Heat dissipation mechanism of small-sized chord motor driver

Abstract

The utility model relates to the technical field of driver heat dissipation, and particularly discloses a heat dissipation mechanism of a small-sized chord motor driver, which comprises a substrate for bearing, a component is arranged at the top of the substrate, and a heat conduction upper plate and a heat conduction bottom plate are arranged at the bottom of the substrate and are used for guiding heat of the substrate; a fixed distance is kept between the top of the heat-conducting upper plate and the substrate, and one or more assemblies are arranged at the distance; the assembly comprises one or more VC vapor chambers; through the combination of the heat conduction upper plate and the heat conduction bottom plate which are matched with the base plate, the heat conduction device can be matched with filled heat conduction media to achieve heat conduction during use, and through the combination of the arranged fan, when the heat conduction device is used, the fan is utilized to enable the fins to make full contact with the air, the unique arrangement of the fins is utilized, air circulation can be better achieved, and the heat conduction efficiency is improved. In addition, the clamping frame and the heat conduction bottom plate are arranged at the bottoms of the fins, so that the stability of the fins can be kept.

Description

Technical Field

[0001] The utility model relates to the technical field of driver heat dissipation, in particular to a heat dissipation mechanism of a small-sized outboard motor driver. Background Art

[0002] In the application of small outboard motor drivers, due to the large motor power and high output current, a large amount of heat is generated during operation, which places high demands on the heat dissipation of the circuit board. If the heat dissipation is not good, the ambient temperature of the circuit board will be high, which will cause the temperature of some components on the circuit board to rise, resulting in failures. In severe cases, it may cause the components to burn out or even cause the entire system to crash. Therefore, the origin of the heat dissipation problem is that the heat generated by the large amount of power consumption of the circuit board during operation cannot be dissipated in time, causing the temperature inside the circuit board to remain high, thereby causing failures and damage to the system.

[0003] However, due to the miniaturization factor, the heat dissipation measures of the circuit board are limited when it is used. The heat from the outside world and the operating power consumption of components can easily affect the circuit board. Based on this, it is necessary to improve the heat dissipation measures of the circuit board. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a heat dissipation mechanism for a small-sized outboard motor driver, which is used to solve the problems raised by the above-mentioned background technology.

[0005] The heat dissipation mechanism of the small outboard motor driver of the utility model comprises a substrate for carrying, components are arranged on the top of the substrate, and a heat-conducting upper plate and a heat-conducting bottom plate are arranged on the bottom of the substrate to guide the heat of the substrate;

[0006] A fixed distance is maintained between the top of the heat-conducting upper plate and the base plate, and one or more assemblies are arranged at the distance;

[0007] The assembly includes one or more VC vapor chambers, a filling gap is arranged between every two of the VC vapor chambers, and the filling gap is filled with thermal conductive paint.

[0008] As a further improvement of the present invention, the substrate includes a plate body 1, and positioning holes are provided at diagonal positions of the four sides of the frame of the plate body 1 for fixing the substrate.

[0009] As a further improvement of the present invention, the heat-conducting upper plate includes a second plate body, and a second combination hole adapted to the positioning hole is provided at the diagonal portions of the frame around the bottom of the second plate body for combining the substrate and the heat-conducting upper plate.

[0010] As a further improvement of the utility model, one or more fins arranged in an array are provided at the bottom of the plate body 2, and a groove adapted to the plate body 2 is opened in the middle of the multiple fins, and a fan is provided in the groove to guide the circulation of air.

[0011] As a further improvement of the utility model, the heat-conducting base plate includes a plate body three, and a card frame corresponding to the fin is arranged on one side of the plate body three close to the fin of the plate body two, and grooves are arranged in the middle of multiple card frames, and a guide ring is arranged at the groove for adapting to the fan to guide air circulation.

[0012] As a further improvement of the present invention, a combination hole three matching with the combination hole two is opened at the diagonal positions of the frame around the bottom of the plate body three, and the positioning hole, the combination hole two and the combination hole three are connected by fasteners.

[0013] As a further improvement of the utility model, a support column is provided in the middle of the guide ring, and the support column is abutted and adapted with the middle of the fan.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model uses a combination of a set substrate, a set heat-conducting upper plate and a set heat-conducting bottom plate. When in use, it can cooperate with the filled heat-conducting medium to realize the heat extraction. Combined with the set fan, when in use, the fan is used to allow the fins to fully contact with the air. The unique arrangement of the fins can better realize the air circulation to meet the heat dissipation needs, and the card frame and the heat-conducting bottom plate set at the bottom of the fins can keep the fins stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the front view structure of the substrate, the heat-conducting upper plate and the heat-conducting bottom plate combination of the utility model;

[0018] Figure 2 This is a schematic diagram of the top view of the substrate structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the top view of the heat-conducting upper plate of the utility model;

[0020] Figure 4 It is a schematic diagram of the top view of the heat-conducting bottom plate of the utility model.

[0021] In the figure: 1, substrate; 2, heat-conducting upper plate; 3, heat-conducting bottom plate; 4, assembly;

[0022] 11. Plate body 1; 12. Positioning hole;

[0023] 21. Plate body 2; 22. Combination hole 2; 23. Fins; 24. Fan;

[0024] 31. Plate body three; 32. Card frame; 33. Support column; 34. Guide ring; 35. Combination hole three;

[0025] 41. VC heat spreader; 42. Filling gap. DETAILED DESCRIPTION

[0026] The following will disclose multiple embodiments of the utility model with diagrams. For the purpose of clear description, many physical details will be described together in the following description. However, it should be understood that these physical details should not be used to limit the utility model. In other words, in some embodiments of the utility model, these physical details are not necessary. In addition, for the purpose of simplifying the diagram, some conventional structures and components will be depicted in a simple schematic manner in the diagram.

[0027] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0028] See also Figure 1 , Figure 2 as well as Figure 3 In the application of small outboard motor drivers, since the motor power is large and the output current is also high, a large amount of heat is generated during operation, which places high demands on the heat dissipation of the circuit board. If the heat dissipation is not good, the ambient temperature of the circuit board is high, which will cause the temperature of some components on the circuit board to rise, thereby causing failures. Based on this, the present application provides a heat dissipation mechanism for a small outboard motor driver, including a substrate 1 for carrying, components are arranged on the top of the substrate 1, and a heat-conducting upper plate 2 and a heat-conducting bottom plate 3 are arranged at the bottom of the substrate 1 to guide the heat of the substrate 1;

[0029] A fixed distance is maintained between the top of the heat-conducting upper plate 2 and the base plate 1, and one or more assemblies 4 are arranged at the distance;

[0030] The assembly 4 includes one or more VC vapor chambers 41 . A filling gap 42 is disposed between every two VC vapor chambers 41 . The filling gap 42 is filled with thermal conductive paint.

[0031] The VC heat spreader 41 has good thermal conductivity and can quickly transfer the heat on the substrate 1 to the thermally conductive upper plate 2. Filling the gap 42 with thermally conductive paint can further increase the heat dissipation surface area and improve the heat transfer efficiency.

[0032] The working principle of this heat dissipation mechanism is that when the substrate 1 generates heat, the heat is conducted to the top of the substrate 1 through the components. Then, the VC heat spreader 41 quickly conducts the heat to the thermally conductive upper plate 2, and further conducts the heat through the thermally conductive paint in the gap 42. Finally, the thermally conductive upper plate 2 dissipates the heat to the outside to achieve the purpose of heat dissipation.

[0033] This heat dissipation mechanism has the characteristics of simple structure and good heat dissipation effect. By combining the VC heat spreader 41 and the filled thermal conductive paint, the heat dissipation path is shorter and the thermal conductivity is more efficient, thereby effectively solving the heat dissipation problem in the small outboard motor driver and ensuring the stable operation of the circuit board.

[0034] See also Figure 2 The substrate 1 includes a plate body 11 , and positioning holes 12 are provided at diagonal positions of the four sides of the frame of the plate body 11 for fixing the substrate 1 .

[0035] When installing the substrate 1, the operator can place the substrate 1 in a fixed position through the positioning holes 12, and then fix the substrate 1 in the desired position with corresponding screws. The design of the positioning holes 12 can not only ensure the firmness of the substrate 1, but also prevent the substrate 1 from shaking during use, which may affect the normal operation of the components on the substrate 1. At the same time, the setting of the positioning holes 12 can also simplify the installation process of the substrate 1 and improve the operating efficiency.

[0036] See also Figure 1 , Figure 2 as well as Figure 3 The heat-conducting upper plate 2 includes a plate body 21, and a combination hole 22 adapted to the positioning hole 12 is arranged at the diagonal positions of the frame around the bottom of the plate body 21, which is used for the combination of the substrate 1 and the heat-conducting upper plate 2. The substrate 1 can be connected to the heat-conducting upper plate 2 through the combination hole 22 to achieve the purpose of heat conduction and heat dissipation.

[0037] The bottom of the plate body 21 is provided with one or more fins 23 arranged in an array. A groove adapted to the plate body 21 is provided in the middle of the plurality of fins 23. A fan 24 is provided at the groove to guide the circulation of air. The design of the fins 23 is intended to increase the surface area and provide a larger heat dissipation surface to enhance the heat dissipation effect. A groove adapted to the plate body 21 is provided in the middle of the plurality of fins 23 to install the fan 24. Such a design can ensure that the fan 24 is tightly combined with the fins 23 to guide the circulation of air.

[0038] When the fan 24 is working, it will generate a strong wind force, and through the arrangement of the fins 23 and the guidance of the grooves, the air is effectively blown to the fins 23, increasing the contact area between the fins 23 and the air, accelerating the transfer and dissipation of heat. In this way, the heat on the fins 23 can be effectively transferred to the surrounding air, and the air circulation can be maintained, thereby achieving a good heat dissipation effect.

[0039] This heat dissipation mechanism takes the heat-conducting upper plate 2 as the core, combines the base plate 1 and the heat-conducting upper plate 2 together through the connection of the combination holes, and simultaneously utilizes the combination of the fins 23 and the fan 24 to increase the heat dissipation surface area and promote air circulation, thereby achieving an efficient heat dissipation effect.

[0040] See also Figure 1 , Figure 2 , Figure 3 as well as Figure 4 The heat-conducting bottom plate 3 includes a plate body 31. A card frame 32 corresponding to the fin 23 is provided on one side of the plate body 31 close to the fin 23 of the plate body 21. A groove is provided in the middle of the plurality of card frames 32. A guide ring 34 is provided at the groove to match the fan 24 and guide air circulation. The frame is designed to match the fin 23 and increase the mechanical strength. A groove is provided in the middle of the plurality of card frames 32, and a guide ring 34 is installed at these grooves. The function of the guide ring 34 is to match the fan 24 and guide air circulation to achieve a better heat dissipation effect.

[0041] The bottom of the plate body 31 is provided with a combination hole 35 adapted to the combination hole 22 at the diagonal positions of the frame around the periphery. The positioning hole 12, the combination hole 22 and the combination hole 35 are connected by fasteners. The combination hole is provided to connect the heat-conducting bottom plate 3 with the heat-conducting upper plate 2 and the base plate 1. The fasteners are used to fix the heat-conducting bottom plate 3 and the stability and reliability of the entire heat dissipation structure.

[0042] A support column 33 is provided in the middle of the guide ring 34, and the support column 33 abuts and fits with the middle of the fan 24. The support column 33 abuts and fits with the middle of the fan 24. The function of the support column 33 is to strengthen the fixation and support of the fan 24 and ensure that the fan 24 can operate stably. At the same time, the support column 33 can also optimize the air flow path and guide the air to the fins 23 to improve the heat dissipation effect.

[0043] The heat-conducting bottom plate 3 corresponds to the fins 23 through the clamp frame 32, ensuring the firmness of the mechanical connection. The setting of the guide ring 34 and the design of the support column 33 make the connection between the fan 24 and the heat-conducting bottom plate 3 tight and able to maintain a stable working state. The entire heat dissipation mechanism provides a reliable heat dissipation solution for small outboard motor drivers through reasonable combination and optimized structure.

[0044] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A heat dissipation mechanism for a small-sized outboard motor driver, comprising a substrate (1) for carrying, components are arranged on the top of the substrate (1), and a heat-conducting upper plate (2) and a heat-conducting bottom plate (3) are arranged on the bottom of the substrate (1) for guiding the heat of the substrate (1); Features: A fixed distance is maintained between the top of the heat-conducting upper plate (2) and the base plate (1), and one or more assemblies (4) are arranged at the distance; The assembly (4) comprises one or more VC heat spreaders (41), a filling gap (42) is provided between every two of the VC heat spreaders (41), and the filling gap (42) is filled with thermal conductive paint.

2. The heat dissipation mechanism of a small outboard motor driver according to claim 1, characterized in that: The substrate (1) comprises a plate body (11), and positioning holes (12) are provided at diagonal positions of the four sides of the frame of the plate body (11) for fixing the substrate (1).

3. The heat dissipation mechanism of a small outboard motor driver according to claim 1, characterized in that: The heat-conducting upper plate (2) comprises a second plate body (21), and a second combination hole (22) adapted to the positioning hole (12) is provided at the diagonal positions of the frame around the bottom of the second plate body (21) for combining the base plate (1) with the heat-conducting upper plate (2).

4. The heat dissipation mechanism of a small outboard motor driver according to claim 3, characterized in that: The bottom of the second plate body (21) is provided with one or more fins (23) arranged in an array, and a groove adapted to the second plate body (21) is opened in the middle of the plurality of fins (23), and a fan (24) is arranged at the groove to guide the circulation of air.

5. The heat dissipation mechanism of a small outboard motor driver according to claim 1, characterized in that: The heat-conducting bottom plate (3) comprises a plate body three (31), a clamping frame (32) corresponding to the fin (23) being arranged on one side of the plate body three (31) close to the fin (23) of the plate body two (21), a groove being arranged in the middle of the plurality of clamping frames (32), and a guide ring (34) being arranged at the groove for matching with the fan (24) to guide air circulation.

6. The heat dissipation mechanism of a small outboard motor driver according to claim 5, characterized in that: Combination holes (35) adapted to the second combination hole (22) are provided at diagonal positions of the frame around the bottom of the third plate body (31), and the second combination hole (22), the positioning hole (12) and the third combination hole (35) are connected by fasteners.

7. The heat dissipation mechanism of a small outboard motor driver according to claim 5, characterized in that: A support column (33) is provided in the middle of the guide ring (34), and the support column (33) is adapted to abut against the middle of the fan (24).

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