Power supply module
By placing the rectifier diode, inductor module and transistor in the power module U-shaped layout around the cold path of the cold plate in the power module, the existing power supply structure compactness and heat dissipation problems are solved, and higher space utilization and smaller Volume structure.
Patent Information
- Application Number
- CN202420859785.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The existing hydrogen production power supply structure has a less compact layout due to heat dissipation problems, which occupies a large space and insufficient space utilization.
By placing the rectifier diode, inductance module and transistor around the cold path of the cold plate, the three major heat sources are more compact in the internal structure of the box, occupy less space, and ensure heat dissipation effect.
It realizes that the space utilization rate of the power module is improved, the volume structure of the power module is reduced, and the compactness and performance of the power module are improved without affecting the heat dissipation effect.
Smart Images

Figure CN222234664U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of battery technology, and in particular to a power module. Background Art
[0002] It is inevitable that green hydrogen will gradually replace grey hydrogen. According to the forecast of major international energy organizations, the output of green hydrogen such as water electrolysis will account for 34% in 2030. By 2060, almost all hydrogen demand will be met by low-emission technologies, of which nearly 80% will be water electrolysis. Hydrogen energy is praised by the international community as the clean energy with the greatest development potential in the 21st century. The technological innovation and industrial development of hydrogen energy continue to be favored, so it is necessary to seize the opportunity and commanding heights of industrial development.
[0003] The existing hydrogen production power supply structure often needs to consider the heat dissipation problem, so the structural layout is not compact enough. The existing structural layout occupies most of the space of the structure, resulting in a large power supply structure and insufficient space utilization. Therefore, a new technical solution is urgently needed to solve the existing technical problems. Utility Model Content
[0004] The purpose of the present application is to provide a power supply module, which has a compact layout and high space utilization without affecting the heat dissipation effect.
[0005] To this end, an embodiment of the present application provides a power supply module, comprising: a box body, the box body comprising a main body, and a first cover plate and a second cover plate assembled on the main body; a cold plate, arranged in the box body, the cold plate is provided with a cold channel, the cold plate is provided with a rectifier diode, a transistor and an inductor module along the cold channel, and the order in which the rectifier diode, the transistor and the inductor module are arranged on the cold channel is adjustable.
[0006] In a possible implementation manner, a metal conductive busbar is further included, and the metal conductive busbar is arranged between the inductor module and the transistor to electrically connect the inductor module to the transistor.
[0007] In a possible implementation, an output capacitor plate is further included, and the output capacitor plate is arranged on the cold plate and close to the rectifier diode.
[0008] In a possible implementation manner, a Hall sensor is further included, and the Hall sensor is arranged between the rectifier diode and the output capacitor plate along the cold channel.
[0009] In a possible implementation, the inductor module is constructed by integrating a plurality of inductors and a metal shell into one module.
[0010] In a possible implementation, the cold plate is a water-cooled plate, which is provided with a water inlet joint and a water outlet joint, the water inlet joint and the water outlet joint extend outside the box body, and the first cover plate is provided with positioning holes for fixing the water inlet joint and the water outlet joint.
[0011] In a possible implementation, a positive electrode output metal bar and a negative electrode output metal bar are disposed on the first cover plate, and the positive electrode output metal bar is electrically connected to the negative electrode output metal bar.
[0012] In a possible implementation, a through-the-wall terminal for connecting an input line is further provided on the first cover plate, and the through-the-wall terminal is fixed to the first cover plate by screws.
[0013] In a possible implementation, an indicator light, a signal terminal, and a debugging network port are provided on the second cover plate, and the indicator light, the signal terminal, and the debugging network port are used to display the status of the power module.
[0014] In a possible implementation, the second cover plate is further provided with a handle for installing the power module on a cabinet.
[0015] According to the power module provided in the embodiment of the present application, the power module arranges the three major heat sources, namely the rectifier diode, the inductor module and the transistor, in a U-shaped layout around the cold channel of the cold plate, which does not affect the heat dissipation effect of the three major heat sources, and makes the internal structure layout of the rectifier diode, the inductor module and the transistor in the box more compact, occupies less internal space of the power module, improves the space utilization of the power module, or reduces the volume structure of the power module. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In addition, in the drawings, the same components are marked with the same reference numerals, and the drawings are not drawn according to the actual scale.
[0017] Figure 1 The external structure of the power module provided in the embodiment of the present application is shown as follows Figure 1 ;
[0018] Figure 2 The external structure of the power module provided in the embodiment of the present application is shown as follows Figure 2 ;
[0019] Figure 3A schematic diagram showing the internal structure of a power module provided in an embodiment of the present application is shown;
[0020] Description of reference numerals:
[0021] 1. Box body; 101. First cover plate; 102. Second cover plate;
[0022] 2. Cold plate;
[0023] 3. Rectifier diode;
[0024] 4. Transistor;
[0025] 5. Inductor module;
[0026] 6. Metal conductive busbar;
[0027] 7. Output capacitor plate;
[0028] 8. Hall sensor;
[0029] 9. Water inlet connector;
[0030] 10. Water outlet connector;
[0031] 11. Positive output metal busbar;
[0032] 12. Negative output metal busbar;
[0033] 13. Through-wall terminal;
[0034] 14. Indicator light;
[0035] 15. Signal terminal;
[0036] 16. Debug network port;
[0037] 17. Handle. DETAILED DESCRIPTION
[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0039] It is inevitable that green hydrogen will gradually replace grey hydrogen. According to the forecast of major international energy organizations, the output of green hydrogen such as water electrolysis will account for 34% in 2030. By 2060, almost all hydrogen demand will be met by low-emission technologies, of which nearly 80% will be water electrolysis. Hydrogen energy is praised by the international community as the clean energy with the greatest development potential in the 21st century. The technological innovation and industrial development of hydrogen energy continue to be favored, so it is necessary to seize the opportunity and commanding heights of industrial development.
[0040] However, the existing hydrogen production power supply structure often needs to consider the heat dissipation problem, so the structural layout is not compact enough. The existing structural layout occupies most of the space of the structure, resulting in a large power supply structure and insufficient space utilization. In order to solve the above technical problems, the embodiment of the present application provides a power supply module, which improves the space utilization of the hydrogen production power supply structure through a compact structural layout, or reduces the volume structure of the power supply module.
[0041] Specifically, see Figures 1 to 3 The embodiment of the present application provides a power module, which includes a box body 1, and a cold plate 2, a rectifier diode 3, a transistor 4 and an inductor module 5 arranged in the box body 1. The box body 1 includes a main body, and a first cover plate 101 and a second cover plate 102 assembled on the main body. In the embodiment of the present application, since the existing power supply structure is mostly a square structure for easy installation and placement, the box body 1 provided in the embodiment of the present application is a cubic structure, and a cavity is arranged in the box body 1; the cold plate 2 is arranged in the box body 1, and the cold plate 2 is provided with a cold channel for heat conduction on its plate surface, and the cold channel is a circulating cold channel so that the power module circulates and dissipates heat; the cold plate 2 is provided with a rectifier diode 3, a transistor 4 and an inductor module 5 along the cold channel, and the order in which the rectifier diode 3, the transistor 4 and the inductor module 5 are arranged on the cold channel is adjustable.
[0042] Preferably, the rectifier diode 2, the transistor 3 and the inductor module 4 form a U shape on the cold plate 2 along the cold channel.
[0043] In a fixed setting of the present application, the rectifier diode 3 is arranged on the cold plate 2 and is arranged at the first position of the cold channel along the water-cooled heat dissipation channel; the transistor 4 is arranged on the cold plate 2 and is located at the second position of the cold channel along the cold channel; the inductor module 5 is arranged on the cold plate 2 and is located at the third position of the cold channel along the cold channel.
[0044] Through the above structural settings, such as Figure 3As shown, the three major heat sources in the power module, namely the rectifier diode 3, the transistor 4 and the inductor module 5, form a U shape along the cold channel on the cold plate 2. Through such a structural layout, the layout of the rectifier diode 3, the transistor 4 and the inductor module 5 on the cold plate 2 is more compact, and the layout of the three major heat sources is arranged around the cold channel of the cold plate 2, which will not affect the heat dissipation effect. While ensuring the heat dissipation effect, the space utilization rate inside the box 1 is improved, or the volume structure of the power module is reduced from the manufacturing perspective.
[0045] In the embodiment of the present application, as mentioned above, the three major heat sources are the rectifier diode 3, the transistor 4 and the inductor module 5, among which the transistor 4 is an IGBT module, which plays a key role as the main functional electronic component of the power module. Therefore, ensuring its good heat dissipation effect is the key to ensuring its excellent performance. The embodiment of the present application sets it at the end position of the cold plate 2, i.e., the third position, to facilitate power-on and circulating heat dissipation.
[0046] In an optional example, the power supply module provided in the embodiment of the present application also includes a metal conductive busbar 6, which is arranged between the transistor 4 and the inductor module 5 to electrically connect the transistor 4 to the inductor module 5. The metal conductive busbar 6 is preferably connected to a copper busbar, which has good electrical and thermal conductivity, as well as good signal transmission capability. By arranging the copper busbar between the transistor 4 and the inductor module 5, when the circuit is turned on, the auxiliary heat conduction function can be further achieved.
[0047] In an optional example, the power module provided in the embodiment of the present application further includes an output capacitor plate 7, which is arranged on the cold plate 2 and close to the rectifier diode 3. The output capacitor plate 7 is used to store energy and stabilize the voltage of the rectifier diode 3. By integrating the output capacitor plate 7 at a position close to the rectifier diode 3, the structure inside the box 1 is further made compact, thereby improving the utilization rate of the space inside the box 1.
[0048] In an optional example, the necessary electronic components of the hydrogen production power supply structure provided in the embodiment of the present application also include a Hall sensor 8, and the Hall sensor 8 is arranged between the rectifier diode 3 and the output capacitor plate 7 along the cold channel.
[0049] In an optional example, the inductor module 5 is constructed by integrating a plurality of inductors and a metal shell into one module.
[0050] Preferably, the inductor module 5 is constructed to integrate three inductors and an aluminum shell into one module. With such a structure, the inductor module 5 can efficiently input direct current, and the three inductors are integrated into one module instead of being dispersed, thereby reducing the space occupied.
[0051] The above is the internal structure layout setting of the power module provided in the embodiment of the present application. Through the compact layout setting of the internal structure, while improving the space utilization, the functions of the electronic components in the power module will not be affected and the heat dissipation effect is good.
[0052] Next, the external structure of the power module provided in the embodiment of the present application is introduced:
[0053] In an optional example, the cold plate 2 provided in the embodiment of the present application is a water-cooled plate, and the cold plate 2 in the box body 1 is provided with a water inlet joint 9 and a water outlet joint 10, and the water inlet joint 9 and the water outlet joint 10 extend outside the box body 1, and accordingly, the first cover plate 101 is provided with positioning holes for fixing the water inlet joint 9 and the water outlet joint 10.
[0054] like Figure 1 As shown, the water inlet joint 9 and the water outlet joint 10 are arranged corresponding to the cold plate 2 inside the box body 1. When extended to the outside of the box body 1, the water inlet joint 9 and the water outlet joint 10 are just located on the surface of the first cover plate 101. The circulating water can be input and output into and out of the cold plate 2 through the water inlet joint 9 and the water outlet joint 10.
[0055] In the embodiment of the present application, the water inlet joint 9 and the water outlet joint 10 are both quick-install joints, which are convenient for installation and removal with the internal cold plate 2.
[0056] It should be noted that, in actual applications, those skilled in the art may also set the cold plate 2 as an air-cooled plate, on which corresponding air inlets and outlets are set to complete an air-cooled cycle. Such flexible changes and adjustments do not deviate from the principles and scope of the present application and should be limited within the scope of protection of the present application.
[0057] In an optional example, a positive electrode output metal bar 11 and a negative electrode output metal bar 12 are provided on the first cover plate 101, and the positive electrode output metal bar 11 and the negative electrode output metal bar 12 are preferably copper bars, and the positive electrode output metal bar 11 is conductively connected to the negative electrode output metal bar 12, and the positive and negative electrode output metal bars are provided on the outer wall of the first cover plate 101 for connecting to an external socket, and the positive electrode output metal bar 11 and the negative electrode output metal bar 12 are conductively connected on the first cover plate 101, which can effectively avoid eddy currents generated by the positive and negative electrodes.
[0058] Furthermore, a through-the-wall terminal 13 for connecting an input line is also provided on the first cover plate 101 , and the through-the-wall terminal 13 is fixed to the first cover plate 101 by screws.
[0059] In an alternative example, Figure 2As shown, the second cover plate 102 is provided with an indicator light 14 , a signal terminal 15 and a debugging network port 16 , and the indicator light 14 , the signal terminal 15 and the debugging network port 16 are used to display the status of the power module.
[0060] For example, the indicator light 14 is divided into different colors to indicate different working states or faults, etc. The signal terminal 15 is used as a device interface to connect external electronic components, and the debugging network port 16 is used by staff to test or debug the power module, etc.
[0061] In an optional example, the second cover plate 102 is further provided with a handle 17 for installing the power module on a cabinet. The power module provided in the present application can be installed in a cabinet or other equipment through the handle 17 for application.
[0062] The above is the external structure layout setting of the power module provided in the embodiment of the present application. Through the above-mentioned layout setting of the external structure, it is closely connected and coordinated with the internal structure to further ensure the normal operation of the power module provided in the embodiment of the present application.
[0063] It should be noted that the power supply module provided in the embodiment of the present application is only introduced and described around the three major heat sources provided in the present application. Other electronic components not involved are existing technologies that can be adjusted and adapted by personnel in this field according to actual conditions, and will not be repeated in this application.
[0064] According to the power module provided in the embodiment of the present application, the power module arranges the three major heat sources, namely the rectifier diode, the inductor module and the transistor, in a U-shaped layout around the cold channel of the cold plate, which does not affect the heat dissipation effect of the three major heat sources, and makes the internal structure layout of the rectifier diode, the inductor module and the transistor in the box more compact, occupies less internal space of the power module, improves the space utilization of the power module, or reduces the volume structure of the power module.
[0065] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.
[0066] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).
[0067] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0068] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A power module, characterized in that: include: A box body, the box body comprising a main body, and a first cover plate and a second cover plate assembled on the main body; A cold plate is arranged in the box, the cold plate is provided with a cold channel, the cold plate is provided with a rectifier diode, a transistor and an inductor module along the cold channel, and the order in which the rectifier diode, the transistor and the inductor module are arranged on the cold channel is adjustable.
2. The power module according to claim 1, characterized in that: It also includes a metal conductive busbar, which is arranged between the inductor module and the transistor to electrically connect the inductor module and the transistor.
3. The power module according to claim 1, characterized in that: It also includes an output capacitor plate, which is arranged on the cold plate and close to the rectifier diode.
4. The power module according to claim 3, characterized in that: A Hall sensor is also included, and the Hall sensor is arranged between the rectifier diode and the output capacitor plate along the cold channel.
5. The power module according to claim 1, characterized in that: The inductor module is constructed by integrating a plurality of inductors and a metal shell into one module.
6. The power module according to claim 1, characterized in that: The cold plate is a water-cooled plate, and the water-cooled plate is provided with a water inlet joint and a water outlet joint, the water inlet joint and the water outlet joint extend outside the box body, and the first cover plate is provided with positioning holes for fixing the water inlet joint and the water outlet joint.
7. The power module according to claim 1, characterized in that: The first cover plate is provided with a positive electrode output metal bar and a negative electrode output metal bar, and the positive electrode output metal bar is electrically connected to the negative electrode output metal bar.
8. The power module according to claim 1, characterized in that: The first cover plate is also provided with a through-wall terminal for connecting an input line, and the through-wall terminal is fixed to the first cover plate by screws.
9. The power module according to claim 1, characterized in that: The second cover plate is provided with an indicator light, a signal terminal and a debugging network port, and the indicator light, signal terminal and debugging network port are used to display the status of the power module.
10. The power module according to claim 1, characterized in that: The second cover plate is also provided with a handle for installing the power module on the cabinet.
