Power supply module
By designing device layout and component combinations with reduced heat dissipation requirements in the power supply module, the heat dissipation problem of high-power power modules under limited volume is solved, efficient heat dissipation and space utilization are achieved, and the normal operation of the power supply module is ensured.
Patent Information
- Application Number
- CN202420712064.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-08
AI Technical Summary
The prior art cannot effectively meet the heat dissipation needs of high-power power modules under limited volume, resulting in excessive heat generation affecting the normal operation of the power module.
A power supply module is designed, by arranging the first and second devices whose heat dissipation needs are sequentially reduced, the first device is close to the water-cooled plate, and the second device is far away from the water-cooled plate, and the water-cooled plate and the heat-cooled fin are used. Components such as sheets, substrates and thermally conductive structural adhesives achieve efficient heat dissipation, and improve heat dissipation efficiency through cooling fans.
Realize timely heat dissipation and cooling of the first device with high heat dissipation needs, avoiding excessive heat generation affecting the normal operation of the power module, and at the same time, effectively utilize the space, reduce the waste of internal space of the power module, and meet the high-power power module. The heat dissipation requirement and avoids the second device being directly affected by the water-cooled plate condensation water.
Smart Images
Figure CN222234660U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power electronics, in particular to a power supply module. Background Art
[0002] The rapid development of the semiconductor industry has led to an increasing demand for high-power power supplies with stable and fast output. Such power supplies generate a lot of heat and have a high demand for heat dissipation and cooling. However, due to the limited volume of such power supplies, the heat dissipation and cooling solutions provided by the existing technology cannot meet the heat dissipation requirements of such high-power power modules under limited volume. Utility Model Content
[0003] The utility model aims to provide a power module to solve the technical problem that the heat dissipation and cooling solution provided by the prior art cannot meet the heat dissipation demand of a high-power power module under a limited volume.
[0004] The power module provided by the utility model is provided with a first device and a second device with decreasing heat dissipation requirements. The power module comprises a power housing and a water-cooling plate arranged along its height direction, the power housing has an opening and an external interface, the water-cooling plate is arranged at the opening and connected to the power housing to form a receiving cavity; the receiving cavity has a first space and a second space arranged along the height direction, wherein the first space is adjacent to the water-cooling plate, the first space is fixedly provided with a heat dissipation fin, and the first device is installed on the heat dissipation fin; the second device is located in the second space.
[0005] Furthermore, the power module also includes a substrate, which is fixedly disposed in the accommodating cavity and spaced apart from the water-cooling plate, and the substrate divides the accommodating cavity into the first space and the second space; the second device is mounted on the substrate.
[0006] Furthermore, one end of the heat dissipation fin is mounted on the water cooling plate, and the other end of the heat dissipation fin is fixedly connected to the base plate.
[0007] Furthermore, the first device includes a MOS tube (Metal Oxide Semiconductor Field Effect Transistor), a ceramic sheet is arranged between the MOS tube and the heat sink fin for separating the two, and the surface of the heat sink fin is coated with a thermal conductive material.
[0008] Furthermore, the second device includes a plurality of circuit boards, and the plurality of circuit boards include a first circuit board and a second circuit board, wherein the first circuit board is vertically connected to the substrate, and the second circuit board is parallel to the substrate.
[0009] Furthermore, there are multiple substrates, which are dispersedly arranged, and a heat dissipation space is formed between at least two of the substrates; the transformer of the power module is arranged in the heat dissipation space, and the power module also includes a thermally conductive structural adhesive, wherein the transformer is installed on the water-cooled plate, and the thermally conductive structural adhesive wraps the transformer.
[0010] Furthermore, the power module also includes a cooling fan, which is installed in the cooling space and is located above the transformer.
[0011] Further, the heat dissipation fan is installed on the first circuit board; and / or, there are multiple heat dissipation fans.
[0012] Furthermore, the second device also includes a capacitor, the capacitor is a cylindrical structure, and the axis of the capacitor is perpendicular to the substrate.
[0013] Furthermore, the power resistor of the power module is arranged in the second space, and the power resistor is installed on the side wall of the power supply casing; and / or the water cooling plate is made of metal; and / or the side of the water cooling plate facing away from the accommodating cavity is coated with a thermal conductive material; and / or the power supply casing is made of metal; and / or at least one of the inner surface and the outer surface of the power supply casing is coated with a thermal conductive material.
[0014] The beneficial effects brought by the power module of the utility model are:
[0015] When the power module is in use, the external interface is used to realize power and communication transmission. By dividing the accommodating cavity of the power module into a first space and a second space arranged along its height direction, and arranging the first device with a higher heat dissipation requirement in the first space adjacent to the water-cooling plate, and arranging the second device with a lower heat dissipation requirement in the second space far from the water-cooling plate, not only can timely heat dissipation and cooling of the first device with a high heat dissipation requirement be achieved, avoiding the normal operation of the power module being affected by excessive heat generation of the first device, but also effective utilization of the space of the power module in the height direction can be achieved, reducing the waste of the internal space of the power module, thereby well meeting the heat dissipation requirements of the high-power power module under limited volume.
[0016] In addition, by arranging the second device in the second space far from the water-cooling plate, the second device is effectively isolated from the water-cooling plate, thereby preventing the second device from being directly affected by the condensed water of the water-cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0018] Figure 1 A schematic diagram of the internal structure of a power module provided in an embodiment of the utility model.
[0019] Description of reference numerals:
[0020] 011-MOS tube; 021-first circuit board; 022-second circuit board; 023-capacitor; 031-transformer; 041-power resistor;
[0021] 100 - power supply housing; 110 - external interface; 200 - water cooling plate; 300 - accommodating cavity; 310 - first space; 320 - second space; 330 - heat dissipation space; 400 - heat dissipation fins; 500 - base plate; 600 - cooling fan; 700 - support column. DETAILED DESCRIPTION
[0022] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific embodiments of the utility model are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0023] Figure 1 This is a schematic diagram of the internal structure of the power module provided in this embodiment. Figure 1 As shown, this embodiment provides a power module, which is provided with a first device and a second device with heat dissipation requirements decreasing in sequence. Specifically, the power module includes a power supply housing 100 and a water cooling plate 200 arranged along its height direction, the power supply housing 100 has an opening and an external interface 110, the water cooling plate 200 is arranged at the opening and connected to the power supply housing 100 to form a accommodating cavity 300; the accommodating cavity 300 has a first space 310 and a second space 320 arranged along the height direction, wherein the first space 310 is adjacent to the water cooling plate 200, the first space 310 is fixedly provided with a heat dissipation fin 400, and the first device is installed on the heat dissipation fin 400; the second device is located in the second space 320.
[0024] It should be noted that the height direction of the power module is Figure 1 The up and down direction of the viewing angle.
[0025] When the power module is in use, the external interface 110 is used to realize power and communication transmission. By dividing the accommodating cavity 300 of the power module into a first space 310 and a second space 320 arranged along the height direction thereof, and arranging the first device with a higher heat dissipation requirement in the first space 310 adjacent to the water-cooling plate 200, and arranging the second device with a lower heat dissipation requirement in the second space 320 farther from the water-cooling plate 200, not only can timely heat dissipation and cooling of the first device with a high heat dissipation requirement be achieved, and the normal operation of the power module is avoided from being affected by excessive heat generation of the first device, but also the space of the power module in the height direction can be effectively utilized, and the waste of the internal space of the power module can be reduced, thereby well meeting the heat dissipation requirements of a high-power power module under a limited volume, especially the heat dissipation of a high-power density power module.
[0026] In addition, by arranging the second device in the second space 320 far from the water cooling plate 200 , the second device is effectively isolated from the water cooling plate 200 , thereby preventing the second device from being directly affected by the condensed water of the water cooling plate 200 .
[0027] Please continue to refer to Figure 1 In this embodiment, the power module may further include a substrate 500. Specifically, the substrate 500 is fixedly disposed in the accommodating cavity 300 and spaced apart from the water-cooling plate 200. The substrate 500 separates the accommodating cavity 300 into a first space 310 and a second space 320. The second device is installed on the substrate 500.
[0028] By setting the above-mentioned substrate 500, on the one hand, it is possible to achieve effective separation of the accommodating cavity 300, so as to obtain a first space 310 and a second space 320 arranged along the height direction of the power module inside. On the other hand, the setting of the substrate 500 also provides an installation basis for the second device, which not only facilitates the arrangement of the second device, but also improves the installation stability of the second device.
[0029] Please continue to refer to Figure 1 In this embodiment, the base plate 500 is fixedly connected to the water cooling plate 200 through a plurality of support columns 700, and the support columns 700 are used to support the base plate 500. This arrangement can not only ensure the installation stability of the base plate 500, but also reduce the overall weight of the power module.
[0030] It should be noted that, in other embodiments, the heat sink 400 may also be used to support the second device. This arrangement allows the heat generated by the second device to be dissipated through the heat sink 400, which is beneficial to improving the heat dissipation efficiency.
[0031] Please continue to refer to Figure 1In this embodiment, one end of the heat dissipation fin 400 is mounted on the water cooling plate 200, and the other end of the heat dissipation fin 400 is fixedly connected to the base plate 500. Specifically, the heat dissipation fin 400 includes a connecting column and a fin disposed on the periphery of the connecting column, wherein the connecting column is connected to the water cooling plate 200, and the fin is parallel to the water cooling plate 200.
[0032] This connection method of the heat dissipation fins 400 can not only ensure the heat dissipation efficiency, but also provide a certain support to the substrate 500 .
[0033] Specifically, the heat dissipation fins 400 are vertically mounted on the water-cooling plate, that is, the connecting columns of the heat dissipation fins 400 are vertically connected to the water-cooling plate 200 .
[0034] Please continue to refer to Figure 1 In this embodiment, the first device includes a MOS tube 011, and a ceramic sheet (not shown in the figure) is provided between the MOS tube 011 and the heat sink fin 400 for separating the two, and the surface of the heat sink fin 400 is coated with a thermal conductive material.
[0035] By arranging the above-mentioned ceramic sheet between the MOS tube 011 and the heat sink fin 400, insulation between the MOS tube 011 and the power supply housing 100 can be achieved; by coating the surface of the heat sink fin 400 with thermal conductive material, the heat dissipated by the MOS tube 011 can be quickly conducted to the heat sink fin 400, thereby improving the heat dissipation efficiency and ensuring the heat dissipation effect.
[0036] Specifically, the material of the ceramic sheet may be alumina.
[0037] Please continue to refer to Figure 1 In this embodiment, the second device includes a plurality of circuit boards, and the plurality of circuit boards include a first circuit board 021 and a second circuit board 022 , wherein the first circuit board 021 is vertically connected to the substrate 500 , and the second circuit board 022 is parallel to the substrate 500 .
[0038] By arranging the multiple circuit boards of the power module in a vertical + horizontal form, on the one hand, the vertical first circuit board 021 can realize the effective utilization of the upper space of the power module, which is beneficial to reduce the volume of the power module. On the other hand, the horizontal second circuit board 022 can meet the purpose of outputting the signal through the external interface 110 to ensure the use function of the power module.
[0039] In this embodiment, both the first circuit board 021 and the second circuit board 022 may be PCBs (Printed Circuit Board).
[0040] Please continue to refer to Figure 1In this embodiment, there are multiple substrates 500, which are dispersedly arranged, and a heat dissipation space 330 is formed between at least two substrates 500; the transformer 031 of the power module is arranged in the above heat dissipation space 330, and the power module also includes a thermal conductive structural adhesive, wherein the transformer 031 is installed on the water cooling plate 200, and the thermal conductive structural adhesive wraps the transformer 031. Specifically in this embodiment, there are two substrates 500, and the two substrates 500 are arranged along the left and right directions ( Figure 1 A heat dissipation space 330 is formed between the two substrates 500.
[0041] By arranging multiple substrates 500 at intervals, a heat dissipation space 330 can be formed between the substrates 500, so that the larger transformer 031 in the power module can be arranged. In addition, by wrapping the transformer 031 with a thermally conductive structural adhesive, the heat generated during the operation of the transformer 031 can be transferred to the heat dissipation space 330 and the water-cooling plate 200 through the thermally conductive structural adhesive, thereby improving the heat dissipation efficiency of the transformer 031 and ensuring that the operating temperature during high-power output is within a safe range.
[0042] It should be noted that, in this embodiment, when the transformer 031 is wrapped with the thermally conductive structural adhesive, the input and output wires of the transformer 031 need to be led out.
[0043] Please continue to refer to Figure 1 In this embodiment, the power module may further include a cooling fan 600. Specifically, the cooling fan 600 is installed in the cooling space 330, and the cooling fan 600 is located on the side of the transformer 031 away from the water cooling plate 200. Figure 1 From the perspective of FIG. 6 , the cooling fan 600 is located above the transformer 031 .
[0044] By setting a cooling fan 600 above the transformer 031 in the cooling space 330, the cooling fan 600 can be used to increase the gas flow in the cooling space 330, so that the hot air can be discharged as quickly as possible, thereby further improving the cooling efficiency of the power module of this embodiment.
[0045] Please continue to refer to Figure 1 In this embodiment, the heat dissipation fan 600 is installed on the first circuit board 021.
[0046] This setting utilizes the first circuit board 021 as the installation base for the cooling fan 600, and there is no need to additionally set up an installation structure for installing the cooling fan 600. On the one hand, it can reduce the occupation of the internal space of the power module, which is beneficial to reducing the volume of the power module. On the other hand, it can also reduce the cost of the power module.
[0047] Please continue to refer to Figure 1In this embodiment, the number of the cooling fans 600 is multiple. Specifically, in this embodiment, the number of the cooling fans 600 is two, and the two cooling fans 600 are arranged along the left and right directions ( Figure 1 side by side in the viewing angle).
[0048] By increasing the number of the heat dissipation fans 600 , the gas flowability in the heat dissipation space 330 can be improved, thereby further improving the heat dissipation efficiency.
[0049] Please continue to refer to Figure 1 In this embodiment, the second device further includes a capacitor 023 , and the capacitor 023 is a cylindrical structure. The capacitor 023 is mounted on the substrate 500 through one end surface, and the axis of the capacitor 023 is perpendicular to the substrate 500 .
[0050] That is, the device with low heat dissipation requirement in the power module also includes capacitor 023. By installing capacitor 023 on substrate 500 with its axis perpendicular to substrate 500, capacitor 023 is also placed vertically, which can also effectively utilize the upper space of the power module, thereby facilitating reducing the volume of the power module.
[0051] Please continue to refer to Figure 1 In this embodiment, the power resistor 041 of the power module is disposed in the second space 320, and the power resistor 041 is installed on the side wall of the power housing 100. The power resistor 041 may be an ultra-thin resistor.
[0052] During the use of the power module, the power resistor 041 consumes the energy stored in the capacitor 023 and also has a heat dissipation requirement. By installing the power resistor 041 on the side wall of the power housing 100, the power housing 100 can be used to dissipate the heat generated by the power resistor 041. On the one hand, the power housing 100 forms the installation base of the power resistor 041 to ensure the installation reliability of the power resistor 041. On the other hand, it can also meet the lower heat dissipation requirement of the power resistor 041.
[0053] In this embodiment, the water cooling plate 200 is made of metal, which can ensure the heat dissipation reliability of the water cooling plate 200.
[0054] In actual use, the power module can directly contact the water cooling device through the water cooling plate 200 to dissipate heat by heat conduction.
[0055] Specifically, the water cooling plate 200 may be made of aluminum alloy.
[0056] In this embodiment, a heat-conducting material is coated on one side of the water-cooling plate 200 that is away from the accommodating cavity 300. This arrangement can speed up the heat conduction rate from the water-cooling plate 200 to the water-cooling device, thereby improving the heat dissipation efficiency.
[0057] Specific to Figure 1 From the perspective of , that is, the lower surface of the water-cooling plate 200 is coated with a thermally conductive material.
[0058] In this embodiment, the power supply housing 100 is made of metal, which can not only ensure the structural strength of the power supply housing 100, but also improve the electromagnetic compatibility performance of the power supply module.
[0059] In this embodiment, at least one of the inner surface and the outer surface of the power supply housing 100 is coated with a thermal conductive material. This arrangement can improve the heat dissipation efficiency of the power supply housing 100 .
[0060] It should be noted that, in the present embodiment, the thermally conductive material coated on the heat sink fins 400 , the thermally conductive material coated on the water cooling plate 200 , and the thermally conductive material coated on the power supply housing 100 may all be thermally conductive silicone grease.
[0061] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.
[0062] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
[0063] In the above embodiments, the descriptions of directions such as “upper”, “lower”, “left”, “right”, and “side” are all based on the drawings.
[0064] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A power module, provided with a first device and a second device having successively decreasing heat dissipation requirements, characterized in that: The power module comprises a power housing (100) and a water cooling plate (200) arranged along its height direction, the power housing (100) having an opening and an external interface (110), the water cooling plate (200) being arranged at the opening and connected to the power housing (100) to form a receiving cavity (300); the receiving cavity (300) having a first space (310) and a second space (320) arranged along the height direction, wherein the first space (310) is adjacent to the water cooling plate (200), a heat dissipation fin (400) is fixedly arranged in the first space (310), and the first component is mounted on the heat dissipation fin (400); and the second component is located in the second space (320).
2. The power module according to claim 1, characterized in that: The power module further comprises a substrate (500), wherein the substrate (500) is fixedly disposed in the accommodating cavity (300) and spaced apart from the water-cooling plate (200), and the substrate (500) divides the accommodating cavity (300) into the first space (310) and the second space (320); and the second device is mounted on the substrate (500).
3. The power module according to claim 2, characterized in that: One end of the heat dissipation fin (400) is mounted on the water-cooling plate (200), and the other end of the heat dissipation fin (400) is fixedly connected to the base plate (500).
4. The power module according to claim 1, characterized in that: The first device comprises a MOS tube (011), a ceramic sheet for separating the MOS tube (011) and the heat sink fin (400) is arranged between the two, and a surface of the heat sink fin (400) is coated with a thermal conductive material.
5. The power module according to claim 2, characterized in that: The second device comprises a plurality of circuit boards, wherein the plurality of circuit boards comprises a first circuit board (021) and a second circuit board (022), wherein the first circuit board (021) is vertically connected to the substrate (500), and the second circuit board (022) is parallel to the substrate (500).
6. The power module according to claim 5, characterized in that: There are a plurality of substrates (500), the plurality of substrates (500) are dispersedly arranged, and a heat dissipation space (330) is formed between at least two of the substrates (500); the transformer (031) of the power module is arranged in the heat dissipation space (330), and the power module further comprises a thermally conductive structural adhesive, wherein the transformer (031) is installed on the water cooling plate (200), and the thermally conductive structural adhesive wraps the transformer (031).
7. The power module according to claim 6, characterized in that: The power module further comprises a cooling fan (600), wherein the cooling fan (600) is installed in the cooling space (330), and the cooling fan (600) is located above the transformer (031).
8. The power module according to claim 7, characterized in that: The heat dissipation fan (600) is installed on the first circuit board (021); and / or, there are multiple heat dissipation fans (600).
9. The power module according to claim 2, characterized in that: The second device further comprises a capacitor (023), wherein the capacitor (023) is a cylindrical structure, and the axis of the capacitor (023) is perpendicular to the substrate (500).
10. The power module according to any one of claims 1 to 8, characterized in that: The power resistor (041) of the power module is arranged in the second space (320), and the power resistor (041) is installed on the side wall of the power supply housing (100); and / or the water cooling plate (200) is made of metal; and / or the side of the water cooling plate (200) facing away from the accommodating cavity (300) is coated with a thermal conductive material; and / or the power supply housing (100) is made of metal; and / or at least one of the inner surface and the outer surface of the power supply housing (100) is coated with a thermal conductive material.