fixing device

Abstract

The utility model provides a wafer adsorption fixing device which comprises a base and a tray, the tray is arranged on the base, and a fastening assembly capable of clamping the tray is arranged on the base. A negative pressure joint and a plurality of adsorption valves are arranged on the base, and one end of each adsorption valve is communicated with the negative pressure joint; a wafer groove is formed in the upper surface of the tray, an adsorption hole is formed in the tray, and the bottom of the wafer groove is communicated with the adsorption hole; an adsorption connector is arranged at one end of the adsorption hole and can be connected with the other end of the adsorption valve through a pipeline. According to the utility model, when the adsorption joint is connected with the adsorption valve through a pipeline, negative pressure can be transmitted to the bottom of the wafer groove through the adsorption joint of the adsorption valve and the adsorption hole, so that the wafer is adsorbed and fixed; and the tray can be designed into various different specifications and can be replaced, so that the compatibility of wafers with various sizes and specifications is realized, and the equipment cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer carrier devices, in particular to a wafer adsorption and fixing device. Background Art

[0002] With the continuous development of semiconductor technology, increasingly stringent requirements are being placed on the compatibility of semiconductor equipment.

[0003] During semiconductor production and testing, the back of the wafer needs to be adsorbed and fixed in the semiconductor equipment. In the field of semiconductor production and testing, conventional semiconductor equipment uses a suction cup integrated with the equipment to fix the wafer, which is often only compatible with one or two types of wafers. In some specific process stages of semiconductor production and testing, there are often multiple sizes of wafers. At this time, the excess wafers of other sizes need to be placed in other equipment that is compatible with the wafers of that size for processing or testing. When there are too many types of wafer sizes, placing different equipment separately is bound to result in a lot of equipment costs. Utility Model Content

[0004] The technical problem to be solved by the utility model is: how to be compatible with chips of various sizes and specifications while reducing costs.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] The utility model provides a wafer adsorption and fixing device, comprising a base and a tray, wherein the tray is arranged on the base, and a fastening assembly capable of clamping the tray is provided on the base; a negative pressure joint and a plurality of adsorption valves are provided on the base, and one end of each adsorption valve is respectively connected with the negative pressure joint; a wafer groove is provided on the upper surface of the tray, and an adsorption hole is provided in the tray, and the bottom of the wafer groove is connected with the adsorption hole; an adsorption joint is provided at one end of the adsorption hole, and the adsorption joint can be connected with the other end of the adsorption valve through a pipeline.

[0007] The beneficial effects of the utility model are:

[0008] By adopting the utility model, the negative pressure joint can be used to connect the negative pressure pipeline of the equipment, and the installation is convenient; when the adsorption joint is connected to the adsorption valve through the pipeline, the negative pressure can be transmitted to the bottom of the wafer slot through the adsorption joint and the adsorption hole of the adsorption valve, so as to realize the adsorption and fixation of the wafer; the tray can be designed with a variety of different specifications and can be replaced, so as to realize compatibility with wafers of various sizes and specifications, and reduce the equipment cost; the tray can be replaced by unlocking the fastening component and removing the pipeline of the adsorption joint, and the operation is convenient.

[0009] On the basis of the above technical solution, the present invention can also be improved as follows.

[0010] Furthermore, the tray is provided with a plurality of wafer slots, and the bottom of each wafer slot is connected to the adsorption hole.

[0011] The use of this type of tray makes it easy to absorb and fix multiple wafers at the same time, improves work efficiency, and has a compact structure.

[0012] Furthermore, the tray is provided with a plurality of adsorption holes, and each wafer slot is connected to one of the adsorption holes; the number of adsorption holes is not greater than the number of adsorption valves, and each adsorption hole is provided with an adsorption joint, and each adsorption joint can be connected to one of the adsorption valves through a pipeline.

[0013] By using this type of tray, the wafer slots can be controlled in batches through different adsorption valves, so that the wafer slots without wafers are not working, avoiding energy loss caused by leakage; at the same time, by adjusting the valve opening, different adsorption forces can be achieved on the same tray, thereby reliably adsorbing wafers of different sizes.

[0014] Furthermore, the wafer slots are distributed along a matrix, each column of wafer slots in the matrix is ​​arranged along the axial direction of the adsorption holes, and each adsorption hole is connected to one column of wafer slots.

[0015] It is easy to identify the connection relationship between the adsorption valve and the adsorption hole, and the operation is convenient.

[0016] Furthermore, the wafer slot is rectangular, and four sides of the wafer slot are respectively provided with retreat grooves.

[0017] The relief groove can be used to accommodate fastening components to facilitate wafer access.

[0018] Furthermore, a plug is provided at one end of the adsorption hole away from the adsorption joint.

[0019] Easy to process; when foreign matter enters the adsorption hole, the adsorption hole can be opened by removing the plug, making it easy to blow out the foreign matter.

[0020] Furthermore, the wafer slot is circular, and a positioning block and at least two positioning pins are provided on the edge of the wafer slot. The positioning block and the positioning pins are both connected to the tray, and the edge of the positioning block protrudes toward the inside of the wafer slot.

[0021] The positioning block and the positioning pins constrain the range of the wafer to prevent the wafer from sliding; when a round wafer is placed, the edge of the positioning block can be engaged with the positioning notch on the edge of the wafer to prevent the wafer from rotating and reduce processing errors.

[0022] Furthermore, a positioning groove is provided on the tray, and the positioning block is inserted into the positioning groove.

[0023] The positioning block is detachable, making it easy to remove the positioning block and place the chip.

[0024] Furthermore, the fastening assembly includes a fixing seat, an ejector pin, a handle and a connecting rod. The fixing seat is fixed on the base. The ejector pin passes through the fixing seat and is provided with a limiting nut. One end of the ejector pin passes through the fixing seat and faces the tray. The handle is rotatably connected to the fixing seat. One end of the connecting rod is hinged to the handle, and the other end is hinged to the ejector pin. A limiting structure is also provided on the base, and the tray is located between the limiting structure and the fastening assembly.

[0025] The movement of the ejector pin can be controlled by turning the handle, which is easy to operate; the structure is compact and occupies little space.

[0026] Furthermore, the tray is rectangular; the limiting structure is a plurality of limiting pins, and the plurality of limiting pins are distributed along two adjacent sides of the tray; and the ejector pin is directly opposite to a corner of the tray away from the limiting pin.

[0027] When the ejector pin leaves the pallet, the pallet can move away from the limit pin, making it easy to disassemble and assemble the pallet. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the utility model.

[0029] Figure 2 for Figure 1 Cross-sectional view along the axial direction of the adsorption hole.

[0030] Figure 3 Schematic diagram of the structure of the second pallet.

[0031] Figure 4 It is a schematic diagram of the structure of the third type of pallet.

[0032] Figure 5 Schematic diagram of the structure of the fourth pallet.

[0033] Figure 6 It is a schematic diagram of the structure of the fifth type of pallet.

[0034] Figure 7 It is a structural schematic diagram of the fastening component.

[0035] In the accompanying drawings, the technical features represented by the reference numerals are as follows:

[0036] 1-base; 2-tray; 3-negative pressure joint; 4-adsorption valve; 5-wafer slot; 6-adsorption hole; 7-adsorption joint; 8-retreat slot; 9-plug; 10-positioning block; 11-positioning nail; 12-positioning slot; 13-limiting pin; 14-fixing seat; 15-thimble; 16-handle; 17-connecting rod; 18-limiting nut. DETAILED DESCRIPTION

[0037] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0038] This utility model refers to Figure 1-7 .

[0039] The utility model provides a wafer adsorption and fixing device, comprising a base 1 and a tray 2, wherein the tray 2 is arranged on the base 1, and the base 1 is provided with a fastening component capable of clamping the tray 2; a negative pressure joint 3 and a plurality of adsorption valves 4 are provided on the base 1, and one end of each adsorption valve 4 is respectively connected with the negative pressure joint 3; a wafer groove 5 is provided on the upper surface of the tray 2, and an adsorption hole 6 is provided in the tray 2, and the bottom of the wafer groove 5 is connected with the adsorption hole 6; an adsorption joint 7 is provided at one end of the adsorption hole 6, and the adsorption joint 7 can be connected with the other end of the adsorption valve 4 through a pipeline.

[0040] principle:

[0041] In the installed state, the base 1 can be fixed in any semiconductor device to replace its suction cup and other structures; the negative pressure connector 3 is connected to the negative pressure pipeline of the semiconductor device to provide adsorption power. The tray 2 is replaceable, and the size of the wafer slot 5 on the tray 2 matches the size of the wafer to be adsorbed. A variety of trays 2 of different specifications can be designed to place wafers of different sizes. The sizes of the wafer slots 5 on the same tray 2 can all be the same, and are used to place the same type of wafer; the sizes of the wafer slots 5 on the same tray 2 can also be set to multiple sizes, and are used to place different types of wafers.

[0042] When working, select the corresponding tray 2 according to the size specifications of the wafer material, place the tray 2 on the base 1, and clamp it with the fastening assembly; connect the adsorption joint 7 on the tray 2 to the adsorption valve 4 through the pipeline. The wafer is placed in the wafer slot 5. When the adsorption valve 4 is opened, the negative pressure of the equipment pipeline is transmitted to the bottom of the wafer slot 5 through the negative pressure joint 3, the adsorption valve 4, the adsorption joint 7, and the adsorption hole 6 in sequence, thereby adsorbing and fixing the wafer.

[0043] By adopting the utility model, the negative pressure joint 3 can be used to connect the negative pressure pipeline of the equipment, and the installation is convenient; when the adsorption joint 7 is connected to the adsorption valve 4 through the pipeline, the negative pressure can be transmitted to the bottom of the wafer slot 5 through the adsorption joint 7 and the adsorption hole 6 of the adsorption valve 4, so as to realize the adsorption and fixation of the wafer; the tray 2 can be designed with a variety of different specifications and can be replaced, so as to realize compatibility with wafers of various sizes and specifications, and reduce the equipment cost; the tray 2 can be replaced by unlocking the fastening assembly and removing the pipeline of the adsorption joint 7, which is easy to operate.

[0044] Further, such as Figure 1-4 As shown in 6 , the tray 2 is provided with a plurality of wafer slots 5 , and the bottom of each wafer slot 5 is connected to the adsorption hole 6 .

[0045] The use of this type of tray 2 facilitates the simultaneous adsorption and fixing of multiple wafers, thereby improving work efficiency and having a compact structure.

[0046] Furthermore, a plurality of adsorption holes 6 are provided in the tray 2, and each wafer slot 5 is connected to one of the adsorption holes 6; the number of the adsorption holes 6 is not greater than the number of the adsorption valves 4, and each adsorption hole 6 is provided with an adsorption connector 7, and each adsorption connector 7 can be connected to one of the adsorption valves 4 through a pipeline.

[0047] By adopting this type of tray 2, the wafer slots 5 can be controlled in batches through different adsorption valves 4, so that the wafer slots 5 without wafers are not working, avoiding energy loss caused by leakage; at the same time, by adjusting the valve opening, different adsorption forces can be achieved on the same tray 2, thereby reliably adsorbing wafers of different sizes.

[0048] Furthermore, the wafer slots 5 are distributed along a matrix, each column of the wafer slots 5 in the matrix is ​​arranged along the axial direction of the adsorption holes 6 , and each adsorption hole 6 is connected to one column of the wafer slots 5 .

[0049] It is easy to identify the connection relationship between the adsorption valve 4 and the adsorption hole 6, and the operation is convenient.

[0050] Furthermore, the wafer slot 5 is rectangular, and four sides of the wafer slot 5 are respectively provided with retreat grooves 8 .

[0051] The relief groove 8 can be used to accommodate a fastening component to facilitate the placement and removal of the wafer.

[0052] Further, such as Figure 2 As shown: a plug 9 is provided at one end of the adsorption hole 6 away from the adsorption joint 7.

[0053] The plug 9 and the tray 2 can be connected by threads or fixed by welding; the processing is convenient; when foreign matter enters the adsorption hole 6, the plug 9 can be removed to make the adsorption hole 6 pass through, so that the foreign matter can be blown out easily.

[0054] Further, such as Figure 5-6 As shown: the wafer slot 5 is circular, and a positioning block 10 and at least two positioning pins 11 are provided at the edge of the wafer slot 5 . The positioning block 10 and the positioning pins 11 are both connected to the tray 2 , and the edge of the positioning block 10 protrudes toward the inner side of the wafer slot 5 .

[0055] The positioning block 10 and the positioning pin 11 constrain the range of the wafer to prevent the wafer from sliding; when a round wafer is placed, the edge of the positioning block 10 can be engaged with the positioning notch on the edge of the wafer to prevent the wafer from rotating and reduce processing errors.

[0056] Furthermore, a positioning groove 12 is provided on the tray 2 , and the positioning block 10 is inserted into the positioning groove 12 .

[0057] The positioning block 10 is detachable, so it is convenient to remove the positioning block 10 and take and place the wafer.

[0058] Further, such as Figure 1 , 7 As shown: the fastening assembly includes a fixing seat 14, an ejector pin 15, a handle 16 and a connecting rod 17. The fixing seat 14 is fixed on the base 1. The ejector pin 15 passes through the fixing seat 14 and is provided with a limiting nut 18. One end of the ejector pin 15 passes through the fixing seat 14 and faces the tray 2. The handle 16 is rotatably connected to the fixing seat 14. One end of the connecting rod 17 is hinged to the handle 16, and the other end is hinged to the ejector pin 15. A limiting structure is also provided on the base 1, and the tray 2 is located between the limiting structure and the fastening assembly.

[0059] Note: The handle 16, the connecting rod 17, and the ejector pin 15 form a crank slider mechanism. Turning the handle 16 can control the ejector pin 15 to move toward or away from the tray 2. The ejector pin 15 moves toward the tray 2 and tightens the limit nut 18, so that the tray 2 is pressed against the limit structure.

[0060] The movement of the ejector pin 15 can be controlled by rotating the handle 16, which is easy to operate; the structure is compact and the space occupied is small.

[0061] Further, such as Figure 1 As shown: the tray 2 is rectangular; the limiting structure is a plurality of limiting pins 13 , and the plurality of limiting pins 13 are distributed along two adjacent sides of the tray 2 ; the ejector pin 15 is facing a corner of the tray 2 away from the limiting pin 13 .

[0062] When the ejector pin 15 leaves the tray 2, the tray 2 can move away from the limiting pin 13, so that the tray 2 can be easily disassembled and assembled.

[0063] In the description of the present invention, it should be understood that if there are descriptive terms indicating orientation, direction or positional relationship, such as: "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the referred part, element or whole must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0064] In the present utility model, if the terms describing the relative functional relationship of the structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be a fixed connection, a detachable connection, or an integrated one; can be a mechanical connection or an electrical connection; can be a direct connection or an indirect connection through an intermediate medium, can be the internal connection of two elements or the interaction relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present utility model can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0065] In the present invention, if there are descriptive terms with subsidiary or connecting meanings, for example, the first feature is "on" or "below" the second feature, unless otherwise clearly specified and limited, it should not be interpreted in a restrictive manner. For example, "on" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0066] Furthermore, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of the different embodiments and examples described in this specification without contradiction, and these combinations or combinations shall all fall within the scope summarized by the utility model.

[0068] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and cannot be construed as limitations on the present invention. A person skilled in the art can change, modify, replace and modify the above embodiments within the scope of information available from public channels and in combination with the technical inspiration provided by the present application documents.

Claims

1. A wafer adsorption and fixing device, characterized in that: The invention comprises a base (1) and a tray (2), wherein the tray (2) is arranged on the base (1), and the base (1) is provided with a fastening assembly capable of clamping the tray (2); the base (1) is provided with a negative pressure joint (3) and a plurality of adsorption valves (4), and one end of each adsorption valve (4) is respectively connected to the negative pressure joint (3); a wafer groove (5) is provided on the upper surface of the tray (2), and an adsorption hole (6) is provided in the tray (2), and the bottom of the wafer groove (5) is connected to the adsorption hole (6); an adsorption joint (7) is provided at one end of the adsorption hole (6), and the adsorption joint (7) can be connected to the other end of the adsorption valve (4) through a pipeline.

2. The wafer adsorption and fixing device according to claim 1, characterized in that: The tray (2) is provided with a plurality of wafer slots (5), and the bottom of each wafer slot (5) is respectively connected to a suction hole (6).

3. The wafer adsorption and fixing device according to claim 2, characterized in that: The tray (2) is provided with a plurality of adsorption holes (6), and each wafer slot (5) is connected to one of the adsorption holes (6); the number of the adsorption holes (6) is not greater than the number of the adsorption valves (4), and each adsorption hole (6) is provided with an adsorption joint (7), and each adsorption joint (7) can be connected to one of the adsorption valves (4) through a pipeline.

4. The wafer adsorption and fixing device according to claim 3, characterized in that: The wafer slots (5) are distributed along a matrix, each row of wafer slots (5) in the matrix is ​​arranged along the axial direction of the adsorption holes (6), and each adsorption hole (6) is connected to one row of wafer slots (5).

5. The wafer adsorption and fixing device according to claim 2, characterized in that: The wafer slot (5) is rectangular, and four sides of the wafer slot (5) are respectively provided with retreat slots (8).

6. The wafer adsorption and fixing device according to claim 1, characterized in that: A plug (9) is provided at one end of the adsorption hole (6) away from the adsorption joint (7).

7. The wafer adsorption and fixing device according to claim 1, characterized in that: The wafer slot (5) is circular, and a positioning block (10) and at least two positioning pins (11) are provided at the edge of the wafer slot (5). The positioning block (10) and the positioning pins (11) are both connected to the tray (2), and the edge of the positioning block (10) protrudes toward the inside of the wafer slot (5).

8. The wafer adsorption and fixing device according to claim 7, characterized in that: The tray (2) is also provided with a positioning groove (12), and the positioning block (10) is inserted into the positioning groove (12).

9. The wafer adsorption and fixing device according to claim 1, characterized in that: The fastening assembly comprises a fixing seat (14), a thimble (15), a handle (16) and a connecting rod (17); the fixing seat (14) is fixed on the base (1); the thimble (15) passes through the fixing seat (14) and is provided with a limiting nut (18); one end of the thimble (15) passing through the fixing seat (14) faces the tray (2); the handle (16) is rotatably connected to the fixing seat (14); one end of the connecting rod (17) is hinged to the handle (16) and the other end is hinged to the thimble (15); a limiting structure is also provided on the base (1); the tray (2) is located between the limiting structure and the fastening assembly.

10. The wafer adsorption and fixing device according to claim 9, characterized in that: The tray (2) is rectangular; the limiting structure is a plurality of limiting pins (13), and the plurality of limiting pins (13) are distributed along two adjacent sides of the tray (2); the ejector pin (15) faces a corner of the tray (2) away from the limiting pin (13).

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