Radio frequency device, radar and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of electronic devices, provides a radio frequency device, a radar and electronic equipment, and can greatly reduce the mutual interference between an antenna and a chip, thereby improving the performance of the antenna, and improving the electromagnetic compatibility and anti-electromagnetic interference capability of the chip. The radio frequency device comprises a chip, at least one first transmission structure, a circuit board and at least one antenna, the chip is arranged on one side of the circuit board and is used for generating and / or receiving a radio frequency signal; one side, facing the circuit board, of the chip is provided with at least one radiation conversion structure; the first transmission structure is arranged on one side, facing the chip, of the circuit board, and is arranged corresponding to the radiation conversion structure; the circuit board comprises at least one second transmission structure, and the second transmission structure corresponds to the first transmission structure; the antennas are arranged on the sides, deviating from the first transmission structures, of the corresponding second transmission structures.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a radio frequency device, a radar, and an electronic device. Background Art

[0002] Radio frequency device is a commonly used electronic device, such as Figure 1 and Figure 2 As shown, the radio frequency device includes a chip structure 1, a PCB (Printed Circuit Board) 2 and a patch antenna 3, and the patch antenna 3 is arranged on the side of the PCB 2 facing the chip structure 1; Figure 2 The black arrow in the figure indicates the signal transmission path. The RF signal generated by the chip structure 1 is transmitted to the trace on the PCB 2 through the solder ball 4 of the ball grid array (BGA), and then radiated into space through the patch antenna 3 on the PCB 2. The antenna and chip of this type of RF device interfere with each other, thereby reducing the antenna performance, and is also not conducive to the electromagnetic compatibility (EMC) and electromagnetic interference (EMI) capabilities of the chip. Utility Model Content

[0003] The embodiments of the present application provide a radio frequency device, a radar, and an electronic device, which can significantly reduce the mutual interference between the antenna and the chip, thereby improving the antenna performance and improving the electromagnetic compatibility and anti-electromagnetic interference capability of the chip.

[0004] According to some embodiments of the present application, the embodiments of the present application provide, on one hand, a radio frequency device, including: a chip, at least one first transmission structure, a circuit board, and at least one antenna;

[0005] The chip is arranged on one side of the circuit board and is used to generate and / or receive radio frequency signals;

[0006] The chip is provided with at least one radiation conversion structure on a side facing the circuit board;

[0007] The first transmission structure is arranged on a side of the circuit board facing the chip and is arranged corresponding to the radiation conversion structure;

[0008] The circuit board includes at least one second transmission structure, and the second transmission structure is arranged corresponding to the first transmission structure;

[0009] The antenna is arranged on a side of the corresponding second transmission structure away from the first transmission structure;

[0010] The RF signal generated by the chip is transmitted to the antenna via the radiation conversion structure, the first transmission structure, and the second transmission structure; and / or the RF signal received by the antenna is transmitted to the chip via the second transmission structure, the first transmission structure, and the radiation conversion structure.

[0011] According to some embodiments of the present application, another aspect of the embodiments of the present application provides a radar, comprising the above-mentioned radio frequency device.

[0012] According to some embodiments of the present application, another aspect of the embodiments of the present application provides an electronic device, including the above-mentioned radar.

[0013] The embodiments of the present application provide a radio frequency device, a radar and an electronic device. The radio frequency device realizes the transmission of radio frequency signals through the cooperation of the radiation conversion structure of the chip, the first transmission structure, the second transmission structure of the circuit board and the antenna. At the same time, by setting the antenna on the side of the corresponding second transmission structure away from the first transmission structure, the chip and the antenna are set on different sides of the circuit board, which increases the setting distance between the two, thereby greatly reducing the mutual interference between the antenna and the chip, thereby improving the antenna performance, and improving the electromagnetic compatibility and electromagnetic interference of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. Unless otherwise specified, the pictures in the drawings do not constitute a scale limitation. In order to more clearly illustrate the embodiments of the present application or the technical solutions in the traditional technology, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 A schematic diagram of the structure of a radio frequency device provided for related technology;

[0016] Figure 2 for Figure 1 Schematic diagram of signal transmission path of the structure;

[0017] Figure 3 One of the structural schematic diagrams of a radio frequency device provided in an embodiment of the present application;

[0018] Figure 4 for Figure 3 Schematic diagram of signal transmission path of the structure;

[0019] Figure 5 One of the structural schematic diagrams of multiple conductive parts provided in the embodiment of the present application;

[0020] Figure 6 The second structural schematic diagram of multiple conductive parts provided in the embodiment of the present application;

[0021] Figure 7 A second structural diagram of a radio frequency device provided in an embodiment of the present application;

[0022] Figure 8 A third structural diagram of a radio frequency device provided in an embodiment of the present application;

[0023] Fig. 9 A fourth structural diagram of a radio frequency device provided in an embodiment of the present application;

[0024] Fig.10 This is a fifth structural diagram of a radio frequency device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0026] In the description of the embodiments of the present application, "at least one" means one or more, "at least one layer" means one or more layers, and "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. For example, if the device or element in the figure is inverted, then the element described as being "below" or "below" or "below" or "bottom" of other elements or features will be oriented "above" or "top" of the other elements or features. Therefore, the term "below" may cover both the above and below orientations depending on the context in which the term is used, which will be obvious to a person of ordinary skill in the art. The material can be oriented in other ways (e.g., rotated 90 degrees, inverted, flipped), and the spatially relative descriptors used herein can be interpreted accordingly.

[0030] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0031] The present application embodiment provides a radio frequency device, combined with Figure 3 , Figure 4 , Figure 7-10 As shown, the radio frequency device includes: a chip 10, at least one first transmission structure 20, a circuit board 30 and at least one antenna 40;

[0032] The chip 10 is disposed on one side of the circuit board 30 and is used to generate and / or receive radio frequency signals;

[0033] The chip 10 is provided with at least one radiation conversion structure 11 on a side facing the circuit board 30; the radiation conversion structure 11 is used to radiate the radio frequency signal generated by the chip 10 to the first transmission structure 20, and / or to receive the radio frequency signal transmitted from the first transmission structure 20;

[0034] The first transmission structure 20 is arranged on a side of the circuit board 30 facing the chip 10 and is arranged corresponding to the radiation conversion structure 11; the first transmission structure 20 is used to transmit the radio frequency signal transmitted by the radiation conversion structure 11 to the second transmission structure, and / or, to transmit the radio frequency signal transmitted by the second transmission structure to the radiation conversion structure;

[0035] The circuit board includes at least one second transmission structure, which is arranged corresponding to the first transmission structure; the second transmission structure is used to transmit the radio frequency signal transmitted by the first transmission structure to the antenna, and / or, to transmit the radio frequency signal received by the antenna to the first transmission structure; the second transmission structure can be as follows Figure 3 and Figure 4 The insulating portion 311 shown, or may be Figure 7 The transmission through hole 312 shown, or, alternatively, may be Fig. 9 The first group of transmission units 313 and the second group of transmission units 314 are stacked as shown, or they can also be as shown in FIG. Fig.10 The first sub-hole 315 and the second sub-hole 316 are shown to be connected. Of course, the second transmission structure can also be other structures, which will not be listed here one by one.

[0036] The antenna is arranged on a side of the corresponding second transmission structure away from the first transmission structure; the antenna is used to radiate the radio frequency signal transmitted by the second transmission structure to the surroundings, and / or to transmit the received radio frequency signal to the second transmission structure.

[0037] The chip, the first transmission structure, the second transmission structure of the circuit board and the antenna can form a radio frequency signal transmission channel; the transmission channel can have the function of sending signals and / or receiving signals, which is not limited in the present embodiment. Figure 3 , Figure 4 , Figure 7-10 The illustration is made by taking the example that the radio frequency device includes both a transmission channel for sending signals and a transmission channel for receiving signals.

[0038] For example, the RF device may only have the function of sending signals, that is, the RF signal generated by the chip is transmitted to the antenna via the radiation conversion structure, the first transmission structure and the second transmission structure in sequence, and the antenna radiates the received RF signal to the surroundings; at this time, the chip is used to generate RF signals, the radiation conversion structure is used to radiate the RF signal generated by the chip to the first transmission structure, the first transmission structure is used to transmit the RF signal transmitted by the radiation conversion structure to the second transmission structure, the second transmission structure is used to transmit the RF signal transmitted by the first transmission structure to the antenna, and the antenna is used to radiate the RF signal transmitted by the second transmission structure to the surroundings.

[0039] For example, the RF device may only have the function of receiving signals, that is, the antenna receives RF signals in space, and transmits the RF signals to the chip via the second transmission structure, the first transmission structure and the radiation conversion structure in sequence; at this time, the antenna is used to transmit the RF signal obtained after the electromagnetic wave is converted to the second transmission structure, the second transmission structure is used to transmit the RF signal transmitted by the antenna to the first transmission structure, the first transmission structure is used to transmit the RF signal transmitted by the second transmission structure to the radiation conversion structure, the radiation conversion structure is used to receive the RF signal transmitted by the first transmission structure, and the chip is used to receive the RF signal.

[0040] For example, the radio frequency device may have the function of sending and receiving signals, that is, the function of sending and receiving signals may be completed in different time periods. For example, in the first time period, the radio frequency device may have the function of sending signals. At this time, the chip is used to generate radio frequency signals, the radiation conversion structure is used to radiate the radio frequency signals generated by the chip to the first transmission structure, the first transmission structure is used to transmit the radio frequency signals transmitted by the radiation conversion structure to the second transmission structure, the second transmission structure is used to transmit the radio frequency signals transmitted by the first transmission structure to the antenna, and the antenna is used to convert the radio frequency signals transmitted by the second transmission structure into electromagnetic wave signals. In the second time period, the radio frequency device may have the function of receiving signals. At this time, the antenna is used to transmit the radio frequency signals obtained after the electromagnetic waves are converted to the second transmission structure, the second transmission structure is used to transmit the radio frequency signals transmitted by the antenna to the first transmission structure, the first transmission structure is used to transmit the radio frequency signals transmitted by the second transmission structure to the radiation conversion structure, the radiation conversion structure is used to receive the radio frequency signals transmitted by the first transmission structure, and the chip is used to receive radio frequency signals.

[0041] The above-mentioned first transmission structure is arranged corresponding to the radiation conversion structure, the second transmission structure is arranged corresponding to the first transmission structure, and the antenna is arranged on the side of the corresponding second transmission structure away from the first transmission structure, that is, the radiation conversion structure, the first transmission structure, the second transmission structure and the antenna are arranged one by one.

[0042] The above-mentioned chip generates and / or receives radio frequency signals, wherein the type of radio frequency signals is not limited. For example, the radio frequency signal may be a FMCW (Frequency-Modulated Continuous Wave) millimeter wave signal, and of course, it may also be a radio frequency signal of other bands; or, if conditions permit, it may also be applicable to fields such as 5G communications.

[0043] The specific structure of the first transmission structure is not limited. For example, the first transmission structure may be a conductive cavity structure, or other structures that can transmit radio frequency signals. The size, shape and material of the first transmission structure are not limited, as long as the frequency of the transmitted radio frequency signal meets the cutoff frequency of the chip, the radio frequency signal is ensured to be normally transmitted to the interface according to its working wavelength.

[0044] The specific structure of the above-mentioned radiation conversion structure is not limited. For example, the radiation conversion structure can be a resonant converter, and the resonant converter can be set in a resonant state to facilitate the output of the radio frequency signal to the second transmission structure with maximum power.

[0045] The specific structure of the second transmission structure is not limited. For example, the second transmission structure can be a hollow structure with air as the transmission medium, such as a through hole, or a solid structure with insulating material as the transmission medium. Of course, other structures are also possible.

[0046] The chip may also have other functions such as signal processing. For example, after receiving the signal reflected by the object to be measured, the chip may process the signal, thereby analyzing and judging the motion state, size or position of the object to be measured. The chip may be provided with multiple transceiver ports. For example, four transmitting ports and four receiving ports may be provided. Figure 4 , Figure 7 , Fig. 9 and Fig.10 As shown, the RF signal generated by the chip 1 is transmitted to the antenna 40 via the radiation conversion structure 11, the first transmission structure 20 and the second transmission structure in sequence, and the antenna 40 radiates the received RF signal to the free space; the object to be measured in the free space reflects the RF signal, and the reflected signal is obtained by the antenna 40 as an echo signal, and is transmitted to the chip 10 via the second transmission structure, the first transmission structure 20 and the radiation conversion structure 11 in sequence, and the chip 10 processes the signal, so as to detect information such as the motion state or position of the object to be measured.

[0047] The number of antennas provided in the above radio frequency device can be selected according to actual requirements. For example, two receiving antennas and two transmitting antennas can be provided, and each antenna is respectively provided with a radiation conversion structure, a first transmission structure and a second transmission structure.

[0048] The above-mentioned antenna can be a metal antenna or a plastic metallized antenna. Compared with the existing patch antenna, on the one hand, it can avoid using microstrip lines as feed lines, greatly reducing RF losses and thus improving RF performance; on the other hand, it is unnecessary to use the high-frequency circuit board required for the patch antenna, thereby reducing the production cost and improving the flexibility of the antenna design.

[0049] The above-mentioned radio frequency device can be applied to transportation electronic equipment such as automobiles, bicycles, motorcycles, ships, subways or trains to detect objects such as vehicles, pedestrians, overpasses, trees or parking spaces. Of course, it can also be applied to security equipment such as cameras, or other fields, which are not limited here.

[0050] An embodiment of the present application provides a radio frequency device, in which signal transmission is achieved through the mutual cooperation of the radiation conversion structure of the chip, the first transmission structure, the second transmission structure of the circuit board and the antenna; the antenna is arranged on the side of the corresponding second transmission structure away from the first transmission structure, so that the chip and the antenna are arranged on different sides of the circuit board, increasing the setting distance between the two, thereby greatly reducing the mutual interference between the antenna and the chip, thereby improving the antenna performance, and improving the electromagnetic compatibility and electromagnetic interference of the chip.

[0051] In one or more embodiments, reference Figure 3 As shown, the first transmission structure 20 includes a plurality of independently arranged conductive parts 21; the plurality of conductive parts 21 are arranged around the corresponding radiation conversion structure 11 to form a cavity structure.

[0052] The radio frequency signal can be transmitted along the cavity structure formed by multiple conductive parts. The specific material of the conductive part is not limited. For example, the conductive part can be a solder ball or a conductive adhesive layer, so that while forming the cavity structure, the circuit board and the chip can also be connected; at this time, the conductive part can be electrically connected to the circuit board and the chip respectively. It should be noted that when the solder ball is used as the conductive part in the embodiment of the present application, the multiple solder balls form a cavity structure, thereby realizing the transmission of the radio frequency signal, and can also play the role of connecting the circuit board and the chip. Of course, the radio frequency device can also set other solder balls in the area where the first transmission structure and the radiation conversion structure are not set, and these solder balls are only used for welding; or, if the radio frequency device also includes other functional chips, these solder balls can also be used for signal transmission between other functional chips and circuit boards.

[0053] The cavity structure surrounded by the above-mentioned multiple conductive parts can be a hollow structure with air as the transmission medium, or it can also be a solid structure with insulating material as the transmission medium, which is not limited here. The size and shape of the cavity structure surrounded by the above-mentioned multiple conductive parts are not limited. For example, the multiple conductive parts can be surrounded by a cross-section of a circle, a triangle, or a solid structure. Figure 5 The quadrilateral or irregular shaped cavity structure shown (for example: Figure 6The ridge shape shown). The size of the cavity structure surrounded by multiple conductive parts, the dielectric constant inside the cavity structure and other factors will affect the signal frequency transmitted by the cavity structure. Under the premise that other influencing factors remain unchanged, the smaller the size of the cavity structure surrounded by multiple conductive parts, the larger the corresponding signal frequency; under the premise that other influencing factors remain unchanged, the larger the dielectric constant of the cavity structure surrounded by multiple conductive parts, the smaller the corresponding signal frequency. The chip design size and the dielectric constant of the transmission medium and other factors are comprehensively considered to meet the cutoff frequency requirements of the chip.

[0054] In one or more embodiments, reference Figure 8 As shown, the first transmission structure further includes a first organic portion 22 , and at least a portion of the space in the cavity structure is filled with the first organic portion 22 .

[0055] The material of the above-mentioned first organic part is not limited. For example, the material of the first organic part may include: epoxy resin or modified epoxy resin. At least part of the space in the cavity structure is filled with the first organic part, including: part of the space in the cavity structure is filled with the first organic part; or, the entire space in the cavity structure is filled with the first organic part, that is, the first organic part fills the entire space in the cavity structure, which is not limited here. Since the dielectric constant of the first organic part is greater than the dielectric constant of air, the dielectric constant of the cavity structure filled with the first organic part is greater than the dielectric constant of the hollow cavity structure. It can be seen from the above description that, under the premise that other influencing factors remain unchanged, the larger the dielectric constant of the cavity structure surrounded by multiple conductive parts, the smaller the corresponding signal frequency; under the premise that other influencing factors remain unchanged, the smaller the size of the cavity structure surrounded by multiple conductive parts, the larger the corresponding signal frequency. When the designed transmission signal frequency remains unchanged, the dielectric constant of the cavity structure filled with the first organic part increases compared to the hollow cavity structure, thus reducing the signal frequency; at this time, the size of the cavity structure surrounded by multiple conductive parts can be reduced, thereby increasing the signal frequency to ensure that the signal frequencies corresponding to the cavity structure filled with the first organic part and the hollow cavity structure are the same. That is, under the premise of ensuring the transmission performance, the size of the cavity structure filled with the first organic part can be made smaller, which is conducive to the miniaturization of the chip and thus saves costs.

[0056] In one or more embodiments, the radio frequency device includes a plurality of first transmission structures, the chip is provided with a plurality of radiation conversion structures, and the circuit board includes a plurality of second transmission structures; Figure 8 As shown, the radio frequency device further includes a second organic part 23, and any adjacent first transmission structures 20 are filled with the second organic part 23; the first organic part 22 and the second organic part 23 are an integrated structure, thereby simplifying the manufacturing process and further saving costs.

[0057] In one or more embodiments, reference Figure 3and Figure 8 As shown, the circuit board also includes a body structure 35, and each second transmission structure is surrounded by a body structure 35; the body structure 35 includes at least a body conductive layer 33 and a body insulating layer 34 that are alternately stacked, and the top layer and the bottom layer in the body structure 35 are both body conductive layers 33, and the top layer of the body structure 35 is closer to the first transmission structure 20 than the bottom layer of the body structure 35. The specific number of layers of the body conductive layer and the body insulating layer is not limited here, and can be selected according to actual conditions. The body conductive layer can be a copper foil layer. The material of the body insulating layer can be epoxy resin, polyimide or polytetrafluoroethylene, etc. Figure 3 and Figure 8 The illustration is made by taking the example that the body structure 35 includes a body insulating layer 34 and two body conductive layers 33 .

[0058] In one or more embodiments, the first transmission structure includes a plurality of independently arranged conductive parts; the shape of the cross section of the second transmission structure is the same as the shape of the cross section of the cavity structure surrounded by the plurality of conductive parts, so as to facilitate the consistency of transmission. For example, if the shape of the cross section of the cavity structure surrounded by the plurality of conductive parts is a rectangle, the shape of the cross section of the second transmission structure may also be a rectangle. The size and shape of the second transmission structure will affect the signal frequency and transmission path of its transmission. The size and shape of the second transmission structure are not limited here, as long as the cutoff frequency requirements of the chip are met to ensure that the RF signal is normally transmitted to the interface according to its working wavelength.

[0059] The following provides a specific structure of a second transmission structure.

[0060] In one or more embodiments, the size of the cross section of the second transmission structure remains constant along the thickness direction of the circuit board.

[0061] In some embodiments, the second transmission structure may be Figure 7 The transmission through hole 312 shown in the figure is connected to the cavity structure formed by the conductive part 21. In this way, the radio frequency signal can be transmitted along the Figure 7 The straight line path with arrows is shown as transmission. The antenna 40 is arranged at the opening of the transmission through hole 312 which is away from the chip 10 .

[0062] The circuit board generally includes a multilayer board. When each layer of the board is formed, a sub-through hole can be formed in the corresponding area; the multilayer board is correspondingly pressed and stacked, and multiple sub-through holes are connected to form a transmission through hole.

[0063] To avoid signal leakage, refer to Figure 7As shown, the circuit board 30 further includes a first shielding layer 36, which covers the side wall of the transmission through hole 312; the first shielding layer 36 may be a metal-plated layer. Alternatively, the circuit board further includes a plurality of first shielding holes; the plurality of first shielding holes are arranged around the transmission through hole. The first shielding holes may be metallized through holes.

[0064] In some embodiments, reference Figure 3 , Figure 4 and Figure 8 As shown, the second transmission structure is an insulating portion 311, and the insulating portion 311 is connected to the cavity structure formed by the conductive portion 21. The antenna 40 is arranged on a side of the insulating portion 311 away from the chip 10.

[0065] The circuit board generally includes a multilayer board. When each layer of the board is formed, an insulating layer can be formed in a corresponding area. The multilayer board is correspondingly pressed and stacked, and the multiple insulating layers form an insulating part.

[0066] To avoid signal leakage, refer to Figure 3 , Figure 4 and Figure 8 As shown, the circuit board 30 further includes a plurality of second shielding holes 32; the plurality of second shielding holes 32 are arranged around the insulating portion 311. The second shielding holes may be metallized through holes.

[0067] The specific structure of a second transmission structure is provided below.

[0068] In one or more embodiments, the size of the cross section of the second transmission structure changes along the thickness direction of the circuit board. The trend of the change is not limited here, and for example, it can be an increasing change, or a decreasing change, or it can be an increasing change first and then a decreasing change.

[0069] In some embodiments, in order to simplify the structure and reduce the difficulty of manufacturing, the second transmission structure includes a plurality of transmission units arranged in layers, each of which includes at least one transmission insulation layer. For example, each transmission unit includes two transmission insulation layers.

[0070] refer to Fig. 9 As shown, multiple transmission units are arranged along a preset direction (such as Fig. 9 The transmission units 313 of the first group are stacked in the same size, and the transmission units 314 of the second group are stacked in the same size. The cross-sectional dimensions of the first group of transmission units 313 are greater than the cross-sectional dimensions of the second group of transmission units 314, wherein the preset direction is consistent with the direction from the bottom layer of the main body structure 35 to the top layer of the main body structure 35; the partial boundaries of the first group of transmission units 313 and the partial boundaries of the second group of transmission units 314 are along the preset direction (such as Fig. 9B1A1 direction shown) overlap; reference Fig. 9 As shown, the second transmission structure further includes a first transmission conductive layer 36, and the first transmission conductive layer 36 is arranged along a preset direction (such as Fig. 9 The first transmission conductive layer 36 and the second group of transmission units 314 are overlapped along a preset direction. Fig. 9 The second transmission structure includes two stacked transmission units, each of which includes a transmission insulation layer.

[0071] The circuit board generally includes a multilayer board. When each layer of the board is formed, a transmission insulating sublayer can be formed in the corresponding area. By setting through holes, blind holes or buried holes, the multilayer board is pressed and stacked to form the transmission unit with the above-mentioned multiple stacking settings. The number of layers of the above-mentioned transmission insulating layer and the number of layers of the main body insulating layer in the main body structure can be the same. The transmission insulating layer and the main body insulating layer located on the same layer can be formed by a single patterning process to reduce the manufacturing process flow.

[0072] So, reference Fig. 9 As shown, the signal is transmitted in the horizontal direction in the first group of transmission units 313 and in the vertical direction in the second group of transmission units 314, that is, the transmission path of the signal in the second transmission structure is a curved path; in this way, the antenna can be set more flexibly, so that the antenna is as far away from the chip as possible, further reducing the mutual interference between the two.

[0073] To avoid signal leakage, refer to Fig. 9 As shown, the circuit board 30 further includes a plurality of third shielding holes 37 and a plurality of fourth shielding holes 38; the plurality of third shielding holes 38 are arranged around the first group of transmission units 313, and the plurality of fourth shielding holes 38 are arranged around the second group of transmission units 314. The third shielding holes 37 and the fourth shielding holes 38 may be metallized through holes.

[0074] In some embodiments, reference Fig. 9 As shown, the second transmission structure includes a predetermined direction (such as Fig. 9 The first sub-hole 315 and the second sub-hole 316 are connected in the B2A2 direction as shown, and the size of the cross section of the first sub-hole 315 is larger than the size of the cross section of the second sub-hole 316, wherein the preset direction (such as Fig. 9 The B2A2 direction shown in the figure is consistent with the direction from the bottom layer of the main structure 35 to the top layer of the main structure 35; the second transmission structure also includes a second transmission conductive layer 37, which is arranged at an opening position in the first sub-hole 315 that is not connected to the second sub-hole 316, and the second transmission conductive layer 37 is connected to the first sub-hole 315 along a preset direction (such as Fig. 9The second transmission conductive layer 37 and the bottom layer of the main structure 35 are an integral structure.

[0075] The circuit board generally includes a multilayer board. When each layer of the board is formed, a first sub-hole or a second sub-hole can be formed in the corresponding area. After the multilayer board is pressed and stacked correspondingly, the above-mentioned first sub-hole and second sub-hole can be formed.

[0076] So, reference Fig.10 As shown, the signal is transmitted in the horizontal direction in the first sub-hole 315 and in the vertical direction in the second sub-hole 316, that is, the transmission path of the signal in the second transmission structure is a bent path; in this way, the antenna can be set more flexibly, so that the antenna is as far away from the chip as possible, further reducing the mutual interference between the two.

[0077] To avoid signal leakage, refer to Fig.10 As shown, the circuit board 30 further includes a second shielding layer 39 and a third shielding layer 41 , the second shielding layer 39 covers the side wall of the first sub-hole 315 , and the third shielding layer 41 covers the side wall of the second sub-hole 316 ; the second shielding layer and the third shielding layer may be metal coating layers.

[0078] Alternatively, the circuit board further includes a plurality of fifth shielding holes and a plurality of sixth shielding holes; the plurality of fifth shielding holes are arranged around the first sub-hole, and the plurality of sixth shielding holes are arranged around the second sub-hole. The fifth shielding holes and the sixth shielding holes may be metallized through holes.

[0079] The embodiment of the present application further provides a radar, which includes the above-mentioned radio frequency device. The working band of the radar is not limited. For example, the working band of the radar can be a millimeter wave band, and of course it can also be other bands. The application scenario of the radar is not limited. For example, the radar can be used in transportation electronic equipment such as cars, bicycles, motorcycles, ships, subways or trains to detect objects such as vehicles, pedestrians, overpasses, trees or parking spaces. Of course, it can also be used in security equipment such as cameras, or other fields, which are not limited here.

[0080] The embodiment of the present application also provides an electronic device, including the above-mentioned radar. The electronic device can be used in components and products in fields such as smart housing, transportation, smart home, consumer electronics, monitoring, industrial automation, cabin detection and health care. For example, the electronic device can be intelligent transportation equipment (for example: cars, bicycles, motorcycles, ships, subways or trains, etc.), security equipment (for example: cameras), liquid level / flow rate detection equipment, smart wearable devices (for example: bracelets or glasses, etc.), smart home equipment (for example: sweeping robots, door locks, TVs, air conditioners or smart lights, etc.), various communication devices (for example: mobile phones or tablets, etc.), and gates, smart traffic lights, smart signs, traffic cameras or various industrialized mechanical arms (or robots), etc., or various instruments for detecting life characteristic parameters or various equipment equipped with the instrument, such as: car cabin detection, indoor personnel monitoring, smart medical equipment or consumer electronic equipment, etc.

[0081] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in practical applications, various changes may be made to the embodiments in form and detail without departing from the spirit and scope of the present application. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application, and therefore the scope of protection of the present application shall be subject to the scope defined in the claims.

Claims

1. A radio frequency device, characterized in that: include: A chip, at least one first transmission structure, a circuit board and at least one antenna; The chip is arranged on one side of the circuit board and is used to generate and / or receive radio frequency signals; The chip is provided with at least one radiation conversion structure on a side facing the circuit board; The first transmission structure is arranged on a side of the circuit board facing the chip and is arranged corresponding to the radiation conversion structure; The circuit board includes at least one second transmission structure, and the second transmission structure is arranged corresponding to the first transmission structure; the antenna is arranged on a side of the corresponding second transmission structure away from the first transmission structure; The radio frequency signal generated by the chip is transmitted to the antenna through the radiation conversion structure, the first transmission structure, and the second transmission structure; And / or, the radio frequency signal received by the antenna is transmitted to the chip through the second transmission structure, the first transmission structure, and the radiation conversion structure.

2. The radio frequency device according to claim 1, characterized in that: The first transmission structure includes a plurality of conductive parts; the plurality of conductive parts are arranged around the corresponding radiation conversion structure to form a cavity structure.

3. The radio frequency device according to claim 2, characterized in that: The first transmission structure further includes a first organic portion, and at least a portion of the space in the cavity structure is filled with the first organic portion.

4. The radio frequency device according to claim 3, characterized in that: The radio frequency device includes a plurality of the first transmission structures, the chip is provided with a plurality of the radiation conversion structures, and the circuit board includes a plurality of the second transmission structures; The radio frequency device further includes a second organic portion, and the second organic portion is filled between any adjacent first transmission structures.

5. The radio frequency device according to any one of claims 2 to 4, characterized in that: The circuit board also includes a main body structure, which includes at least a main body conductive layer and a main body insulating layer. The top layer and the bottom layer of the main body structure are both the main body conductive layers, and the top layer of the main body structure is arranged close to the first transmission structure.

6. The radio frequency device according to claim 2, characterized in that: The second transmission structure is a transmission through hole, and the transmission through hole is communicated with the cavity structure formed by the conductive part.

7. The radio frequency device according to claim 6, characterized in that: The circuit board further comprises a first shielding layer, wherein the first shielding layer covers the side wall of the transmission through hole; Alternatively, the circuit board further includes a plurality of first shielding holes; the plurality of first shielding holes are arranged around the transmission through hole.

8. The radio frequency device according to claim 2, characterized in that: The second transmission structure is an insulating part, and the insulating part is communicated with the cavity structure formed by the conductive part.

9. The radio frequency device according to claim 8, characterized in that: The circuit board further includes a plurality of second shielding holes; the plurality of second shielding holes are arranged around the insulating portion.

10. The radio frequency device according to claim 5, characterized in that: The second transmission structure comprises a plurality of transmission units arranged in layers, each of the transmission units comprising at least one transmission insulation layer; The multiple transmission units include a first group of transmission units and a second group of transmission units along a preset direction, the cross-sectional dimensions of each of the stacked transmission units in the first group of transmission units are the same, the cross-sectional dimensions of each of the stacked transmission units in the second group of transmission units are the same, and the cross-sectional dimensions of the first group of transmission units are greater than those of the second group of transmission units, wherein the preset direction is consistent with the direction from the bottom layer of the main structure to the top layer of the main structure.

11. The radio frequency device according to claim 10, characterized in that: The second transmission structure further includes a first transmission conductive layer, which is disposed at a lower side of the transmission unit located at the bottom along the preset direction, and the first transmission conductive layer overlaps with the second group of transmission units along the preset direction.

12. The radio frequency device according to claim 5, characterized in that: The second transmission structure includes a first sub-hole and a second sub-hole connected along a preset direction, and the size of the cross-section of the first sub-hole is larger than the size of the cross-section of the second sub-hole, wherein the preset direction is consistent with the direction from the bottom layer of the main structure to the top layer of the main structure.

13. A radar, characterized in that: include: A radio frequency device as claimed in any one of claims 1 to 12.

14. An electronic device, characterized in that: include: A radar as claimed in claim 13.

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